JPH05191733A - Solid-state image pickup device - Google Patents

Abstract

PURPOSE:To easily fix a diffraction grating to an optical image projection face of the solid-state image pickup element in parallel at a prescribed interval. CONSTITUTION:The device is provided with a solid-state image pickup element 13 and a diffraction grating plate 15 arranged opposite to the optical image projection face of the solid-state image pickup element 13 at a prescribed interval. The fixed part of the diffraction grating plate 15 is fixed with an adhesives 18 including plural micro beads 19 made of spheres or cylinders whose diameter is uniform.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solid-state image pickup device,
In particular, the present invention relates to a solid-state imaging device that includes a diffraction grating plate that is arranged to face the optical image projection surface of the solid-state imaging device.

[0002]

2. Description of the Related Art In recent years, a solid-state image pickup device is known in which a diffraction grating plate for so-called moire prevention is incorporated in the device.

That is, there is a casing (package) in which the concave portion of the main surface is closed by a glass plate, and the solid-state image sensor is mounted on the bottom surface of the concave portion with the main surface which is the optical image projection surface facing upward. ing. Electrodes are arranged in parallel around the main surface of the solid-state imaging device, and each of these electrodes is connected to a lead that extends and is supported and fixed to the outside of the housing via a bonding wire.

A diffraction grating plate is arranged so as to face the main surface of the solid-state image pickup device, and the diffraction grating plate is fixed to a step portion provided on the side wall of the recessed portion of the housing with an adhesive.

As a result, the light image is formed on the light image projection surface, which is the main surface of the solid-state image pickup device, through the glass plate and the diffraction grating plate.

The solid-state image pickup device having such a structure is
For example, the document “Video Information 1986 May Issue Vo
L. 18 Industrial Development Organization KK Issue ”.

[0007]

However, in the solid-state image pickup device having such a configuration, it is difficult to dispose the diffraction grating plate in parallel with the optical image projection plane of the solid-state image pickup device at a predetermined distance. Met. This is because it cannot be fixed parallel to the fixed surface due to variations in the amount of adhesive applied to the fixed portion of the diffraction grating plate.

Therefore, there remains a problem that moire is not sufficiently prevented.

Therefore, the present invention has been made under such circumstances, and an object of the present invention is to make a diffraction grating plate parallel to a light image projection plane of a solid-state image pickup device and to have a predetermined size. An object of the present invention is to provide a solid-state imaging device that can be easily fixed at intervals of.

[0010]

In order to achieve such an object, the present invention is basically arranged so that a solid-state image pickup device and a light image projection surface of the solid-state image pickup device are opposed to each other at a predetermined interval. In the solid-state imaging device including a diffraction grating plate, the fixing portion of the diffraction grating plate is fixed by an adhesive material containing a plurality of microbeads each having a spherical or cylindrical body with a uniform diameter. It is a thing.

[0011]

In the solid-state image pickup device having such a structure, the diffraction grating plate is fixed at the fixing portion by an adhesive material containing a plurality of micro beads each having a spherical shape or a cylindrical shape with a uniform diameter. There is.

Therefore, for example, when the diffraction grating plate is fixed on the main surface which is the optical image projection surface of the solid-state image pickup device,
Since the distance between the main surface of the solid-state image sensor and the diffraction grating plate is determined by the diameter of the microbeads, the distance can be easily set in parallel and to a predetermined value.

Also, when the diffraction grating plate is fixed to the housing (package) of the apparatus, it can be fixed at a predetermined distance from the mounting surface of the housing on which the solid-state image sensor is mounted. For this reason, when the main surface of the solid-state image sensor can be mounted parallel to the mounting surface, the separation distance between the main surface of the solid-state image sensor and the diffraction grating plate can be easily set in parallel to a predetermined value. be able to.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIGS. 2A to 2E are block diagrams showing an embodiment of a solid-state image pickup device according to the present invention. Here, (a) is a plan view, (b) is a front view, and (c) is (a).
Is a cross-sectional view taken along the line cc of FIG. 6, (d) is a side view, and (e) is a cross-sectional view taken along the line ee of (a).

First, there is a package 10 made of, for example, a resin material, and a concave portion 11 is formed on the main surface (the surface on the side where an optical image is projected) of this package 10. A part of the lead frame 12 is exposed on the bottom surface of the recess 11.

That is, in the center of the recessed portion 11, there is an island portion 12A to which a solid-state image pickup device 13 to be described later is die-bonded, and around the island portion 12A, each of the lead frames 12 called inner lead portions 12B. The tip is located.

In this embodiment, the inner lead portion 12B
Are positioned on two sides of the four sides surrounding the island portion 12A, which face each other.

The lead frame 12 extends as it is from the inner lead portion 12B, which is the tip end thereof, into the package 10 and projects to the outside of the package 10 to form an outer lead 12C.

A solid-state image pickup device 13 is die-bonded to the island portion 12A of the lead frame 12 via a resin adhesive, for example. The configuration of the solid-state image pickup device 13 will be described in detail with reference to FIG. 2. The surface opposite to the bonding surface with the island portion 12A is a surface (main surface) on which an optical image is projected.

Electrodes are provided on the main surface of the solid-state image pickup device 13 on the inner lead portion 12B side, and these electrodes are electrically connected to the inner leads 12B via bonding wires 14.

Above the solid-state image sensor 13,
The diffraction grating plate 15 is arranged so as to be fixed by a resin adhesive 18 on two opposite sides of the four sides.

In this embodiment, in particular, FIG.
As shown in FIG. 1 which is an enlarged view of (e), the resin adhesive 18 contains a large number of micro beads 19 made of glass spheres having a uniform diameter. The distance between the diffraction grating plate 15 and the main surface, which is the optical image projection surface of the solid-state imaging device 13, is the microbeads 19 described above.
It will be fixed according to the diameter.

The fixing portion of the solid-state image pickup device 13 to the diffraction grating plate 15 by the resin adhesive 18 is a side orthogonal to the side where the electrodes are juxtaposed, and thus the electrodes do not become a problem. In this way, the diffraction grating plate 15 can be fixed.

Further, the concave portion 11 of the package 10 in which the solid-state image pickup device 13 and the diffraction grating plate 15 are arranged is closed by a glass plate 17, and an optical image is projected on the solid-state image pickup device 13 through the glass plate 17. The solid-state image pickup device 13 is protected from external force.

FIG. 3 is a schematic overall configuration diagram showing an embodiment of the solid-state image pickup device 13 applied to the solid-state image pickup device according to the present invention.

In the figure, each element is formed on the main surface of a one-chip semiconductor substrate in the arrangement as shown. In the figure, a plurality of photodiodes 1 are formed in a matrix in a light image projection area on the main surface of the semiconductor substrate.

Although only 3 × 4 photodiodes are shown in this drawing for convenience of explanation, in actuality, about 20 photodiodes are used.
About 10,000 to about 400,000 have been formed.

Here, the photodiode 1 is a photoelectric conversion element that generates an electric charge according to the intensity of the light upon irradiation with the light.

Further, there is a vertical shift register 2 formed along the column direction for each group of photodiodes 1 arranged in the column direction (vertical direction in the drawing), and each vertical shift register 2 is composed of a CCD element. It is composed of a charge transfer element.

These vertical shift registers 2 read the charges generated in the photodiodes 1 arranged in the column direction and transfer the charges to the outside of the optical image projection area along the column direction. Is becoming

The charge read from each photodiode 1 to the vertical shift register 2 is performed by a charge read gate (not shown).

Further, the charges respectively transferred from the respective vertical registers 2 are outputted to the horizontal shift register 4 and transferred by the horizontal shift register 4 in the horizontal direction. This horizontal shift register 4
Are composed of CCD elements like the above vertical shift registers 2.

The output from the horizontal shift register 4 is input to the output circuit 5, converted into, for example, a voltage in the output circuit 5, and taken out to the outside.

Then, on the main surface of the semiconductor substrate on which each element is formed in this way, an opening is formed in the region where each photodiode 1 is formed, so that only each photodiode 1 is exposed. A film (not shown) is formed.

4 to 7 are process charts showing the manufacturing process of the solid-state image pickup device shown in FIG. Each figure is shown in Figure 2 (c).
It corresponds to. Each step will be described below.

Step 1. The solid-state image sensor 13 is die-bonded in the recess 11 of the package 10 in which the leads 12 are supported and fixed, and then the electrodes of the solid-state image sensor 13 and the inner leads 12B are connected by the bonding wires 14 (FIG. 4).

Step 2. The resin adhesive 18 is applied to opposite sides of the main surface of the solid-state imaging device 13 on the side where the electrodes are not arranged in parallel. In this case, the resin adhesive 18 contains a large number of micro beads 19 made of glass spheres having a uniform diameter (FIG. 5).

Step 3. The diffraction grating plate 15 is arranged so as to cover the main surface of the solid-state imaging device 13, and the resin adhesive 1
Place on top of 8. After that, the diffraction grating plate 15 is pressed toward the solid-state imaging device 13 side, and the diffraction grating plate 15 and the solid-state imaging device 1 are pressed.
One microbead 19 is arranged between the two. As a result, the diffraction grating plate 15 is attached to the solid-state imaging device 1
The resin beads 18 are fixed by the resin adhesive 18 while maintaining a distance equal to the diameter of the microbeads 19 with respect to the main surface of No. 3 (FIG. 6).

Step 4. The glass plate 17 closes the recess 11 of the package 10 to complete the manufacturing (FIG. 7).

According to the solid-state image pickup device according to such an embodiment, a resin adhesive material containing a plurality of micro beads 19 each having a uniform diameter at the fixing portion of the diffraction grating plate 15 with the solid-state image pickup device 13. It is fixed by 18.

Therefore, the distance between the main surface of the solid-state image pickup device 13 and the diffraction grating plate 15 is determined by the diameter of the microbeads 19. Therefore, the distance can be easily set in parallel and to a predetermined value. Will be able to.

In the above-mentioned embodiment, the diffraction grating plate 5 is directly fixed to the surface of the solid-state image pickup device 13. However, as shown in FIG. 8, a step 16 is provided on the side wall of the recess 11 of the package 10, and the diffraction grating plate 15 is provided at the step 16.
When fixing the, the present invention can be applied to the fixing portion. An enlarged view of FIG. 8 is shown in FIG. In this case, when the solid-state imaging device 18 is die-bonded, the bottom surface of the recessed portion 11 and the main surface of the solid-state imaging device 18 are parallel to each other by fixing with the resin adhesive 18A containing the microbeads 19A. In addition, the distance can be set to a predetermined value. Therefore, the concave portion 11
By accurately forming the step portion 16 formed on the side wall of the solid-state image pickup device, the diffraction grating plate 15 can be arranged in parallel with the main surface of the solid-state imaging device 13 at a predetermined distance.

Further, in the above-mentioned embodiment, the micro beads 19 are spherical ones, but the micro beads 19 are not limited to this and may be cylindrical ones. Absent. In this case, it is preferable that the length is sufficiently longer than the diameter. This is because the microbeads 19 formed of a cylindrical body must always be placed in the resin adhesive 18 in a recumbent state. That is, in such a state, the distance between the adhered materials is determined by the diameter of the cylindrical body.

[0044]

As is clear from the above description,
According to the solid-state imaging device of the present invention, the diffraction grating plate can be easily fixed in parallel with the optical image projection plane of the solid-state imaging device at a predetermined interval.

[Brief description of drawings]

FIG. 1 is a main part configuration diagram showing an embodiment of a solid-state imaging device according to the present invention.

2A to 2E are configuration diagrams showing an embodiment of a solid-state imaging device according to the present invention, FIG. 2A is a plan view, and FIG.
Is a front view, (c) is a sectional view taken along line cc of (a),
(D) is a side view and (e) is a sectional view taken along line ee of (a).

FIG. 3 is a schematic configuration diagram showing an embodiment of a solid-state imaging device applied to the solid-state imaging device according to the present invention.

FIG. 4 is a process chart showing an embodiment of a method for manufacturing a solid-state imaging device according to the present invention, in which the steps 1. FIG.

5A to 5C are process drawings showing an embodiment of a method for manufacturing a solid-state imaging device according to the present invention, in which the process 2. FIG.

FIG. 6 is a process diagram showing an embodiment of a method for manufacturing a solid-state imaging device according to the present invention, in which the process 3. FIG.

FIG. 7 is a process chart showing an embodiment of a method for manufacturing a solid-state imaging device according to the present invention, in which the process 4. FIG.

FIG. 8 is a sectional configuration diagram showing another embodiment of the solid-state imaging device according to the present invention.

9 is a partially enlarged view of FIG.

[Explanation of symbols]

13 ... Solid-state imaging device, 15 ... Diffraction grating plate, 18 ... Resin adhesive, 19 ... Microbeads.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Shoya Izumi 3300 Hayano, Mobara-shi, Chiba Hitachi Mobara factory (72) Inventor Toshio Nakano 3681 Hayano, Mobara-shi, Chiba Hitachi Device Engineering Co., Ltd. ( 72) Inventor Shu Iguchi, 3681 Hayano, Mobara-shi, Chiba Hitachi Device Engineering Co., Ltd. (72) Inventor Masaaki Yokoyama, 3681 Hayano, Mobara-shi, Chiba Hitachi Device Engineering Co., Ltd.

Claims (1)

[Claims] 1. A solid-state image pickup device comprising a solid-state image pickup device and a diffraction grating plate arranged opposite to an optical image projection surface of the solid-state image pickup device at a predetermined interval, wherein the fixed part of the diffraction grating plate has a uniform diameter. A solid-state imaging device characterized by being fixed by an adhesive material containing a plurality of microbeads each having a spherical or cylindrical shape.