JPS5869962U - Seam-sealed semiconductor device for solid-state imaging - Google Patents
Seam-sealed semiconductor device for solid-state imagingInfo
- Publication number
- JPS5869962U JPS5869962U JP16615381U JP16615381U JPS5869962U JP S5869962 U JPS5869962 U JP S5869962U JP 16615381 U JP16615381 U JP 16615381U JP 16615381 U JP16615381 U JP 16615381U JP S5869962 U JPS5869962 U JP S5869962U
- Authority
- JP
- Japan
- Prior art keywords
- solid
- state imaging
- seam
- semiconductor device
- sealed semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Solid State Image Pick-Up Elements (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は、従来の固体撮像用シーム封止半導体装置の一
例を示す要部断面図、第２図は同装置のシーム封止時の
一部拡大断面図、第３図は本考案の一実施例における固
体撮像用シーム封止半導体装置の要部断面図、第４図は
本考案の他の実施例の一部断面図、第５図ａ、 ｂ、
ｃはさらに他の実施例の断面図である。
１・・・・・・容器、２・・・・・・凹部、３・・・・
・・固体撮像素子、４・・・・・・接着剤、５・・・・
・・ワイヤ、６・・・・・・リード端子、７・・・・・
・シールリング、８・・・・・・キャップ、８′・・・
・・・フランジ部、９−−−−−−窓、１０−−−−−
−ガラス、１１・・・・・・低融点ガラス、１２・・・
・・・シーム封止用の電極。
Ｃ釦 −
ｌ〃
１FIG. 1 is a cross-sectional view of essential parts of an example of a conventional seam-sealed semiconductor device for solid-state imaging, FIG. 2 is a partially enlarged cross-sectional view of the same device when seam-sealed, and FIG. 3 is a cross-sectional view of an example of the present invention. FIG. 4 is a cross-sectional view of a main part of a seam-sealed semiconductor device for solid-state imaging according to an embodiment of the present invention; FIG.
c is a sectional view of still another embodiment. 1... Container, 2... Concavity, 3...
...Solid-state image sensor, 4...Adhesive, 5...
...Wire, 6...Lead terminal, 7...
・Seal ring, 8...Cap, 8'...
・・・Flange part, 9------Window, 10------
-Glass, 11...Low melting point glass, 12...
... Electrode for seam sealing. C button - l〃 1
Claims (1)
された固体撮像素子と、上記容器の凹部側の表面に設け
られたシールリングと、このシールリングの内周縁に嵌
合する凸部が形成されたキャップと、このキャップの凸
部に形成された窓を覆うガラスとを有し、上記キャップ
の凸部を上記シールリングの内周縁に嵌合させ、上記キ
ャップのフランジ部を上記シールリングの表面に固着し
てなる固体撮像用シーム封止半導体装置。A container in which a recess is formed, a solid-state imaging device fixed to the bottom surface of the recess of the container, a seal ring provided on the surface of the container on the recess side, and a projection that fits into the inner peripheral edge of the seal ring. and a glass that covers a window formed in a convex portion of the cap, the convex portion of the cap is fitted to the inner peripheral edge of the seal ring, and the flange portion of the cap is connected to the seal ring. A seam-sealed semiconductor device for solid-state imaging that is fixed to the surface of a ring.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16615381U JPS5869962U (en) | 1981-11-06 | 1981-11-06 | Seam-sealed semiconductor device for solid-state imaging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16615381U JPS5869962U (en) | 1981-11-06 | 1981-11-06 | Seam-sealed semiconductor device for solid-state imaging |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5869962U true JPS5869962U (en) | 1983-05-12 |
Family
ID=29958319
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16615381U Pending JPS5869962U (en) | 1981-11-06 | 1981-11-06 | Seam-sealed semiconductor device for solid-state imaging |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5869962U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015031903A (en) * | 2013-08-06 | 2015-02-16 | セイコーエプソン株式会社 | Optical device, optical module, electronic equipment, and optical chassis |
| JP2015195330A (en) * | 2013-08-26 | 2015-11-05 | 京セラ株式会社 | Cover member for optical device and optical device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56116649A (en) * | 1980-02-19 | 1981-09-12 | Matsushita Electric Ind Co Ltd | Manufacturing of semiconductor device |
-
1981
- 1981-11-06 JP JP16615381U patent/JPS5869962U/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56116649A (en) * | 1980-02-19 | 1981-09-12 | Matsushita Electric Ind Co Ltd | Manufacturing of semiconductor device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015031903A (en) * | 2013-08-06 | 2015-02-16 | セイコーエプソン株式会社 | Optical device, optical module, electronic equipment, and optical chassis |
| JP2015195330A (en) * | 2013-08-26 | 2015-11-05 | 京セラ株式会社 | Cover member for optical device and optical device |
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