JPS59173342U - Semiconductor element storage container - Google Patents

Semiconductor element storage container

Info

Publication number
JPS59173342U
JPS59173342U JP1983067884U JP6788483U JPS59173342U JP S59173342 U JPS59173342 U JP S59173342U JP 1983067884 U JP1983067884 U JP 1983067884U JP 6788483 U JP6788483 U JP 6788483U JP S59173342 U JPS59173342 U JP S59173342U
Authority
JP
Japan
Prior art keywords
storage container
semiconductor element
element storage
protrusion
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1983067884U
Other languages
Japanese (ja)
Other versions
JPS6334275Y2 (en
Inventor
安田　美子
Original Assignee
松下電器産業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 松下電器産業株式会社 filed Critical 松下電器産業株式会社
Priority to JP1983067884U priority Critical patent/JPS59173342U/en
Publication of JPS59173342U publication Critical patent/JPS59173342U/en
Application granted granted Critical
Publication of JPS6334275Y2 publication Critical patent/JPS6334275Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Landscapes

  • Casings For Electric Apparatus (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図はハーメチック封止に用いられる半導体収納容器
の分解斜視図、第２図ａは従来の封止されたパッケージ
の外観図、−第２図すはａのＡ−Ａ′−線断面図、第３
図は本考案の一実施例のローザイの位置合わせ突起部を
設けた半導体収納容器の斜視図、第４図は第３図の容器
に半田額縁を設置した斜視図、第５図は第４図のＢ−Ｂ
’に対応する封止状態の断面図である。 １・・・・・・セラミックパッケージ、３・・・・・・
Ａｕ　−３ｎ半田額縁、４・・・・・・メタルキャップ
、７・・・・・・突起部。 第５図 ６４５　７ ＼　／／／／Figure 1 is an exploded perspective view of a semiconductor storage container used for hermetic sealing, Figure 2 a is an external view of a conventional sealed package, and Figure 2 is a sectional view taken along line A-A' in Figure 2 a. , 3rd
The figure is a perspective view of a semiconductor storage container provided with a Rosai positioning protrusion according to an embodiment of the present invention, FIG. 4 is a perspective view of the container shown in FIG. 3 with a solder frame installed, and FIG. B-B
FIG. 2 is a sectional view of a sealed state corresponding to FIG. 1...Ceramic package, 3...
Au-3n solder picture frame, 4...Metal cap, 7...Protrusion. Fig. 5 645 7 \ ////

Claims (2)

【実用新案登録請求の範囲】[Scope of utility model registration request] （１）封止用ローザイを載置するシールリングの上部に
、前記ローザイの位置決めを行なうための突起部を設け
たことを設けたことを特徴とする半導体素子収納容器。(1) A semiconductor device storage container, characterized in that a protrusion for positioning the sealing ring is provided on the upper part of the seal ring on which the sealing ring is placed. （２）突起部力釦−ザイと同材料であることを特徴とす
る実用新案登録請求の範囲第１項記載の半導体素子収納
容器。(2) The semiconductor device storage container according to claim 1, wherein the protrusion is made of the same material as the power button.
JP1983067884U 1983-05-06 1983-05-06 Semiconductor element storage container Granted JPS59173342U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983067884U JPS59173342U (en) 1983-05-06 1983-05-06 Semiconductor element storage container

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983067884U JPS59173342U (en) 1983-05-06 1983-05-06 Semiconductor element storage container

Publications (2)

Publication Number Publication Date
JPS59173342U true JPS59173342U (en) 1984-11-19
JPS6334275Y2 JPS6334275Y2 (en) 1988-09-12

Family

ID=30198068

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983067884U Granted JPS59173342U (en) 1983-05-06 1983-05-06 Semiconductor element storage container

Country Status (1)

Country Link
JP (1) JPS59173342U (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5529589U (en) * 1978-08-18 1980-02-26
JPS55164847U (en) * 1979-05-16 1980-11-27

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5529589B2 (en) * 1972-05-30 1980-08-05

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5529589U (en) * 1978-08-18 1980-02-26
JPS55164847U (en) * 1979-05-16 1980-11-27

Also Published As

Publication number Publication date
JPS6334275Y2 (en) 1988-09-12

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