JPS5874061A - Manufacture of dip type case - Google Patents
Manufacture of dip type caseInfo
- Publication number
- JPS5874061A JPS5874061A JP17430281A JP17430281A JPS5874061A JP S5874061 A JPS5874061 A JP S5874061A JP 17430281 A JP17430281 A JP 17430281A JP 17430281 A JP17430281 A JP 17430281A JP S5874061 A JPS5874061 A JP S5874061A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- lead frame
- dip type
- leads
- insulating substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
Description
【発明の詳細な説明】
この発明はＤＩＰ型ケースの製造方法にかかシ、特に多
数リードを有するＤＩＰ型硝子ケースの製造方法に関す
る。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of manufacturing a DIP type case, and more particularly to a method of manufacturing a DIP type glass case having multiple leads.
従来の硝子ケースの製造方法は絶縁基板上に硝子材料を
介してＤＩＰ型リードフレームを１着してＤＩＰ型ケー
スを製造してい良。The conventional method for manufacturing a glass case is to manufacture a DIP type case by attaching one DIP type lead frame to an insulating substrate through a glass material.
すなわち、従来のＤＩＰＩ！ｌ硝子ケースはり一ド７レ
ームを薄板から打抜き、さらに所定の位置で折曲げた状
態のＤＩＰ型リードフレームを用いて絶縁基板上の硝子
材料を介して固着する方法で製造していた。しかしなが
ら、リードフレームが２４リ一ド以上の多数リードにガ
つた場合ＤＩＰ型リードフレーム、特に端部のリードは
、金属細線で配線するリード先端部から折曲げ部までの
距離が長い為、リード先端部の安定性が々くなる。That is, conventional DIPI! The glass case was manufactured by punching out 7 frames from a thin plate and fixing it to an insulating substrate via a glass material using a DIP type lead frame bent at a predetermined position. However, if the lead frame has a large number of leads (24 leads or more), DIP type lead frames, especially the leads at the ends, have a long distance from the lead tip to the bent part where the wire is wired with thin metal wire, so the lead tip The stability of the parts is improved.
それゆえ、リードフレームのリード先端のバラツキが大
きくなシさらにリード先端部の位置精度も低下し絶縁基
板上の硝子材料に均一に固着することが出来なかった。Therefore, the dispersion of the lead tips of the lead frame was large, and the positional accuracy of the lead tips also deteriorated, making it impossible to uniformly fix the leads to the glass material on the insulating substrate.
その為にＤＩＰ型硝子ケースを製造した後の半導体素子
の組立を安定に行なうむとが出来ず、組立工程の自動化
を容易に行なうことも出来なかつた◎
本発明の目的は上述したＤＩＰ型硝子ケースの製造方法
を改良し組立工程における品質の安定化、組立工程の自
動化を計ったＤＩＰ型硝子ケースの製造方法を提供する
ものである。For this reason, it was impossible to stably assemble the semiconductor elements after manufacturing the DIP type glass case, and it was not possible to easily automate the assembly process. The present invention provides a method of manufacturing a DIP type glass case, which improves the manufacturing method of the DIP type glass case, stabilizes quality in the assembly process, and automates the assembly process.
本発明の特徴は、ＤＩＰ型ケースの製造方法において、
硝子封止する領域外に各リード間を固定する連結部を有
するフラットリードフレームを絶縁基板上の硝子材料を
介して固着する工程と、各リード間を固定する連結部を
切断する工程と、所定の位置で折シ曲げる同定を含むＤ
ＩＰ型ケースの製造方法にある。The feature of the present invention is that in the method of manufacturing a DIP type case,
A step of fixing a flat lead frame having connecting portions for fixing each lead outside the area to be sealed with glass through a glass material on an insulating substrate, a step of cutting the connecting portions for fixing each lead, and a step of cutting the connecting portions for fixing each lead to each other. D including the identification of bending at the position of
It is in the manufacturing method of IP type case.
次に本発明の詳細な説明する。第１図に示す様に絶縁基
板ｌ上に硝子材料２ｔ−形成する工程と、第２図に示す
様に硝子材料２と接触しない領域で、しかも所定の位置
で折曲げる部分から離れた位置にリードフレームのリー
ド３間を連結する連結部４を有するフラットリードフレ
ーム５を用いて絶縁基板１上の硝子材料２に固着する工
程と、第３図に示す様に連結部４を切断して所定の位置
で折曲げを行なう工程とを含むＤＩＰｆｆｉ硝子ケース
６の製造方法である。Next, the present invention will be explained in detail. As shown in FIG. 1, the glass material 2t is formed on the insulating substrate l, and as shown in FIG. A process of fixing a flat lead frame 5 having a connecting part 4 connecting between the leads 3 of the lead frame to a glass material 2 on an insulating substrate 1, and cutting the connecting part 4 to a predetermined position as shown in FIG. This is a method of manufacturing a DIPffi glass case 6, including a step of bending at the position.
この様なりＩＰ型硝子ケースの製造方法はリードフレー
ムのリード先端のバラツキがリード間を固定する連結部
で保持されておシ、シかも、リードフレーム製造時のプ
レス工程の歪み奄フラット型リード７レムである為極〈
わずかに押えられ、リードフレームのリード先端位置精
度を確保する仁とが出来るから、絶縁基板上の硝子材料
に均一に固着することが出来る。しかも絶縁基板上の硝
子に７ラツトリ一ドフレーム管固着したのちにＤＩＰ型
硝子ケースを製造するためにリードフレームの折曲げ時
のリード先端のバラツキは発生しない。In this way, the manufacturing method for IP type glass cases is such that the unevenness of the lead tips of the lead frame is held by the connection part that fixes the leads. Rem is a pole
Since it is slightly pressed down and a groove is formed to ensure the accuracy of the position of the lead tip of the lead frame, it is possible to uniformly adhere to the glass material on the insulating substrate. Moreover, since the DIP type glass case is manufactured after the seven-layer lead frame tube is fixed to the glass on the insulating substrate, variations in the lead tips do not occur when the lead frame is bent.
従って、２４リ一ド以上を有するリードフレームの絶縁
基板上の硝子材料の固着が安定にしかも均一に行なう事
が出来る・
以上説明した様にこの発明によるＤＩＰ型硝子ケースの
製造方法は多数リードを有するＤＩＰＩＩ硝子ケースを
品質よく安定に製造することが出来る・ ：・
、Therefore, the glass material on the insulating substrate of a lead frame having 24 leads or more can be stably and uniformly fixed.As explained above, the method for manufacturing a DIP type glass case according to the present invention can have a large number of leads. We can stably manufacture DIP II glass cases with high quality.
,
第１図、第２図および第３図は本発明のＤＩＰ型硝子ケ
ースの製造方法を示す図である。
尚、図において、ｌ・・・・・・絶縁基板、２・・・・
・・硝子材料、３・・・・・・リード、４・・・・・・
連結部、５・・・・・・フラットリードフレーム、６・
・・・・・ＤＩＰｆｌ硝子ケース、７・・・・・・折曲
げ部である。
代理人 弁理士 内 原 晋
１２昭
第３図FIGS. 1, 2, and 3 are diagrams showing a method of manufacturing a DIP type glass case according to the present invention. In the figure, l... insulating substrate, 2...
...Glass material, 3...Lead, 4...
Connection part, 5...Flat lead frame, 6.
...DIPfl glass case, 7...Bent part. Agent Patent Attorney Susumu Uchihara 12th year Figure 3
Claims (1)
するフラットリードフレームを絶縁基板上の硝子材料を
介して固着する工程と、各リード間を固定する該連結部
を切断する工程と、所定の位置で折シ曲げる固定を含む
ことを特徴とするＤＩＰ型ケースの製造方法。A step of fixing a flat lead frame having a connecting portion for fixing between each lead outside the area to be glass-sealed via a glass material on an insulating substrate, and a step of cutting the connecting portion for fixing between each lead, A method for manufacturing a DIP type case, the method comprising fixing the case by bending it at a predetermined position.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17430281A JPS5874061A (en) | 1981-10-29 | 1981-10-29 | Manufacture of dip type case |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17430281A JPS5874061A (en) | 1981-10-29 | 1981-10-29 | Manufacture of dip type case |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5874061A true JPS5874061A (en) | 1983-05-04 |
| JPS6255302B2 JPS6255302B2 (en) | 1987-11-19 |
Family
ID=15976282
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17430281A Granted JPS5874061A (en) | 1981-10-29 | 1981-10-29 | Manufacture of dip type case |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5874061A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6373656A (en) * | 1986-09-17 | 1988-04-04 | Mitsubishi Electric Corp | Semiconductor device and manufacture thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50110772A (en) * | 1974-02-08 | 1975-09-01 | ||
| JPS5159269A (en) * | 1974-11-20 | 1976-05-24 | Nippon Electric Co | Handotaisochino seizohoho |
| JPS5386575A (en) * | 1977-01-10 | 1978-07-31 | Mitsubishi Electric Corp | Production of semiconductor device |
| JPS5390867A (en) * | 1977-01-21 | 1978-08-10 | Hitachi Ltd | Glass hermetic sealing for lead wire |
-
1981
- 1981-10-29 JP JP17430281A patent/JPS5874061A/en active Granted
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50110772A (en) * | 1974-02-08 | 1975-09-01 | ||
| JPS5159269A (en) * | 1974-11-20 | 1976-05-24 | Nippon Electric Co | Handotaisochino seizohoho |
| JPS5386575A (en) * | 1977-01-10 | 1978-07-31 | Mitsubishi Electric Corp | Production of semiconductor device |
| JPS5390867A (en) * | 1977-01-21 | 1978-08-10 | Hitachi Ltd | Glass hermetic sealing for lead wire |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6373656A (en) * | 1986-09-17 | 1988-04-04 | Mitsubishi Electric Corp | Semiconductor device and manufacture thereof |
| JPH0622266B2 (en) * | 1986-09-17 | 1994-03-23 | 三菱電機株式会社 | Semiconductor device and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6255302B2 (en) | 1987-11-19 |
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