JPS5390867A - Glass hermetic sealing for lead wire - Google Patents

Glass hermetic sealing for lead wire

Info

Publication number
JPS5390867A
JPS5390867A JP490877A JP490877A JPS5390867A JP S5390867 A JPS5390867 A JP S5390867A JP 490877 A JP490877 A JP 490877A JP 490877 A JP490877 A JP 490877A JP S5390867 A JPS5390867 A JP S5390867A
Authority
JP
Japan
Prior art keywords
lead wire
hermetic sealing
glass hermetic
glass
applying
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP490877A
Other languages
Japanese (ja)
Other versions
JPS6024581B2 (en
Inventor
Michio Tanimoto
Shunei Uematsu
Toshio Kanno
Kazuhisa Takashima
Shunichiro Fujioka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP52004908A priority Critical patent/JPS6024581B2/en
Publication of JPS5390867A publication Critical patent/JPS5390867A/en
Publication of JPS6024581B2 publication Critical patent/JPS6024581B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE: To avoid applying a high temperature to the pellet when the glass hermetic sealing is given to the lead wire, and thus to prevent the lowering of the characteristics, by applying the hot air, laser beam, infrared rays, etc. to the crack existing area of the glass layer or to the unsteady sealing area.
COPYRIGHT: (C)1978,JPO&Japio
JP52004908A 1977-01-21 1977-01-21 Hermetic sealing method for lead wires Expired JPS6024581B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP52004908A JPS6024581B2 (en) 1977-01-21 1977-01-21 Hermetic sealing method for lead wires

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP52004908A JPS6024581B2 (en) 1977-01-21 1977-01-21 Hermetic sealing method for lead wires

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP59225760A Division JPS60192352A (en) 1984-10-29 1984-10-29 Sealing process of integrated circuit device

Publications (2)

Publication Number Publication Date
JPS5390867A true JPS5390867A (en) 1978-08-10
JPS6024581B2 JPS6024581B2 (en) 1985-06-13

Family

ID=11596733

Family Applications (1)

Application Number Title Priority Date Filing Date
JP52004908A Expired JPS6024581B2 (en) 1977-01-21 1977-01-21 Hermetic sealing method for lead wires

Country Status (1)

Country Link
JP (1) JPS6024581B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5759367A (en) * 1980-09-26 1982-04-09 Fujitsu Ltd Semiconductor container
JPS5874061A (en) * 1981-10-29 1983-05-04 Nec Corp Manufacture of dip type case
JPS58138353U (en) * 1982-03-12 1983-09-17 京セラ株式会社 semiconductor package

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5759367A (en) * 1980-09-26 1982-04-09 Fujitsu Ltd Semiconductor container
JPS5874061A (en) * 1981-10-29 1983-05-04 Nec Corp Manufacture of dip type case
JPS6255302B2 (en) * 1981-10-29 1987-11-19 Nippon Electric Co
JPS58138353U (en) * 1982-03-12 1983-09-17 京セラ株式会社 semiconductor package
JPS633166Y2 (en) * 1982-03-12 1988-01-26

Also Published As

Publication number Publication date
JPS6024581B2 (en) 1985-06-13

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