JPH07226524A - Photoelectric conversion device - Google Patents

Abstract

PURPOSE:To provide a low-cost photoelectric conversion device while a miniaturization, which responds to a sensor size, of the device is realized. CONSTITUTION:A photoelectric conversion device is manufactured into a structure, wherein a sensor chip 11 is soldered on a hard substrate 10, each terminal (each electrode) of said sensor chip 11 is connected to electrodes 10a, which are arranged on the substrate by a wire bonding, said electrodes 10a are electrically connected to a connection part 12 for connecting electrically with an external circuit, a photodiode array is provided on the chip 11 as a photodetector, a glass 13 is arranged on the array as an optical window member in such a way as to cover the array, the peripheral part of the chip 11 is covered with a transparent resin member 14 excluding the upper surface of the glass 13 and moreover, a sensor module is directly secured on the substrate, which is coated with a resin member 15 mixed with a paint for light-shielding, with the resin member.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure of a photoelectric conversion device, and more particularly to a mounting structure for fixing a photoelectric conversion element to a substrate.

[0002]

2. Description of the Related Art Generally, a PSD, a photodiode, a C
A photoelectric conversion element (hereinafter referred to as a sensor) such as a CD line sensor is used. This sensor performs a process of converting a light beam guided by an optical system from light into an electric signal and generates a photometric value and distance measurement data.

In particular, a sensor mounted on a portable image pickup device such as a camera is required to have a small module. Therefore, conventionally, a small package for mounting a sensor chip as shown in FIG. 5 has been developed to reduce the size of the sensor module. As the material of this package, there are ceramic, glass epoxy, clear mold, and the like. Here, ceramic is used.

The package 2 includes a sensor chip 1 and
A lead frame (not shown), a plurality of input / output terminals 4,
The optical window member 3 made of glass or the like provided in a lid state.

With this structure, the lead frame is internally provided with a plurality of electrodes 5 for connection with each terminal (electrode) on the sensor chip 1, and these electrodes are electrically connected to an external circuit. To the outside from the side of the lead frame,
An input / output terminal 4 electrically connected to the electrode 5 is provided. The electrodes on the sensor chip 1 mounted inside the lead frame are electrically connected to the connection electrodes 5 by wire bonding 6.

[0006]

However, when developing the above-mentioned photoelectric conversion element (sensor), it is necessary to develop a package that matches the shape of the sensor chip. However, package development according to individual size sensor is
The cost is high, and as a result, the manufacturing cost is affected.

Therefore, generally, when developing a plurality of sensors, one package is commonly used to reduce the cost. But in this case
Since the size of the lead frame is manufactured according to the large size of the sensor chip, when mounting the small size sensor chip, a wasteful space is created, and the miniaturization is restricted. Therefore, an object of the present invention is to provide an inexpensive photoelectric conversion device while realizing miniaturization according to the sensor size.

[0008]

In order to achieve the above object, the present invention provides a photoelectric conversion element that receives light from a subject and outputs a photoelectric conversion signal, and a substrate that can be electrically connected to the outside. Electrical connection means for electrically connecting the wiring on the substrate and the photoelectric conversion element, a light-transmissive optical window member arranged on the light receiving surface of the photoelectric conversion element, and the photoelectric conversion element Provided is a photoelectric conversion device including a resin member for fixing the optical window member. Further, the resin member is light-transmissive, and a light-shielding member is further provided outside the light-transmissive resin member, and a frame member is arranged around the photoelectric conversion element to provide the photoelectric conversion device.

[0009]

In the photoelectric conversion device having the above-described structure, the photoelectric conversion element of an arbitrary size and the optical window member corresponding to the size are directly fixed to the substrate by the resin member. A light-shielding member is applied on the light-transmissive resin member, and a wall member that secures a predetermined flatness for maintaining the fixed state of the substrate, the photoelectric conversion element, and the optical window member is the photoelectric conversion element. It is located in the periphery.

[0010]

Embodiments of the present invention will now be described in detail with reference to the drawings. FIG. 1 shows a configuration example of a photoelectric conversion device as a first embodiment according to the present invention and will be described.

In this embodiment, a hard substrate 10 made of a glass epoxy material is used. A region for mounting the sensor chip 11 is provided on the hard substrate 10, and a plurality of electrodes 10 connected to respective terminals (electrodes) of the sensor chip 11 by wire bonding are provided on the substrate in the vicinity thereof.
a is arranged. These electrodes 10a are respectively connected to a connecting portion 12 provided at one end of the hard substrate 10 for electrically connecting to an external circuit by a wiring 10b that passes through the inside or the surface of the electrically independent substrate. To be done.

The area in which the sensor chip 11 is mounted is electrically insulated from the specification required for mounting, that is, ensuring flatness for providing adhesion, or at the same potential as the substrate of the sensor chip. To do so.

Although not shown, a photodiode array is formed on the sensor chip 11 as a light receiving portion, and a glass having a low melting point is placed on the sensor chip 11 at a position where light guided optically enters. 13 is arranged as an optical window member.

The glass 13 is attached to the sensor chip 11
In order to fix the upper part, the peripheral part of the sensor chip 11 except the glass 13 is covered with the transparent resin member 14. At the same time, the transparent resin member 14 also serves as a protective member so that the sensor chip 13 is not directly exposed.

With reference to FIG. 2, the manufacturing process of the photoelectric conversion device thus constructed will be described. First, in the step of FIG. 2A, the sensor chip 11 is fixed to a predetermined position of the hard substrate 10 by brazing or the like.

Next, in the step of FIG. 2B, the terminals (electrodes) of the fixed sensor chip 11 and the electrodes 10a of the substrate are electrically connected by wire bonding. Figure 2
In step (c), the sensor chip 11 is covered with a photo-curing transparent resin member 14, and immediately after that, in step (d) of FIG. Then, the resin is irradiated with ultraviolet rays to be cured, and the glass 13 is fixed.

Further, in the step of FIG. 2 (e), in order to prevent the incidence of light from other than the incident surface of the glass 13, a resin member 15 mixed with a light-shielding paint is applied on the transparent resin member 14, and the sensor chip is formed. It covers the periphery of 11 to prevent unwanted light from entering the photodiode array of the sensor.

Through the above steps, the sensor chip is directly mounted on the substrate. In this embodiment, the glass material is used as the optical window member, but a transparent resin member such as an acrylic resin material or a polyolefin resin material can be used as a matter of course. Further, when the light-shielding resin member is used for light shielding, the thickness of the resin member becomes thicker, and the effect of reducing the influence of moisture intrusion can be expected.

Next, FIGS. 3 (a) and 3 (b) show a configuration example of a photoelectric conversion device as a second embodiment according to the present invention, which will be described. In this embodiment, a flexible substrate is used as the substrate. FIG. 3B is a diagram showing a structure of the sensor module shown in FIG. This photoelectric conversion device is manufactured by the same manufacturing process as that of the first embodiment described above.

First, the sensor chip 22 is fixed to a predetermined position of the flexible substrate 21 by brazing or the like. At this time, the flexible substrate 21 is provided with electrode portions exposed at positions corresponding to the respective electrodes of the sensor chip 22, and they are contacted and connected by being fixed. In addition to the electrode connection, the wire connection may be used as in the first embodiment.

Then, a wall-shaped frame member 23 for preventing resin flow is mounted on the flexible substrate 21 so that the sensor chip 22 is fitted therein. The frame member 23 is made of resin such as polycarbonate,
In order to maintain the fixation of the sensor chip 22 and the optical system member 25 by means of No. 4, that is, to prevent the resin from flowing out of the predetermined range to be mounted and the flatness of the receiving portion of the substrate being unable to be secured, This is a measure to prevent the resin from adhering to the electrode parts for mounting components such as chip capacitors and lead wires after mounting on the periphery. The frame member 23 is not limited to a resin member such as polycarbonate, but may be appropriately selected from ceramics or the like.

Then, after the resin member 24 is filled around the sensor chip 22, a transparent member 25 such as glass is placed on the sensor chip 22 so as to be placed thereon. Then, the transparent member 25 is fixed by irradiating the resin member 24 with ultraviolet rays to cure the resin member 24.

In this embodiment, the sensor chip 22 is fixed and wired, and then the frame member 23 is fixed. However, if connection work is possible, the frame member 23 is first fixed and then the sensor chip 22 is mounted. You may.

In this embodiment, a test terminal row 27 for testing the sensor module 26 is arranged on the flexible substrate 21. In the above-described first embodiment, since it is premised that the terminal for performing the board test is also used as the terminal for external connection, the test terminal is not provided specially.

However, in the second embodiment, the test terminal row 27 is provided so as to correspond to the position of the test pin of the tester (tester) even when the flexible substrate 21 and the sensor chip 22 have a special shape. ing. Even if the size of the sensor chip and the arrangement of the input / output terminals are different, the check can be made common by the test terminal row 27 having a common arrangement, which improves the development efficiency.

Next, FIG. 4 shows an example of mounting a photoelectric conversion device as a third embodiment according to the present invention. This photoelectric conversion device is an example in which various optical components are mounted in close contact with each other on a plane (upper surface) on the incident side of the sensor chip directly or via glass.

The photoelectric conversion device shown in FIG. 4A has a glass 31 having a uniform thickness, which is applied on the sensor chip 30.
If the surface m and the surface n on the light emitting side of the optical member 32 are parallel flat surfaces, the sensor chip 30 and the optical member 32 can be positioned relatively easily.

Therefore, the sensor chip 30 and the optical member 32
It can be mounted by filling a photo-curing resin member 33 between the two and, and adhering both members closely. The optical member 32 is an example of a re-imaging lens of a so-called image phase difference type optical system that obtains a distance from a lateral shift amount of two images.

As described above, the optical member 32 is placed directly on the upper surface of the sensor chip 30, or if the flatness (parallelism) with the upper surface of the sensor chip can be secured, a glass or the like having a uniform thickness is interposed. However, any specifications may be used. For example, the optical low-pass filter 35 shown in FIG. 4 (b), the infrared cut filter shown in FIG. 4 (c), the optical multilayer film 36 such as anti-reflection coating glass, and the light splitting prism shown in FIG. 4 (d). A member such as 37 can be used according to the purpose.

The optical member may have any shape as long as the surface on the sensor side can ensure the flatness at the time of mounting. In that case, the glass is not attached to the surface as in the above embodiment, but the surface shown in FIG. An optical member may be directly attached to the upper surface of the sensor chip in the type of b) like the diffraction grating 38 of the low-pass filter of FIG.

Further, at the time of mounting, it is necessary to align the light receiving portion on the sensor chip with the optical member, and a portion of the optical member on the sensor where the received light beam does not pass is used to perform the alignment as shown in FIG. alignment mark 3 as shown in f)
9 is attached to a predetermined position of the sensor chip 30, and the diffraction grating 38
It is also possible to align with the end of.

Although each of the embodiments has been described on the premise that the sensor is a photodiode array, it is clear from the object of the present invention that the sensor is a divided photodiode for photometry, a PSD, a multi-line sensor or an area. It may be an optical sensor of the following type such as a sensor.

Although the transparent resin having a light transmitting property is used in the embodiments of the present invention, an opaque resin may be used. In this case, a small amount of opaque resin enters between the window member and the sensor chip, and if the amount of the opaque resin is small, the amount of transmitted light will decrease slightly, but the amount of decrease will be small, so that it can be put to practical use.

As described above, in the photoelectric conversion device of this embodiment, since the sensor chip (sensor module) can be directly mounted on the substrate, the size around the sensor can be reduced and the cost for mounting can be kept low. Therefore, the development cost of the sensor can be efficiently performed, and the small product can be easily supported.

According to the above embodiment of the present invention, the following configuration can be obtained. (1) A photoelectric conversion element that receives light and outputs a photoelectric conversion signal, a substrate that can be electrically connected to the outside, and an electrical connection that electrically connects the wiring on the substrate and the photoelectric conversion element Means, an optical window member arranged on the light receiving surface of the photoelectric conversion element, and a resin member for fixing the photoelectric conversion element and the optical window member to each other. It is a conversion device.

(2) The photoelectric conversion element is any one of a solid-state image pickup element, a semiconductor position detecting element, a photodiode, a phototransistor, a CCD line sensor, a MOS line sensor, a CCD image sensor or a MOS image sensor. ) Is a photoelectric conversion device described in.

(3) In the photoelectric conversion device described in (1) or (2), the substrate is a flexible substrate or a hard substrate. (4) In the photoelectric conversion device described in (1) to (3), the resin member is light transmissive.

(5) In the photoelectric conversion device described in (4), a light blocking member is further provided outside the light transmissive resin member. (6) In the photoelectric conversion device described in (1) to (4) above, the optical member is disposed in close contact with the light incident surface side of the optical window member via a light-transmissive resin. is there.

(7) In the photoelectric conversion device described in any one of (1) to (6) above, a resin having a light shielding property is arranged in a place other than the optical window member. (8) The optical window member is made of glass or a light-transmissive resin, and is optically a member having transmission or wavelength selectivity, wavefront splitting property, or antireflection film. The photoelectric conversion device according to any one of (1) to (7).

(9) In the photoelectric conversion device described in any one of (1) to (8), a wall-shaped frame member is arranged around the photoelectric conversion element. (10) The resin member is fixed, including the electrical connecting means, (1) to (8).
The photoelectric conversion device described in 1.

(11) A photoelectric conversion sensor chip which receives light and outputs a photoelectric conversion signal, a substrate for holding the photoelectric conversion sensor chip, and an optical element arranged on the light receiving surface of the photoelectric conversion sensor chip. And a resin member for fixing the photoelectric conversion sensor chip and the optical window member to each other. Further, the present invention is not limited to the above-described embodiment, and needless to say, various modifications and applications can be made without departing from the scope of the invention.

[0042]

As described above in detail, according to the present invention, sensor modules (sensor chips) of various sizes can be directly mounted on a substrate without using a package, and the size around the sensor for mounting can be reduced. It is reduced and the cost for implementation is reduced. In addition, the development of the sensor can be done efficiently,
A photoelectric conversion device that can be easily mounted on a small product can be provided.

[Brief description of drawings]

FIG. 1 is a diagram showing a configuration example of a photoelectric conversion device as a first embodiment according to the present invention.

FIG. 2 is a diagram for explaining a manufacturing process of the photoelectric conversion device shown in FIG.

FIG. 3 is a diagram showing a configuration example of a photoelectric conversion device as a second embodiment according to the present invention.

FIG. 4 is a diagram showing a configuration example of a photoelectric conversion device as a third embodiment according to the present invention.

FIG. 5 is a diagram showing a configuration example of a conventional photoelectric conversion device.

[Explanation of symbols]

1, 11, 22 ... Sensor chip, 2 ... Lead frame,
3 ... Optical window member, 4 ... Input / output terminal, 5, 10a ... Electrode, 10 ... Hard substrate, 10b ... Wiring, 12 ... Connection part, 1
3 ... Glass, 14 ... Transparent resin member, 15, 24 ... Resin member, 21 ... Flexible substrate, 23 ... Frame member, 25 ... Optical system member.

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification number Office reference number FI technical display location H01L 23/28 D 8617-4M 27/14 // H01L 31/10 H01L 31/10 A

Claims (3)

[Claims] 1. A photoelectric conversion element that receives light from a subject and outputs a photoelectric conversion signal, a substrate that can be electrically connected to the outside, a wiring on the substrate, and the photoelectric conversion element are electrically connected. Electrical connection means for connection, a light-transmissive optical window member arranged on the light receiving surface of the photoelectric conversion element, a resin member for fixing the photoelectric conversion element and the optical window member, A photoelectric conversion device comprising: 2. The photoelectric conversion device according to claim 1, wherein the resin member is light-transmissive, and a light-shielding member is further provided outside the light-transmissive resin member. 3. The photoelectric conversion device according to claim 1, wherein a frame member is arranged around the photoelectric conversion element.