JP2577550B2
(ja)
*
|
1986-11-20 |
1997-02-05 |
新技術事業団 |
▲iii▼−▲v▼族化合物半導体単結晶薄膜の不純物添加法
|
JPH0766906B2
(ja)
*
|
1984-07-26 |
1995-07-19 |
新技術事業団 |
GaAsエピタキシャル成長方法
|
GB2162207B
(en)
*
|
1984-07-26 |
1989-05-10 |
Japan Res Dev Corp |
Semiconductor crystal growth apparatus
|
US5294286A
(en)
*
|
1984-07-26 |
1994-03-15 |
Research Development Corporation Of Japan |
Process for forming a thin film of silicon
|
GB8508699D0
(en)
*
|
1985-04-03 |
1985-05-09 |
Barr & Stroud Ltd |
Chemical vapour deposition of products
|
JPS61260622A
(ja)
*
|
1985-05-15 |
1986-11-18 |
Res Dev Corp Of Japan |
GaAs単結晶薄膜の成長法
|
US5250148A
(en)
*
|
1985-05-15 |
1993-10-05 |
Research Development Corporation |
Process for growing GaAs monocrystal film
|
US4877573A
(en)
*
|
1985-12-19 |
1989-10-31 |
Litton Systems, Inc. |
Substrate holder for wafers during MBE growth
|
GB2185494B
(en)
*
|
1986-01-18 |
1989-11-15 |
Stc Plc |
Vapour phase deposition process
|
JP2652630B2
(ja)
*
|
1986-04-02 |
1997-09-10 |
理化学研究所 |
結晶成長方法
|
JP2587623B2
(ja)
*
|
1986-11-22 |
1997-03-05 |
新技術事業団 |
化合物半導体のエピタキシヤル結晶成長方法
|
GB2202236B
(en)
*
|
1987-03-09 |
1991-04-24 |
Philips Electronic Associated |
Manufacture of electronic devices comprising cadmium mercury telluride
|
DE3873593T2
(de)
*
|
1987-04-21 |
1992-12-10 |
Seiko Instr Inc |
Apparatur zur herstellung von halbleiterkristallen.
|
FR2618455B1
(fr)
*
|
1987-07-21 |
1994-03-18 |
Nissim Yves |
Procede de croissance epitaxiale de couches en materiau iii-v ou ii-vi par modulation rapide de la temperature
|
US5296087A
(en)
*
|
1987-08-24 |
1994-03-22 |
Canon Kabushiki Kaisha |
Crystal formation method
|
JPH0239525A
(ja)
*
|
1988-07-29 |
1990-02-08 |
Hitachi Ltd |
半導体熱処理装置
|
DE3855871T2
(de)
*
|
1987-09-11 |
1997-10-16 |
Hitachi Ltd |
Vorrichtung zur Durchführung einer Wärmebehandlung an Halbleiterplättchen
|
JPH01109022A
(ja)
*
|
1987-10-22 |
1989-04-26 |
Toyota Motor Corp |
歯車シエービング機
|
DE3743938C2
(de)
*
|
1987-12-23 |
1995-08-31 |
Cs Halbleiter Solartech |
Verfahren zum Atomschicht-Epitaxie-Aufwachsen einer III/V-Verbindungshalbleiter-Dünnschicht
|
US5108779A
(en)
*
|
1988-05-26 |
1992-04-28 |
General Electric Company |
Diamond crystal growth process
|
US5261959A
(en)
*
|
1988-05-26 |
1993-11-16 |
General Electric Company |
Diamond crystal growth apparatus
|
DE3821907A1
(de)
*
|
1988-06-29 |
1990-01-11 |
Philips Patentverwaltung |
Anordnung zur prozessfuehrung bei der physikalisch/chemischen behandlung von halbleitern in einem ofen
|
US4931132A
(en)
*
|
1988-10-07 |
1990-06-05 |
Bell Communications Research, Inc. |
Optical control of deposition of crystal monolayers
|
GB2234529B
(en)
*
|
1989-07-26 |
1993-06-02 |
Stc Plc |
Epitaxial growth process
|
JP2758247B2
(ja)
*
|
1990-03-26 |
1998-05-28 |
三菱電機株式会社 |
有機金属ガス利用薄膜形成装置
|
US5769540A
(en)
*
|
1990-04-10 |
1998-06-23 |
Luxtron Corporation |
Non-contact optical techniques for measuring surface conditions
|
JPH042699A
(ja)
*
|
1990-04-18 |
1992-01-07 |
Mitsubishi Electric Corp |
結晶成長方法
|
EP0459394B1
(fr)
*
|
1990-05-30 |
1995-12-13 |
Hitachi, Ltd. |
Appareil d'usinage par laser et méthode de celui-ci
|
US5483919A
(en)
*
|
1990-08-31 |
1996-01-16 |
Nippon Telegraph And Telephone Corporation |
Atomic layer epitaxy method and apparatus
|
US5238525A
(en)
*
|
1990-09-14 |
1993-08-24 |
Massachusetts Institute Of Technology |
Analysis of Rheed data from rotating substrates
|
US5122222A
(en)
*
|
1990-09-14 |
1992-06-16 |
Massachusetts Institute Of Technology |
Frequency-domain analysis of RHEED data
|
US5101764A
(en)
*
|
1991-02-20 |
1992-04-07 |
Texas Instruments Incorporated |
Method and apparatus for integrating optical sensor into processor
|
JP2987379B2
(ja)
*
|
1991-11-30 |
1999-12-06 |
科学技術振興事業団 |
半導体結晶のエピタキシャル成長方法
|
JPH05243166A
(ja)
*
|
1992-02-26 |
1993-09-21 |
Nec Corp |
半導体基板の気相成長装置
|
US5288364A
(en)
*
|
1992-08-20 |
1994-02-22 |
Motorola, Inc. |
Silicon epitaxial reactor and control method
|
JP2567331B2
(ja)
*
|
1992-11-06 |
1996-12-25 |
新技術事業団 |
化合物半導体単結晶薄膜の成長法
|
JPH0817161B2
(ja)
*
|
1992-11-06 |
1996-02-21 |
新技術事業団 |
超格子半導体装置の製造方法
|
US5305417A
(en)
*
|
1993-03-26 |
1994-04-19 |
Texas Instruments Incorporated |
Apparatus and method for determining wafer temperature using pyrometry
|
US5549756A
(en)
*
|
1994-02-02 |
1996-08-27 |
Applied Materials, Inc. |
Optical pyrometer for a thin film deposition system
|
JP2785803B2
(ja)
*
|
1996-05-01 |
1998-08-13 |
日本電気株式会社 |
フォトマスクの白点欠陥修正方法および装置
|
AU3145197A
(en)
|
1996-06-28 |
1998-01-21 |
Lam Research Corporation |
Apparatus and method for high density plasma chemical vapor deposition
|
US6013155A
(en)
*
|
1996-06-28 |
2000-01-11 |
Lam Research Corporation |
Gas injection system for plasma processing
|
US5756369A
(en)
*
|
1996-07-11 |
1998-05-26 |
Lsi Logic Corporation |
Rapid thermal processing using a narrowband infrared source and feedback
|
US6184158B1
(en)
|
1996-12-23 |
2001-02-06 |
Lam Research Corporation |
Inductively coupled plasma CVD
|
US6042687A
(en)
*
|
1997-06-30 |
2000-03-28 |
Lam Research Corporation |
Method and apparatus for improving etch and deposition uniformity in plasma semiconductor processing
|
US5960158A
(en)
*
|
1997-07-11 |
1999-09-28 |
Ag Associates |
Apparatus and method for filtering light in a thermal processing chamber
|
DE19748041A1
(de)
*
|
1997-10-30 |
1998-12-17 |
Wacker Siltronic Halbleitermat |
Vorrichtung und Verfahren zur Messung und Regelung der Temperatur einer Halbleiterscheibe
|
US6015465A
(en)
*
|
1998-04-08 |
2000-01-18 |
Applied Materials, Inc. |
Temperature control system for semiconductor process chamber
|
US5970214A
(en)
*
|
1998-05-14 |
1999-10-19 |
Ag Associates |
Heating device for semiconductor wafers
|
US5930456A
(en)
*
|
1998-05-14 |
1999-07-27 |
Ag Associates |
Heating device for semiconductor wafers
|
US6210484B1
(en)
|
1998-09-09 |
2001-04-03 |
Steag Rtp Systems, Inc. |
Heating device containing a multi-lamp cone for heating semiconductor wafers
|
JP2000150406A
(ja)
*
|
1998-11-13 |
2000-05-30 |
Nec Corp |
ランプアニール装置
|
US6771895B2
(en)
|
1999-01-06 |
2004-08-03 |
Mattson Technology, Inc. |
Heating device for heating semiconductor wafers in thermal processing chambers
|
JP4057198B2
(ja)
*
|
1999-08-13 |
2008-03-05 |
東京エレクトロン株式会社 |
処理装置及び処理方法
|
US6620723B1
(en)
|
2000-06-27 |
2003-09-16 |
Applied Materials, Inc. |
Formation of boride barrier layers using chemisorption techniques
|
US7405158B2
(en)
|
2000-06-28 |
2008-07-29 |
Applied Materials, Inc. |
Methods for depositing tungsten layers employing atomic layer deposition techniques
|
US6551929B1
(en)
|
2000-06-28 |
2003-04-22 |
Applied Materials, Inc. |
Bifurcated deposition process for depositing refractory metal layers employing atomic layer deposition and chemical vapor deposition techniques
|
US7964505B2
(en)
*
|
2005-01-19 |
2011-06-21 |
Applied Materials, Inc. |
Atomic layer deposition of tungsten materials
|
US7101795B1
(en)
|
2000-06-28 |
2006-09-05 |
Applied Materials, Inc. |
Method and apparatus for depositing refractory metal layers employing sequential deposition techniques to form a nucleation layer
|
US7732327B2
(en)
|
2000-06-28 |
2010-06-08 |
Applied Materials, Inc. |
Vapor deposition of tungsten materials
|
US6998579B2
(en)
|
2000-12-29 |
2006-02-14 |
Applied Materials, Inc. |
Chamber for uniform substrate heating
|
US6825447B2
(en)
*
|
2000-12-29 |
2004-11-30 |
Applied Materials, Inc. |
Apparatus and method for uniform substrate heating and contaminate collection
|
US6765178B2
(en)
|
2000-12-29 |
2004-07-20 |
Applied Materials, Inc. |
Chamber for uniform substrate heating
|
US20020083897A1
(en)
*
|
2000-12-29 |
2002-07-04 |
Applied Materials, Inc. |
Full glass substrate deposition in plasma enhanced chemical vapor deposition
|
US20020127336A1
(en)
*
|
2001-01-16 |
2002-09-12 |
Applied Materials, Inc. |
Method for growing thin films by catalytic enhancement
|
US6811814B2
(en)
|
2001-01-16 |
2004-11-02 |
Applied Materials, Inc. |
Method for growing thin films by catalytic enhancement
|
US6951804B2
(en)
|
2001-02-02 |
2005-10-04 |
Applied Materials, Inc. |
Formation of a tantalum-nitride layer
|
US6878206B2
(en)
*
|
2001-07-16 |
2005-04-12 |
Applied Materials, Inc. |
Lid assembly for a processing system to facilitate sequential deposition techniques
|
US6660126B2
(en)
|
2001-03-02 |
2003-12-09 |
Applied Materials, Inc. |
Lid assembly for a processing system to facilitate sequential deposition techniques
|
US6734020B2
(en)
|
2001-03-07 |
2004-05-11 |
Applied Materials, Inc. |
Valve control system for atomic layer deposition chamber
|
KR100425449B1
(ko)
*
|
2001-05-18 |
2004-03-30 |
삼성전자주식회사 |
포토 화학기상증착법을 이용한 다층막 형성방법과 그 장치
|
US7056278B2
(en)
*
|
2001-06-01 |
2006-06-06 |
Adamed Sp. Z.O.O. |
Method of treating overactive bladder in women
|
US6849545B2
(en)
|
2001-06-20 |
2005-02-01 |
Applied Materials, Inc. |
System and method to form a composite film stack utilizing sequential deposition techniques
|
US7211144B2
(en)
*
|
2001-07-13 |
2007-05-01 |
Applied Materials, Inc. |
Pulsed nucleation deposition of tungsten layers
|
US20070009658A1
(en)
*
|
2001-07-13 |
2007-01-11 |
Yoo Jong H |
Pulse nucleation enhanced nucleation technique for improved step coverage and better gap fill for WCVD process
|
US7085616B2
(en)
|
2001-07-27 |
2006-08-01 |
Applied Materials, Inc. |
Atomic layer deposition apparatus
|
US20030059538A1
(en)
*
|
2001-09-26 |
2003-03-27 |
Applied Materials, Inc. |
Integration of barrier layer and seed layer
|
US7049226B2
(en)
*
|
2001-09-26 |
2006-05-23 |
Applied Materials, Inc. |
Integration of ALD tantalum nitride for copper metallization
|
US6936906B2
(en)
*
|
2001-09-26 |
2005-08-30 |
Applied Materials, Inc. |
Integration of barrier layer and seed layer
|
US6916398B2
(en)
*
|
2001-10-26 |
2005-07-12 |
Applied Materials, Inc. |
Gas delivery apparatus and method for atomic layer deposition
|
US6729824B2
(en)
|
2001-12-14 |
2004-05-04 |
Applied Materials, Inc. |
Dual robot processing system
|
US6911391B2
(en)
|
2002-01-26 |
2005-06-28 |
Applied Materials, Inc. |
Integration of titanium and titanium nitride layers
|
US6998014B2
(en)
|
2002-01-26 |
2006-02-14 |
Applied Materials, Inc. |
Apparatus and method for plasma assisted deposition
|
US6827978B2
(en)
*
|
2002-02-11 |
2004-12-07 |
Applied Materials, Inc. |
Deposition of tungsten films
|
US6833161B2
(en)
*
|
2002-02-26 |
2004-12-21 |
Applied Materials, Inc. |
Cyclical deposition of tungsten nitride for metal oxide gate electrode
|
US7439191B2
(en)
*
|
2002-04-05 |
2008-10-21 |
Applied Materials, Inc. |
Deposition of silicon layers for active matrix liquid crystal display (AMLCD) applications
|
US6720027B2
(en)
|
2002-04-08 |
2004-04-13 |
Applied Materials, Inc. |
Cyclical deposition of a variable content titanium silicon nitride layer
|
US6846516B2
(en)
*
|
2002-04-08 |
2005-01-25 |
Applied Materials, Inc. |
Multiple precursor cyclical deposition system
|
US6869838B2
(en)
*
|
2002-04-09 |
2005-03-22 |
Applied Materials, Inc. |
Deposition of passivation layers for active matrix liquid crystal display (AMLCD) applications
|
US20030194825A1
(en)
*
|
2002-04-10 |
2003-10-16 |
Kam Law |
Deposition of gate metallization for active matrix liquid crystal display (AMLCD) applications
|
US6875271B2
(en)
|
2002-04-09 |
2005-04-05 |
Applied Materials, Inc. |
Simultaneous cyclical deposition in different processing regions
|
US7279432B2
(en)
|
2002-04-16 |
2007-10-09 |
Applied Materials, Inc. |
System and method for forming an integrated barrier layer
|
US6821563B2
(en)
|
2002-10-02 |
2004-11-23 |
Applied Materials, Inc. |
Gas distribution system for cyclical layer deposition
|
US20040065255A1
(en)
*
|
2002-10-02 |
2004-04-08 |
Applied Materials, Inc. |
Cyclical layer deposition system
|
US7262133B2
(en)
|
2003-01-07 |
2007-08-28 |
Applied Materials, Inc. |
Enhancement of copper line reliability using thin ALD tan film to cap the copper line
|
WO2004113585A2
(fr)
*
|
2003-06-18 |
2004-12-29 |
Applied Materials, Inc. |
Depot de couches atomiques de matieres barrieres
|
FR2887029B1
(fr)
|
2005-06-09 |
2007-08-03 |
Agence Spatiale Europeenne |
Appareillage de mesure de temperature sans contact d'echantillons de materiaux places sous vide
|
JP5017950B2
(ja)
*
|
2005-09-21 |
2012-09-05 |
株式会社Sumco |
エピタキシャル成長装置の温度管理方法
|
US8821637B2
(en)
*
|
2007-01-29 |
2014-09-02 |
Applied Materials, Inc. |
Temperature controlled lid assembly for tungsten nitride deposition
|
US20110179992A1
(en)
*
|
2008-10-24 |
2011-07-28 |
Schwerdtfeger Jr Carl Richard |
Crystal growth methods and systems
|
US11402672B2
(en)
|
2018-05-03 |
2022-08-02 |
X Development Llc |
Quantum confined nanostructures with improved homogeneity and methods for making the same
|