JPH1126782A - Semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To eliminate the package made of ceramic or the like, by forming a space only in the light receiving area of the light receiving element in a semiconductor element, providing airtight sealing by a transparent member, and directly soldering an external connecting electrode pad of the semiconductor element to another mounting substrate with Ni or the like. SOLUTION: The surface of a light receiving area 2 is covered by a transparent member 3 comprising glass or the like, wherein a frame part 3a is formed as a unitary body at a surrounding part, so that a space is formed on the light receiving area 2 of the light receiving element of a semiconductor element 1. Sealing resin 6 is provided at the junction part of the transparent member and the surface of the semiconductor element 1, and bonding sealing is performed. A wiring 4 from the light receiving area is introduced to the surface of the external surrounding part of the semiconductor element 1. The surface of an external connecting electrode pad 5 provided at the end of the wire comprises metal or alloy such a Ni or the like. The wire is directly soldered to the mounting substrate. Therefore, the package comprising ceramic or the like can be eliminated.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device comprising a semiconductor element having a light receiving element such as a photodiode, a line sensor, an image sensor, etc., and more particularly to a semiconductor device having an improved semiconductor element mounting structure.

[0002]

2. Description of the Related Art Conventionally, as a mounting structure of a semiconductor device having a light receiving element such as a photodiode, a line sensor, an image sensor, etc., a structure as shown in FIG. 6 is known. That is, a semiconductor element 101 having a light receiving element having a light receiving section area 102 is housed in a package 103 made of ceramic or the like, and an external connection electrode on the surface of the semiconductor element 101 and an electrode provided in the package 103 are made of metal. The semiconductor devices are connected by thin wires 104, and a transparent member 105 such as glass is mounted on the surface of the package 103, and their joints are sealed with a sealing resin 106. FIG. 6
In the figure, 107 is an external lead provided on the side surface of the package 103.

As shown in FIG. 7, in Japanese Patent Application Laid-Open No. 3-155657, a semiconductor element 201 having a light-receiving element provided with a light-receiving section area 202 is mounted on a transparent member 203 made of glass or the like provided with a wiring 204. The semiconductor element 201 is electrically connected via a protruding electrode 205, the outer peripheral portion of the semiconductor element 201 is sealed with a sealing resin 206, and an electrode pad 207 formed on the surface of the transparent member 203 is mounted on the transparent member 203. A structure configured to be connectable to a substrate is disclosed, and a method of connecting and mounting via this protruding electrode is COG (chip-on-glass).
It is called a method.

[0004]

By the way, in a mounting system in which a semiconductor element is housed in a package such as a ceramic as shown in FIG. 6, it is difficult to reduce the size and thickness and the package such as a ceramic is expensive. Therefore, there is a problem that cost reduction is difficult. Further, in the mounting method using the COG method of connecting to a transparent substrate made of glass or the like through a protruding electrode as shown in FIG. There is a risk of being covered with the sealing resin. Further, as one of the mounting modes using the COG method, there is a mounting method in which a space between a transparent substrate and a semiconductor element having a light receiving element is filled with a transparent resin. The transparent resin easily peels off on the surface of the light receiving area or the surface of the transparent substrate due to moisture absorption, and when an image sensor with a micro lens is provided as a light receiving element, the lens effect is obtained by filling the sealing resin. There are many problems such as drastic reduction, and it has been found that it is better to provide a space on the surface of a semiconductor element having a light receiving element.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problems in a semiconductor device using a conventional mounting method, and it is possible to reduce the mounting size, thickness and weight of the semiconductor device, and to reduce the mounting cost. It is intended to provide a device.

[0006]

In order to solve the above problems, the present invention relates to a semiconductor device having a light receiving element such as a photodiode, a line sensor, an image sensor and the like.
Transparent members such as glass, quartz, sapphire, and transparent resin
The light receiving portion area of the semiconductor element is disposed only in the light receiving portion area of the semiconductor element so that a space is formed between the light receiving portion surface of the semiconductor element and the outer peripheral portion of the semiconductor element. The surface of the external connection electrode pad drawn out to
The semiconductor device is made of a metal or alloy that can be directly soldered such as Ni, Cr, Au, Ag, and solder.

In the semiconductor device thus constructed, only the light receiving section area forms a space, is hermetically sealed by a transparent member, and is provided with an external connection electrode pad which can be directly soldered. This eliminates the need for packages such as ceramics, and eliminates the need for die bonding and wire bonding to the package.
The thickness and the weight can be reduced, and the mounting cost can be reduced. Further, a semiconductor element having a light receiving portion area of a light receiving element provided in a concave portion provided in a semiconductor substrate is replaced with a CO.
By mounting by the G method, it is possible to prevent the sealing resin from entering the light receiving area.

[0008]

Next, an embodiment will be described. 1A and 1B are a plan view and a sectional view showing a first embodiment of a semiconductor device according to the present invention. In the figure, reference numeral 1 denotes a semiconductor element having a light receiving element, and a frame portion 3a is integrally formed in a peripheral portion so that a space is formed on a light receiving section area 2 of the light receiving element of the semiconductor element 1.
The transparent member 3 made of glass, quartz, transparent resin, etc.
The surface of the light receiving section area 2 is covered, and a sealing resin 6 is provided at the junction between the transparent member 3 and the surface of the semiconductor element 1 to seal and bond. On the outer peripheral surface of the semiconductor element 1, a wiring 4 is led out from the light receiving area 2, and the surface of the external connection electrode pad 5 provided at the end thereof is N
It is made of a metal or alloy such as i, Cr, Au, Ag, solder, or the like, and is configured so that the semiconductor element 1 can be directly soldered to a separate mounting board (not shown).

In the semiconductor device configured as described above, since the semiconductor element can be directly soldered to the mounting substrate as described above, a package made of ceramic or the like is not required.
The mounting size can be reduced in size, thickness and weight, and the mounting cost can be reduced.

Next, a second embodiment will be described. FIG. 2 is a sectional view showing a second embodiment, in which the same or corresponding members as those in the first embodiment shown in FIGS. 1A and 1B are denoted by the same reference numerals. I have. In this embodiment, a sealing frame 7 is formed on the outer periphery surrounding the light receiving section area 2 of the semiconductor element 1 using a synthetic resin such as polyimide, epoxy, or phenol by printing or etching. A plate-shaped transparent member 3 made of glass, quartz, sapphire, transparent resin or the like is bonded and sealed with a sealing resin 6 on the surface of the stop frame 7 to constitute a semiconductor device.

In this embodiment, the transparent member 3 can be constituted by a simple plate rather than a molded product in which the frame is integrally formed in the peripheral portion as in the first embodiment. Can be reduced. Note that, instead of forming the sealing frame 7 by a method such as printing, it is needless to say that the sealing frame 7 may be formed separately by molding with a resin or the like and adhered to the surface of the semiconductor element. .

FIG. 3 is a sectional view showing a modification of the second embodiment shown in FIG. 2. In this modification, a frame 7 is shown.
Is formed smaller than the outer peripheral portion of the plate-shaped transparent member 3, the sealing resin 6 is applied between the transparent member 3 and the surface of the semiconductor element 1, and the sealing is performed. With this configuration, the same effect as that of the second embodiment shown in FIG. 2 can be obtained.

FIG. 4 is a sectional view showing a third embodiment of the present invention, in which members identical or corresponding to those of the first embodiment shown in FIGS. The same reference numerals are given. In this embodiment, the semiconductor element 1
A concave portion is previously formed in the semiconductor substrate constituting the semiconductor device, a light receiving portion area 2 of the light receiving element is formed in the concave portion, and a surface wiring 4 is provided from the light receiving portion area 2 to the outer peripheral surface of the semiconductor device 1. The plate-shaped transparent member 3 is placed directly on the surface of the substrate 1 and is sealed with a sealing resin 6.

In this embodiment, FIGS. 2 and 3
Since it is not necessary to form the sealing frame according to the second embodiment and its modification shown in FIG. 1, the thickness can be further reduced in the thickness direction.

In the first to third embodiments, the transparent member 3 may be formed of optical components such as various optical filters, diffraction gratings, polarizing plates, holograms, prisms and lenses. It is.

FIG. 5 is a sectional view showing a fourth embodiment. In this embodiment, similarly to the third embodiment shown in FIG. 4, a concave portion is previously formed in a semiconductor substrate constituting a semiconductor element, and the light receiving portion area 2 of the light receiving element is formed in the concave portion.
Is formed, a surface wiring 4 is provided from the light receiving area 2 to the outer peripheral surface of the semiconductor element 1, and a protruding electrode 8 made of Au, solder or the like is formed at the end. On the other hand, a plate-shaped transparent member 3 made of glass, quartz, sapphire, or the like is provided with a surface wiring 4 having an electrode pad 5 formed at an end portion. The semiconductor element is electrically connected, and the electrically connected portion is bonded and sealed with a sealing resin 6 to form a semiconductor device.

In this embodiment, the semiconductor element 1 and the plate-shaped transparent member 3 are electrically connected via the protruding electrode 8, and the connection portion is sealed with a sealing resin.
Even when the OG method is used, since the light receiving area of the light receiving element is formed in the concave portion of the semiconductor substrate, it is possible to prevent the sealing resin from entering the light receiving area.

[0018]

As described above with reference to the embodiments, according to the present invention, only the light receiving portion area of the light receiving element in the semiconductor element forms a space and is hermetically sealed by the transparent member. The external connection electrode pads are configured so that they can be soldered directly to a separate mounting board, eliminating the need for packages such as ceramics, and eliminating the need for die or wire bonding to the package. It is possible to reduce the size, thickness, and weight of the device, and to reduce the mounting cost. Further, by forming the light receiving portion area of the light receiving element in the concave portion of the semiconductor substrate, even when mounting is performed using the COG method using the protruding electrodes, the sealing resin is prevented from entering the light receiving portion area. be able to.

[Brief description of the drawings]

FIG. 1 is a plan view and a cross-sectional view illustrating a first embodiment of a semiconductor device according to the present invention.

FIG. 2 is a sectional view showing a second embodiment of the present invention.

FIG. 3 is a cross-sectional view showing a modification of the second embodiment shown in FIG.

FIG. 4 is a sectional view showing a third embodiment of the present invention.

FIG. 5 is a sectional view showing a fourth embodiment of the present invention.

FIG. 6 is a cross-sectional view illustrating a configuration example of a conventional semiconductor device.

FIG. 7 is a cross-sectional view showing another configuration example of a conventional semiconductor device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Semiconductor element 2 Light-receiving area 3 Transparent member 4 Surface wiring 5 Electrode pad 6 Sealing resin 7 Sealing frame 8 Projecting electrode

Claims (4)

[Claims] 1. A semiconductor device having a light receiving element such as a photodiode, a line sensor, and an image sensor.
Transparent members such as glass, quartz, sapphire, and transparent resin
The light receiving portion area of the semiconductor element is disposed only in the light receiving portion area of the semiconductor element so that a space is formed between the light receiving portion surface of the semiconductor element and the outer peripheral portion of the semiconductor element. The surface of the external connection electrode pad drawn out to
A semiconductor device formed of a directly solderable metal or alloy such as Ni, Cr, Au, Ag, and solder. 2. A sealing frame made of a synthetic resin such as polyimide, epoxy or phenol is provided on an outer peripheral portion of a light receiving area of the semiconductor element, and the surface of the sealing frame covers the light receiving area. 2. The semiconductor device according to claim 1, wherein the transparent member is mounted as described above. 3. The semiconductor device according to claim 1, wherein a light receiving area of the semiconductor element is formed in a concave portion provided on the semiconductor substrate in advance, and a wiring from the light receiving area is drawn out to an outer peripheral surface of the semiconductor substrate. The semiconductor device according to claim 1, wherein: 4. A semiconductor device comprising: a light receiving portion area of a light receiving element formed in a concave portion provided in a semiconductor substrate; and an external connection electrode pad formed on a wiring led out to an outer peripheral surface of the semiconductor substrate. The transparent member subjected to the above is disposed facing the light receiving area of the semiconductor element, and the electrode pad of the semiconductor element is electrically connected to the wiring of the transparent member via a projecting electrode made of Au, solder, or the like, A semiconductor device, wherein the electrical connection portion is sealed with a sealing material.