JPS6436650A - Polyphenylene sulfide resin composition - Google Patents
Polyphenylene sulfide resin compositionInfo
- Publication number
- JPS6436650A JPS6436650A JP19143887A JP19143887A JPS6436650A JP S6436650 A JPS6436650 A JP S6436650A JP 19143887 A JP19143887 A JP 19143887A JP 19143887 A JP19143887 A JP 19143887A JP S6436650 A JPS6436650 A JP S6436650A
- Authority
- JP
- Japan
- Prior art keywords
- polyphenylene sulfide
- sulfide resin
- composition
- 100mum
- incorporating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
PURPOSE:To obtain a composition with improved moisture resistance and reduced internal stress, suitable as a material for semiconductor sealing, by incorporating a polyphenylene sulfide resin with silica-based filler and glass fiber of short fiber length. CONSTITUTION:The objective composition can be obtained by incorporating (A) a polyphenylene sulfide resin with (B) 10-60wt.% of glass fiber with a diameter of 5-20mum so that the average fiber length become <=100mum in the final molded article and (C) 10-60wt.% of rectangular silica-based filler with an average particle size of <=50mum and content of particles having a size of >=100mum being <=1wt.% totaling 30-80wt.% for the components B and C. Using this composition, two molded plates either or both of which have recess well for housing semiconductors are made and a lead frame fitted with semiconductors is put between the two plates followed by heating to melt them to combine into one, thus producing a semiconductor sealed article.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19143887A JPS6436650A (en) | 1987-07-30 | 1987-07-30 | Polyphenylene sulfide resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19143887A JPS6436650A (en) | 1987-07-30 | 1987-07-30 | Polyphenylene sulfide resin composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6436650A true JPS6436650A (en) | 1989-02-07 |
Family
ID=16274624
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19143887A Pending JPS6436650A (en) | 1987-07-30 | 1987-07-30 | Polyphenylene sulfide resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6436650A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0385221A2 (en) * | 1989-02-22 | 1990-09-05 | Idemitsu Petrochemical Co. Ltd. | Polyarylene sulfide resin compositions and molded articles |
| JP2002037620A (en) * | 2000-07-25 | 2002-02-06 | Ube Nitto Kasei Co Ltd | Spherical silica particle bulk materials and method of preparing it and resin composition using it |
| WO2005103160A1 (en) | 2004-04-26 | 2005-11-03 | Toho Chemical Industry Co., Ltd. | Biodegradable resin composition |
| KR100730855B1 (en) * | 2003-10-27 | 2007-06-20 | 미쓰비시 쥬시 가부시끼가이샤 | Reflective film |
-
1987
- 1987-07-30 JP JP19143887A patent/JPS6436650A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0385221A2 (en) * | 1989-02-22 | 1990-09-05 | Idemitsu Petrochemical Co. Ltd. | Polyarylene sulfide resin compositions and molded articles |
| JP2002037620A (en) * | 2000-07-25 | 2002-02-06 | Ube Nitto Kasei Co Ltd | Spherical silica particle bulk materials and method of preparing it and resin composition using it |
| KR100730855B1 (en) * | 2003-10-27 | 2007-06-20 | 미쓰비시 쥬시 가부시끼가이샤 | Reflective film |
| WO2005103160A1 (en) | 2004-04-26 | 2005-11-03 | Toho Chemical Industry Co., Ltd. | Biodegradable resin composition |
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