JP2000164740A - Hermetic package and manufacture thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make the overall structure thin and avoid variation in electronic element characteristics by providing electrodes led out of an insulative base, metal caps fixed to seal openings, and an integrated installing strip having a thermal expansion coefficient nearly equal to that of the insulative base. SOLUTION: Ceramic and glass powders are kneaded to prepare a glass- ceramic insulative base 1, having a thermal expansion coefficient of 10-14×10-6/ deg.C which comprises a bottom 2 and a frame 3. Electrode-forming recesses are formed at both sides of the length and recesses 6, 7 for receiving grounding strips formed at both sides of the width are provided. A conductive paste is coated at isolated positions on the upper face of the bottom 2, to form baked electrodes one of which extends to the back of bottom via the end face of the recess and the other of which extends to the back of the bottom 2 after running around beneath the frame 3 and passing over the end face of the other recess. Supports for electronic elements 11, made of the same material and at the same time as the electrodes, are provided.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an airtight package in which an electronic element such as a quartz oscillator is sealed in an insulating base and sealed with a cap. The present invention also relates to a method for manufacturing an airtight package in which an electronic element such as a crystal resonator element is sealed in an insulating base and sealed with a cap.

[0002]

2. Description of the Related Art As an airtight package for a crystal unit,
Some include an insulating base, a conductor led out of the insulating base to the outside of the insulating base, and a cap sealed in an opening of the insulating base. A typical example of such an airtight package will be described below. FIG.
1 is a plan view of the conventional hermetic package with the cap removed, and FIG. 12 is a longitudinal sectional view taken along the line CC of FIG. 11 in a state where the cap is added to the hermetic package of FIG. In the figure, reference numeral 31 denotes an insulating base such as alumina ceramic, which has a bottom portion 32 and a frame portion 33. Reference numerals 34 and 35 denote electrodes formed by baking a conductive paste drawn out from the inside of the insulating base 31 to the outside of the insulating base 31. Reference numeral 36 shown by a dashed line denotes a crystal vibrating element or the like connected and fixed to the electrodes 34 and 35. The electronic element 37 is an insulating cap made of alumina ceramic fixed and sealed in the opening of the insulating base 31 via an adhesive 38 such as glass or resin.

[0003] In the airtight package having the above configuration,
Since the cap 37 is an insulating material made of alumina ceramic or the like, not only is there a limit to the reduction in thickness, but also due to the influence of stray capacitance and external electromagnetic waves, fluctuations in the frequency characteristics of the electronic element 36 such as a crystal vibrating element, etc. There is a problem that characteristic fluctuation occurs. In order to solve the former problem among the above problems, for example, grounding using a metal cap may be considered. However, since the difference between the thermal expansion coefficients of the alumina ceramic and the metal constituting the insulating base 1 is large, stress is generated, and a new problem occurs in that the stress causes a change in the characteristics of the electronic element 36. . In order to solve the latter problem, for example,
It is conceivable to form a metal layer on the inner surface of the insulating cap 37 and ground this metal layer. However, in such a structure, the cap becomes thicker. Further, regardless of whether a metal cap is used or a metal layer is formed on the inner surface of the insulating cap, only a conductive adhesive such as solder or conductive resin can be used as the adhesive 38, and the adhesive 38 is grounded. There is a new problem that a means for performing such operations is required.

[0004]

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a hermetic package in which the thickness of the whole hermetic package is reduced and in which characteristics of electronic elements do not fluctuate due to stray capacitance or external electromagnetic waves. Another object of the present invention is to provide a method for manufacturing the above-mentioned hermetic package.

[0005]

According to a first aspect of the present invention, there is provided an insulating base, an electrode extending from the inside of the insulating base to the outside of the insulating base, and an opening of the insulating base. A hermetically sealed package having a fixedly sealed cap, wherein the cap is a metal cap having a thermal expansion coefficient similar to that of the insulating base, and a ground strip is provided integrally with the metal cap. It is an airtight package.

According to a second aspect of the present invention, there is provided an insulating base, an electrode extending from the inside of the insulating base to the outside of the insulating base, and a cap fixedly sealed to an opening of the insulating base. In the hermetic package having the above, the cap is a metal cap having a thermal expansion coefficient similar to that of the insulating base, and a grounding strip integrated with the metal cap is provided, and the grounding strip is formed of the insulating base. An airtight package characterized by protruding from a lower surface of an insulating base through a side surface.

According to a third aspect of the present invention, there is provided an insulating base, an electrode extending from the inside of the insulating base to the outside of the insulating base, and a cap fixedly sealed in an opening of the insulating base. In the hermetic package having the above, the cap is a metal cap having a thermal expansion coefficient similar to that of the insulating base, and a grounding strip integrated with the metal cap is provided, and the grounding strip is formed of the insulating base. An airtight package characterized in that it protrudes from the lower surface of the insulating base through the side surface and that the tip of the ground strip is tapered more than other portions.

According to a fourth aspect of the present invention, there is provided an insulating base, an electrode extending from the inside of the insulating base to the outside of the insulating base, and a cap fixedly sealed to an opening of the insulating base. In the hermetic package having the above, the cap is a metal cap having a thermal expansion coefficient similar to that of the insulating base, and a grounding strip integrated with the metal cap is provided, and the grounding strip is formed of the insulating base. An airtight package characterized in that a mechanically fragile portion is provided at a boundary portion between a metal cap and a ground strip, which passes through a side surface, as compared with other portions.

According to a fifth aspect of the present invention, there is provided an insulating base, an electrode extending from the inside of the insulating base to the outside of the insulating base, and a cap fixedly sealed in an opening of the insulating base. Wherein the cap is a metal cap having a thermal expansion coefficient similar to that of the insulating base, and a grounding strip integrated with the metal cap is provided, and the grounding strip is provided on a side surface of the insulating base. An airtight package having a concave portion for receiving a strip.

According to a sixth aspect of the present invention, there is provided an insulating base, an electrode extending from the inside of the insulating base to the outside of the insulating base, and a cap fixedly sealed to an opening of the insulating base. Wherein the cap is a metal cap having a thermal expansion coefficient similar to that of the insulating base, and a method of manufacturing an airtight package provided with a ground strip integrally formed with the metal cap. A step of forming a metal frame in which the cap and the grounding strip are integrally connected, a step of separating the metal cap and the grounding strip from the metal frame as a unit, and an integrated body of the metal cap and the grounding strip. And a step of firmly sealing the opening in the opening of the base.

An insulating base, an electrode extending from the inside of the insulating base to the outside of the insulating base, and a cap fixedly sealed in an opening of the insulating base, wherein the cap is formed of the insulating base A method for manufacturing a hermetic package having a metal cap having a thermal expansion coefficient similar to that of a base, and a ground strip provided integrally with the metal cap, wherein a step of preparing a metal strip having a predetermined width and thickness is provided. Manufacturing a metal frame in which a metal cap and a grounding strip are integrally connected to the metal strip, and sealingly sealing the integrated body of the metal cap and the grounding strip to an opening of the insulating base. And a step of integrally separating the metal cap and the ground strip from the metal frame.

[0012]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below.
This will be described with reference to the drawings. FIG. 1 shows an airtight package A according to a first embodiment of the present invention.
2 is a plan view of the hermetic package A according to the first embodiment of the present invention with the metal cap removed, and FIG. 3 is a longitudinal sectional view of the hermetic package A of FIG. 2 taken along the line BB. FIG. 4 is a front view of the hermetic package A of FIG. In the figure, reference numeral 1 denotes an insulating base made of a glass ceramic kneaded with ceramic powder and glass powder and having a coefficient of thermal expansion of 10 to 14 × 10 ⁻⁶ / ° C., having a bottom 2 and a frame 3. 4,
5 is a recess for forming an electrode formed on both sides in the longitudinal direction of the insulating base 1, and 6 and 7 are for receiving grounding strips described later formed on both sides in the short direction of the base 1. Of the recess. Reference numerals 8 and 9 denote electrodes formed by applying and baking a conductive paste at spaced positions on the upper surface of the bottom 2, and one electrode 8 is formed to extend to the back surface of the bottom 2 through the end surface of the recess 4. ing. The other electrode 9 bypasses the bottom of the frame 3 and passes through the end face of the other recess 5 to form the bottom 2.
Is formed so as to extend to the back surface. 10 is electrodes 8, 9
And a support portion for an electronic element such as a crystal vibrating element called a “pillow” formed simultaneously with the same material. Numeral 11 indicated by a two-dot chain line is an electronic element such as a quartz vibrating element which is connected and fixed to the electrodes 8 and 9 with a conductive adhesive or the like. Reference numeral 12 denotes an adhesive formed on the upper surface of the frame 3 such as solder, low-melting glass, resin, or the like. Reference numeral 13 denotes a metal cap made of stainless steel or the like containing 17.00 to 19.00% of Cr whose thermal expansion coefficient is fixed to the frame body portion 3 via the adhesive 12 and whose thermal expansion coefficient is similar to that of the insulating base 1. It is. here,
Grounding strips 14 are formed integrally with the metal cap 13 at a position １ ／ of the length in the short direction, and the grounding strips 14 are formed on the side surface of the insulating base 1. And projecting from the lower surface of the insulating base 1 through the recesses 6 and 7 formed in the insulating base 1. Further, the tip portions 14a, 14a of the ground strips 14, 14 are formed in a knife edge shape, which is an example of a taper shape than other portions.

In the hermetic package A having the above structure,
Since the thermal expansion coefficients of the insulating base 1 and the metal cap 13 are substantially the same, the insulating base 1 and the metal cap 13
Can be directly bonded and sealed with the adhesive 12 without using an intermediate metal body. Also, since the metal cap 13 is used,
Compared to a conventional insulating cap made of alumina ceramic or the like, the thickness can be reduced, and the entire hermetic package can be reduced in thickness. Further, since the grounding strips 14 are provided integrally with the metal cap 13, the grounding strips 1 are provided.
By grounding the terminals 4 and 14, it is possible to prevent the characteristics of the electronic element 11 from fluctuating due to stray capacitance and external electromagnetic waves. Furthermore, since the metal cap 13 is grounded via the grounding strips 14, 14, the adhesive 1 for sealing the metal cap 13 is used.
As 2, not only a conductive adhesive such as a solder or a conductive resin but also a non-conductive adhesive such as a low-melting glass or a normal resin adhesive can be used. Furthermore, the ground strip 1
Since the tips 14a, 14a of the four, 14 are formed in the shape of a knife edge, when the ground strips 14, 14 are inserted into a through hole of a printed circuit board or the like, the insertion work becomes easy. In the above embodiment, the coefficient of thermal expansion is 10 to 1
4 × 10 ^-6 / ° C glass ceramic insulating base 1
And the case where the metal cap 13 made of stainless steel having the same coefficient of thermal expansion is combined. When the insulating base 1 is made of alumina ceramic, the metal cap 13 is made of nickel / iron having the same coefficient of thermal expansion. Alloy or iron / nickel / cobalt alloy.

FIG. 5 is a front view of an airtight package B according to a second embodiment of the present invention. This embodiment is shown in FIGS.
The shapes of the ground strips 15 are different from those of the embodiment shown in FIG. That is, the grounding strips 14, 14 of the embodiment shown in FIGS. 1 to 4 are formed to have the same width as a whole, but each of the distal end portions 1 of the grounding strips 15, 15 of the present embodiment.
5a and 15a are formed in a tapered shape in which the width is gradually reduced as an example of a tapered shape as compared with other portions. Also, the boundary between the metal cap 13 and the ground strips 15, 15 is
As an example of 5b and 15b, it is formed narrower than other portions. According to the above configuration, the ground strips 15, 15
Are formed in a tapered shape whose width gradually decreases, so that when the ground strips 15, 15 are inserted into through holes of a printed circuit board or the like, the insertion work is extremely easy and reliable. There is a feature that can be done. Also,
Since the boundary between the metal cap 13 and the ground strips 15 is formed narrower than other parts as an example of the fragile parts 15b, 15b, the metal cap 13 of the ground strips 14, 14 is formed. There is a feature that the bending can be easily performed at a boundary portion between the adhesive 12 and the adhesive material 12 and the metal cap does not crack due to the bending operation. In addition, each tip part 15 of the above-mentioned grounding strip 15, 15
a, 15a, and the narrow brittle portions 15b, 15 at the boundaries between the metal cap 13 and the ground strips 15, 15.
b may be implemented separately.

FIG. 6 is a longitudinal sectional view corresponding to FIG. 1 of an airtight package C according to a third embodiment of the present invention. In this embodiment, the lower ends of the grounding strips 16, 16 integrated with the metal cap 13 are bent into a “J BEND type” shape. Therefore, as compared with the embodiment shown in FIGS. 1 to 5, there is a feature that surface mounting becomes possible.

FIG. 7 shows a hermetic terminal D according to a fourth embodiment of the present invention.
FIG. In this embodiment, the lower ends 17a, 17a of the ground strips 17, 17 integrated with the metal cap 13 are shorter than the lower end of the insulating base 1, and
At the boundary with the narrow portions 17b, 1
7b. Also, in the recesses 6 and 7 of the insulating base 1,
A ground electrode 18 extending to the back surface of the insulating base 1;
The lower ends of the ground strips 17 are connected and fixed to the ground electrodes 18 by solder or the like (not shown). According to this embodiment, FIGS.
Ground strips 14, 14, 15, 15, 16,
Compared with 16, the ground strips 17 can be shortened, and the material cost can be reduced. In particular, ground strips 17,
In the case where 17 is manufactured by pressing or etching integrally with the metal cap 13 from a frame material to be described later, there is a feature that the utilization rate of the material is improved and the cost can be reduced.

FIG. 7 shows an airtight package of the present invention, in particular,
FIG. 9 is a plan view of a metal frame for describing an embodiment of a method of manufacturing the ground strips 14 integrated with the metal cap 13, and FIG. 9 is a process block diagram. In the figure,
First, in a first step, an insulating base 1 made of glass ceramic is used.
A metal strip 20 having a thermal expansion coefficient similar to the above is prepared (a). Next, in the second step, the metal cap 13 and the ground strips 14 are integrally formed by mechanical pressing or etching on both sides in the width direction on both sides in the width direction. The formed metal frame 23 is manufactured (b). In the drawing, reference numeral 24 denotes a band-like portion 21 for intermittently transporting the metal frame 23 at a constant pitch.
22 is a sprocket, 25 is a metal frame 23
This is a bridging strip for maintaining the mechanical strength of the bridge. After this, the third
In the process, the ground strip 1 is removed from the metal frame 23.
4 and 14 are cut by mechanical pressing or etching as indicated by alternate long and short dash lines 26 and 26. Then, a metal cap 13 and the grounding strips 14, 14 are obtained integrally (c). Therefore, if this integrated material is sealed on the frame portion 3 of the insulating base 1 with the adhesive 12 (d), the hermetic package A of FIG. 1 is obtained (e).

In the above embodiment, the metal cap 13
And the ground strips 14 and 14 are cut off and then sealed in the frame 3 of the insulating base 1.
A plurality of insulating bases 1 are manufactured in a connected manner, while a plurality of insulating bases 1 and a plurality of metal caps 13 are formed using a metal frame 23 having a plurality of metal caps 13 and ground strips 14, 14. And simultaneously or sequentially sealed,
After a plurality of hermetic packages are manufactured, the portions of the ground strips 14, 14 close to the strips 21, 22 may be cut as indicated by alternate long and short dash lines 26, 26. That is, as shown in FIG. 10, first, a metal strip 20 having a thermal expansion coefficient similar to that of the insulating base 1 made of glass ceramic is prepared in the first step (a). Next, in the second step, the metal cap 13 and the ground strips 14 are integrally formed by mechanical pressing or etching on both sides in the width direction on both sides in the width direction. The formed metal frame 23 is manufactured (b). In the drawing, reference numeral 24 denotes a sprocket formed on the strips 21 and 22 for intermittently transporting the metal frame 23 at a constant pitch, and reference numeral 25 denotes a bridging strip for maintaining the mechanical strength of the metal frame 23. . Thereafter, in a third step, the metal cap 13 and the grounding strips 14, 14 of the metal frame 23 are formed.
An adhesive 12 is placed on the frame 3 of the insulating base 1.
(C). Thereafter, the strips 21, 22 of the ground strips 14, 14 in the metal frame 23.
Are cut by a mechanical press or the like as shown by the dashed lines 26, 26 (d). Then, the ground strip 1
An airtight package A shown in FIG. 1 is obtained in which the metal cap 13 integrated with 4, 4 is sealed in the opening of the frame 3 of the insulating base 1 (e).

In both of the above-described manufacturing methods, the strip-shaped portions 21 of the ground strips 14 of the metal strip 20 can be used.
As shown by a two-dot chain line 27, 27 in FIG. 8, a solder tape is applied to a portion close to 22 to produce a metal frame 23, and then the ground strips 14, 14 are cut. Since the solder can be present at the tips of the grounding strips 14 after cutting, the grounding strips 14 are connected and fixed to a printed circuit board or the like after the airtight package A is manufactured. There is a feature that the step of applying solder plating to the tips of the strips 14, 14 can be omitted.

Although the above embodiment has been described with respect to a hermetic package having a specific structure, the present invention is not limited to such a structure, and is applicable to hermetic packages having various structures without departing from the spirit of the present invention. it can. For example, FIG.
In place of the single supporting portion 10, a plurality of supporting portions may be provided. In addition, electrodes 8 and 9 having a predetermined height are made of only a conductive material.
Instead of forming the supporting portion 10, steps or projections for the electrode and the supporting portion having a predetermined height are formed integrally with the bottom portion 2 around the upper surface of the bottom portion 2 of the insulating base 1. ,
An electrode material may be applied thereon to form an electrode and a support. According to such a configuration, only the thin conductive layer is formed on the step or the convex portion for the electrode and the support portion having the predetermined height, and as a result, the electrode and the support portion having the predetermined height are formed. It can be formed, reducing the amount of expensive conductive materials used,
The feature is that the cost can be reduced. Further, instead of the electrodes 8 and 9 on the center lines at both ends in the longitudinal direction of the rear surface of the insulating base 1 as shown in FIG. 1, electrodes may be formed on diagonal portions of the rear surface of the insulating base 1. Furthermore, the weak portion at the boundary between the ground strip and the metal cap 13 may be formed not only in a narrow shape but also in a small cross section by etching or notching, or may be formed in a narrow shape. And a small cross section by etching or notching may be used in combination.

[0021]

As described above, the present invention provides an insulating base, an electrode extending from the inside of the insulating base to the outside of the insulating base, and a cap fixedly sealed in an opening of the insulating base. Since the cap is a metal cap having a thermal expansion coefficient similar to that of the insulating base, and a ground strip integrally provided with the metal cap, the cap is a hermetic package. By adopting the cap, the cap can be made thinner, and accordingly, the entire hermetic package can be made thinner.In addition, the grounding strip integrated with the metal cap is grounded, resulting in stray capacitance and extraneous electromagnetic waves. Variations in the characteristics of the electronic element can be prevented. Furthermore, since the metal cap is grounded via the ground strip, not only a conductive adhesive such as solder or conductive resin but also a non-conductive glass such as low melting point glass or resin can be used as an adhesive for cap sealing. There are various effects that a conductive adhesive can also be used. The present invention also includes an insulating base, an electrode led out of the insulating base to the outside of the insulating base, and a cap fixedly sealed to an opening of the insulating base, wherein the cap is A method for manufacturing a hermetic package having a metal cap having a coefficient of thermal expansion similar to that of an insulating base and a ground strip integrated with the metal cap, wherein a metal strip having a predetermined width and thickness is prepared. A step of manufacturing a metal frame in which a metal cap and a ground strip are integrally connected to the metal strip, a step of integrally separating the metal cap and the ground strip from the metal frame, and A method for manufacturing a hermetic package, characterized in that the hermetic package has a step of fixing and sealing an integral body of a cap and a ground strip to an opening of the base. There is an effect that kill. The present invention also includes an insulating base, an electrode led out of the insulating base to the outside of the insulating base, and a cap fixedly sealed to an opening of the insulating base, wherein the cap is A method for manufacturing a hermetic package having a metal cap having a coefficient of thermal expansion similar to that of an insulating base and a ground strip integrated with the metal cap, wherein a metal strip having a predetermined width and thickness is prepared. A step of manufacturing a metal frame in which a metal cap and a grounding strip are integrally connected to the metal strip, and fixing the integrated body of the metal cap and the grounding strip to an opening of the insulating base. Since the method for manufacturing an airtight package includes a step of sealing and a step of integrally separating the metal cap and the ground strip from the metal frame, the airtight package having the above structure can be easily manufactured. And efficiently an effect that can be produced.

[Brief description of the drawings]

FIG. 1 is a longitudinal sectional view of an airtight package A according to a first embodiment of the present invention, taken along line AA of FIG. 2;

FIG. 2 is a plan view of the airtight package A according to the first embodiment of the present invention, from which a metal cap is removed.

FIG. 3 is a longitudinal sectional view of the hermetic package A according to the first embodiment of the present invention, taken along line BB of FIG. 2;

FIG. 4 is a front view of the airtight package A according to the first embodiment of the present invention.

FIG. 5 is a front view of an airtight package B according to a second embodiment of the present invention.

FIG. 6 is a longitudinal sectional view corresponding to FIG. 1 of an airtight package C according to a third embodiment of the present invention.

FIG. 7 is a front view of an airtight package D according to a fourth embodiment of the present invention.

FIG. 8 is a plan view of a metal frame for explaining a manufacturing method according to an embodiment of the present invention.

FIG. 9 is a process block diagram for describing a manufacturing method according to one embodiment of the present invention.

FIG. 10 is a process block diagram for explaining a manufacturing method according to another embodiment of the present invention.

FIG. 11 is a plan view of a conventional hermetic package with a cap removed.

FIG. 12 is a vertical cross-sectional view of the hermetic package to which a conventional cap is added, taken along line CC in FIG. 11;

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 insulating base 6, 7 recess for receiving strip for grounding 8, 9 electrode 11 electronic element (crystal vibrating element) 12 adhesive 13 metal cap 14, 15, 16, 17 grounding strip 14 a taper (knife edge shape) 15a Tapered part 15b, 17b Fragile part (narrow part) 20 Metal strip 23 Metal frame

Claims (7)

[Claims] 1. An airtight package having an insulating base, an electrode extending from the inside of the insulating base to the outside of the insulating base, and a cap fixedly sealed in an opening of the insulating base. A hermetic package characterized in that a metal cap having a thermal expansion coefficient similar to that of the insulating base is provided, and a ground strip is provided integrally with the metal cap. 2. An airtight package having an insulating base, an electrode extending from the inside of the insulating base to the outside of the insulating base, and a cap fixedly sealed in an opening of the insulating base. Is a metal cap having a coefficient of thermal expansion similar to that of the insulating base, and a grounding strip integral with the metal cap is provided. The grounding strip passes through the side surface of the insulating base and the lower surface of the insulating base. An airtight package characterized by being more protruding. 3. An airtight package having an insulating base, an electrode led out of the insulating base to the outside of the insulating base, and a cap fixedly sealed in an opening of the insulating base. Is a metal cap having a coefficient of thermal expansion similar to that of the insulating base, and a grounding strip integral with the metal cap is provided. The grounding strip passes through the side surface of the insulating base and the lower surface of the insulating base. An airtight package characterized in that the tip of the ground strip is more tapered than other portions. 4. An airtight package having an insulating base, an electrode led out of the insulating base to the outside of the insulating base, and a cap fixedly sealed in an opening of the insulating base. Is a metal cap having a thermal expansion coefficient similar to that of the insulating base, and a grounding strip integrated with the metal cap is provided. An airtight package characterized in that a mechanically fragile portion is provided at a boundary portion between the strip and the other portion. 5. An airtight package having an insulating base, an electrode extending from the inside of the insulating base to the outside of the insulating base, and a cap fixedly sealed in an opening of the insulating base. Is a metal cap having a thermal expansion coefficient similar to that of the insulating base, and a grounding strip integrated with the metal cap is provided, and a concave portion for receiving the grounding strip is provided on a side surface of the insulating base. Airtight package characterized by: 6. An insulating base, an electrode led out from the inside of the insulating base to the outside of the insulating base, and a cap fixedly sealed in an opening of the insulating base, wherein the cap is A method for manufacturing a hermetic package having a metal cap having a thermal expansion coefficient similar to that of an insulating base, and a ground strip provided integrally with the metal cap, wherein a metal strip having a predetermined width and thickness is prepared. A step of manufacturing a metal frame in which a metal cap and a ground strip are integrally connected to the metal strip, a step of integrally separating the metal cap and the ground strip from the metal frame, and And a step of fixing and sealing an integral body of the cap and the ground strip to the opening of the insulating base. 7. An insulating base, an electrode led out of the insulating base to the outside of the insulating base, and a cap fixedly secured to an opening of the insulating base, wherein the cap is A method for manufacturing a hermetic package having a metal cap having a thermal expansion coefficient similar to that of an insulating base, and a ground strip provided integrally with the metal cap, wherein a metal strip having a predetermined width and thickness is prepared. A step of manufacturing a metal frame in which a metal cap and a grounding strip are integrally connected to the metal strip, and fixing the integrated body of the metal cap and the grounding strip to an opening of the insulating base. A method for manufacturing an airtight package, comprising: a step of sealing; and a step of integrally separating the metal cap and the ground strip from a metal frame.