FR2782812B1 - Dispositif electronique pour transferer un signal numerique - Google Patents

Dispositif electronique pour transferer un signal numerique

Info

Publication number
FR2782812B1
FR2782812B1 FR9904015A FR9904015A FR2782812B1 FR 2782812 B1 FR2782812 B1 FR 2782812B1 FR 9904015 A FR9904015 A FR 9904015A FR 9904015 A FR9904015 A FR 9904015A FR 2782812 B1 FR2782812 B1 FR 2782812B1
Authority
FR
France
Prior art keywords
transferring
electronic device
digital signal
digital
signal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
FR9904015A
Other languages
English (en)
Other versions
FR2782812A1 (fr
Inventor
Kanji Otsuka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kanji Otsuka Jp
NEC Corp
Sharp Corp
Sony Corp
Fujitsu Semiconductor Ltd
Renesas Electronics Corp
Lapis Semiconductor Co Ltd
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP1998087457A external-priority patent/JP3480306B6/ja
Application filed by Individual filed Critical Individual
Publication of FR2782812A1 publication Critical patent/FR2782812A1/fr
Application granted granted Critical
Publication of FR2782812B1 publication Critical patent/FR2782812B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dc Digital Transmission (AREA)
  • Memory System (AREA)
FR9904015A 1998-03-31 1999-03-31 Dispositif electronique pour transferer un signal numerique Expired - Lifetime FR2782812B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1998087457A JP3480306B6 (ja) 1998-03-31 電子装置

Publications (2)

Publication Number Publication Date
FR2782812A1 FR2782812A1 (fr) 2000-03-03
FR2782812B1 true FR2782812B1 (fr) 2005-08-26

Family

ID=13915408

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9904015A Expired - Lifetime FR2782812B1 (fr) 1998-03-31 1999-03-31 Dispositif electronique pour transferer un signal numerique

Country Status (3)

Country Link
US (2) US6522173B1 (fr)
DE (1) DE19914305B4 (fr)
FR (1) FR2782812B1 (fr)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6480548B1 (en) * 1997-11-17 2002-11-12 Silicon Graphics, Inc. Spacial derivative bus encoder and decoder
US7031420B1 (en) 1999-12-30 2006-04-18 Silicon Graphics, Inc. System and method for adaptively deskewing parallel data signals relative to a clock
JP3675688B2 (ja) * 2000-01-27 2005-07-27 寛治 大塚 配線基板及びその製造方法
JP2003168736A (ja) * 2001-11-30 2003-06-13 Hitachi Ltd 半導体素子及び高周波電力増幅装置並びに無線通信機
DE10256119B4 (de) * 2001-12-03 2016-08-04 Kanji Otsuka Elektronische Vorrichtung
US20040113711A1 (en) * 2001-12-28 2004-06-17 Brunker David L. Grouped element transmission channel link
US8847696B2 (en) * 2002-03-18 2014-09-30 Qualcomm Incorporated Flexible interconnect cable having signal trace pairs and ground layer pairs disposed on opposite sides of a flexible dielectric
US7336139B2 (en) * 2002-03-18 2008-02-26 Applied Micro Circuits Corporation Flexible interconnect cable with grounded coplanar waveguide
US6930381B1 (en) * 2002-04-12 2005-08-16 Apple Computer, Inc. Wire bonding method and apparatus for integrated circuit
JP4056348B2 (ja) * 2002-10-07 2008-03-05 株式会社ルネサステクノロジ 集積回路チップモジュールおよび携帯電話機
TW589541B (en) * 2003-03-07 2004-06-01 Acer Labs Inc Low cross-talk design and related method for co-layout of different buses in an electric board
JP4142992B2 (ja) * 2003-05-15 2008-09-03 株式会社フジクラ ＧＨｚ帯伝送の伝送線路構造およびＧＨｚ帯伝送に用いるコネクタ
JP2005027041A (ja) 2003-07-02 2005-01-27 Renesas Technology Corp 固体撮像装置
US8023280B2 (en) * 2003-07-28 2011-09-20 Qualcomm Incorporated Communication circuit for driving a plurality of devices
EP1698216A1 (fr) * 2003-12-24 2006-09-06 Molex Incorporated Ligne de transmission a impedance de transformation et plages de soudure
US7245173B2 (en) * 2004-08-16 2007-07-17 Texas Instruments Incorporated Method to reduce integrated circuit power consumption by using differential signaling within the device
JP4745697B2 (ja) * 2005-03-29 2011-08-10 富士通セミコンダクター株式会社 複数の配線層を有する半導体回路の端子層設定方法、端子層設定プログラム、配線端子延長処理プログラム、および、その端子層を設定に用いられる端子延長用コンポーネント
US7239213B2 (en) * 2005-08-23 2007-07-03 International Business Machines Corporation Reduced cross-talk signaling circuit and method
JP4804926B2 (ja) * 2006-01-12 2011-11-02 富士通セミコンダクター株式会社 半導体集積回路
JP5410664B2 (ja) * 2007-09-04 2014-02-05 寛治 大塚 半導体集積回路パッケージ、プリント配線板、半導体装置および電源供給配線構造
JP4412508B2 (ja) * 2007-10-04 2010-02-10 Ｎｅｃエレクトロニクス株式会社 半導体回路
KR100888063B1 (ko) * 2008-10-21 2009-03-11 최경덕 대용량 신호 전송 매체용 연성 인쇄 회로 기판
DE102011087827A1 (de) * 2011-12-06 2013-06-06 Endress + Hauser Flowtec Ag Verfahren und Schaltung zur Netzsynchronisation eines magnetisch-induktiven Durchflussmessgeräts
JP5933354B2 (ja) 2012-06-12 2016-06-08 ルネサスエレクトロニクス株式会社 半導体装置

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2736107B2 (ja) * 1989-03-14 1998-04-02 株式会社東芝 信号配線基板
JPH0336614A (ja) * 1989-07-03 1991-02-18 Mitsumi Electric Co Ltd 回路モジュール
JPH0798620A (ja) * 1992-11-13 1995-04-11 Seiko Epson Corp 電子装置およびこれを用いたコンピュータ
US5376902A (en) * 1993-08-31 1994-12-27 Motorola, Inc. Interconnection structure for crosstalk reduction to improve off-chip selectivity
JP3461204B2 (ja) * 1993-09-14 2003-10-27 株式会社東芝 マルチチップモジュール
US5418504A (en) * 1993-12-09 1995-05-23 Nottenburg; Richard N. Transmission line
JP2724102B2 (ja) * 1993-12-28 1998-03-09 ケル株式会社 ２層構造フレキシブルプリント基板
JP3113153B2 (ja) * 1994-07-26 2000-11-27 株式会社東芝 多層配線構造の半導体装置
JP3667855B2 (ja) 1996-01-25 2005-07-06 株式会社ルネサステクノロジ 半導体装置
JPH09283869A (ja) * 1996-04-09 1997-10-31 Matsushita Electric Ind Co Ltd 高周波機器
US5841686A (en) * 1996-11-22 1998-11-24 Ma Laboratories, Inc. Dual-bank memory module with shared capacitors and R-C elements integrated into the module substrate
US6025742A (en) * 1997-12-31 2000-02-15 International Business Machines Corporation Low voltage differential swing driver circuit
US6160423A (en) * 1998-03-16 2000-12-12 Jazio, Inc. High speed source synchronous signaling for interfacing VLSI CMOS circuits to transmission lines
US6237056B1 (en) * 2000-07-14 2001-05-22 Videon, Inc. Apparatus and method for high speed board-to board ribbon cable data transfer

Also Published As

Publication number Publication date
JP3480306B2 (ja) 2003-12-15
DE19914305B4 (de) 2004-11-25
DE19914305A1 (de) 1999-10-07
US20030090291A1 (en) 2003-05-15
JPH11284126A (ja) 1999-10-15
US6522173B1 (en) 2003-02-18
US6693801B2 (en) 2004-02-17
FR2782812A1 (fr) 2000-03-03

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Legal Events

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TQ Partial transmission of property
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TQ Partial transmission of property

Owner name: OKI SEMICONDUCTOR CO LTD, JP

Effective date: 20140526

Owner name: SHARP KABUSHIKI KAISHA, JP

Effective date: 20140526

Owner name: LAPIS SEMICONDUCTOR CO.LTD, JP

Effective date: 20140526

Owner name: KANJI OTSUKA, JP

Effective date: 20140526

Owner name: SONY CORPORATION, JP

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Owner name: FUJITSU SEMICONDUCTOR LIMITED, JP

Effective date: 20140526

Owner name: NEC CORPORATION, JP

Effective date: 20140526

Owner name: RENESAS TECHNOLOGY CORP, JP

Effective date: 20140526

TQ Partial transmission of property

Owner name: RENESAS ELECTRONICS CORPORATION, JP

Effective date: 20141118

Owner name: OKI SEMICONDUCTOR CO LTD, JP

Effective date: 20141118

Owner name: KANJI OTSUKA, JP

Effective date: 20141118

Owner name: SHARP KABUSHIKI KAISHA, JP

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Owner name: SONY CORPORATION, JP

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Owner name: NEC CORPORATION, JP

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Owner name: LAPIS SEMICONDUCTOR CO.LTD, JP

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