JPS58105143U - Seam-sealed semiconductor device for solid-state imaging - Google Patents
Seam-sealed semiconductor device for solid-state imagingInfo
- Publication number
- JPS58105143U JPS58105143U JP318682U JP318682U JPS58105143U JP S58105143 U JPS58105143 U JP S58105143U JP 318682 U JP318682 U JP 318682U JP 318682 U JP318682 U JP 318682U JP S58105143 U JPS58105143 U JP S58105143U
- Authority
- JP
- Japan
- Prior art keywords
- seam
- solid
- semiconductor device
- sealed semiconductor
- state imaging
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Solid State Image Pick-Up Elements (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は、従来の固体撮像用シーム封止半導体装置の一
例を示す要部断面図、第２図は同装置のシーム封止時の
一部拡大断面図、第３図は本考案の一実施例における固
体撮像用シーム封止半導体装置の要部断面図、第４図は
同装置の一部拡大断面図である。
１・・・・・・容器、２・・・・・・凹部、３・・・・
・・固体撮像素子、４・・・・・・接着剤、５・・・・
・・ワイヤ、６・・・・・・リード端子、７・・・・・
・シールリング、８・・・・・・キャップ、８′・・・
・・・フランジ部、９−−−−−−窓、１０−−−−−
−ガラス、１１・・・・・・低融点ガラス、１２・・・
・・・シーム封止用の電極。
＼第３図
−第４図FIG. 1 is a cross-sectional view of essential parts of an example of a conventional seam-sealed semiconductor device for solid-state imaging, FIG. 2 is a partially enlarged cross-sectional view of the same device when seam-sealed, and FIG. 3 is a cross-sectional view of an example of the present invention. FIG. 4 is a cross-sectional view of a main part of a seam-sealed semiconductor device for solid-state imaging in an embodiment, and FIG. 4 is a partially enlarged cross-sectional view of the same device. 1... Container, 2... Concavity, 3...
...Solid-state image sensor, 4...Adhesive, 5...
...Wire, 6...Lead terminal, 7...
・Seal ring, 8...Cap, 8'...
・・・Flange part, 9------Window, 10------
-Glass, 11...Low melting point glass, 12...
... Electrode for seam sealing. ＼Figure 3-Figure 4
Claims (1)
された固体撮像素子と、上記容器の凹部側の表面に設け
られたシールリングと、窓を有するキャップと、このキ
ャップの片面に上記窓を覆うように固定されたガラスと
を有し、上記キャップに固定されたガラスを上記シール
リングの内周縁に嵌合させ、上記キャップのフランジ部
を上記シールリングの表面に固着してなる固体撮像用シ
ーム封止半導体装置。a container in which a recess is formed; a solid-state image sensor fixed to the bottom surface of the recess of the container; a seal ring provided on the surface of the container on the recess side; a cap having a window; a glass fixed to cover a window; the glass fixed to the cap is fitted to the inner peripheral edge of the seal ring; and the flange of the cap is fixed to the surface of the seal ring. Seam-sealed semiconductor device for imaging.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP318682U JPS58105143U (en) | 1982-01-12 | 1982-01-12 | Seam-sealed semiconductor device for solid-state imaging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP318682U JPS58105143U (en) | 1982-01-12 | 1982-01-12 | Seam-sealed semiconductor device for solid-state imaging |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58105143U true JPS58105143U (en) | 1983-07-18 |
Family
ID=30016135
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP318682U Pending JPS58105143U (en) | 1982-01-12 | 1982-01-12 | Seam-sealed semiconductor device for solid-state imaging |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58105143U (en) |
-
1982
- 1982-01-12 JP JP318682U patent/JPS58105143U/en active Pending
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