JPH0416496Y2 - - Google Patents

Description

[Detailed Description of the Invention] Industrial Application Field This invention relates to a flat package, and more specifically, is suitable for a crystal resonator in which a package body and a cap are sealed with a low melting point glass interposed therebetween.

2. Description of the Related Art In electronic components such as semiconductor devices and crystal resonators, semiconductor elements and elements such as crystal pieces are packaged because their characteristics change due to moisture or the like. Some products are packaged with resin, but in terms of reliability, they are inferior to those sealed in can cases or ceramic packages, so can cases or ceramic packages are used for applications that require high reliability. ing. However, with can cases and ceramic package cages,
Although moisture does not infiltrate, as disclosed in Japanese Utility Model Publication No. 1973-36187, if the device is sealed with solder, the flux vapor will deteriorate the device, so a device sealed with glass is considered. There is.

FIG. 7 shows a plan view of an example of a conventional glass-sealed ceramic flat package with the cap removed, and FIG. 8 shows a sectional view corresponding to the line -- in FIG. In the figure, 1 is the package body, and a pair of Kovar, 42 alloys (Fe: 58%, Ni: 42%) are placed between the bottom plate 2 made of ceramic such as alumina or steatite and the frame 3 with a glass 4 interposed therebetween. )
The leads 5 and 6 are hermetically sealed. A cap 7 made of ceramic such as alumina or steatite is hermetically sealed to the frame 3 via a low-melting glass 8. In the figure, a chain double-dashed line 9 indicates a crystal piece, which is electrically and mechanically connected and fixed across the pair of leads 5 and 6 via a conductive adhesive or the like.

Problems to be Solved by the Invention Incidentally, in the flat package described above, the leads 5 and 6 are manufactured by pressing or etching a plate material having a constant width W, as shown in FIG. is extremely large, and since each lead 5, 6 has a large-diameter circular arc portion 5a, 6a in the center, the pitch P is also large, and the material utilization rate is extremely poor, resulting in a high cost of the leads 5, 6. There was a problem with that.

In addition, the leads 5 and 6 are often directly inserted into through-holes in printed circuit boards, etc., and require a certain level of mechanical strength. There was also the problem that the crystal element 9 became close to being supported by a rigid body, and the vibration of the crystal element 9 was hindered.

Means for Solving the Problems Therefore, this invention is characterized in that the inner ends of the plate leads are made free ends, and a support member is fixed between the free ends of the inner ends of the opposing plate leads. It is something.

Effect: According to the above means, the plate leads can be formed in a comb-like and staggered shape, and the width of the plate material for manufacturing the plate leads is reduced, and the pitch is also reduced, so the material utilization rate is increased. This is a significant improvement, and the cost of plate leads can be reduced. Furthermore, since the support member is connected between the plate leads, the mechanical strength of the support member can be set independently of the mechanical strength of the plate leads, so that the vibration of the crystal piece is not hindered.

Embodiment Hereinafter, an embodiment of this invention will be described with reference to the drawings.

FIG. 1 is a plan view of the flat package with the cap removed, and FIG. 2 is a sectional view taken along the line -- in FIG. The figure is the same as FIGS. 7 and 8 except for the leads, and the same parts are given the same reference numerals and their explanations will be omitted. The leads of this embodiment are two pairs of plate leads 10a, 10b and 1 whose inner ends are free ends.
1a and 11b are sealed with glass 4, and between the free ends of plate leads 10a and 10b and plate lead 1.
A phosphor bronze wire between the free ends of 1a and 11b, respectively;
Support members 12 and 13 made of piano wire or the like are connected and fixed. Then, the front and back electrodes of the crystal blank 9 are connected to support members 12 and 1 by conductive adhesive or the like.
3 is electrically and mechanically connected and fixed. In this case, if the ends of the front and back electrodes of the crystal piece 9 are terminated on the same main surface, the support members 12, 1
It becomes easier to connect and fix the connection to 3.

FIGS. 3 to 6 show plan views of essential parts at each stage for explaining the method of manufacturing the lead. First, as shown in FIG.
A plate material made of Kovar, 42 alloy, etc. is prepared, and the plate lead 10a, is formed by pressing or etching.
A lead frame 16 is produced in which the lead frames 10b, 11a, and 11b are formed in a ladder shape and alternate, and both ends of each are connected and integrated with bridging members 14 and 15. The width W and pitch P of this lead frame 16 are extremely small compared to the width W and pitch P of the conventional lead frame shown in FIG. do. Next, when cutting at the dashed-dotted lines 17 and 18 in FIG. 3, as shown in FIG.
Comb blade-shaped lead frames 16a and 16b each having an integrated lead frame 1b are obtained. As shown in FIG.
The free ends of the two are arranged opposite each other at a predetermined distance L. In this state, as shown in FIG.
Support members 12 and 13 made of phosphor bronze wire, piano wire, etc. are welded and fixed between the free ends of b and between the free ends of plate leads 11a and 11b, respectively. Next, the dashed dotted line 19 of the bridging members 14, 15 in FIG.
When 20 points are cut, the result is as shown in Figure 6.
A set of lead assemblies 21 is obtained. After that, this lead assembly 21 is hermetically sealed between the bottom plate 2 and the frame 3 via the glass 4 in the same manner as the conventional lead frame shown in FIG.
By cutting from point 23, the flat package main body 1 is obtained.

Note that the support members 12 and 13 may have shapes other than the illustrated example.

Effects of the invention As described above, this invention can significantly reduce the width of the member forming the plate lead and significantly improve material utilization.Furthermore, since the crystal piece is supported by a Zapoto member separate from the plate lead, The mechanical strength of the support member can be set independently of the mechanical strength of the lead, and the vibration of the crystal piece is not hindered.

[Brief explanation of drawings]

Figure 1 is a plan view of a flat package according to an embodiment of this invention, with the cap removed.
It is a sectional view corresponding to the - line in the figure. FIGS. 3 to 6 are plan views of essential parts at each stage for explaining the manufacturing method of the lead assembly used in this invention. Figure 7 is a plan view of a conventional flat package with the cap removed, and Figure 8 is a -
FIG. FIG. 9 is a plan view of a lead frame used in a conventional flat package. 1...Flat package body, 2...Bottom plate,
3...Frame body, 4...Glass, 7...Cap, 8
...Low melting point glass, 10a, 10b, 11a, 1
1b...Plate lead, 12, 13...Support member.

Claims (1)

[Scope of Claim for Utility Model Registration] A flat package consisting of a flat package body in which a plate lead is hermetically sealed via glass, and a cap sealed via low melting point glass, wherein the plate lead is sealed within the flat package body. What is claimed is: 1. A flat package cage, characterized in that the flat package is arranged so that one end is a free end, and a support member is fixed between the free ends of the inner ends of opposing plate leads.