JP2015031903A - Optical device, optical module, electronic equipment, and optical chassis - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an optical device, an optical module, electronic equipment and an optical chassis, in which airtightness of an inner space can be maintained when seam welding is carried out.SOLUTION: An optical filter device 600 includes: a base 620 having a cylindrical side wall 622; a metal ring 640 that is cylindrical and coaxial with the side wall 622, has a first end face 641 joined to the side wall 622 and a second end face 642 on an opposite side to the first end face 641; a lid 630 having a second opening 633 and joined to the second end face 642; a second glass member 650 joined to the lid 630 and closing the second opening 633; and a wavelength variable interference filter 5 housed in a housing space enclosed by the base 620, the metal ring 640 and the lid 630. The second glass member 650 is disposed on a side closer to the second opening 633 than a virtual straight line L1 connecting an outer peripheral edge 642A on the second end face 642 of the metal ring 640 and an outer peripheral edge 632 of an upper face 631 of the lid 630.

Description

  The present invention relates to an optical device, an optical module, an electronic apparatus, and an optical housing.

Conventionally, an optical device in which an optical element such as an interference filter or a mirror device is housed in a hermetically sealed casing is known (for example, see Patent Document 1).
In this electronic device package including a base and a lid, a large current is applied to a joint portion between the base and the lid while tracing a welding electrode roller for seam welding. (Seam bonding) is performed.

JP 2005-93675 A

By the way, in the case where an optical element such as an interference filter is accommodated in a housing constituted by a base and a lid, an opening for allowing light to enter or exit from the lid or the base is formed, and a translucent member that closes the opening (for example, Glass member) must be joined.
When joining such a base and a lid by seam welding, when the welding electrode roller contacts the translucent member, an electric current flows between the translucent member and the lid, and a crack or the like is generated at the joining portion where the translucent member and the lid are joined. May occur. In this case, there exists a subject that the airtightness of a translucent member and a lid will fall.

  An object of the present invention is to provide an optical device, an optical module, an electronic apparatus, and an optical housing that can maintain the airtightness of the internal space when seam welding is performed.

  The optical device of the present invention includes a base having a recess surrounded by a side wall, a metal frame bonded to an end surface on the side wall, and having a first surface opposite to the bonding surface with the side wall, A lid that is joined to the metal frame and has a second surface opposite to the joint surface with the metal frame, and an opening, a translucent member that is joined to the lid and closes the opening, and the base An optical element placed on the concave portion of the base, and the translucent member has an outer peripheral end on the first surface of the metal frame in a cross-sectional view along the depth direction of the concave portion of the base, It does not intersect with a virtual straight line connecting the outer peripheral edge of the second surface of the lid.

In the present invention, the translucent member does not intersect the virtual straight line connecting the outer peripheral end of the first surface of the metal frame and the outer peripheral end of the second surface of the lid in a cross-sectional view. That is, the translucent member is provided on the opening side (inside) of the lid from the virtual straight line.
For this reason, when seam-bonding the metal frame and the lid, when the electrode roller for seam bonding is brought into contact with the outer peripheral end of the first surface of the metal frame and the outer peripheral end of the second surface of the lid, The electrode roller does not contact the translucent member. For this reason, an electric current is not sent between a translucent member and a lid, a deformation | transformation of a lid or a translucent member, a crack in the junction part of a lid and a translucent member can be prevented, and the inside of accommodation space is maintained highly airtight. Is possible.

In the optical device of the present invention, the minimum distance dimension from the outer peripheral end of the lid to the outer peripheral end of the translucent member in a plan view viewed from the depth direction of the recess of the base is 1.5 mm or more. Is preferred.
When seam bonding is performed, a large current flows between the lid and the metal frame, so that the temperature at the bonding site of the lid and the metal frame locally increases. Here, when the minimum distance dimension from the outer peripheral edge of the second surface of the lid to the outer peripheral edge of the translucent member is less than 1.5 mm, heat at the time of seam bonding is transmitted to the joint portion of the translucent member and the lid. End up. Since the translucent member and the lid are joined by a joining member different from the translucent member and the lid, if the heat is transferred as described above, a crack or the like may occur due to a difference in thermal expansion coefficient. There is a possibility that the bonding strength and airtightness of the translucent member and the lid may be lowered. On the other hand, in the present invention, with the configuration as described above, heat at the time of seam bonding is not easily transmitted to the bonding portion of the light-transmitting member and the lid, and a decrease in bonding strength and airtightness can be suppressed.

In the optical device of the present invention, the lid is a flat plate having a uniform thickness dimension, and the thickness dimension of the lid is preferably 0.15 mm or more.
When the thickness dimension of the lid is less than 0.15 mm, bending may occur due to stress at the time of seam joining of the lid and the metal frame. In this case, the joint portion of the light transmitting member and the lid is broken or cracked by the stress due to the bending deformation, and the joint strength and the airtightness are lowered. On the other hand, in the present invention, due to the above-described configuration, the lid is hardly bent even when a stress is applied during seam bonding, and the breakage of the light-transmitting member and the bonded portion of the lid due to the bending can be suppressed.

In the optical device according to the aspect of the invention, the lid includes a lid joint portion that is joined to the metal frame, and a lid main body portion that is provided closer to the opening than the lid joint portion and has a thickness dimension larger than that of the lid joint portion. And are preferably provided.
When joining by seam joining, it joins by making an electric current flow locally between a lid junction part and a metal frame, and raising temperature locally. At this time, in order to flow a large current efficiently, it is necessary to reduce the thickness dimension at the lid joint. However, when the lid has a uniform flat plate shape, as described above, the lid may be bent due to stress during seam welding.
On the other hand, in the present invention, the lid has a lid main body portion having a thickness dimension larger than that of the lid joint portion inside the lid joint portion. For this reason, even when the thickness dimension of the lid joint portion is made as thin as possible, the bending of the lid can be suppressed, and the joint strength of the seam joint can be improved by reducing the thickness dimension of the lid joint portion. .

In the optical device according to the aspect of the invention, it is preferable that the lid main body portion does not intersect the virtual straight line.
In such a configuration, the electrode roller does not contact the lid main body during seam bonding. Therefore, it is possible to prevent heat from being transmitted from the lid main body portion to the translucent member, and it is possible to suppress inconvenience that the bonded portion of the lid and the translucent member is destroyed by heat.

In the optical device of the present invention, it is preferable that a thickness dimension of the lid main body portion is 0.15 mm or more.
In the present invention, by making the thickness of the lid main body portion 0.15 mm or more, the bending of the lid can be suppressed as in the above-described invention. Moreover, in a lid junction part, thickness dimension can be set to about 0.1 mm, for example, and the joint strength and airtightness of a lid and a metal frame can fully be ensured.

In the optical device according to the aspect of the invention, it is preferable that the optical element is a Fabry-Perot etalon element including a pair of reflective films facing each other.
In the present invention, a Fabry-Perot etalon element as an optical element is accommodated in an accommodation space constituted by a lid and a base. In the Fabry-Perot etalon element, the reflection film may be deteriorated by heat or the like. On the other hand, in this invention, as mentioned above, it becomes the structure where the heat | fever at the time of seam welding is not transmitted easily, and can suppress the performance fall of a Fabry-Perot etalon element.
In addition, when using an etalon element that is provided with a driving means such as an electrostatic actuator and can change the gap size between the reflecting films, the inside of the housing space is maintained under a reduced pressure such as a vacuum to increase the response speed during driving. It is preferable to speed up. If it is this invention, since a high airtightness can be maintained by the structure as mentioned above, the fall of a response speed can be suppressed.

The optical module according to the present invention includes a base having a recess surrounded by a side wall, a metal frame bonded to an end surface on the side wall, and having a first surface opposite to the bonding surface with the side wall, the metal A lid that is bonded to the frame and is opposite to the bonding surface with the metal frame; and a lid having an opening; a translucent member that is bonded to the lid and closes the opening; and a recess in the base An optical device having a mounted Fabry-Perot etalon element; and a light receiving unit that receives light emitted from the optical device, wherein the translucent member extends along a depth direction of the concave portion of the base In a cross-sectional view, the metal frame does not intersect with an imaginary straight line connecting the outer peripheral end of the first surface of the metal frame and the outer peripheral end of the lid of the second surface.
In the present invention, as in the above-described invention, heat is hardly transmitted to the Fabry-Perot etalon element in the optical device, and deterioration of the reflective film can be suppressed. Therefore, in the optical module, light having a desired wavelength can be received by the light receiving unit with high accuracy.

The electronic device according to the present invention includes a base having a recess surrounded by a side wall, a metal frame bonded to an end surface on the side wall, and having a first surface opposite to the bonding surface with the side wall, the metal A lid that is bonded to the frame and is opposite to the bonding surface with the metal frame; and a lid having an opening; a translucent member that is bonded to the lid and closes the opening; and a recess in the base An optical device having a mounted Fabry-Perot etalon element; and a control unit that controls the optical device, wherein the translucent member is a cross-sectional view along the depth direction of the recess of the base, It does not intersect with an imaginary straight line connecting the outer peripheral end of the first surface of the metal frame and the outer peripheral end of the second surface of the lid.
In the present invention, similarly to the above-described invention, heat is not easily transmitted to the Fabry-Perot etalon element in the optical device, and deterioration of the reflective film can be suppressed. Therefore, even in an electronic apparatus, various processes such as a spectroscopic measurement process can be performed with high accuracy based on the light output from the optical device.

An optical housing according to the present invention includes a base having a recess surrounded by a side wall, a metal frame bonded to an end surface on the side wall, and having a first surface opposite to the bonding surface with the side wall. A lid that is bonded to the metal frame and that has a second surface opposite to the bonding surface with the metal frame, and an opening; and a light-transmissive member that is bonded to the lid and closes the opening. The translucent member connects the outer peripheral end of the first surface of the metal frame and the outer peripheral end of the second surface of the lid in a cross-sectional view along the depth direction of the concave portion of the base. It does not intersect with a virtual straight line.
In the present invention, similarly to the above-described invention, no current is passed between the light-transmitting member and the lid during seam bonding, and deformation of the lid and the light-transmitting member and cracks at the bonding portion of the lid and the light-transmitting member are prevented. It is possible to maintain the inside of the housing space constituted by the lid and the base in a highly airtight manner.

The top view which shows the outline of the optical filter device of 1st embodiment. Sectional drawing of the optical filter device of 1st embodiment. The top view of the wavelength variable interference filter of 1st embodiment. Sectional drawing of the wavelength variable interference filter of 1st embodiment. The flowchart which shows the manufacturing process of the optical filter device of 1st embodiment. The figure which shows the seam joining in the housing | casing joining process of 1st embodiment. Sectional drawing of the optical filter device of 2nd embodiment. The figure which shows the seam joining in the housing | casing joining process of 2nd embodiment. The block diagram which shows schematic structure of the color measuring apparatus of 3rd embodiment. The figure which shows schematic structure of the gas detection apparatus which is an example of an electronic device. The block diagram which shows the structure of the control system of the gas detection apparatus of FIG. The figure which shows schematic structure of the food analyzer which is an example of an electronic device. The figure which shows schematic structure of the spectroscopic camera which is an example of an electronic device.

[First embodiment]
Hereinafter, a first embodiment according to the present invention will be described with reference to the drawings.
[Configuration of optical filter device]
FIG. 1 is a plan view showing a schematic configuration of an optical filter device 600, which is an embodiment of the optical device of the present invention. FIG. 2 is a cross-sectional view of the optical filter device 600.
The optical filter device 600 is a device that extracts and emits light having a predetermined target wavelength from incident light to be inspected, and is housed in a housing 610 (the optical housing of the present invention) and the housing 610. A wavelength variable interference filter 5 is provided. Such an optical filter device 600 can be incorporated into an optical module such as a colorimetric sensor, or an electronic device such as a colorimetric device or a gas analyzer. Note that the configuration of an optical module or electronic device including the optical filter device 600 will be described in detail later.

[Configuration of wavelength tunable interference filter]
The wavelength variable interference filter 5 is an example of the optical element of the present invention.
3 is a plan view showing a schematic configuration of the variable wavelength interference filter 5 housed in the housing 610. FIG. 4 is a schematic configuration of the variable wavelength interference filter 5 taken along line IV-IV in FIG. FIG.
As shown in FIG. 3, the variable wavelength interference filter 5 includes a fixed substrate 51 and a movable substrate 52. The fixed substrate 51 and the movable substrate 52 are each formed of, for example, various glasses such as soda glass, crystalline glass, quartz glass, lead glass, potassium glass, borosilicate glass, and alkali-free glass, crystal, and the like. . Then, as shown in FIG. 4, the fixed substrate 51 and the movable substrate 52 are integrally formed by being bonded by the bonding film 53 (the first bonding film 531 and the second bonding film 532). . Specifically, the first bonding portion 513 of the fixed substrate 51 and the second bonding portion 523 of the movable substrate 52 are bonded by a bonding film 53 made of, for example, a plasma polymerized film mainly containing siloxane. .
In the following description, the wavelength tunable interference filter 5 was seen from a plan view seen from the thickness direction of the fixed substrate 51 or the movable substrate 52, that is, from the stacking direction of the fixed substrate 51, the bonding film 53, and the movable substrate 52. The plan view is referred to as a filter plan view.

As shown in FIG. 4, the fixed substrate 51 is provided with a fixed reflective film 54 constituting one of the pair of reflective films of the present invention. The movable substrate 52 is provided with a movable reflective film 55 that constitutes the other of the pair of reflective films of the present invention. The fixed reflection film 54 and the movable reflection film 55 are disposed to face each other via the inter-reflection film gap G1.
The wavelength variable interference filter 5 is provided with an electrostatic actuator 56 that is used to adjust the distance (gap size) of the gap G1 between the reflection films. The electrostatic actuator 56 includes a fixed electrode 561 provided on the fixed substrate 51 and a movable electrode 562 provided on the movable substrate 52, and each electrode 561 and 562 are opposed to each other. These fixed electrode 561 and movable electrode 562 are opposed to each other through an interelectrode gap. Here, the electrodes 561 and 562 may be provided directly on the substrate surfaces of the fixed substrate 51 and the movable substrate 52, respectively, or may be provided via other film members.
In the present embodiment, the configuration in which the gap G1 between the reflection films is formed smaller than the gap between the electrodes is exemplified. However, depending on the wavelength range transmitted by the wavelength variable interference filter 5, for example, the gap G1 between the reflection films is formed between the electrodes. You may form larger than a gap.
Further, in the filter plan view, the side C <b> 1-C <b> 2 of the fixed substrate 51 protrudes outward from the side C <b> 1 ′ -C <b> 2 ′ of the movable substrate 52, thereby constituting the fixed-side electrical component 514. Further, the side C3′-C4 ′ of the movable substrate 52 protrudes outward from the side C3-C4 of the fixed substrate 51, and constitutes the movable-side electrical component 524.

(Configuration of fixed substrate)
In the fixed substrate 51, an electrode arrangement groove 511 and a reflection film installation part 512 are formed by etching. The fixed substrate 51 is formed to have a thickness larger than that of the movable substrate 52, and the fixed substrate is caused by electrostatic attraction when a voltage is applied between the fixed electrode 561 and the movable electrode 562 or internal stress of the fixed electrode 561. There is no 51 deflection.

The electrode arrangement groove 511 is formed in an annular shape centering on the filter center point O of the fixed substrate 51 in the filter plan view. The reflection film installation part 512 is formed so as to protrude from the center part of the electrode arrangement groove 511 toward the movable substrate 52 in the plan view. The groove bottom surface of the electrode arrangement groove 511 is an electrode installation surface 511A on which the fixed electrode 561 is arranged. In addition, the protruding front end surface of the reflection film installation portion 512 is a reflection film installation surface 512A.
Further, in the fixed substrate 51, connection electrode grooves 511B are provided in a region from the electrode arrangement groove 511 to the fixed-side electrical component 514 and a region from the electrode arrangement groove 511 to the side C3-C4. In the present embodiment, the electrode installation surface 511A, the bottom of the connection electrode groove 511B, and the surface of the fixed-side electrical component 514 are on the same plane.

A fixed electrode 561 constituting the electrostatic actuator 56 is provided on the electrode installation surface 511A. More specifically, the fixed electrode 561 is provided in a region of the electrode installation surface 511 </ b> A that faces a movable electrode 562 of the movable portion 521 described later. In addition, an insulating film for ensuring insulation between the fixed electrode 561 and the movable electrode 562 may be stacked over the fixed electrode 561.
The fixed substrate 51 is provided with a fixed connection electrode 563 connected to the outer peripheral edge of the fixed electrode 561. The fixed connection electrode 563 is provided across the connection electrode groove 511 </ b> B from the electrode arrangement groove 511 toward the fixed-side electrical component 514 and the fixed-side electrical component 514. The fixed connection electrode 563 forms a fixed electrode pad 563P that is electrically connected to an inner terminal portion described later in the fixed-side electrical component 514.
In the present embodiment, a configuration in which one fixed electrode 561 is provided on the electrode installation surface 511A is shown. For example, a configuration in which two concentric circles centering on the filter center point O are provided (double electrode configuration). ) Etc. In addition, a configuration in which a transparent electrode is provided on the fixed reflection film 54, or a conductive fixed reflection film 54 may be used to form a connection electrode from the fixed reflection film 54 to the fixed-side electrical component 514. The electrode 561 may have a structure in which a part thereof is cut off in accordance with the position of the connection electrode.

As described above, the reflective film installation portion 512 is formed in a substantially cylindrical shape that is coaxial with the electrode arrangement groove 511 and has a smaller diameter than the electrode arrangement groove 511, and is formed on the movable substrate 52 of the reflection film installation portion 512. An opposing reflection film installation surface 512A is provided.
As shown in FIG. 4, a fixed reflection film 54 is installed in the reflection film installation portion 512. As the fixed reflective film 54, for example, a metal film such as Ag or an alloy film such as an Ag alloy can be used. For example, a dielectric multilayer film in which the high refractive layer is TiO ₂ and the low refractive layer is SiO ₂ may be used. Further, a reflective film in which a metal film (or alloy film) is laminated on a dielectric multilayer film, a reflective film in which a dielectric multilayer film is laminated on a metal film (or alloy film), a single refractive layer (TiO ₂ , SiO ₂₎ and a metal film (or alloy film) and the like may be used reflective film formed by laminating a.

  Further, an antireflection film may be formed at a position corresponding to the fixed reflection film 54 on the light incident surface of the fixed substrate 51 (the surface on which the fixed reflection film 54 is not provided). This antireflection film can be formed by alternately laminating a low refractive index film and a high refractive index film, and reduces the reflectance of visible light on the surface of the fixed substrate 51 and increases the transmittance.

  Of the surfaces of the fixed substrate 51 facing the movable substrate 52, the surfaces on which the electrode placement groove 511, the reflective film installation portion 512, and the connection electrode groove 511 </ b> B are not formed by etching constitute the first bonding portion 513. The first bonding portion 513 is provided with a first bonding film 531. By bonding the first bonding film 531 to the second bonding film 532 provided on the movable substrate 52, as described above, The fixed substrate 51 and the movable substrate 52 are joined.

(Configuration of movable substrate)
The movable substrate 52 includes a circular movable portion 521 centered on the filter center point O, and a holding portion 522 that is coaxial with the movable portion 521 and holds the movable portion 521.

The movable part 521 is formed with a thickness dimension larger than that of the holding part 522. The movable portion 521 is formed to have a diameter larger than at least the diameter of the outer peripheral edge of the reflection film installation surface 512A in the filter plan view. The movable part 521 is provided with a movable electrode 562 and a movable reflective film 55.
Similar to the fixed substrate 51, an antireflection film may be formed on the surface of the movable portion 521 opposite to the fixed substrate 51. Such an antireflection film can be formed by alternately laminating a low refractive index film and a high refractive index film, reducing the reflectance of visible light on the surface of the movable substrate 52 and increasing the transmittance. Can be made.

  The movable electrode 562 faces the fixed electrode 561 through the gap G2, and is formed in an annular shape having the same shape as the fixed electrode 561. The movable electrode 562 forms an electrostatic actuator 56 together with the fixed electrode 561. The movable substrate 52 is provided with a movable connection electrode 564 connected to the outer peripheral edge of the movable electrode 562. The movable connection electrode 564 is provided from the movable part 521 to a position facing the connection electrode groove 511B provided on the side C3-C4 side of the fixed substrate 51, the movable side electrical part 524, and the movable side electrical part 524. The movable electrode pad 564P electrically connected to the inner terminal portion is configured.

The movable reflective film 55 is provided in the central part of the movable surface 521A of the movable part 521 so as to face the fixed reflective film 54 via the gap G1. As the movable reflective film 55, a reflective film having the same configuration as that of the fixed reflective film 54 described above is used.
In the present embodiment, as described above, an example in which the gap G2 is larger than the dimension of the gap G1 is shown, but the present invention is not limited to this. For example, when infrared rays or far infrared rays are used as the measurement target light, the gap G1 may be larger than the gap G2 depending on the wavelength range of the measurement target light.

The holding part 522 is a diaphragm that surrounds the periphery of the movable part 521, and has a thickness dimension smaller than that of the movable part 521. Such a holding part 522 is easier to bend than the movable part 521, and the movable part 521 can be displaced toward the fixed substrate 51 by a slight electrostatic attraction. At this time, since the movable portion 521 has a thickness dimension larger than that of the holding portion 522 and becomes rigid, even when the holding portion 522 is pulled toward the fixed substrate 51 by electrostatic attraction, the shape of the movable portion 521 changes. Absent. Therefore, the movable reflective film 55 provided on the movable portion 521 is not bent, and the fixed reflective film 54 and the movable reflective film 55 can be always maintained in a parallel state.
In the present embodiment, the diaphragm-like holding part 522 is illustrated, but the present invention is not limited to this. For example, a configuration in which beam-like holding parts arranged at equiangular intervals around the filter center point O are provided. And so on.

  In the movable substrate 52, a region facing the first joint portion 513 is a second joint portion 523. The second bonding portion 523 is provided with the second bonding film 532. As described above, the second bonding film 532 is bonded to the first bonding film 531, so that the fixed substrate 51 and the movable substrate 52 are bonded. Monkey.

[Case configuration]
As shown in FIGS. 1 and 2, the housing 610 includes a base 620, a lid 630, and a metal ring 640 (metal frame). The base 620 and the lid 630 are joined to each other via the metal ring 640, whereby an accommodation space is formed inside, and the wavelength variable interference filter 5 is accommodated in the accommodation space.

(Base configuration)
The base 620 is made of, for example, ceramic. The base 620 includes a pedestal portion 621 and a side wall portion 622.
The pedestal portion 621 is configured in a flat plate shape having, for example, a rectangular outer shape in a filter plan view, and a cylindrical side wall portion 622 rises from the outer peripheral portion of the pedestal portion 621 toward the lid 630. In the present embodiment, since the pedestal portion 621 has a rectangular flat plate shape, an example in which the side wall portion 622 is formed in a rectangular tube shape corresponding to this is shown. Good.

The pedestal portion 621 includes a first opening 623 that penetrates in the thickness direction. The first opening 623 is provided so as to include a region overlapping the reflective films 54 and 55 in a plan view of the pedestal 621 viewed from the thickness direction in a state where the wavelength variable interference filter 5 is accommodated in the pedestal 621. ing.
Further, a first glass member 627 covering the first opening 623 is joined to a surface (base outer surface 621B) opposite to the lid 630 of the pedestal 621. The joining of the pedestal 621 and the first glass member 627 is performed by, for example, low melting point glass joining using a glass frit (low melting point glass) that is a piece of glass melted at a high temperature and rapidly cooled, epoxy resin, or the like. Adhesion can be used. In the present embodiment, the housing space is kept airtight in a state where the inside of the housing space is maintained under reduced pressure. Therefore, it is preferable that the pedestal 621 and the first glass member 627 are bonded using low-melting glass bonding.

Further, an inner terminal portion 624 connected to each electrode pad 563P, 564P of the wavelength tunable interference filter 5 is provided on the inner surface (base inner surface 621A) facing the lid 630 of the pedestal portion 621. The inner terminal portion 624 and the electrode pads 563P and 564P are connected using a wire such as Au, for example, by wire bonding. In addition, although wire bonding is illustrated in this embodiment, for example, FPC (Flexible Printed Circuits) may be used.
The pedestal portion 621 has a through hole 625 at a position where the inner terminal portion 624 is provided. The inner terminal portion 624 is connected to the outer terminal portion 626 provided on the base outer surface 621 </ b> B of the pedestal portion 621 through the through hole 625.

  The side wall portion 622 rises from the edge portion of the pedestal portion 621 and covers the periphery of the wavelength variable interference filter 5 placed on the base inner side surface 621A. A surface (end surface 622A) facing the lid 630 of the side wall portion 622 is, for example, a flat surface parallel to the base inner surface 621A.

  The wavelength variable interference filter 5 is fixed to the base 620 using a fixing material such as an adhesive. At this time, the wavelength variable interference filter 5 may be fixed to the pedestal portion 621 or may be fixed to the side wall portion 622. The fixing material may be provided at a plurality of positions, but the wavelength tunable interference filter 5 may be fixed at one place in order to prevent the stress of the fixing material from being transmitted to the wavelength tunable interference filter 5. preferable.

(Composition of metal ring)
The metal ring 640 is formed in a rectangular tube shape corresponding to the end surface 622A of the side wall 622, and is joined to the end surface 622A. That is, the metal ring 640 is formed in a rectangular tube shape that is coaxial with the side wall portion 622. The metal ring 640 is made of, for example, an alloy such as Kovar, metal, or the like, and has a metal plating (for example, nickel-containing plating) on the outer peripheral surface.
Further, the end surface (first end surface 641: first surface of the present invention) of the metal ring 640 on the base 620 side is bonded to the end surface 622A of the side wall 622 by various bonding methods such as welding and anodic bonding.
An end face (second end face 642) opposite to the first end face 641 of the metal ring 640 is joined to the lid 630 by seam joining.

(Lid composition)
The lid 630 is a plate-like member having a rectangular outer shape in plan view. The lid 630 can be made of, for example, an alloy such as Kovar or a metal. In the present embodiment, the lid 630 is made of Kovar. In the present embodiment, the lid 630 has a thickness dimension of 0.2 mm. A detailed description of the thickness dimension of the lid 630 will be described later.

As shown in FIGS. 1 and 2, the lid 630 has a second opening 633 (corresponding to the opening of the present invention) penetrating along the thickness direction of the lid 630. The second opening 633 is provided so as to include a region overlapping the reflective films 54 and 55 in a state where the wavelength variable interference filter 5 is placed on the base 620.
The upper surface 631 (second surface of the present invention) of the lid 630 covers the second opening 633, and the second glass member 650 (corresponding to the translucent member of the present invention) is fixed to, for example, low melting point glass or the like. Joined by a member 670.

The surface of the lid 630 is covered with metal plating in a region where the fixing member 670 is not provided. For this metal plating, a material having good adhesion to the lid 630 can be selected. For example, in this embodiment, a metal plating containing nickel is used for the Kovar lid 630.
The region where the metal plating is provided may be the entire region where the fixing member 670 is not in contact, or only the surface of the lid 630 facing the metal ring 640 (the lid joint 634). In this embodiment, the lid 630 and the metal ring 640 are joined by seam joining, and if the metal plating is provided at the lid joining portion 634, the base 620 and the lid 630 are joined via the metal ring 640. Can do.

(Positional relationship between side wall, metal ring, lid, and second glass member)
Next, a specific positional relationship among the side wall 622, the metal ring 640, the lid 630, and the second glass member 650 will be described based on the drawings.
In the present embodiment, as shown in FIG. 2, an imaginary straight line L <b> 1 that connects the outer peripheral end 642 </ b> A on the second end surface 642 of the metal ring 640 and the outer peripheral end 632 on the surface opposite to the metal ring 640 of the lid 630. .
In the present embodiment, the outer peripheral edge 651 on the upper surface (the surface opposite to the lid 630) of the second glass member 650 is located on the inner side of the virtual straight line L1, that is, on the second opening 633 side. That is, the second glass member 650 does not intersect with the virtual straight line L1.
Further, the outer peripheral end 622B of the end surface 622A of the side wall portion 622 is also located on the inner side of the virtual straight line L1. That is, the side wall 622 does not intersect with the virtual straight line L1.

[Manufacture of optical filter devices]
A method for manufacturing the optical filter device 600 as described above will be described.
FIG. 5 is a flowchart showing a manufacturing process of the housing 610 of the optical filter device 600 of the present embodiment.
As shown in FIG. 5, in this embodiment, it manufactures by a base formation process, a filter fixing process, a lid formation process, and a housing | casing joining process.

In the base forming step, the ceramic sheets having the first opening 623 and the through-holes 625 are laminated, and further, the ceramic sheets corresponding to the side wall parts 622 are laminated, and these are fired. Thereby, the basic shape of the base 620 having the base portion 621 and the side wall portion 622 is formed.
Thereafter, the metal ring 640 is joined to the end surface 622A of the side wall 622. As a method for joining the metal ring 640, for example, a metal film is formed on the end face 622A to be metallized, and the metal ring 640 is joined to the metallized end face 622A through a metal brazing such as Ni plating. Note that the bonding method is not limited to this, and for example, fixing with an adhesive or the like, brazing with various brazing materials such as metal brazing and inorganic brazing, pressure bonding, solid phase bonding, and the like can be used.

Thereafter, the through hole 625 is filled with a conductive member (for example, a metal paste), the inner terminal portion 624 is formed on the base inner side surface 621A of the pedestal portion 621, and the outer terminal portion 626 is formed on the base outer side surface 621B. Thereby, the airtightness in the through-hole 625 is maintained.
And the 1st glass member 627 which covers the 1st opening part 623 is joined to the base outer side surface 621B using low melting glass.

In the filter fixing step, a fixing material such as an adhesive is applied to the base inner side surface 621A or the side wall portion 622 of the base 620. Then, alignment is performed so that the reflective films 54 and 55 of the wavelength tunable interference filter 5 are arranged in the opening region of the first opening 623, and the reflective films 54 and 55 of the wavelength tunable interference filter 5 are fixed by a fixing material. To do.
Thereafter, the electrode pads 563P and 564P of the wavelength variable interference filter 5 and the inner terminal portion 624 of the base 620 are connected by wire bonding.

  In the lid forming step, first, metal plating is formed on the Kovar lid 630 provided with the second opening 633. Then, the metal plating in the joining area | region of the 2nd glass member 650 is removed, and the 2nd glass member 650 is joined by fixing members 670, such as low melting glass.

FIG. 6 is a diagram illustrating a state at the time of seam joining in the housing joining process.
In the case joining process, the base 620 and the lid 630 are joined. Specifically, for example, seam bonding is performed in an environment set in a vacuum atmosphere by a vacuum chamber apparatus or the like.
In the seam joining, a pair of seam joining electrode rollers 700A and 700B is used, and one electrode roller 700A is brought into contact with one point on the outer peripheral end 632 of the lid 630 and one point on the outer peripheral end 642A of the metal ring 640. Further, the other electrode roller 700B is brought into contact with a point on the outer peripheral ends 632 and 642A that is symmetrical to a point on the outer peripheral ends 632 and 642A that is in contact with the electrode roller 700A. The electrode roller 700A. 700B is rotated and traced along the outer peripheral edges 632 and 642A. As a result, a large current flows from the electrode rollers 700 </ b> A and 700 </ b> B to the lid 630 and the metal ring 640. At this time, at the point of contact with the electrode rollers 700A and 700B, electric resistance is increased and high heat is generated, so that the metal plating on the lid joint 634 and the metal plating on the metal ring 640 are welded.

Moreover, since the outer peripheral end 651 of the second glass member 650 and the outer peripheral end 622B of the side wall portion 622 do not intersect with the virtual straight line L1, the electrode rollers 700A and 700B are not in contact with each other.
Therefore, the second glass member 650 does not generate heat due to the contact of the electrode rollers 700A and 700B, and the deformation of the second glass member 650 and the breakage or crack of the fixing member 670 are prevented.
In the above manufacturing method, an example in which the housing joining process is performed in the vacuum chamber apparatus has been described. For example, as illustrated in FIG. 2, a through-hole 628 is formed in the base 620 and the housing joining process is performed. Thereafter, the storage space may be evacuated, and then the through hole 628 may be sealed with, for example, a metal ball 628A (Au or the like). The through hole 628 is not limited to the base 620, and may be provided in the lid 630, or may be provided in both.

(Lid dimension setting)
Next, the dimensions of the lid 630 capable of performing suitable seam joining in the housing joining process of the present embodiment will be described.
As shown in FIG. 2, the thickness dimension of the lid 630 is a, the dimension (distance between the joints) from the outer peripheral end 632 of the lid 630 to the outer peripheral end 651 of the second glass member 650 is b, and these dimensions a, b Table 1 below shows the airtightness of the optical filter device 600 when V is changed. In addition, in the joining result of Table 1, when airtight sealing is possible, “◯”, when airtight sealing is impossible, “×”, when leakage is large and sufficient airtightness is not maintained Indicated by “△”.

In the present embodiment, a flat lid 630 is used. In this case, in order to join the lid joint 634 and the metal ring 640 appropriately at the time of seam joining, it is necessary to set the thickness dimension a of the lid 630 to 0.2 mm or less.
On the other hand, when the thickness dimension a of the lid 630 is set to 0.1 mm, the lid 630 bends due to the pressing force of the electrode rollers 700A and 700B during seam joining. In this case, the fixing member 670 that joins the lid 630 and the second glass member 650 is broken or cracked, and as shown in Table 1, it is difficult to maintain airtightness appropriately.

Further, when the inter-bonding distance b is less than 1.5 mm (for example, 0.8 mm), heat generated during seam bonding is transmitted to the fixing member 670. Since the fixing member 670 and the lid 630 have different thermal expansion coefficients, when such heat is transmitted, the fixing member 670 is damaged due to the difference in the thermal expansion coefficient, and the airtightness is lowered.
From Table 1, in this embodiment, when the thickness dimension a and the inter-bonding distance b1 are 0.15 mm, it is preferable to set the inter-joining distance b to 4 mm or more. When a is 0.2 mm, it is preferable to set the distance between joints to 2.6 mm or more.

  In the present embodiment, as described above, the lid 630 is formed to have a uniform thickness, and the thickness dimension a needs to be 0.2 mm or less by seam bonding. For this reason, heat is easily transferred from the lid 630 to the fixing member 670, and even when the inter-joining distance b is set to 1.5 mm, the fixing member 670 is damaged by the heat and the airtightness is lowered. The same was true when the thickness dimension a was 0.15 mm and the inter-bonding distance b was 2.6 mm, and sufficient airtightness could not be secured. Further, when the thickness dimension a of the lid 630 is formed to be thicker than 0.2 mm (for example, 0.3 mm), for example, the amount of current is increased in order to obtain the bonding strength between the lid bonding portion 634 and the metal ring 640. Necessary. At that time, due to heat generation due to an increase in the amount of current, a crack occurred in the base 620 itself due to a difference in thermal expansion coefficient between the side wall 622 and the metal ring 640.

[Operational effects of the first embodiment]
In the present embodiment, a metal ring 640 is joined to the end surface 622A of the side wall 622 of the base 620, and the lid 630 is joined to the metal ring 640 by seam joining. A second glass member 650 that closes the second opening 633 is joined to the upper surface 631 of the lid 630.
The outer peripheral end 651 of the second glass member 650 does not intersect with the virtual straight line L1 that connects the outer peripheral end 642A of the second end surface 642 on the lid 630 side of the metal ring 640 and the outer peripheral end 632 of the upper surface 631 of the lid 630. , Located on the inner side (the second opening 633 side) from the virtual straight line L1. For this reason, when the electrode rollers 700A and 700B are brought into contact with the outer peripheral end 632 of the lid 630 and the outer peripheral end 642A of the metal ring 640 at the time of seam bonding in the casing bonding step, the second glass member 650 and the electrode rollers 700A and 700B. Does not come into contact, and no heat is generated. Therefore, breakage of the joint portion (fixing member 670) of the lid 630 and the second glass member 650 can be prevented, and the joint strength and airtightness can be maintained.

  In the present embodiment, since the inter-joining distance b is 1.5 mm or more, heat is not easily transmitted from the lid joining portion 634 to the fixing member 670 during seam joining. Thereby, breakage of the fixing member 670 due to the difference in thermal expansion coefficient between the lid 630 and the fixing member 670 can be suppressed, and a decrease in airtightness can be suppressed.

  In the present embodiment, the lid 630 has a flat plate shape having a uniform thickness, and the lid 630 can be easily formed. Further, since the thickness dimension “a” of the lid 630 is 0.15 mm or more, even when a pressing force is applied by the electrode rollers 700 </ b> A and 700 </ b> B during seam joining in the housing joining process, the lid 630 is difficult to bend and the lid 630 is bent. It is possible to prevent the fixing member 670 from being damaged. Thereby, the fall of airtightness can be suppressed more.

[Second Embodiment]
Next, 2nd embodiment which concerns on this invention is described based on drawing.
In the first embodiment, the lid 630 having a uniform thickness dimension is used. On the other hand, in the second embodiment, the lid is formed with different thickness dimensions in the lid joint part joined to the metal ring 640 and the lid main body part inside the lid joint part. It is different from the embodiment.

FIG. 7 is a cross-sectional view of the optical filter device in the second embodiment. In the following description, the same reference numerals are given to the configurations already described, and the description thereof is omitted or simplified.
In the optical filter device 600A of the present embodiment, the lid 630A is not formed to have a uniform thickness, and the lid opening 633 is provided on the inner periphery side of the lid bonding portion 634 and the lid bonding portion 634 on the outer periphery of the lid 630A. The thickness of the lid main body 635 is different.
The lid joint 634 has a thickness dimension of, for example, 0.1 mm in order to ensure sufficient joint strength and airtightness during seam joining.
On the other hand, the thickness dimension a1 of the lid main body 635 is formed to be 0.15 mm or more.
In addition, an inter-joining distance b1 from the outer peripheral end 632 of the upper surface 631 to the outer peripheral end 651 of the second glass member 650 in the lid joint portion 634 is formed to be 1.5 mm or more.

  In the present embodiment, as shown in FIG. 7, the outer peripheral end 622B of the end surface 622A of the side wall 622 is formed inside the virtual straight line L2 connecting the outer peripheral end 642A of the metal ring 640 and the outer peripheral end 632 of the lid joint 634. The outer peripheral end 636 of the lid main body 635 and the outer peripheral end 651 of the second glass member 650 are located. That is, the side wall part 622, the lid main body part, and the second glass member 650 do not intersect with the virtual straight line L2.

(Manufacturing method of optical filter device)
The optical filter device 600A having the above-described configuration is also manufactured by the process shown in FIG. 5 as in the first embodiment.
FIG. 8 is a diagram illustrating a case joining process in the manufacture of the optical filter device 600A.
As shown in FIG. 8, also in this embodiment, the electrode rollers 700A and 700B do not contact the second glass member 650. As a result, the fixing member 670 can be prevented from being damaged by the electrode rollers 700A and 700B coming into contact with the second glass member 650.
Further, the outer peripheral end 636 of the lid main body 635 does not contact the electrode rollers 700A and 700B. Thereby, there is no heat generation in the lid main body 635, and the inconvenience that this heat is transmitted to the fixing member 670 can be suppressed.

(Lid dimension setting)
Next, in the present embodiment, the dimensions of the lid 630 </ b> A capable of performing suitable seam bonding in the housing bonding step will be described.
Table 2 below shows the air tightness of the optical filter device 600A when the thickness dimension of the lid joint portion 634 is 0.1 mm and the thickness dimension a1 of the lid main body portion 635 and the distance between joints b1 are changed.

In the present embodiment, as described above, the thickness dimension of the lid joint portion 634 can be set to 0.1 mm, and the lid joint portion 634 and the metal ring 640 can be appropriately joined.
Here, when the thickness dimension a1 of the lid main body 635 is set to be less than 0.15 mm, the lid 630A is bent by the pressing force of the electrode rollers 700A and 700B as in the first embodiment, and internal airtightness is ensured. It becomes difficult.
On the other hand, by setting the thickness dimension a1 of the lid main body 635 to 0.15 mm or more, it is possible to prevent the lid 630A from being bent even when the pressing force of the electrode rollers 700A and 700B is applied during seam joining. Become.

  In addition, when the inter-bonding distance b is less than 1.5 mm (for example, 0.8 mm), heat generated during seam bonding is transmitted to the bonding portion of the fixing member 670. Since the fixing member 670 and the lid 630 have different thermal expansion coefficients, when such heat is transmitted, the fixing member 670 is damaged due to the difference in thermal expansion coefficient, and the airtightness is lowered.

As shown in Table 2, in this embodiment, when the thickness dimension a1 of the lid main body 635 and the inter-joining distance b1 are 0.15 mm, the inter-joining distance b1 is set to 4 mm or more. When the thickness dimension a1 is 0.2 mm, it is preferable to set the distance between joints to 2.6 mm or more.
Further, in the present embodiment, since the lid joint portion 634 and the lid main body portion 635 can be made to have different thickness dimensions, the thickness dimension of the lid main body portion 635 can be set to 0.2 mm or more. Can be set to 1.5 mm.

  In Table 2, when the thickness a1 of the lid body 635 is set to 0.15 mm and 0.2 mm, and the distance b1 between the joints is set to 1.5 mm, the thickness dimension a1 of the lid body is 0.15 mm. When the distance b1 is set to 2.6 mm, similarly to the first embodiment, heat from the lid joint 634 is easily transferred to the fixing member 670, and the fixing member 670 is damaged by the heat, and thus airtightness is increased. It is falling.

[Operational effects of the second embodiment]
In this embodiment, the lid 630 includes a lid joint portion 634 and a lid main body portion 635 on the inner side (second opening portion 633 side) than the lid joint portion 634, and the lid body 635 has a thickness dimension a <b> 1. It is larger than the thickness dimension of the portion 634.
By adopting such a configuration, the thickness dimension of the lid joint portion 634 can be made smaller than in the first embodiment, and the lid joint portion 634 and the metal ring 640 can be joined with stronger joint strength and high airtightness. Can do. Further, even when stress is applied from the electrode rollers 700A and 700B during the seam joining in the housing joining process, the thickness of the lid main body 635 can be set large, so that the bending of the lid 630 can be suppressed. .
Therefore, for example, the thickness dimension of the lid joint portion 634 is set to 0.1 mm, and the thickness dimension of the lid main body portion 635 is set to 0.15 mm or more, so that the thickness dimension of the lid joint portion is greater than that of the optical filter device 600 of the first embodiment. Can also be reduced.

  In this embodiment, the thickness dimensions of the lid joint portion 634 and the lid body portion 635 can be made different from each other. By increasing the thickness dimension a1 of the lid body portion 635, heat at the time of seam joining is transmitted to the fixing member. It becomes difficult. Therefore, for example, as shown in Table 2, even when the inter-joining distance b1 is set to 1.5 mm, a decrease in airtightness can be suppressed by setting the thickness dimension a1 of the lid main body 635 to 0.3 mm or more.

[Third embodiment]
Next, a third embodiment according to the present invention will be described based on the drawings.
In the third embodiment, a colorimetric sensor 3 that is an optical module in which the optical filter device 600 according to the first embodiment is incorporated, and a colorimetric apparatus 1 that is an electronic apparatus in which the optical filter device 600 is incorporated will be described. Instead of the optical filter device 600, the optical filter device 600A of the second and third embodiments may be incorporated.

[Schematic configuration of color measuring device]
FIG. 9 is a block diagram illustrating a schematic configuration of the colorimetric device 1.
The color measuring device 1 is an electronic device of the present invention. As shown in FIG. 9, the color measurement device 1 includes a light source device 2 that emits light to the inspection target X, a color measurement sensor 3 (optical module), and a control device 4 that controls the overall operation of the color measurement device 1. And comprising. In this color measurement device 1, the color measurement sensor 3 receives the inspection target light emitted from the light source device 2 and reflected by the inspection target X. The color measurement device 1 is a device that analyzes and measures the chromaticity of the inspection target light, that is, the color of the inspection target X, based on the detection signal output from the received color measurement sensor 3.

[Configuration of light source device]
The light source device 2 includes a light source 21 and a plurality of lenses 22 (only one is shown in FIG. 9), and emits white light to the inspection target X. The plurality of lenses 22 may include a collimator lens. In this case, the light source device 2 converts the white light emitted from the light source 21 into parallel light by the collimator lens and inspects from a projection lens (not shown). Inject toward the target X. In the present embodiment, the colorimetric device 1 including the light source device 2 is illustrated. However, for example, when the inspection target X is a light emitting member such as a liquid crystal panel, the light source device 2 may not be provided.

[Configuration of colorimetric sensor]
The colorimetric sensor 3 constitutes the optical module of the present invention, and includes the optical filter device 600 of the first embodiment. In this embodiment, the optical filter device 600 is illustrated, but the optical filter device 600A of the second embodiment may be used. As shown in FIG. 9, the colorimetric sensor 3 includes an optical filter device 600, a detection unit 31 that receives light transmitted through the optical filter device 600, and a voltage that changes the wavelength of light transmitted through the wavelength variable interference filter 5. And a control unit 32.
Further, the colorimetric sensor 3 includes an incident optical lens (not shown) that guides reflected light (inspection light) reflected by the inspection target X to a position facing the wavelength variable interference filter 5. Then, the colorimetric sensor 3 uses the wavelength variable interference filter 5 in the optical filter device 600 to split the light having a predetermined wavelength out of the inspection target light incident from the incident optical lens. Receive light.

The detection unit 31 includes a plurality of photoelectric exchange elements, and generates an electrical signal corresponding to the amount of received light. Here, the detection unit 31 is connected to the control device 4 via, for example, the circuit board 311, and outputs the generated electric signal to the control device 4 as a light reception signal.
The circuit board 311 is connected to an outer terminal portion 626 formed on the base outer surface 621B of the housing 610, and is connected to the voltage control unit 32 via a circuit formed on the circuit board 311. ing.
In such a configuration, the optical filter device 600 and the detection unit 31 can be integrally configured via the circuit board 311, and the configuration of the colorimetric sensor 3 can be simplified.

  The voltage control unit 32 is connected to the outer terminal unit 626 of the optical filter device 600 through the circuit board 311. The voltage control unit 32 drives the electrostatic actuator 56 by applying a predetermined step voltage between the fixed electrode pad 563P and the movable electrode pad 564P based on the control signal input from the control device 4. As a result, an electrostatic attractive force is generated in the gap between the electrodes, and the holding portion 522 is bent, so that the movable portion 521 is displaced toward the fixed substrate 51, and the gap G1 between the reflection films can be set to a desired dimension. It becomes.

[Configuration of control device]
The control device 4 controls the overall operation of the color measurement device 1.
As this control device 4, for example, a general-purpose personal computer, a portable information terminal, a color measurement dedicated computer, or the like can be used.
As shown in FIG. 9, the control device 4 includes a light source control unit 41, a colorimetric sensor control unit 42, a colorimetric processing unit 43, and the like.
The light source control unit 41 is connected to the light source device 2. Then, the light source control unit 41 outputs a predetermined control signal to the light source device 2 based on, for example, a user setting input, and causes the light source device 2 to emit white light with a predetermined brightness.
The colorimetric sensor control unit 42 is connected to the colorimetric sensor 3. The colorimetric sensor control unit 42 sets a wavelength of light received by the colorimetric sensor 3 based on, for example, a user's setting input, and outputs a control signal for detecting the amount of light received at this wavelength. Output to the colorimetric sensor 3. Thereby, the voltage control unit 32 of the colorimetric sensor 3 sets the voltage applied to the electrostatic actuator 56 so as to transmit only the wavelength of light desired by the user based on the control signal.
The colorimetric processing unit 43 analyzes the chromaticity of the inspection target X from the amount of received light detected by the detection unit 31.

[Operational effects of the third embodiment]
The color measurement device 1 of this embodiment includes an optical filter device 600 as in the first embodiment. As described above, in the optical filter device 600, the base 620 and the lid 630 are bonded with high airtightness and strong bonding strength through the metal ring 640 by seam bonding. In addition, breakage at the joint portion (fixing member 670) of the lid 630 and the second glass member 650 during seam joining is unlikely to occur. Therefore, the airtightness of the accommodation space in the optical filter device 600 is high, and changes in internal pressure can be suppressed.
For this reason, the installation environment of the wavelength tunable interference filter 5 can be maintained for a long time under reduced pressure, and high responsiveness when the wavelength tunable interference filter 5 is driven can be maintained. Further, the deterioration of the reflection films 54 and 55 can be suppressed, and the decrease in resolution can also be suppressed.
Therefore, even in the colorimetric sensor 3 and the colorimetric apparatus 1 including the optical filter device 600 as described above, the performance degradation can be suppressed, and light of a target wavelength extracted with high resolution can be detected over a long period of time. And accurate color analysis processing can be performed.

[Modification of Embodiment]
In addition, this invention is not limited to the above-mentioned embodiment, The deformation | transformation in the range which can achieve the objective of this invention, improvement, etc. are included in this invention.
For example, in each of the above embodiments, the example in which the outer peripheral end 622B of the side wall portion 622 is located inside the virtual straight line L1 (the virtual straight line L2 in the second embodiment) is not limited to this. It suffices that at least the outer peripheral end 651 of the second glass member 650 is positioned inside the virtual straight line L1 (L2), and the outer peripheral end 622B of the side wall portion 622 may be positioned, for example, on the virtual straight line L1 (L2). .
Moreover, in the said embodiment, although the side wall part 622 and the metal ring 640 showed the example which is a square cylinder shape, it is not limited to this, For example, cylindrical shapes, such as cylindrical shape, may be sufficient.

  In the said embodiment, although the example comprised by Kovar as the lid 630 was shown, it is not limited to this, For example, you may use other metal raw materials, such as titanium. However, when the thermal conductivity is high, it is necessary to increase the inter-bonding distance b (b1). When the Young's modulus is small, the lid 630 is easily bent, and thus the thickness dimension a (a1) needs to be increased. is there. Therefore, it is preferable to appropriately set the thickness dimension a (a1) and the inter-joining distance b (b1) depending on the material of the lid 630.

In each of the above embodiments, the wavelength variable interference filter 5 is exemplified as the optical element according to the present invention, but the present invention is not limited to this. For example, examples of the optical element include a mirror device that can precisely change the light reflection direction.
Furthermore, although the wavelength variable interference filter 5 is illustrated as an optical element, an interference filter in which the electrostatic actuator 56 is not provided and the gap dimension between the reflection films 54 and 55 is fixed may be used.

Moreover, although the colorimetric apparatus 1 was illustrated in the third embodiment as the electronic apparatus of the present invention, the optical device, optical module, and electronic apparatus of the present invention can be used in various other fields.
For example, it can be used as a light-based system for detecting the presence of a specific substance. As such a system, for example, an in-vehicle gas leak detector that detects a specific gas with high sensitivity by adopting a spectral measurement method using a wavelength variable interference filter provided in the optical device of the present invention, or a light for breath test A gas detection device such as an acoustic noble gas detector can be exemplified.
An example of such a gas detection device will be described below with reference to the drawings.

FIG. 10 is a schematic diagram illustrating an example of a gas detection apparatus including a wavelength variable interference filter.
FIG. 11 is a block diagram illustrating a configuration of a control system of the gas detection device of FIG.
As shown in FIG. 10, the gas detection device 100 includes a sensor chip 110, a flow path 120 including a suction port 120A, a suction flow path 120B, a discharge flow path 120C, and a discharge port 120D, a main body 130, It is configured with.
The main body unit 130 includes a sensor unit cover 131 having an opening through which the flow channel 120 can be attached, a discharge unit 133, a housing 134, an optical unit 135, a filter 136, an optical filter device 600, a light receiving element 137 (detection unit), and the like. And a control unit 138 that processes a detected signal and controls the detection unit, a power supply unit 139 that supplies power, and the like. Instead of the optical filter device 600, the optical filter device 600A in the second and third embodiments may be used. The optical unit 135 emits light, and a beam splitter 135B that reflects light incident from the light source 135A toward the sensor chip 110 and transmits light incident from the sensor chip toward the light receiving element 137. And a lens 135C, a lens 135D, and a lens 135E.
As shown in FIG. 10, an operation panel 140, a display unit 141, a connection unit 142 for interface with the outside, and a power supply unit 139 are provided on the surface of the gas detection device 100. When the power supply unit 139 is a secondary battery, a connection unit 143 for charging may be provided.
Further, as shown in FIG. 11, the control unit 138 of the gas detection apparatus 100 includes a signal processing unit 144 configured by a CPU, a light source driver circuit 145 for controlling the light source 135A, and a wavelength variable interference of the optical filter device 600. A voltage control unit 146 for controlling the filter 5, a light receiving circuit 147 that receives a signal from the light receiving element 137, a code of the sensor chip 110 is read, and a signal from the sensor chip detector 148 that detects the presence or absence of the sensor chip 110 is obtained. A sensor chip detection circuit 149 for receiving and a discharge driver circuit 150 for controlling the discharge means 133 are provided.

Next, operation | movement of the above gas detection apparatuses 100 is demonstrated below.
A sensor chip detector 148 is provided inside the sensor unit cover 131 at the upper part of the main body unit 130, and the sensor chip detector 148 detects the presence or absence of the sensor chip 110. When the signal processing unit 144 detects the detection signal from the sensor chip detector 148, the signal processing unit 144 determines that the sensor chip 110 is attached, and displays a display signal for displaying on the display unit 141 that the detection operation can be performed. put out.

For example, when the operation panel 140 is operated by the user and an instruction signal to start the detection process is output from the operation panel 140 to the signal processing unit 144, the signal processing unit 144 first sends the signal processing unit 144 to the light source driver circuit 145. A light source activation signal is output to activate the light source 135A. When the light source 135A is driven, laser light having a single wavelength and stable linear polarization is emitted from the light source 135A. The light source 135A includes a temperature sensor and a light amount sensor, and the information is output to the signal processing unit 144. When the signal processing unit 144 determines that the light source 135A is stably operating based on the temperature and light quantity input from the light source 135A, the signal processing unit 144 controls the discharge driver circuit 150 to operate the discharge unit 133. Thereby, the gas sample containing the target substance (gas molecule) to be detected is guided from the suction port 120A to the suction channel 120B, the sensor chip 110, the discharge channel 120C, and the discharge port 120D.
The suction port 120A is provided with a dust removal filter 120A1, and relatively large dust, a part of water vapor, and the like are removed.

The sensor chip 110 is a sensor that incorporates a plurality of metal nanostructures and uses localized surface plasmon resonance. In such a sensor chip 110, an enhanced electric field is formed between the metal nanostructures by laser light, and when gas molecules enter the enhanced electric field, Raman scattered light and Rayleigh scattered light including information on molecular vibrations are generated. To do.
These Rayleigh scattered light and Raman scattered light enter the filter 136 through the optical unit 135, and the Rayleigh scattered light is separated by the filter 136, and the Raman scattered light enters the optical filter device 600. Then, the signal processing unit 144 controls the voltage control unit 146 to adjust the voltage applied to the wavelength variable interference filter 5 of the optical filter device 600, and the Raman scattered light corresponding to the gas molecule to be detected is converted into the optical filter device. The light is dispersed by 600 wavelength variable interference filter 5. Thereafter, when the dispersed light is received by the light receiving element 137, a light reception signal corresponding to the amount of received light is output to the signal processing unit 144 via the light receiving circuit 147.
The signal processing unit 144 compares the spectrum data of the Raman scattered light corresponding to the gas molecule to be detected obtained as described above and the data stored in the ROM, and determines whether or not the target gas molecule is the target gas molecule. To determine the substance. Further, the signal processing unit 144 displays the result information on the display unit 141 or outputs the result information from the connection unit 142 to the outside.

  10 and 11 exemplify the gas detection device 100 that performs gas detection from the Raman scattered light obtained by spectrally dividing the Raman scattered light by the wavelength variable interference filter 5 of the optical filter device 600. In addition, as a gas detection apparatus, you may use as a gas detection apparatus which specifies gas classification by detecting the intrinsic absorbance of gas. In this case, a gas sensor that allows gas to flow into the sensor and detects light absorbed by the gas in the incident light is used as the optical module of the present invention. A gas detection device that analyzes and discriminates the gas flowing into the sensor by such a gas sensor is an electronic apparatus of the present invention. Even in such a configuration, it is possible to detect a gas component using the wavelength variable interference filter.

In addition, the system for detecting the presence of a specific substance is not limited to the detection of the gas as described above, but a non-invasive measuring device for saccharides by near-infrared spectroscopy, and non-invasive information on food, living body, minerals, etc. A substance component analyzer such as a measuring device can be exemplified.
Hereinafter, a food analyzer will be described as an example of the substance component analyzer.

FIG. 12 is a diagram illustrating a schematic configuration of a food analysis apparatus which is an example of an electronic apparatus using the optical filter device 600.
As shown in FIG. 12, the food analysis device 200 includes a detector 210 (optical module), a control unit 220, and a display unit 230. The detector 210 includes a light source 211 that emits light, an imaging lens 212 into which light from a measurement object is introduced, an optical filter device 600 that splits light introduced from the imaging lens 212, and the dispersed light. And an imaging unit 213 (detection unit) for detection. Instead of the optical filter device 600, the optical filter device 600A in the second and third embodiments may be used.
The control unit 220 also turns on and off the light source 211 and controls the brightness at the time of lighting, a voltage control unit 222 that controls the wavelength variable interference filter 5 of the optical filter device 600, and imaging. A detection control unit 223 that controls the unit 213 to acquire a spectral image captured by the imaging unit 213, a signal processing unit 224, and a storage unit 225.

  In the food analyzer 200, when the system is driven, the light source 211 is controlled by the light source control unit 221, and light is irradiated from the light source 211 to the measurement object. Then, the light reflected by the measurement object enters the optical filter device 600 through the imaging lens 212. The wavelength variable interference filter 5 of the optical filter device 600 is applied with a voltage capable of dispersing a desired wavelength under the control of the voltage control unit 222, and the dispersed light is captured by an imaging unit 213 configured by, for example, a CCD camera or the like. Imaged. The captured light is accumulated in the storage unit 225 as a spectral image. In addition, the signal processing unit 224 controls the voltage control unit 222 to change the voltage value applied to the wavelength tunable interference filter 5, and acquires a spectral image for each wavelength.

Then, the signal processing unit 224 performs arithmetic processing on the data of each pixel in each image accumulated in the storage unit 225, and obtains a spectrum at each pixel. In addition, the storage unit 225 stores, for example, information related to food components with respect to the spectrum, and the signal processing unit 224 analyzes the obtained spectrum data based on the information related to food stored in the storage unit 225. The food component contained in the detection target and its content are obtained. Moreover, a food calorie, a freshness, etc. are computable from the obtained food component and content. Furthermore, by analyzing the spectral distribution in the image, it is possible to extract a portion of the food to be inspected that has reduced freshness, and to detect foreign substances contained in the food. Can also be implemented.
Then, the signal processing unit 224 performs processing for causing the display unit 230 to display information such as the components and contents of the food to be examined, the calories, and the freshness obtained as described above.

FIG. 12 shows an example of the food analysis apparatus 200, but it can also be used as a non-invasive measurement apparatus for other information as described above with a substantially similar configuration. For example, it can be used as a biological analyzer for analyzing biological components such as measurement and analysis of body fluid components such as blood. As such a bioanalytical device, for example, a device that detects ethyl alcohol as a device that measures a body fluid component such as blood, it can be used as a drunk driving prevention device that detects the drunk state of the driver. Further, it can also be used as an electronic endoscope system provided with such a biological analyzer.
Furthermore, it can also be used as a mineral analyzer for performing component analysis of minerals.

Furthermore, the variable wavelength interference filter, optical module, and electronic apparatus of the present invention can be applied to the following devices.
For example, it is possible to transmit data using light of each wavelength by changing the intensity of light of each wavelength over time. In this case, light of a specific wavelength is transmitted by a wavelength variable interference filter provided in the optical module. The data transmitted by the light of the specific wavelength can be extracted by separating the light and receiving the light at the light receiving unit, and the electronic data having such a data extraction optical module can be used to extract the light data of each wavelength. By processing, optical communication can be performed.

In addition, as an electronic device, the present invention can be applied to a spectroscopic camera, a spectroscopic analyzer, or the like that captures a spectroscopic image by dispersing light with a wavelength variable interference filter. An example of such a spectroscopic camera is an infrared camera incorporating a wavelength variable interference filter.
FIG. 13 is a schematic diagram showing a schematic configuration of the spectroscopic camera. As shown in FIG. 13, the spectroscopic camera 300 includes a camera body 310, an imaging lens unit 320, and an imaging unit 330 (detection unit).
The camera body 310 is a part that is gripped and operated by a user.
The imaging lens unit 320 is provided in the camera body 310 and guides incident image light to the imaging unit 330. Further, as shown in FIG. 13, the imaging lens unit 320 includes an objective lens 321, an imaging lens 322, and an optical filter device 600 provided between these lenses. Instead of the optical filter device 600, the optical filter device 600A in the second and third embodiments may be used.
The imaging unit 330 includes a light receiving element, and images the image light guided by the imaging lens unit 320.
In such a spectroscopic camera 300, a spectral image of light having a desired wavelength can be captured by transmitting light having a wavelength to be imaged by the variable wavelength interference filter 5 of the optical filter device 600.

Furthermore, it can also be used as an optical device using a wavelength variable interference filter as a bandpass filter. For example, it can also be used as an optical laser device that splits and transmits only a narrow-band light centered on a predetermined wavelength among light in a predetermined wavelength range emitted from the light emitting element.
In addition, the tunable interference filter housed in the optical device of the present invention may be used as a biometric authentication device, for example, authentication of blood vessels, fingerprints, retinas, irises, etc. using light in the near infrared region or visible region. It can also be applied to devices.

  Furthermore, an optical module and an electronic device can be used as a concentration detection device. In this case, the infrared energy (infrared light) emitted from the substance is spectrally analyzed by the variable wavelength interference filter, and the analyte concentration in the sample is measured.

  As described above, the optical device, the optical module, and the electronic apparatus of the present invention can be applied to any apparatus that separates predetermined light from incident light. And since the said optical device can disperse | distribute a some wavelength with one device as mentioned above, the measurement of the spectrum of a some wavelength and the detection with respect to a some component can be implemented accurately. Therefore, compared with the conventional apparatus which takes out a desired wavelength with a plurality of devices, it is possible to promote downsizing of the optical module and the electronic device, and for example, it can be suitably used for portable or in-vehicle electronic devices.

  In addition, the specific structure for carrying out the present invention may be configured by appropriately combining the above-described embodiments and modification examples within the scope in which the object of the present invention can be achieved, and may be appropriately changed to other structures and the like. May be.

  DESCRIPTION OF SYMBOLS 1 ... Color measurement apparatus, 3 ... Color measurement sensor, 4 ... Control apparatus, 5 ... Wavelength variable interference filter, 31 ... Detection part, 54 ... Fixed reflection film, 55 ... Movable reflection film, 100 ... Gas detection apparatus, 137 ... Light reception Element, 138 ... Control unit, 200 ... Food analyzer, 213 ... Imaging unit, 220 ... Control unit, 300 ... Spectral camera, 600,600A ... Optical filter device, 610 ... Housing (optical housing), 620 ... Base, 630 ... Lid, 631 ... Upper surface, 632 ... Outer peripheral edge, 633 ... Second opening, 634 ... Lid joint, 635 ... Lid body, 640 ... Metal ring (metal frame), 641 ... First end surface, 642 ... First Two end surfaces, 642A ... outer peripheral end, 650 ... second glass member (translucent member), 651 ... outer peripheral end, 670 ... fixing member, L1, L2 ... virtual straight line.

Claims (10)

A base having a recess surrounded by a side wall;
A metal frame bonded to an end surface on the side wall portion and having a first surface opposite to the bonding surface with the side wall portion;
A lid that is bonded to the metal frame, has a second surface opposite to the bonding surface with the metal frame, and an opening;
A translucent member bonded to the lid and closing the opening;
An optical element placed in the concave portion of the base,
The translucent member is an imaginary straight line connecting the outer peripheral end of the first surface of the metal frame and the outer peripheral end of the second surface of the lid in a cross-sectional view along the depth direction of the concave portion of the base. An optical device characterized by not intersecting with. The optical device according to claim 1.
The optical device according to claim 1, wherein a minimum distance dimension from the outer peripheral end of the lid to the outer peripheral end of the translucent member is 1.5 mm or more in a plan view when viewed from the depth direction of the concave portion of the base. The optical device according to claim 1 or 2,
The said lid is a flat plate which has a uniform thickness dimension, The thickness dimension of the said lid is 0.15 mm or more. The optical device characterized by the above-mentioned. The optical device according to claim 1 or 2,
The lid includes: a lid joint portion joined to the metal frame; and a lid main body portion provided on the opening side of the lid joint portion and having a thickness dimension larger than that of the lid joint portion. Optical device characterized. The optical device according to claim 4.
The optical device, wherein the lid main body portion does not intersect with the virtual straight line. The optical device according to claim 4 or 5,
The optical device is characterized in that a thickness dimension of the lid main body portion is 0.15 mm or more. The optical device according to any one of claims 1 to 6,
The optical device is a Fabry-Perot etalon element including a pair of reflective films facing each other. A base having a recess surrounded by a side wall, a metal frame bonded to an end surface on the side wall, and having a first surface opposite to the bonding surface with the side wall, and bonded to the metal frame, the metal A second surface opposite to the joint surface with the frame, a lid having an opening, a translucent member that is joined to the lid and closes the opening, and a Fabry-Perot etalon placed in the recess of the base An optical device having an element;
A light receiving unit for receiving light emitted from the optical device,
The translucent member is an imaginary straight line connecting the outer peripheral end of the first surface of the metal frame and the outer peripheral end of the second surface of the lid in a cross-sectional view along the depth direction of the concave portion of the base. An optical module characterized in that it does not cross. A base having a recess surrounded by a side wall, a metal frame bonded to an end surface on the side wall, and having a first surface opposite to the bonding surface with the side wall, and bonded to the metal frame, the metal A second surface opposite to the joint surface with the frame, a lid having an opening, a translucent member that is joined to the lid and closes the opening, and a Fabry-Perot etalon placed in the recess of the base An optical device having an element;
A control unit for controlling the optical device,
The translucent member is an imaginary straight line connecting the outer peripheral end of the first surface of the metal frame and the outer peripheral end of the second surface of the lid in a cross-sectional view along the depth direction of the concave portion of the base. Electronic equipment characterized by not crossing with A base having a recess surrounded by a side wall;
A metal frame bonded to an end surface on the side wall portion and having a first surface opposite to the bonding surface with the side wall portion;
A lid that is bonded to the metal frame, has a second surface opposite to the bonding surface with the metal frame, and an opening;
A translucent member bonded to the lid and closing the opening,
The translucent member is an imaginary straight line connecting the outer peripheral end of the first surface of the metal frame and the outer peripheral end of the second surface of the lid in a cross-sectional view along the depth direction of the concave portion of the base. An optical housing characterized by not intersecting with.

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