JPH11164209A - Mount device for solid-state image pickup element - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a mount device for the solid-state image pickup element by which a problem such as production of dust is solved in the case of using a printed circuit board connecting to the solid-state image pickup element and that is easily fixed. SOLUTION: A cover 31 made by the method for making a throughhole is fixed to a side face and a face of an opening 23 opposite to an optical glass 22 in the opening 23 formed to an insulation board 21a made of a fiber resin such as glass epoxy. The cover 31 prevents production of dust of the insulation board 21a from the opening 23 formed to the insulation board 21a.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a device for mounting a solid-state image pickup device used in an image pickup device such as a video camera.

[0002]

2. Description of the Related Art As an example of mounting a solid-state imaging device, TOG {T
AB (tape-automated bondig) On Glass}. This content is described in JP-A-7-99214, and has a structure as shown in FIG.

In FIG. 7, an optical glass 2 through which light passes is fixed to a predetermined position of a TAB tape 1 using an adhesive 3 which is cured by heat or ultraviolet rays. 6 is formed, the anisotropic conductive paste 7 is applied, and then hot-pressed to the TAB tape 1 which is a flexible substrate using a material such as polyimide.

The TAB tape 1 is flexible because the substrate itself is flexible and a method of holding the substrate portion cannot be adopted. Therefore, as a fixing method, a method of connecting and fixing the glass epoxy substrate 8, a method of directly fixing the CCD 4, A method of directly fixing the optical glass 2 or the like can be considered, but as a result, the use is limited.

By the way, as shown in FIG. 8, instead of the TAB tape 1, a printed wiring board 11 made of glass epoxy or the like is used.
Is used, since the material of the insulating substrate of the printed wiring board 11 is a fiber resin, when the opening 12 is processed at the edge portion of the opening 12 for taking in the light through the optical glass 2 into the CCD 4, time is shortened. There is dust 13 generated through the process. After mounting, the dust 13 adheres to the CCD 4 and the optical glass 2 to cause a problem on an image.

While the thickness of the TAB tape 1 is about 80 μm, the thickness of the printed wiring board 11 is about 1 mm, about 12 mm.
When a lens having a short focal length is used for miniaturization as shown in FIG. 9, light in the peripheral portion of the image is input to the imaging area 14 of the CCD 4 from an oblique direction. As a result, the printed wiring board 11 blocks light in the range of “A”.

As described above, in the TOG, since the TAB tape 1 is used, the substrate itself is flexible, and there is a case where the substrate cannot be held at the time of mounting. Also, TA
When trying to obtain the same function as TOG by using a printed wiring board 11 such as glass epoxy instead of B tape,
When dust 13 is generated from the processed portion of the opening 12 or when a lens having a short focal length is used, there is a problem that the thickness of the printed wiring board 11 causes vignetting.

[0008]

In the above-mentioned conventional mounting device, the mounting of the solid-state imaging device by TOG may not be able to hold the substrate portion at the time of mounting, and in order to eliminate this problem, the TAB TAB tape of TOG must be used. When it is changed to a printed wiring board, there is a problem that dust is generated.

Accordingly, the present invention provides a mounting device for a solid-state image sensor which eliminates the problems that occur when a printed circuit board to which a solid-state image sensor is connected and which is easily fixed is used.

[0010]

In order to solve the above-mentioned problems, a solid-state imaging device mounting apparatus according to the present invention comprises a transparent member, a fiber resin wiring board adhered to the transparent member, A photoelectric conversion element electrically connected to the insulating substrate via an anisotropic conductive film, and an opening formed in the wiring substrate to capture light into the photoelectric conversion element via the transparent member. And a cover member covering an opening edge of the opening.

By using the fiber resin wiring board having the above structure and covering the opening formed in the wiring board with a cover member for capturing light, dust generated at the opening of the wiring board can be suppressed. And contribute to improvement in yield.

[0012]

Embodiments of the present invention will be described below in detail with reference to the drawings. In this embodiment, the TAB tape is replaced with a printed wiring board using an insulating substrate of a fiber resin such as glass epoxy, and
It is possible to realize a G structure.

In FIG. 1, a printed wiring board 21 using an insulating substrate made of a fiber resin such as glass epoxy is adhered to one surface of an optical glass 22 with an adhesive 24. The optical glass 22 transmits light. The thickness of the optical glass 22 is determined by the optical design, and is, for example, about 1 mm. An optical low-pass filter may be used as the optical glass 22, and this function may be used in combination. Alternatively, glass in which an infrared cut filter or the like and an optical low-pass filter are laminated may be used. Glass with a low-pass filter laminated may be used. The optical glass 22 is not limited to this as long as it is a translucent member. For example, an inorganic material such as quartz or silicon or an organic material such as polyethylene may be used.

As shown in FIG. 2, the printed wiring board 21 is formed on an insulating substrate 21a made of fiber resin such as glass epoxy.
A plurality of copper leads 21b are formed, and the thickness is, for example, about 1 mm. The printed wiring board 21 has, for example, a rectangular opening 23. Opening 23 is optical glass 2
2 is formed to allow the light that has entered through 2 to pass through. The copper lead 21b is connected to the insulating substrate 2 on the two sides facing the opening 23.
1a are formed at regular intervals. In other words, there is always an insulating substrate 21a between adjacent copper leads 21b.
Exists. Although the copper leads 21b are not formed on the insulating substrate 21a on the other two sides other than the two opposite sides of the opening 23, the copper leads 21b may be formed on these two sides. The thickness of the copper lead 21b is, for example, about 35 μm. The width of the copper lead 21b is, for example, about 100 μm.

The printed wiring board 21 is preferably black. Thereby, reflection can be prevented, and incidence of unnecessary radiation can be prevented. In this case, a black insulating substrate 21a may be used, or black may be applied.

The adhesive 24 is, for example, an adhesive such as epoxy acrylate, modified acryl, epoxy, etc., for example, an adhesive which is cured by heat, ultraviolet light, or both. The thickness of the adhesive 24 is, for example, about 10 μm to 20 μm.

On the opposite surface of the printed wiring board 21 to which the optical glass 22 is attached, CC
D26 is connected. The anisotropic conductive film 25 is formed not only along the side where the copper lead 21b exists, but also
It is more preferable to form along two other sides other than this side.

The thus formed anisotropic conductive film 25
Indicates the printed wiring board 21 in addition to the electrical connection function.
For mechanically connecting the CCD and the CCD 26 and the opening 2
It also has a function of sealing a hollow portion formed by 3 or the like from the outside. Note that the anisotropic conductive film 25 is preferably black.
Thereby, reflection can be prevented, and incidence of unnecessary radiation can be prevented.

On the surface of the CCD 26, electrode pads 27 are formed along two sides of the CCD 26 corresponding to the copper leads 21b. Copper leads 21b are formed along four sides, and CC
Electrode pads may be formed along four sides of D26. A bump 28 is formed on each electrode pad 27. The diameter of the bump 28 is, for example, 90 μm. The height of the bump 28 is, for example, 30 μm.

Copper lead 21b and bump 2 corresponding to copper lead 21b
8 is electrically connected via conductive particles contained in the anisotropic conductive film 25. A micro lens 29 is formed on the light receiving surface of the CCD 26. CCD 26 is optical glass 22,
Light is received through the opening 23 and the micro lens 29.

On the optical glass 22, an anisotropic conductive film 25 is provided.
Is formed so as to cover. Sealing resin 30
Is, for example, a phenol or epoxy-based sealing resin, for example, a type of sealing resin that is cured by heat or ultraviolet rays or a combination thereof. The sealing resin 30 reinforces the electrical connection and the mechanical connection between the printed wiring board 21 and the CCD 26. However, since the anisotropic conductive film 25 also has the function of the sealing resin 30, the sealing resin 3
0 can be omitted.

The opening 23 formed in the insulating substrate 21a made of a fiber resin such as glass epoxy is provided with a cover portion formed of a copper foil like a through hole so as to hang the side surface and the surface facing the optical glass 22. 31 is fixed.
The cover portion 31 is formed of the insulating substrate 2 generated at the opening 23 portion.
1a can be prevented from being generated.

In this embodiment, dust from the printed wiring board 21 which is likely to be generated in the opening 23 can be suppressed, so that a decrease in yield due to dust can be suppressed.

FIG. 3 is a cross-sectional view for explaining a second embodiment of the present invention. In this embodiment,
A cover part 311 made of synthetic resin is formed in the opening part 23 by the same method as in the outsert, instead of the cover part 31 formed of copper foil in FIG. The same functional portions as those in FIG. 1 are denoted by the same reference numerals, and description thereof will be omitted.

Also in this embodiment, dust from the printed wiring board 21 which is likely to be generated at the opening 23 can be suppressed.

FIG. 4 is a sectional view for explaining a third embodiment of the present invention. The same functional portions as those in FIG. 1 are denoted by the same reference numerals, and description thereof will be omitted.

That is, the cover portion 31a is formed on a taper portion 41 which is formed so that the opening area of the opening portion 23 is gradually narrowed from the optical glass 22 to the CCD 26. The tapered portion 41 can prevent light incident obliquely through the optical glass 22 and the microlens 29 from being blocked, and the cover portion 31a can be an outsert-formed cover portion made of synthetic resin shown in FIG. 31
May be.

In this embodiment, not only the generation of dust from the opening 23 can be suppressed, but also the occurrence of vignetting when a short-focus lens is used can be prevented.

FIG. 5 is a cross-sectional view for explaining a fourth embodiment of the present invention. The same reference numerals are given to the same functional parts as in FIG. 1, and the description thereof will be omitted.

In this embodiment, as shown in FIG. 6 (a), openings 23a-2a of the same shape whose area gradually decreases.
Insulating substrates 21aa to 21ac made of fiber resin such as glass epoxy having 3c are laminated and laminated with the centers of openings 23a to 23c aligned to form openings 23 as shown in FIG. 6B. . In the opening 23,
A cover portion 31b made of copper foil is formed like a through hole. Further, a copper lead 21b is fixed on the insulating substrate 21aa.

Therefore, even in this case, dust from the printed wiring board 21 which is likely to be generated at the opening 23 is suppressed, and the openings 23a to 23a whose area gradually decreases.
3c can realize the same function as the tapered portion 41 of FIG.

The present invention is not limited to the above-described embodiment. For example, the same effect can be obtained even if the cover is plated or painted. M instead of CCD
An OS type image sensor may be used.

[0033]

As described above, according to the image pickup device mounting apparatus of the present invention, the opening formed in the printed wiring board for taking in light is covered with the cover member, so that the opening of the wiring board is provided. Dust generated in the process can be suppressed, and the yield can be improved.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view for explaining a first embodiment of the present invention.

FIG. 2 is a perspective view for explaining a main part of FIG. 1;

FIG. 3 is a sectional view for explaining a second embodiment of the present invention;

FIG. 4 is a sectional view for explaining a third embodiment of the present invention;

FIG. 5 is a sectional view for explaining a fourth embodiment of the present invention;

FIG. 6 is an exploded sectional view for explaining a main part of FIG. 5;

FIG. 7 is a sectional view for explaining conventional TOG mounting.

8 is a cross-sectional view for describing a problem when a TAB tape used for TOG mounting in FIG. 7 is changed to a printed wiring board.

FIG. 9 is an explanatory diagram for explaining another problem of FIG. 8;

[Explanation of symbols]

21 ... Printed wiring board, 21a, 21aa to 21ac
... Insulating substrate, 21b ... Copper lead, 22 ... Optical glass, 2
3 opening, 24 adhesive, 25 anisotropic conductive film, 26
... CCD, 27 ... electrode pad, 28 ... bump, 29 ... microlens, 30 ... sealing resin, 31,311,31
a, 31b ... cover part.

Claims (5)

[Claims] A transparent member; a wiring board made of fiber resin adhered to the transparent member; a photoelectric conversion element electrically connected to the insulating substrate via an anisotropic conductive film; An opening formed in the wiring board for capturing light into the photoelectric conversion element via the transparent member, and a cover member covering an opening edge of the opening. Mounting device for a solid-state imaging device. 2. The device according to claim 1, wherein the cover member has a through-hole structure. 3. The apparatus according to claim 1, wherein the cover member is formed by outsert. 4. The opening according to claim 1, wherein the opening, together with the cover member, has a tapered structure such that the opening area increases as approaching the transparent member from the photoelectric conversion element side. Mounting device for solid-state imaging devices. 5. The opening for increasing the opening area as approaching the transparent member from the photoelectric conversion element side, wherein the area of the opening formed in the wiring substrate of each layer by forming the wiring substrate into a laminated structure is as follows: As approaching the transparent member,
The mounting device for a solid-state imaging device according to claim 4, wherein the opening area is widened.