FR2732544B1 - Dispositif de ventilation pour circuit integre - Google Patents

Dispositif de ventilation pour circuit integre

Info

Publication number
FR2732544B1
FR2732544B1 FR9503884A FR9503884A FR2732544B1 FR 2732544 B1 FR2732544 B1 FR 2732544B1 FR 9503884 A FR9503884 A FR 9503884A FR 9503884 A FR9503884 A FR 9503884A FR 2732544 B1 FR2732544 B1 FR 2732544B1
Authority
FR
France
Prior art keywords
integrated circuit
ventilation device
ventilation
integrated
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9503884A
Other languages
English (en)
Other versions
FR2732544A1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=27438081&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=FR2732544(B1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Priority to GB9504272A priority Critical patent/GB2298520B/en
Priority to US08/399,041 priority patent/US5522700A/en
Priority to DE19509904A priority patent/DE19509904C2/de
Application filed by Individual filed Critical Individual
Priority to FR9503884A priority patent/FR2732544B1/fr
Priority to US08/604,487 priority patent/US5582506A/en
Publication of FR2732544A1 publication Critical patent/FR2732544A1/fr
Application granted granted Critical
Publication of FR2732544B1 publication Critical patent/FR2732544B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04DNON-POSITIVE-DISPLACEMENT PUMPS
    • F04D29/00Details, component parts, or accessories
    • F04D29/58Cooling; Heating; Diminishing heat transfer
    • F04D29/582Cooling; Heating; Diminishing heat transfer specially adapted for elastic fluid pumps
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
FR9503884A 1995-03-03 1995-04-03 Dispositif de ventilation pour circuit integre Expired - Fee Related FR2732544B1 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
GB9504272A GB2298520B (en) 1995-03-03 1995-03-03 Heat sink device for integrated circuit
US08/399,041 US5522700A (en) 1995-03-03 1995-03-06 Fan device for integrated circuit
DE19509904A DE19509904C2 (de) 1995-03-03 1995-03-18 Kühlvorrichtung zum Ableiten von Wärme von elekronischen Komponenten mittels eines Ventilators
FR9503884A FR2732544B1 (fr) 1995-03-03 1995-04-03 Dispositif de ventilation pour circuit integre
US08/604,487 US5582506A (en) 1995-03-03 1996-02-21 Fan assembly for an integrated circuit

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
GB9504272A GB2298520B (en) 1995-03-03 1995-03-03 Heat sink device for integrated circuit
US08/399,041 US5522700A (en) 1995-03-03 1995-03-06 Fan device for integrated circuit
DE19509904A DE19509904C2 (de) 1995-03-03 1995-03-18 Kühlvorrichtung zum Ableiten von Wärme von elekronischen Komponenten mittels eines Ventilators
FR9503884A FR2732544B1 (fr) 1995-03-03 1995-04-03 Dispositif de ventilation pour circuit integre

Publications (2)

Publication Number Publication Date
FR2732544A1 FR2732544A1 (fr) 1996-10-04
FR2732544B1 true FR2732544B1 (fr) 1997-06-06

Family

ID=27438081

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9503884A Expired - Fee Related FR2732544B1 (fr) 1995-03-03 1995-04-03 Dispositif de ventilation pour circuit integre

Country Status (4)

Country Link
US (2) US5522700A (fr)
DE (1) DE19509904C2 (fr)
FR (1) FR2732544B1 (fr)
GB (1) GB2298520B (fr)

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JP3069819B2 (ja) * 1992-05-28 2000-07-24 富士通株式会社 ヒートシンク並びに該ヒートシンクに用いるヒートシンク取付具及びヒートシンクを用いた可搬型電子装置
JP3578825B2 (ja) * 1995-03-17 2004-10-20 富士通株式会社 ヒートシンク
US5677829A (en) * 1995-06-07 1997-10-14 Thermalloy, Inc. Fan attachment clip for heat sink
US5590025A (en) * 1995-06-07 1996-12-31 Thermalloy, Inc. Fan attachment clip for heat sink
JPH09116061A (ja) * 1995-10-13 1997-05-02 Mitsubishi Materials Corp 電子部品用冷却装置
US5603374A (en) * 1996-04-05 1997-02-18 Malico Inc. Heat sink assembly for an integrated circuit
GB2312324B (en) * 1996-04-19 2000-11-15 Hong Chen Fu In Fan/pins seat assembly for an integrated circuit
US5793608A (en) * 1996-06-11 1998-08-11 Sun Microsystems, Inc. Cooling system for enclosed electronic components
JP3206436B2 (ja) * 1996-07-03 2001-09-10 松下電器産業株式会社 ヒートシンク装置
US5724228A (en) * 1996-08-14 1998-03-03 Lee; Tzu-I CPU heat dissipator
US5699854A (en) * 1996-11-08 1997-12-23 Hong; Chen Fu-In Miniature fan assembly for outputting air in a certain direction
JP3942248B2 (ja) * 1997-02-24 2007-07-11 富士通株式会社 ヒートシンクおよびそれを搭載した情報処理装置
US5828551A (en) * 1997-03-04 1998-10-27 Hoshino Kinzoku Koygo Kabushiki Kaisha Heat sink apparatus for an electronic component
US5727624A (en) * 1997-03-18 1998-03-17 Liken Lin CPU heat dissipating device with airguiding units
US6109340A (en) * 1997-04-30 2000-08-29 Nidec Corporation Heat sink fan
USD408514S (en) * 1997-10-07 1999-04-20 Sunonwealth Electric Machine Industry Co., Ltd. Heat dissipation fan
GB2330901B (en) * 1997-11-04 2001-05-09 Sunonwealth Electr Mach Ind Co Heat dissipation device
DE29822121U1 (de) 1997-12-24 1999-02-18 Papst Motoren Gmbh & Co Kg Abdeckung für einen Lüfter
JP3454707B2 (ja) * 1998-03-31 2003-10-06 山洋電気株式会社 電子部品冷却装置
USD403755S (en) * 1998-04-06 1999-01-05 Robert Liang Fan
JP2000012751A (ja) * 1998-06-24 2000-01-14 Nippon Densan Corp 冷却ファン装置
US6206641B1 (en) * 1998-06-29 2001-03-27 Samsung Electro-Mechanics Co., Ltd. Micro fan
US6017185A (en) * 1998-08-13 2000-01-25 Chaun-Choung Industrial Corp. Fan fixing structure of a radiator
US6053242A (en) * 1999-03-11 2000-04-25 Hsin-mao Hsieh Heat sink assembly
EP1239359A4 (fr) * 1999-06-11 2007-12-12 Jiung-Jung Wang Dissipateur thermique pour une unite centrale d'un ordinateur portable
US6301110B1 (en) * 1999-09-30 2001-10-09 Sanyo Denki Co., Ltd. Electronic component cooling apparatus
GB2393333B (en) * 2000-04-18 2004-07-07 Sunonwealth Electr Mach Ind Co Circuit board and heat-dissipating device
CA2417432C (fr) * 2000-09-01 2010-11-02 The Center For Blood Research, Inc. Polypeptides modifies stabilises dans une conformation souhaitee et procedes de production correspondants
US6503055B1 (en) * 2000-10-30 2003-01-07 Heidelberger Druckmaschinen Ag Environmental control system blower assembly
US6415852B1 (en) * 2001-01-11 2002-07-09 Foxconn Precision Components Co., Ltd. Heat sink assembly
GB2379266B (en) * 2001-08-29 2005-10-19 Sunonwealth Electr Mach Ind Co Heat dissipating device
JP3954821B2 (ja) * 2001-09-03 2007-08-08 建準電機工業股▲分▼有限公司 放熱器の構造
US7083850B2 (en) * 2001-10-18 2006-08-01 Honeywell International Inc. Electrically conductive thermal interface
US6661665B2 (en) 2002-03-11 2003-12-09 Sun Microsystems, Inc. Method and apparatus for removing heat from an electronic device
TW537437U (en) * 2002-06-28 2003-06-11 Shuttle Inc CPU heat dissipating fastener
CN100405885C (zh) * 2003-04-15 2008-07-23 台达电子工业股份有限公司 一种风扇结构
CN100378975C (zh) * 2003-05-07 2008-04-02 富士通株式会社 冷却部件、基板和电子设备
TWI241382B (en) * 2003-10-27 2005-10-11 Sunonwealth Electr Mach Ind Co Airflow guiding structure for a heat dissipating fan
US7221566B1 (en) * 2004-01-28 2007-05-22 Nvidia Corporation System for cooling a processor while reducing air flow noise
CN2736570Y (zh) * 2004-08-31 2005-10-26 鸿富锦精密工业(深圳)有限公司 风扇固定装置
JP2006250132A (ja) * 2005-03-14 2006-09-21 Nippon Densan Corp 送風機及びその関連技術
JP4562770B2 (ja) * 2005-04-15 2010-10-13 富士通株式会社 ヒートシンク、回路基板、電子機器
US7583502B2 (en) * 2006-06-13 2009-09-01 Taiwan Semiconductor Manufacturing Co., Ltd. Method and apparatus for increasing heat dissipation of high performance integrated circuits (IC)
US7789126B2 (en) * 2006-09-29 2010-09-07 Intel Corporation Fan attachment apparatus for fan component assemblies
TWI306384B (en) * 2006-10-04 2009-02-11 Delta Electronics Inc Heat dissipating module and fan thereof
TWI326333B (en) * 2006-12-26 2010-06-21 Sunonwealth Electr Mach Ind Co Low air-noise fan housing structure
TWI362584B (en) * 2007-04-02 2012-04-21 Hon Hai Prec Ind Co Ltd Heat dissipating device
TW200928113A (en) * 2007-12-26 2009-07-01 Delta Electronics Inc Heat dissipation module and fan thereof
CN101662918B (zh) * 2008-08-27 2012-10-10 富准精密工业(深圳)有限公司 散热装置
CA2839911C (fr) 2011-06-22 2019-11-12 Ecotech Marine, Llc Unite d'eclairage et procede de commande
US20150116997A1 (en) * 2013-10-29 2015-04-30 Acrooptics, Llc LED Lighting System for Promoting Biological Growth
AT515828B1 (de) 2014-05-23 2022-02-15 Fronius Int Gmbh Kühlvorrichtung und Wechselrichtergehäuse mit einer solchen Kühlvorrichtung
PL3493023T3 (pl) * 2017-11-30 2022-01-24 Listan Gmbh & Co. Kg Zasilacz
US11859915B1 (en) * 2019-01-31 2024-01-02 Advanced Thermal Solutions, Inc. Fluid mover enclosure
CN214852404U (zh) 2021-02-06 2021-11-23 北京图森智途科技有限公司 一种控制设备
EP4096376A1 (fr) * 2021-05-24 2022-11-30 Aptiv Technologies Limited Dispositif de refroidissement et ensemble dissipateur thermique l'incorporant

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3069819B2 (ja) * 1992-05-28 2000-07-24 富士通株式会社 ヒートシンク並びに該ヒートシンクに用いるヒートシンク取付具及びヒートシンクを用いた可搬型電子装置
US5309983B1 (en) * 1992-06-23 1997-02-04 Pcubid Computer Tech Low profile integrated heat sink and fan assembly
EP1056129A3 (fr) * 1992-08-06 2002-01-30 Pfu Limited Dispositif de refroidissement pour un composant générant de la chaleur
US5288203A (en) * 1992-10-23 1994-02-22 Thomas Daniel L Low profile fan body with heat transfer characteristics
US5299632A (en) * 1993-02-19 1994-04-05 Lee Lien Jung Fin device for an integrated circuit
DE9302754U1 (fr) * 1993-02-25 1993-04-15 Hwang Piin Co. Ltd., Lu Jou Hsiang, Taipeh, Tw
JP2938704B2 (ja) * 1993-03-19 1999-08-25 富士通株式会社 集積回路パッケージ
JP2901867B2 (ja) * 1993-03-19 1999-06-07 富士通株式会社 ヒートシンク及びヒートシンクの取付構造
US5287249A (en) * 1993-07-07 1994-02-15 Global Win Technology Co., Ltd. Fin assembly for an integrated circuit
US5335722A (en) * 1993-09-30 1994-08-09 Global Win Technology Co., Ltd Cooling assembly for an integrated circuit
US5368094A (en) * 1993-11-02 1994-11-29 Hung; Chin-Ping Bipartite heat sink positioning device for computer chips
US5377745A (en) * 1993-11-30 1995-01-03 Hsieh; Hsin M. Cooling device for central processing unit
US5409352A (en) * 1994-04-18 1995-04-25 Lin; Mike CPU heat dissipating device
US5421402A (en) * 1994-11-22 1995-06-06 Lin; Chuen-Sheng Heat sink apparatus

Also Published As

Publication number Publication date
GB9504272D0 (en) 1995-04-19
DE19509904A1 (de) 1996-09-19
US5582506A (en) 1996-12-10
FR2732544A1 (fr) 1996-10-04
GB2298520A (en) 1996-09-04
GB2298520B (en) 1999-09-08
US5522700A (en) 1996-06-04
DE19509904C2 (de) 1999-02-25

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Legal Events

Date Code Title Description
ST Notification of lapse

Effective date: 20081231