JPS57106184A - Manufacture of airtight window - Google Patents

Manufacture of airtight window

Info

Publication number
JPS57106184A
JPS57106184A JP55183305A JP18330580A JPS57106184A JP S57106184 A JPS57106184 A JP S57106184A JP 55183305 A JP55183305 A JP 55183305A JP 18330580 A JP18330580 A JP 18330580A JP S57106184 A JPS57106184 A JP S57106184A
Authority
JP
Japan
Prior art keywords
glass
outer ring
temperature
metallic outer
lens cap
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP55183305A
Other languages
Japanese (ja)
Other versions
JPS6160594B2 (en
Inventor
Takeshi Wachi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Home Electronics Ltd
NEC Corp
Original Assignee
NEC Home Electronics Ltd
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Home Electronics Ltd, Nippon Electric Co Ltd filed Critical NEC Home Electronics Ltd
Priority to JP55183305A priority Critical patent/JPS57106184A/en
Publication of JPS57106184A publication Critical patent/JPS57106184A/en
Publication of JPS6160594B2 publication Critical patent/JPS6160594B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Joining Of Glass To Other Materials (AREA)

Abstract

PURPOSE:To improve the transparency of glass by a method wherein glass is heated at a working temperature and sealed into a metallic outer ring in an airtight manner, a film on the surface of the glass is removed through acidizing, and the glass is reheated at a temperature, which is higher than the working temperature, of the melting point or higher of the glass. CONSTITUTION:A transparent glass disk 10a is placed on the metallic outer ring 9, heated at 100 deg.C, and sealed into the metallic outer ring 9, and a lens cap 8 is obtained. The lens cap is immersed in an acid liquid, and the film 16 adhering on the surface of the glass is removed. The cap 8 is arranged to a sealing jig 12, and reheated at the temperature of 700-900 deg.C, which is higher than the melting point or higher of the glass 10 and is lower than the working temperature by 100 deg.C. Accordingly, the airtight window such as the lens cap made of the glass having high transparency can be formed.
JP55183305A 1980-12-24 1980-12-24 Manufacture of airtight window Granted JPS57106184A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55183305A JPS57106184A (en) 1980-12-24 1980-12-24 Manufacture of airtight window

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55183305A JPS57106184A (en) 1980-12-24 1980-12-24 Manufacture of airtight window

Publications (2)

Publication Number Publication Date
JPS57106184A true JPS57106184A (en) 1982-07-01
JPS6160594B2 JPS6160594B2 (en) 1986-12-22

Family

ID=16133349

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55183305A Granted JPS57106184A (en) 1980-12-24 1980-12-24 Manufacture of airtight window

Country Status (1)

Country Link
JP (1) JPS57106184A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007005716A (en) * 2005-06-27 2007-01-11 Matsushita Electric Ind Co Ltd Manufacturing method of lens cap
JP2008193401A (en) * 2007-02-05 2008-08-21 Epson Toyocom Corp Piezoelectric vibrator, and manufacturing method thereof

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007005716A (en) * 2005-06-27 2007-01-11 Matsushita Electric Ind Co Ltd Manufacturing method of lens cap
JP4679264B2 (en) * 2005-06-27 2011-04-27 パナソニック株式会社 Lens cap manufacturing method
JP2008193401A (en) * 2007-02-05 2008-08-21 Epson Toyocom Corp Piezoelectric vibrator, and manufacturing method thereof

Also Published As

Publication number Publication date
JPS6160594B2 (en) 1986-12-22

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