FR2483686A1 - METHOD FOR MANUFACTURING A SOLAR BATTERY - Google Patents
METHOD FOR MANUFACTURING A SOLAR BATTERY Download PDFInfo
- Publication number
- FR2483686A1 FR2483686A1 FR8110817A FR8110817A FR2483686A1 FR 2483686 A1 FR2483686 A1 FR 2483686A1 FR 8110817 A FR8110817 A FR 8110817A FR 8110817 A FR8110817 A FR 8110817A FR 2483686 A1 FR2483686 A1 FR 2483686A1
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- active region
- laser
- cutting
- transparent electrode
- electrode
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- 238000000034 method Methods 0.000 title claims abstract description 40
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 11
- 239000004065 semiconductor Substances 0.000 claims abstract description 28
- 239000000463 material Substances 0.000 claims abstract description 27
- 239000000758 substrate Substances 0.000 claims abstract description 20
- 229910021417 amorphous silicon Inorganic materials 0.000 claims description 20
- 238000005520 cutting process Methods 0.000 claims description 18
- 238000003698 laser cutting Methods 0.000 claims description 10
- 239000011195 cermet Substances 0.000 claims description 8
- 229910052779 Neodymium Inorganic materials 0.000 claims description 5
- QEFYFXOXNSNQGX-UHFFFAOYSA-N neodymium atom Chemical group [Nd] QEFYFXOXNSNQGX-UHFFFAOYSA-N 0.000 claims description 5
- 229910052710 silicon Inorganic materials 0.000 claims description 5
- 239000010703 silicon Substances 0.000 claims description 5
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 4
- 239000007772 electrode material Substances 0.000 claims description 4
- 229910004613 CdTe Inorganic materials 0.000 claims description 2
- UHYPYGJEEGLRJD-UHFFFAOYSA-N cadmium(2+);selenium(2-) Chemical compound [Se-2].[Cd+2] UHYPYGJEEGLRJD-UHFFFAOYSA-N 0.000 claims description 2
- 230000008020 evaporation Effects 0.000 claims 1
- 238000001704 evaporation Methods 0.000 claims 1
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 15
- 239000011521 glass Substances 0.000 description 7
- 229910052697 platinum Inorganic materials 0.000 description 7
- 229910001887 tin oxide Inorganic materials 0.000 description 7
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 5
- 229910003437 indium oxide Inorganic materials 0.000 description 5
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 4
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 4
- 238000004544 sputter deposition Methods 0.000 description 4
- 239000004020 conductor Substances 0.000 description 3
- 229910052738 indium Inorganic materials 0.000 description 3
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 230000005284 excitation Effects 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 2
- 239000003607 modifier Substances 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920006333 epoxy cement Polymers 0.000 description 1
- ZAMACTJOCIFTPJ-UHFFFAOYSA-N ethyl dibunate Chemical compound CC(C)(C)C1=CC=C2C(S(=O)(=O)OCC)=CC(C(C)(C)C)=CC2=C1 ZAMACTJOCIFTPJ-UHFFFAOYSA-N 0.000 description 1
- 229950001503 ethyl dibunate Drugs 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 108090000623 proteins and genes Proteins 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
- B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/268—Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/0445—PV modules or arrays of single PV cells including thin film solar cells, e.g. single thin film a-Si, CIS or CdTe solar cells
- H01L31/046—PV modules composed of a plurality of thin film solar cells deposited on the same substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/0445—PV modules or arrays of single PV cells including thin film solar cells, e.g. single thin film a-Si, CIS or CdTe solar cells
- H01L31/046—PV modules composed of a plurality of thin film solar cells deposited on the same substrate
- H01L31/0463—PV modules composed of a plurality of thin film solar cells deposited on the same substrate characterised by special patterning methods to connect the PV cells in a module, e.g. laser cutting of the conductive or active layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/06—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers
- H01L31/075—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers the potential barriers being only of the PIN type, e.g. amorphous silicon PIN solar cells
- H01L31/076—Multiple junction or tandem solar cells
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/16—Composite materials, e.g. fibre reinforced
- B23K2103/166—Multilayered materials
- B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/548—Amorphous silicon PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/092—Laser beam processing-diodes or transistor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/093—Laser beam treatment in general
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/94—Laser ablative material removal
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Sustainable Development (AREA)
- Life Sciences & Earth Sciences (AREA)
- Computer Hardware Design (AREA)
- Optics & Photonics (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Sustainable Energy (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- High Energy & Nuclear Physics (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Manufacturing & Machinery (AREA)
- Photovoltaic Devices (AREA)
Abstract
PROCEDE DE FABRICATION D'UNE BATTERIE SOLAIRE, CARACTERISE EN CE QU'IL CONSISTE A: DECOUPER UNE ELECTRODE TRANSPARENTE SUR UN SUBSTRAT TRANSPARENT 32 EN UTILISANT UN LASER AYANT UNE ENERGIE SUFFISANTE POUR FORMER UNE PLURALITE DE BANDES D'ELECTRODE TRANSPARENTES 34; REALISER UNE REGION ACTIVE 43 D'UN MATERIAU SEMI-CONDUCTEUR SUR LEDIT SUBSTRAT ET LESDITES BANDES D'ELECTRODES TRANSPARENTES; DECOUPER LADITE REGION ACTIVE EN UTILISANT UN LASER PARALLELE ET ADJACENT AU PREMIER LASER DE FACON A REALISER UN TRACE AU TRAVERS DE LADITE REGION ACTIVE EN VUE DE FORMER DES BANDES DE REGION ACTIVE SANS FORMER D'ELECTRODE TRANSPARENTE ET INTERCONNECTER LESDITES BANDES DE REGION ACTIVE, EN SERIE AVEC UNE ELECTRODE POSTERIEURE.METHOD FOR MANUFACTURING A SOLAR BATTERY, CHARACTERIZED IN THAT IT CONSISTS OF: CUTTING A TRANSPARENT ELECTRODE ON A TRANSPARENT SUBSTRATE 32 BY USING A LASER HAVING SUFFICIENT ENERGY TO FORM A PLURALITY OF TRANSPARENT ELECTRODE BANDS 34; REALIZING AN ACTIVE REGION 43 OF A SEMICONDUCTOR MATERIAL ON SAID SUBSTRATE AND SAID TRANSPARENT ELECTRODE STRIPS; CUT OUT THE SAME ACTIVE REGION USING A PARALLEL LASER AND ADJACATE THE FIRST LASER SO AS TO MAKE A TRACE THROUGH THE SAME ACTIVE REGION WITH A VIEW TO FORMING ACTIVE REGION BANDS WITHOUT FORMING TRANSPARENT ELECTRODE AND INTERCONNECTING THE ACTIVE REGION BANDS, SERIES WITH A POSTERIOR ELECTRODE.
Description
La présente invention concerne des batteries solaires. DeThe present invention relates to solar batteries. Of
façon plus spécifique, cette invention concerne un procédé de fa- more specifically, this invention relates to a method of
brication de cellules solaires connectées en série et de cellules connection of series connected solar cells and cells
solaires à jonction tandem connectées en série. tandem junction solar panels connected in series.
On sait que des dispositifs photovoltaïques, c'est-à-dire We know that photovoltaic devices, that is to say
des cellules solaires, sont capables de transformer le rayonne- solar cells, are able to transform the ray-
ment solaire en énergie électrique utilisable. Cette transforma- solar energy in usable electrical energy. This transformation
tion d'énergie résulte de l'effet photovoltalque bien connu dans le domaine des cellules solaires. Le rayonnement solaire qui tion of energy results from the photovoltaic effect well known in the field of solar cells. The solar radiation which
frappe une cellule solaire et qui est adsorbé par une région ac- hits a solar cell and that is adsorbed by an ac-
tive d'un matériau semi- conducteur engendre des électrons et des lacunes. Ces électrons et lacunes sont séparés par un champ électrique interne, par exemple une jonction redresseuse, dans la cellule solaire. De cette séparation des électrons et des lacunes sur le champ électrique interne résultentla phototension et le tive of a semiconductor material generates electrons and vacancies. These electrons and vacancies are separated by an internal electric field, for example a rectifying junction, in the solar cell. From this separation of electrons and gaps in the internal electric field result phototension and the
photocourant de la cellule.photocurrent of the cell.
Lorsqu'augmente l'aire de la cellule solaire, la résistance When the area of the solar cell increases, the resistance
série de l'électrode incidente au rayonnement solaire de la cel- series of the incident electrode to the solar radiation of the cel-
lule augmente également et ceci se traduit par l'obligation de lule also increases and this results in the obligation to
prévoir des électrodes de grille plus importantes et plus compli- provide larger and more complicated gate electrodes
quées pour extraire le courant engendré pendant l'illumination quées to extract the current generated during the illumination
de la cellule solaire par la lumière du soleil. Le fait de fabri- of the solar cell by sunlight. The fact of
quer des cellules solaires en longues bandes étroites et de rac- quer solar cells in long narrow strips and
corder en série les bandes permet d'éliminer la nécessité de pré- stringing the strips in series eliminates the need for pre-
voir des configurations de grille compliquées. Cependant, jusqu'à présent, la fabrication de minces bandes de cellules solaires connectées en série, ou de cellules solaires à jonction tandem connectées en série nécessitait l'application de techniques de see complicated grid configurations. However, until now, the manufacture of thin strips of solar cells connected in series, or tandem junction solar cells connected in series required the application of techniques of
décapage chimique et des techniques photolithographiques. L'uti- chemical etching and photolithographic techniques. The utility
lisation de ces techniques provoquent souvent la formation de tête d'épingle (retassures) dans les matériaux semi-conducteurs ce qui entraîne un raccourcissement et un endommagement de tout ou partie de la cellule solaire. En outre, la technique de la photolithographie n'est pas facilement adaptable à un traitement continu sur une grande échelle et elle se traduit par une forte The use of these techniques often results in the formation of pinheads (shrinkage) in semiconductor materials, which shortens and damages all or part of the solar cell. In addition, the photolithography technique is not easily adaptable to continuous processing on a large scale and it results in a strong
augmentation du prix de fabrication des cellules solaires connec- increase in the manufacturing price of connected solar cells
tées en série. Par conséquent, il est hautement désirable de tees in series. Therefore, it is highly desirable to
disposer d'un procédé de fabrication de cellules solaires connec- have a process for manufacturing connected solar cells
tées en série ou de cellules solaires à jonction tandem connec- tees in series or connected tandem junction solar cells
2 24836862 2483686
tées en série ne comportant pas de nombreuses étapes de traite- serial tees that do not have many milking stages
ment liquide. C'est là précisément le but de la présente inven- liquid. This is precisely the aim of the present invention.
tion. L'invention est relative à un procédé de fabrication d'une batterie solaire connectée en série et d'une batteris solaire a jonction tandem, connectée en série, utilisant la technique du traçage ou découpage au laser. Ce procédé met en oeuvre, entre autre, le découpage au laser d'un oxyde conducteur transparent déposé sur un substrat transparent en bandes. Ensuite le matériau semi-conducteur est déposé sur le substrat transparent et sur les bandes d'oxyde conducteur transparent. L'oxyde conducteur tion. The invention relates to a method of manufacturing a solar battery connected in series and a tandem junction solar battery, connected in series, using the technique of laser tracing or cutting. This process uses, among other things, the laser cutting of a transparent conductive oxide deposited on a transparent strip substrate. Then the semiconductor material is deposited on the transparent substrate and on the transparent conductive oxide strips. Conductive oxide
transparent constitue le contact supérieur du dispositif. Ce dis- transparent constitutes the upper contact of the device. This dis-
positif subit ensuite un découpage au laser afin de diviser en positive then undergoes laser cutting in order to divide into
bandes le matériau semi-conducteur sans affecter l'oxyde trans- strips the semiconductor material without affecting the trans-
parent conducteur. Les bandes sont parallèles et adjacentes aux bandes de découpage précédemment formées au laser. Ensuite, un contact métallique postérieur est appliqué sur les bandes d'oxyde parent driver. The strips are parallel and adjacent to the cutting strips previously formed by laser. Then a posterior metallic contact is applied to the oxide strips
conducteur transparent et de matériau semi-conducteur et on ef- transparent conductor and semiconductor material and we e-
fectue finalement un traçage au laser ou un découpage parallèle et adjacent aux deux découpages au laser effectués précédemment (mais écartés de ceux-ci) afin d'obtenir un dispositif qui est connecté en série. Des panneaux individuels de cellules solaires connectées en série et de cellules solaires à jonction tandem peuvent être reliés en parallèle de façon à obtenir toute tension et courant désirés. Les matériaux semi-conducteurs, les oxydes conducteurs transparents et les électrodes postérieures utilisées lors de la fabrication de la batterie solaire doivent dtre choisis finally performs a laser tracing or cutting parallel and adjacent to the two laser cuts previously made (but spaced from them) in order to obtain a device which is connected in series. Individual panels of solar cells connected in series and solar cells with tandem junction can be connected in parallel so as to obtain any desired voltage and current. The semiconductor materials, the transparent conductive oxides and the posterior electrodes used during the manufacture of the solar battery must be chosen.
de façon qu'un laser unique soit nécessaire pour effectuer le dé- so that a single laser is needed to perform the
coupage de chaque couche successive avec une énergie décroissante cutting each successive layer with decreasing energy
ou que des lasers de différentes longueurs d'onde soient néces- or that lasers of different wavelengths are needed
saires pour réaliser le découpage d'une couche sans affecter les autres couches. En variante, par exemple, on peut utiliser des to cut a layer without affecting the other layers. Alternatively, for example,
impulsions de laser très courtes de l'ordre de 10 à 20 nanose- very short laser pulses of the order of 10 to 20 nanose-
condes et des fréquences d'impulsions importantes de l'ordre de conditions and significant pulse frequencies of the order of
0,2 à 5 MHz pour effectuer le découpage d'une couche sans affec- 0.2 to 5 MHz to cut a layer without affect
ter les autres couches.ter the other layers.
D'autres caractéristiques et avantages de cette invention Other features and advantages of this invention
ressortiront de la description faite ci-après en référence aux will emerge from the description given below with reference to
dessins annexés qui en illustrent divers exemples de réalisation attached drawings which illustrate various examples of embodiment
3 24836863 2483686
dépourvus de tout caractère limitatif. Sur les dessins: devoid of any limiting character. In the drawings:
- la figure 1 illustre, en section droite, une batterie so- - Figure 1 illustrates, in cross section, a battery so-
laire au silicium amorphe hydrogéné à jonction tandem, fabriqué tandem junction hydrogenated amorphous silicon glass, manufactured
selon la présente invention à partir d'une pluralité de cellu- according to the present invention from a plurality of cells
les solaires à jonction tandem; - les figures 2a à 2f illustrent le procédé de fabrication d'une série de cellules solaires interconnectées, selon un mode de mise en oeuvre du procédé selon cette invention, et - les figures 3a et 3b illustrent une variante de l'invention, prévue pour interconnecter des cellules solaires après les tandem junction sunglasses; - Figures 2a to 2f illustrate the method of manufacturing a series of interconnected solar cells, according to an embodiment of the method according to this invention, and - Figures 3a and 3b illustrate a variant of the invention, provided for interconnect solar cells after
étapes illustrées aux figures 2a à 2e. steps illustrated in Figures 2a to 2e.
On se réfère en premier lieu à la figure 1 qui illustre une section droite d'une batterie solaire à jonction tandem fabriquée à partir d'une pluralité de cellules solaires à jonction tandem interconnectées. La batterie solaire à jonction tandem 10 comporte une série de cellules solaires à jonction tandem 20, 21 et 22, connectées en série sur un substrat 32. Par exemple, les cellules solaires sont fabriquées à l'aide des matériaux décrits dans le brevet américain n 4 064 521, et dans les demandes de brevet Firstly, reference is made to FIG. 1 which illustrates a cross section of a tandem junction solar battery made from a plurality of interconnected tandem junction solar cells. The tandem junction solar battery 10 comprises a series of tandem junction solar cells 20, 21 and 22, connected in series on a substrate 32. For example, the solar cells are manufactured using the materials described in American patent n 4,064,521, and in patent applications
américain n0 70 513, déposée le 28 Août 1979 et n0 109 637, dé- American No. 70,513, filed August 28, 1979 and No. 109,637,
posée le 4 Janvier 1980. En variante, le silicium amorphe peut 9tre fabriqué avec des modificateurs en addition à l'hydrogène et on peut utiliser des silanes tels que les halogènes, du silicium vaporisé ou ayant subit une pulvérisation cathodique ou d'autres matériaux semiconducteurs, tels que OdS, CdSe, CdTe, Cu2S et similaires. asked on January 4, 1980. As a variant, the amorphous silicon can be produced with modifiers in addition to hydrogen and it is possible to use silanes such as halogens, silicon vaporized or having undergone a cathode sputtering or other semiconductor materials , such as OdS, CdSe, CdTe, Cu2S and the like.
Chaque cellule solaire à jonction tandem 20, 21 et 22 com- Each tandem junction 20, 21 and 22 solar cell includes
prend une bande d'oxyde conducteur transparent 34, en tant que takes a transparent conductive oxide strip 34, as
électrode incidente et deux ou plus couches actives 38 et 42 de- incident electrode and two or more active layers 38 and 42 de-
matériau semi-conducteur9 séparées par une jonction tunnel 40. semiconductor material9 separated by a tunnel junction 40.
Les couches actives possèdent des régions 38a, 58b et 38c et 42a, 42b et 42c de types de conductivité différents. La ou les couches The active layers have regions 38a, 58b and 38c and 42a, 42b and 42c of different conductivity types. The layer (s)
semi-conductrices et les jonctions tunnel seront désignées ci- semiconductors and tunnel junctions will be designated below
après collectivement par le terme "région active" 43. Cette ré- collectively after by the term "active region" 43. This re-
gion active 43 comporte une jonction redresseuse soit à l'inté- gion active 43 has a straightening junction either inside
rieur de la région, c'est-à-dire une jonction PN, soit à sa sur- of the region, i.e. a PN junction, either at its
face, c'est-à-dire une barrière de Schottky. La région active 43 face, that is to say a Schottky barrier. The active region 43
peut être une couche d'un matériau semi-conducteur ou une plura- may be a layer of semiconductor material or a plurality of
lité de couches semi-conductrices comme décrit ci-dessus. Les cellules solaires à jonction tandem sont inter-connectées avec lity of semiconductor layers as described above. Tandem junction solar cells are interconnected with
une électrode postérieure 44 et ureconnexion série 46. a rear electrode 44 and ureconnection series 46.
Le découpage ou traçage au laser est utilisé pour fabriquer des bandes à partir du conducteur transparent 34 et les couches semi-conductrices 38 et 40. Les bandes d'oxyde conducteur trans- Laser cutting or tracing is used to make strips from the transparent conductor 34 and the semiconductor layers 38 and 40. The bands of conductive oxide trans-
parent sont parallèles et adjacentes aux bandes de matériau semi- parent are parallel and adjacent to the strips of semi material
conducteur. La technique de découpage au laser permet également de réaliser les structures solaires qui comportent des bandes driver. The laser cutting technique also makes it possible to produce solar structures which have strips
d'une seule région active de matériau semi-conducteur 38, connec- of a single active region of semiconductor material 38, connected
tées en série. L'électrode incidente transparente, le matériau semiconducteur et le matériau constituant l'électrode postérieure ou de dos, doivent être choisis de façon qu'un laser de longueur d'onde unique mais de puissance variable, décroissant à partir de la puissance nécessaire au découpage de l'électrode incidente, tees in series. The transparent incident electrode, the semiconductor material and the material constituting the posterior or back electrode, must be chosen so that a laser of single wavelength but of variable power, decreasing from the power necessary for cutting of the incident electrode,
puisse découper les dispositifs. En variante, les matériaux peu- could cut out the devices. Alternatively, the materials may
vent être choisis de façon qu'un laser émettant de la lumière à une fréquence puisse tracer ou découper un matériau, par exemple, du siliciumramorphe, mais non un autre matériau tel que l'oxyde can be chosen so that a laser emitting light at a frequency can trace or cut a material, for example, siliconramorph, but not another material such as oxide
transparent conducteur.transparent conductive.
Après cette description de la structure d'une cellule solaire After this description of the structure of a solar cell
terminée 10, on se reportera aux figures 2a à 2f qui illustrent la technique de fabrication. Le procédé mis en oeuvre dans cet completed 10, refer to Figures 2a to 2f which illustrate the manufacturing technique. The process used in this
exemple se réfère à la fabrication d'une batterie solaire au sili.- example refers to the production of a solar sili battery.
cium amorphe hydrogéné.hydrogenated amorphous cium.
La figure 2a représente un substrat 32 constitué par exemple FIG. 2a represents a substrate 32 constituted for example
de verre, de matière plastique et similaire. La figure 2b repré- glass, plastic and the like. Figure 2b shows
sente le substrat 32 recouvert d'un oxyde transparent conducteur 54, en tant qu'électrode incidente, constitué d'un matériau tel feels the substrate 32 covered with a transparent conductive oxide 54, as an incident electrode, made of a material such
que l'oxyde d'étain et d'indium, l'oxyde d'étain et similaire. than tin and indium oxide, tin oxide and the like.
L'oxyde transparent conducteur est déposé par vaporisation ou par pulvérisation cathodique ou tout autre procédé bien connu des techniciens. En variante, le substrat de verre 32, recouvert d'un The transparent conductive oxide is deposited by vaporization or by cathode sputtering or any other process well known to technicians. As a variant, the glass substrate 32, covered with a
matériau d'électrode transparent tel que l'oxyde d'étain et a in- transparent electrode material such as tin oxide and has in-
dium est disponible dans le commerce. Le matériau d'électrode transparent et conducteur 34 doit présenter une épaisseur de l'ordre de 6,5 nanomètres et une résistivité de couche inférieure à environ 150 ohms par carré, de préférence inférieure à environ dium is commercially available. The transparent and conductive electrode material 34 should have a thickness of the order of 6.5 nanometers and a layer resistivity of less than about 150 ohms per square, preferably less than about
100.a par carré.100.a per square.
En se référant à la figure 2c, on voit que le substrat 32 qui comporte la couche 34 d'oxyde conducteur transparent est découpé en bandes n l'aide d'un laser. Le laser peut être de tout type capable de découper l'oxyde transparent conducteur. On oeut utiliser par exemple un laser YAG au neodyne excité en continu, rayonnant à 1,06 /um et commandé selon un mode de commutation Q. avec une puissance moyenne de l'ordre de 4,5 watts, une fréquence d'impulsion de l'ordre de 56 K Hz et une vitesse de découpage Referring to FIG. 2c, it can be seen that the substrate 32 which comprises the layer 34 of transparent conductive oxide is cut into strips n using a laser. The laser can be of any type capable of cutting the transparent conductive oxide. One can use for example a laser YAG with neodyne continuously excited, radiating at 1.06 / um and controlled according to a switching mode Q. with an average power of the order of 4.5 watts, a pulse frequency of the order of 56 K Hz and a cutting speed
d'environ 20 cm/seconde.about 20 cm / second.
Ensuite, comme illustré par la figure 2d, la région active 43 est déposée sur les bandes d'électrode incidente. Le substrat 32 comprenant la couche 34 d'oxyde transparent conducteur et la région semi-conductrice active 43 est encore découpée au laser, parallèlement et de façon adjacente au découpage précédent Jusqu'à l'électrode transparente, comme représenté sur la figure 2a. Par exemple, un laser YAG au neodyme à excitation continue, rayonnant à 1,06/um et fonctionnant avec une fréquence d'impulsion Then, as illustrated in FIG. 2d, the active region 43 is deposited on the incident electrode strips. The substrate 32 comprising the layer 34 of transparent conductive oxide and the active semiconductor region 43 is further cut by laser, parallel to and adjacent to the previous cut up to the transparent electrode, as shown in FIG. 2a. For example, a continuously excited neodymium YAG laser, radiating at 1.06 / µm and operating at a pulse frequency
de 36 KHz, une vitesse de découpage de 20 cm/seconde et une puis- of 36 KHz, a cutting speed of 20 cm / second and a power-
sance réglée à 1,7 watts est suffisant pour découper d' silicium sance set to 1.7 watts is enough to cut silicon
amorphe hydrogéné et un cermet jusqu'aux bandes d'oxyde transpa- hydrogenated amorphous and a cermet up to transparent oxide bands
rent conducteur 34 mais sans passer au travers de celles-ci. rent driver 34 but without passing through them.
Comme représenté sur la figure 2f, un matériau d'électrode As shown in Figure 2f, an electrode material
postérieure, constitué de titane, d'aluminium, d'indium ou simi- posterior, made of titanium, aluminum, indium or similar
laire est évaporé angulairement sur les bandes de la cellule so- the area is evaporated angularly on the bands of the cell so-
laire par exemple selon un angle de l'ordre de 30 à 450 par rapport à une perpendiculaire au substrat 32, de telle façon que le matériau forme des bandes 46 qui interconnectent en série les laire for example at an angle of about 30 to 450 relative to a perpendicular to the substrate 32, so that the material forms strips 46 which interconnect in series the
cellules individuelles. Enfin, des contacts 50 et 52 sont connec- individual cells. Finally, contacts 50 and 52 are connected
tés à la structure de batterie solaire par tout procédé connu. ties to the solar battery structure by any known process.
En variante, le matériau de l'électrode postérieure peut être vaporisé, pulvérisé cathodiquement ou déposé par tout procédé connu, sur toute la partie postérieure des bandes de matériau semi-conducteur, comme représenté sur la figure 3a et ensuite ce matériau est découpé au laser, parallèlement au découpage au laser ayant formé la rainure.illustrée à la figure 2e. La rainure est adjacente à la rainure représentée sur la figure 3b. Un découpage au laser YAG au neodyme, à excitation continue, effectué à l'aide d'une fréquence d'impulsion similaire et une vitesse identique, mais avec une puissance de l'ordre de 1,5 w, est suffisant pour tracer le contact électrique postérieur en formant une rainure As a variant, the material of the posterior electrode can be vaporized, cathodically pulverized or deposited by any known method, over the entire posterior part of the strips of semiconductor material, as shown in FIG. 3a and then this material is cut by laser , parallel to the laser cutting having formed the groove illustrated in FIG. 2e. The groove is adjacent to the groove shown in Figure 3b. A continuous excitation neodymium YAG laser cutting, carried out using a similar pulse frequency and an identical speed, but with a power of the order of 1.5 w, is sufficient to trace the contact. posterior electric forming a groove
24'8368624,83686
6 24836866 2483686
nais sans découper les couches de semi-conducteur ou d'oxyde born without cutting the semiconductor or oxide layers
conducteur transparent. Cette technique de zabricetion est appli- transparent conductor. This zabricetion technique is applied
cable aux matériaux semi-conducteurs dans lesquels la résistivité cable to semiconductor materials in which resistivity
superficielle latérale est suffisamment élevée par exemple supé- lateral surface is sufficiently high for example upper
rieure à 1010-<Lpar carré, pour que le contact électrique nos- térieur, appliqué sur les deux parois des bandes semi-conductrices less than 1010- <L per square, so that the electrical contact, applied to the two walls of the semiconductor strips
adjacentes ne sorte pas des cellules. On peut utiliser à cet ef- do not exit the cells. We can use for this purpose
fet du silicium amorphe hydrogéné, des cermets et similaires. Si le semiconducteur ou d'autres matériaux utilisés pour former la région active, présentent une faible résistivité superficielle fet of hydrogenated amorphous silicon, cermets and the like. If the semiconductor or other materials used to form the active region, have low surface resistivity
latérale, il convient alors de protéger le bord de la région ac- lateral, the edge of the region should be protected
tive à l'aide d'un matériau dielectrique approprié, avant de con- tive using an appropriate dielectric material, before con-
necter les bandes en série.nect the strips in series.
Cette invention sera maintenant décrite par les exemples non limitatifs suivants. Il demeure bien entendu que toute variante This invention will now be described by the following nonlimiting examples. Of course, any variant
est à la portée de l'homme de l'art. is within the reach of ordinary skill in the art.
:EX EP LE 1: EX EP LE 1
Un substrat de verre ayant des dimensions de 7,6 x 7,6 cm, A glass substrate having dimensions of 7.6 x 7.6 cm,
recouvert d'une couche d'oxyde d'étain et d'indium ayant une épais- covered with a layer of indium tin oxide having a thick-
seur de l'ordre de 250 nanomètres et une résistivité d'environ ohms par carré, fabriqué par la Société britannique "Triplex Glass Company, Ltd", Kings Norten, Birmingham, a été découpé au - laser, en utilisant un laser YAG au neodyme à excitation continue et commutation en code Q, avec une puissance de 4,5 watts, une fréquence d'impulsion de 36 Khz, une vitesse de traçage de 20 cm/ sec et une distance focale de l'ordre de 27 mm. Le découpage au laser a formé une rainure ayant une largeur d'environ 0,002 cm seur of the order of 250 nanometers and a resistivity of about ohms per square, manufactured by the British company "Triplex Glass Company, Ltd", Kings Norten, Birmingham, was cut by - laser, using a YAG laser with neodymium with continuous excitation and switching to Q code, with a power of 4.5 watts, a pulse frequency of 36 Khz, a tracing speed of 20 cm / sec and a focal distance of the order of 27 mm. The laser cutting formed a groove having a width of about 0.002 cm
entre des bandes d'oxyde d'étain et d'indium de 0,5 cm de large. between strips of tin and indium oxide 0.5 cm wide.
Le verre sous-jacent a légèrement fondu par endroits sur une nro- The underlying glass has melted slightly in places on a nro-
fondeur de quelques centaines d'Angstroms. Après le découpage au laser, la conductivité sur la zone découpée a été mesurée et elle founder of a few hundred Angstroms. After the laser cutting, the conductivity on the cut area was measured and it
a été trouvée légèrement conductrice. La zone légèrement conduc- was found to be slightly conductive. The slightly conductive area
trice a été éliminée par immersion du substrat dans une solution d'une Fart d'acide chlorhydrique concentré dans deux parts d'eau, was removed by immersing the substrate in a solution of a concentrated hydrochloric acid wax in two parts of water,
pendant une durée d'environ 45 secondes. for a duration of approximately 45 seconds.
Ensuite, la région semi-conductrice active comprenant le Next, the active semiconductor region comprising the
cermet PtSiO2, ayant une épaisseur d'environ 15 nanomètres, con- cermet PtSiO2, having a thickness of about 15 nanometers, con-
tenant environ 123X en volume de platine, une couene dopée de type P+ de silicium amorphe hydrogéné d'une épaisseur de l'ordre holding approximately 123X by volume of platinum, a doped skin of type P + of hydrogenated amorphous silicon with a thickness of the order
de 36 nanomètres9 une couche non dopée de silicium amorphe hydro- of 36 nanometers9 an undoped layer of hydro-amorphous silicon
gené ayant une épaisseur d'environ 590 nanomètres, et une couche gene having a thickness of about 590 nanometers, and a layer
finale de silicium amorphe hydrogéné dopé en type N+, d'une épais- final of hydrogenated amorphous silicon doped in N + type, of a thick-
seur de 36 nanomètres, a été déposée sur le substrat et les bandes d'oxyde d'étain et d'indium par les procédés décrits dans le bre- vet américain n0 4 167 051. Le silicium amorphe a été déposé par décharge luminescente dans une atmosphère contenant du -silicium, 36 nanometer, was deposited on the substrate and the bands of indium and tin oxide by the methods described in the American patent n ° 4 167 051. The amorphous silicon was deposited by luminescent discharge in a atmosphere containing -silicon,
de l'hydrogène et des agents modificateurs de conductivité appro- hydrogen and appropriate conductivity modifiers
priés. Le cermet a été formé par co-pulvérisation cathodique de prayed. The cermet was formed by co-sputtering of
platine (Pt) et de silice (SiO2).platinum (Pt) and silica (SiO2).
La région semi-conductrice active a été découpée par traçage The active semiconductor region has been cut out by tracing
à l'aide du laser mentionné précédemment, afin -de former des rai- using the laser mentioned above, in order to form rai-
nures dans la région semi-conductrice active, parallèles mais décalées par rapport au découpage initial au laser. Le laser fonctionnait à une puissance de 1,7 watts et avec une distance nures in the active semiconductor region, parallel but offset from the initial laser cutting. The laser operated at a power of 1.7 watts and with a distance
focale de 48 mm, la fréquence d'impulsion et la vitesse de décou- 48 mm focal length, pulse frequency and uncovering speed
page étant identiques à celles indiquées précédemment. La largeur page being identical to those indicated previously. The width
de la rainure ainsi tracée était d'environ 0,005 cm. La profon- of the groove thus drawn was about 0.005 cm. The depth
deur-de découpage était suffisante pour que la rainure aille the cut-out was sufficient for the groove to go
jusqu'à l'oxyde transparent conducteur, sans toutefois le traver- up to the transparent conductive oxide, without however crossing it
ser' Ensuite, les bandes et la région active ainsi que le substrat transparent ont été revOtus d'une électrode postérieure de titane jusqu'à une épaisseur de l'ordre de 100 nanomètres. La cellule a été découpée pour une troisième fois pour former une rainure dans le contact électrique postérieur, cette rainure étant parallèle et adjacente aux découpages précédents, en utilisant-un laser Then, the bands and the active region as well as the transparent substrate were coated with a posterior titanium electrode to a thickness of the order of 100 nanometers. The cell was cut for a third time to form a groove in the posterior electrical contact, this groove being parallel and adjacent to the previous cuts, using a laser.
fonctionnant à une puissance d'environ 1,3 watts, avec une dis- operating at a power of approximately 1.3 watts, with a dis-
tance focale de l'ordre de 75 mm et les fréquences d'impulsions ainsi que les vitesses de découpage indiquées précédemment. Des bandes de cuivre ont été fixées aux extrémités des électrodes à l'aide d'un cément epoxyargent. Enfin on a enlevé les shunts électriques en appliquant une polarisation inverse de 5 volts à focal length of the order of 75 mm and the pulse frequencies as well as the cutting speeds indicated above. Copper bands were attached to the ends of the electrodes using an epoxy silver cement. Finally we removed the electric shunts by applying a reverse polarization of 5 volts to
chaque cellule.each cell.
La cellule fabriquée selon le processus indiqué ci-dessus a été testée avec une lumière dont l'intensité était équivalente à, une lumière solaire de 1 AM. Une batterie solaire constituée de 12 bandes individuelles de cellule solaire présentait une The cell manufactured according to the process indicated above was tested with a light whose intensity was equivalent to, a sunlight of 1 AM. A solar battery made up of 12 individual strips of solar cell had a
tension Voc de 9,3 volts, environ 0,775 volt par cellule, un cou- Voc voltage of 9.3 volts, approximately 0.775 volts per cell, one cou-
rant de court-circuit J de l'ordre de 5,3 milliampères par cm2, un facteur de charge de 0,51 environ et un rendement de l'ordre short-circuit rant J of the order of 5.3 milliamps per cm2, a load factor of approximately 0.51 and a yield of the order
de 2,1%.2.1%.
EXEIMPLE IIEXAMPLE II
Une batterie solaire connectée en série a été fabriquée selon la technique indiquée dans l'exemple I, cependant le métal du contact postérieur était de l'indium et il a été vaporisé sur la région active du dispositif semi-conducteur en m8me temps que A solar battery connected in series was manufactured according to the technique indicated in Example I, however the metal of the posterior contact was indium and it was vaporized on the active region of the semiconductor device at the same time as
l'oxyde d'étain et d'indium. Ensuite, des rainures ont été décou- tin and indium oxide. Then grooves were cut.
pées dans l'indium par traçage au laser en utilisant une puissanee de laser de 1,3 watt, parallèlement et de façon adjacente aux swords in indium by laser tracing using a laser power of 1.3 watt, parallel and adjacent to
rainures tracées au laser dans le silicium amorphe hydrogéné. laser-traced grooves in hydrogenated amorphous silicon.
Après fixation des électrodes et élimination des courts-circuits électriques, la cellule solaire constituée de 10 cellules à bandes After fixing the electrodes and eliminating electrical short circuits, the solar cell made up of 10 strip cells
individuelles connectées en série, présentait une tension en cir- connected in series, had a voltage in
cuit ouvert de 7,9 volts, un courant de court-circuit de 4,6 mil- cooked open at 7.9 volts, a short-circuit current of 4.6 mil-
liampères par cm, un facteur de charge de 0,51 et un rendement de 1,9%o lorsqu'elle était exposée à une lumière d'essai présentant lamps per cm, a load factor of 0.51 and a yield of 1.9% o when exposed to a test light with
une intensité de l'ordre de 1 AM.an intensity of the order of 1 AM.
EXEMPLE IIIEXAMPLE III
Un substrat de verre de 7,6 x 7,6 cm recouvert d'une couche d'oxyde d'étain et d'indium ayant une résistivité de l'ordre de 104(2-par carré a été découpé par traçage à l'aide d'un laser, selon le processus défini à l'exemple I. Ensuite une structure à jonction tandem comprenant un cermet de platine, une couche de silicium amorphe, une jonction tunnel et une seconde couche de silicium amorphe, a été déposée sur le substrat et les bandes d'oxyde d'étain et d'indium. L'épaisseur de la couche de cermet était de l'ordre de 7,5 nanomètres. La première couche de silicium amorphe, ayant une région de type Pl une épaisseur d'environ 30 manomètres, une région intrinsèque dont l'épaisseur était de l'ordre de 76 nanomètres et une région de type N, a été déposée sur le cermet de platine. Une jonction tunnel d'un cermet de platine de 7,5 manomètres d'épaisseur a été déposée sur la couche de silicium amorphe. La seconde couche de A 7.6 x 7.6 cm glass substrate covered with a layer of indium tin oxide having a resistivity of the order of 104 (2-per square was cut by tracing with Using a laser, according to the process defined in Example I. Next, a tandem junction structure comprising a platinum cermet, a layer of amorphous silicon, a tunnel junction and a second layer of amorphous silicon, was deposited on the substrate and bands of tin and indium oxide. The thickness of the cermet layer was of the order of 7.5 nanometers. The first layer of amorphous silicon, having a Pl type region a thickness d "about 30 manometers, an intrinsic region whose thickness was around 76 nanometers and an N-type region, was deposited on the platinum cermet. A tunnel junction of a platinum cermet of 7.5 manometers thick was deposited on the amorphous silicon layer. The second layer of
silicium amorphe, ayant une région de type P. une région intrin- amorphous silicon, having a P-type region an intrinsic region
sèque et-une région de type N avec des épaisseurs de 30 nanomètres, 408 nanomètres et 45 nanomètres., respectivement, a été déposée sur la jonction tunnel. Les régions de silicium amorphe ont été and an N-type region with thicknesses of 30 nanometers, 408 nanometers and 45 nanometers., respectively, has been deposited on the tunnel junction. The regions of amorphous silicon have been
9 248368-69 248 368-6
déposées par décharge luminescente et les cermets-de platine ont deposited by luminescent discharge and the platinum cermets have
été déposés par co-pulvérisation cathodique de platine et de si- been deposited by cathodic co-sputtering of platinum and
lice. Ces couches ont été découpées par traçage au laser afin de former une rainure parallèle et adjacente au traçage effectué précédemment, à l'aide d'un laser fonctionnant dans les conditions indiquées dans l'exemple I avec une puissance de 1,7 watts. Les running. These layers were cut by laser tracing in order to form a groove parallel and adjacent to the tracing carried out previously, using a laser operating under the conditions indicated in Example I with a power of 1.7 watts. The
rainures ainsi réalisé-es étaient adjacentes et parallèles aux rai- grooves thus produced were adjacent and parallel to the ra-
nures décrites en référence à la figure 2a. Ensuite, une couche d'étain ayant une épaisseur de 100 nanomètres a été vaporisée selon un angle de l'ordre de 30 , par rapport à la perpendiculaire au substrat, comme représenté sur la figure 2f. Des bandes de nures described with reference to Figure 2a. Then, a layer of tin having a thickness of 100 nanometers was vaporized at an angle of the order of 30, relative to the perpendicular to the substrate, as shown in FIG. 2f. Bands of
cuivre ont été fixées à l'électrode à l'aide d'un cément epoxy- copper were attached to the electrode using an epoxy cement
argent. Les courts-circuits électriques ont été éliminés par l'ap- silver. Electrical short circuits have been eliminated by
plication d'une tension de polarisation inverse. application of a reverse bias voltage.
La batterie solaire a été constituée par les cellules dispo-- The solar battery was made up of available cells--
sées horizontalement en série avec deux cellules verticalement en tandem soit un total de 20 cellules. Le dispositif présentait une tension en circuit ouvert de 11,8 volts lorsqu'il était exposé à seated horizontally in series with two cells vertically in tandem for a total of 20 cells. The device had an open circuit voltage of 11.8 volts when exposed to
une lumière d'une intensité de 1 AM. - - a light with an intensity of 1 AM. - -
Il demeure bien entendu que cette invention n'est pas limitée aux différents exemples de réalisation décrits et/ou représentés Obviously, this invention is not limited to the various embodiments described and / or shown.
ici mais qu'elle en englobe toutes les variantes. here but that it encompasses all variants.
Claims (15)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/156,081 US4292092A (en) | 1980-06-02 | 1980-06-02 | Laser processing technique for fabricating series-connected and tandem junction series-connected solar cells into a solar battery |
Publications (2)
Publication Number | Publication Date |
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FR2483686A1 true FR2483686A1 (en) | 1981-12-04 |
FR2483686B1 FR2483686B1 (en) | 1986-03-21 |
Family
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FR8110817A Expired FR2483686B1 (en) | 1980-06-02 | 1981-06-01 | METHOD FOR MANUFACTURING A SOLAR BATTERY |
Country Status (7)
Country | Link |
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US (1) | US4292092A (en) |
JP (1) | JPS5712568A (en) |
DE (1) | DE3121350C2 (en) |
FR (1) | FR2483686B1 (en) |
GB (1) | GB2077038B (en) |
HK (1) | HK78486A (en) |
MY (1) | MY8500783A (en) |
Families Citing this family (164)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4356341A (en) * | 1981-03-13 | 1982-10-26 | Varian Associates, Inc. | Cascade solar cell having conductive interconnects |
US4443651A (en) * | 1981-03-31 | 1984-04-17 | Rca Corporation | Series connected solar cells on a single substrate |
JPS58134482A (en) * | 1982-02-05 | 1983-08-10 | Agency Of Ind Science & Technol | Photovoltaic device |
JPS58137264A (en) * | 1982-02-09 | 1983-08-15 | Fuji Electric Corp Res & Dev Ltd | Photoelectric transducer |
JPS59201471A (en) * | 1983-04-29 | 1984-11-15 | Semiconductor Energy Lab Co Ltd | Photoelectric conversion semiconductor device |
US4529829A (en) * | 1982-11-24 | 1985-07-16 | Semiconductor Energy Laboratory Co., Ltd. | Photoelectric conversion device |
DE3382695T2 (en) * | 1982-11-24 | 1993-09-23 | Semiconductor Energy Lab | PHOTOVOLTAIC CONVERTER. |
JPS607778A (en) * | 1983-06-27 | 1985-01-16 | Semiconductor Energy Lab Co Ltd | Photoelectric conversion semiconductor device |
DE3300041A1 (en) * | 1983-01-03 | 1984-07-05 | Siemens AG, 1000 Berlin und 8000 München | Method for abrading metal layers from substrates by means of laser beams |
JPS59154079A (en) * | 1983-02-22 | 1984-09-03 | Semiconductor Energy Lab Co Ltd | Photoelectric conversion semiconductor device |
JPS59155974A (en) * | 1983-02-25 | 1984-09-05 | Semiconductor Energy Lab Co Ltd | Manufacture of photoelectric converter |
JPS59172274A (en) * | 1983-03-18 | 1984-09-28 | Sanyo Electric Co Ltd | Manufacture of photovoltage device |
DE3310362A1 (en) * | 1983-03-22 | 1984-10-11 | Siemens AG, 1000 Berlin und 8000 München | Method of altering the optical properties of the interface between semiconductor material and metal contact |
JPS59182578A (en) * | 1983-03-31 | 1984-10-17 | Sanyo Electric Co Ltd | Manufacture of photovoltaic device |
JPH0758797B2 (en) * | 1983-04-18 | 1995-06-21 | 株式会社半導体エネルギー研究所 | Method for manufacturing photoelectric conversion semiconductor device |
JPS59193075A (en) * | 1983-04-18 | 1984-11-01 | Semiconductor Energy Lab Co Ltd | Manufacture of photoelectric conversion semiconductor device |
JPS59193782A (en) * | 1983-04-18 | 1984-11-02 | Semiconductor Energy Lab Co Ltd | Laser working machine |
JPH0614556B2 (en) * | 1983-04-29 | 1994-02-23 | 株式会社半導体エネルギー研究所 | Photoelectric conversion device and manufacturing method thereof |
US4502225A (en) * | 1983-05-06 | 1985-03-05 | Rca Corporation | Mechanical scriber for semiconductor devices |
US4517403A (en) * | 1983-05-16 | 1985-05-14 | Atlantic Richfield Company | Series connected solar cells and method of formation |
JPS59220979A (en) * | 1983-05-31 | 1984-12-12 | Sanyo Electric Co Ltd | Manufacture of photovoltaic device |
JPS6014441A (en) * | 1983-07-04 | 1985-01-25 | Semiconductor Energy Lab Co Ltd | Manufacture of semiconductor device |
JPS6014479A (en) * | 1983-07-04 | 1985-01-25 | Semiconductor Energy Lab Co Ltd | Manufacture of photoelectric conversion device |
US4594471A (en) * | 1983-07-13 | 1986-06-10 | Semiconductor Energy Laboratory Co., Ltd. | Photoelectric conversion device |
JPS6059786A (en) * | 1983-09-12 | 1985-04-06 | Sanyo Electric Co Ltd | Manufacture of photovoltaic device |
JPS6041266A (en) * | 1983-08-15 | 1985-03-04 | Semiconductor Energy Lab Co Ltd | Manufacture of photoelectric converter |
JPS6059785A (en) * | 1983-09-12 | 1985-04-06 | Semiconductor Energy Lab Co Ltd | Photoelectric conversion device and manufacture thereof |
JPS6066872A (en) * | 1983-09-22 | 1985-04-17 | Semiconductor Energy Lab Co Ltd | Manufacture of semiconductor device |
JPS6085574A (en) * | 1983-10-18 | 1985-05-15 | Semiconductor Energy Lab Co Ltd | Manufacture of semiconductor device |
JPH0712031B2 (en) * | 1983-10-27 | 1995-02-08 | 株式会社半導体エネルギー研究所 | Processing method of translucent conductive film |
JPS6094781A (en) * | 1983-10-27 | 1985-05-27 | Semiconductor Energy Lab Co Ltd | Manufacture of semiconductor device |
JPS60100480A (en) * | 1983-11-04 | 1985-06-04 | Semiconductor Energy Lab Co Ltd | Manufacture of photoelectric converter |
JPS60100479A (en) * | 1983-11-04 | 1985-06-04 | Semiconductor Energy Lab Co Ltd | Photoelectric converter |
JPH0712032B2 (en) * | 1983-11-07 | 1995-02-08 | 株式会社半導体エネルギー研究所 | Laser processing method for organic resin coating |
JPH0713954B2 (en) * | 1983-11-07 | 1995-02-15 | 株式会社 半導体エネルギー研究所 | Liquid crystal display device manufacturing method |
JP2540501B2 (en) * | 1983-11-10 | 1996-10-02 | 株式会社 半導体エネルギー研究所 | Laser processing method |
JPS60103623A (en) * | 1983-11-10 | 1985-06-07 | Semiconductor Energy Lab Co Ltd | Laser processing method |
GB8330578D0 (en) * | 1983-11-16 | 1983-12-21 | Rca Corp | Inter-connected photovoltaic devices |
JPS60110178A (en) * | 1983-11-18 | 1985-06-15 | Semiconductor Energy Lab Co Ltd | Manufacture of semiconductor device |
US4510344A (en) * | 1983-12-19 | 1985-04-09 | Atlantic Richfield Company | Thin film solar cell substrate |
US4581625A (en) * | 1983-12-19 | 1986-04-08 | Atlantic Richfield Company | Vertically integrated solid state color imager |
US4542255A (en) * | 1984-01-03 | 1985-09-17 | Atlantic Richfield Company | Gridded thin film solar cell |
JPS60211881A (en) * | 1984-04-05 | 1985-10-24 | Semiconductor Energy Lab Co Ltd | Manufacture of semiconductor device |
JPH0693518B2 (en) * | 1984-04-05 | 1994-11-16 | 株式会社半導体エネルギー研究所 | Semiconductor device manufacturing method |
JPS60211880A (en) * | 1984-04-05 | 1985-10-24 | Semiconductor Energy Lab Co Ltd | Manufacture of photoelectric conversion device |
JPS60211817A (en) * | 1984-04-05 | 1985-10-24 | Semiconductor Energy Lab Co Ltd | Apparatus for photoelectric conversion |
JP2585503B2 (en) * | 1984-04-28 | 1997-02-26 | 株式会社 半導体エネルギー研究所 | Laser processing method |
JPS60240171A (en) * | 1984-05-15 | 1985-11-29 | Mitsubishi Electric Corp | Solar electric generator |
JPS6142971A (en) * | 1984-08-06 | 1986-03-01 | Sanyo Electric Co Ltd | Manufacture of semiconductor device |
US4650524A (en) * | 1984-06-20 | 1987-03-17 | Sanyo Electric Co., Ltd | Method for dividing semiconductor film formed on a substrate into plural regions by backside energy beam irradiation |
US4663494A (en) * | 1984-07-19 | 1987-05-05 | Sanyo Electric Co., Ltd. | Photovoltaic device |
JPS6174376A (en) * | 1984-09-19 | 1986-04-16 | Fuji Electric Co Ltd | Thin-film photovoltaic element |
US4574160A (en) * | 1984-09-28 | 1986-03-04 | The Standard Oil Company | Flexible, rollable photovoltaic cell module |
JPS61116884A (en) * | 1984-11-12 | 1986-06-04 | Semiconductor Energy Lab Co Ltd | Manufacture of photoelectric conversion semiconductor device |
JPS61116885A (en) * | 1984-11-12 | 1986-06-04 | Semiconductor Energy Lab Co Ltd | Manufacture of photoelectric conversion semiconductor device |
US4697041A (en) * | 1985-02-15 | 1987-09-29 | Teijin Limited | Integrated solar cells |
US4599154A (en) * | 1985-03-15 | 1986-07-08 | Atlantic Richfield Company | Electrically enhanced liquid jet processing |
US4783421A (en) * | 1985-04-15 | 1988-11-08 | Solarex Corporation | Method for manufacturing electrical contacts for a thin-film semiconductor device |
US4937651A (en) * | 1985-08-24 | 1990-06-26 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device free from the current leakage through a semiconductor layer and method for manufacturing same |
JPS6265479A (en) * | 1985-09-18 | 1987-03-24 | Fuji Electric Corp Res & Dev Ltd | Manufacture of thin film solar battery |
JPS6276786A (en) * | 1985-09-30 | 1987-04-08 | Sanyo Electric Co Ltd | Manufacture of photovoltaic device |
JPH065778B2 (en) * | 1985-12-17 | 1994-01-19 | 株式会社富士電機総合研究所 | Method for manufacturing optical semiconductor device |
EP0229397B1 (en) * | 1986-01-06 | 1995-08-09 | Semiconductor Energy Laboratory Co., Ltd. | Photoelectric conversion device and method for manufacturing the same |
DE3650362T2 (en) * | 1986-01-06 | 1996-01-25 | Semiconductor Energy Lab | High-response photoelectric conversion device and manufacturing method. |
JPS61210681A (en) * | 1986-02-20 | 1986-09-18 | Sanyo Electric Co Ltd | Manufacture of photovoltaic device |
EP0248953A1 (en) * | 1986-06-10 | 1987-12-16 | The Standard Oil Company | Tandem photovoltaic devices |
US6149988A (en) * | 1986-09-26 | 2000-11-21 | Semiconductor Energy Laboratory Co., Ltd. | Method and system of laser processing |
US5708252A (en) * | 1986-09-26 | 1998-01-13 | Semiconductor Energy Laboratory Co., Ltd. | Excimer laser scanning system |
US4865999A (en) * | 1987-07-08 | 1989-09-12 | Glasstech Solar, Inc. | Solar cell fabrication method |
EP0393034B1 (en) * | 1987-07-24 | 1994-02-02 | AMORPHOUS SILICON, Inc. | Solar cell substrate and process for its production |
US6261856B1 (en) | 1987-09-16 | 2001-07-17 | Semiconductor Energy Laboratory Co., Ltd. | Method and system of laser processing |
JPH0620153B2 (en) * | 1987-12-25 | 1994-03-16 | 鐘淵化学工業株式会社 | Photovoltaic element |
US4953577A (en) * | 1989-07-06 | 1990-09-04 | Solarex Corporation | Spray encapsulation of photovoltaic modules |
CA2024662A1 (en) * | 1989-09-08 | 1991-03-09 | Robert Oswald | Monolithic series and parallel connected photovoltaic module |
JP2983684B2 (en) * | 1991-05-23 | 1999-11-29 | 三洋電機株式会社 | Method for manufacturing photovoltaic device |
US5246506A (en) * | 1991-07-16 | 1993-09-21 | Solarex Corporation | Multijunction photovoltaic device and fabrication method |
JP2648064B2 (en) * | 1991-11-15 | 1997-08-27 | 三洋電機株式会社 | Method for manufacturing optical semiconductor device |
US5232549A (en) * | 1992-04-14 | 1993-08-03 | Micron Technology, Inc. | Spacers for field emission display fabricated via self-aligned high energy ablation |
US5432015A (en) * | 1992-05-08 | 1995-07-11 | Westaim Technologies, Inc. | Electroluminescent laminate with thick film dielectric |
US5484314A (en) * | 1994-10-13 | 1996-01-16 | Micron Semiconductor, Inc. | Micro-pillar fabrication utilizing a stereolithographic printing process |
US5492234A (en) * | 1994-10-13 | 1996-02-20 | Micron Technology, Inc. | Method for fabricating spacer support structures useful in flat panel displays |
JP3017422B2 (en) * | 1995-09-11 | 2000-03-06 | キヤノン株式会社 | Photovoltaic element array and manufacturing method thereof |
JPH09260695A (en) * | 1996-03-19 | 1997-10-03 | Canon Inc | Manufacture of photovoltaic device array |
US6211455B1 (en) | 1998-07-02 | 2001-04-03 | Astropower | Silicon thin-film, integrated solar cell, module, and methods of manufacturing the same |
US6077722A (en) * | 1998-07-14 | 2000-06-20 | Bp Solarex | Producing thin film photovoltaic modules with high integrity interconnects and dual layer contacts |
US6239354B1 (en) * | 1998-10-09 | 2001-05-29 | Midwest Research Institute | Electrical isolation of component cells in monolithically interconnected modules |
US6455347B1 (en) * | 1999-06-14 | 2002-09-24 | Kaneka Corporation | Method of fabricating thin-film photovoltaic module |
EP1801889B1 (en) | 1999-09-01 | 2017-05-17 | Kaneka Corporation | Thin-film solar cell module and method of manufacturing the same |
US6353175B1 (en) * | 1999-09-17 | 2002-03-05 | Jx Crystals Inc. | Two-terminal cell-interconnected-circuits using mechanically-stacked photovoltaic cells for line-focus concentrator arrays |
US6155900A (en) | 1999-10-12 | 2000-12-05 | Micron Technology, Inc. | Fiber spacers in large area vacuum displays and method for manufacture |
DE10017610C2 (en) * | 2000-03-30 | 2002-10-31 | Hahn Meitner Inst Berlin Gmbh | Process for producing a solar module with integrated series-connected thin-film solar cells and use thereof |
EP1320892A2 (en) * | 2000-07-06 | 2003-06-25 | BP Corporation North America Inc. | Partially transparent photovoltaic modules |
US20040219801A1 (en) * | 2002-04-25 | 2004-11-04 | Oswald Robert S | Partially transparent photovoltaic modules |
JP4302335B2 (en) * | 2001-05-22 | 2009-07-22 | 株式会社半導体エネルギー研究所 | Manufacturing method of solar cell |
WO2003010143A1 (en) * | 2001-07-26 | 2003-02-06 | Samsung Electronics Co., Ltd. | Dialkylhydroxybenzoic acid derivatives containing metal chelating groups and their therapeutic uses |
US6559411B2 (en) | 2001-08-10 | 2003-05-06 | First Solar, Llc | Method and apparatus for laser scribing glass sheet substrate coatings |
AU2002252110A1 (en) * | 2002-02-27 | 2003-09-09 | Midwest Research Institute | Monolithic photovoltaic energy conversion device |
US20060112987A1 (en) * | 2003-01-10 | 2006-06-01 | Toshinobu Nakata | Transparent thin-film solar cell module and its manufacturing method |
US7535019B1 (en) | 2003-02-18 | 2009-05-19 | Nanosolar, Inc. | Optoelectronic fiber |
US20050072461A1 (en) * | 2003-05-27 | 2005-04-07 | Frank Kuchinski | Pinhole porosity free insulating films on flexible metallic substrates for thin film applications |
DE10326547A1 (en) * | 2003-06-12 | 2005-01-05 | Siemens Ag | Tandem solar cell with a common organic electrode |
US20050224109A1 (en) | 2004-04-09 | 2005-10-13 | Posbic Jean P | Enhanced function photovoltaic modules |
US20050272175A1 (en) * | 2004-06-02 | 2005-12-08 | Johannes Meier | Laser structuring for manufacture of thin film silicon solar cells |
KR100631898B1 (en) * | 2005-01-19 | 2006-10-11 | 삼성전기주식회사 | Gallium nitride based light emitting device having ESD protection capability and method for manufacturing same |
US7196262B2 (en) * | 2005-06-20 | 2007-03-27 | Solyndra, Inc. | Bifacial elongated solar cell devices |
US7394016B2 (en) * | 2005-10-11 | 2008-07-01 | Solyndra, Inc. | Bifacial elongated solar cell devices with internal reflectors |
US7772485B2 (en) * | 2005-07-14 | 2010-08-10 | Konarka Technologies, Inc. | Polymers with low band gaps and high charge mobility |
US8158881B2 (en) * | 2005-07-14 | 2012-04-17 | Konarka Technologies, Inc. | Tandem photovoltaic cells |
US7781673B2 (en) * | 2005-07-14 | 2010-08-24 | Konarka Technologies, Inc. | Polymers with low band gaps and high charge mobility |
US20080006324A1 (en) * | 2005-07-14 | 2008-01-10 | Konarka Technologies, Inc. | Tandem Photovoltaic Cells |
US20070267055A1 (en) * | 2005-07-14 | 2007-11-22 | Konarka Technologies, Inc. | Tandem Photovoltaic Cells |
US20070181179A1 (en) * | 2005-12-21 | 2007-08-09 | Konarka Technologies, Inc. | Tandem photovoltaic cells |
US8344238B2 (en) * | 2005-07-19 | 2013-01-01 | Solyndra Llc | Self-cleaning protective coatings for use with photovoltaic cells |
KR100725110B1 (en) * | 2005-12-14 | 2007-06-04 | 한국과학기술원 | Pass-through integrated thin-film solar cells and method of manufacturing thereof |
KR100656738B1 (en) * | 2005-12-14 | 2006-12-14 | 한국과학기술원 | Intergrated thin-film solar cells and method of manufacturing thereof |
US7259322B2 (en) * | 2006-01-09 | 2007-08-21 | Solyndra, Inc. | Interconnects for solar cell devices |
US20070210420A1 (en) * | 2006-03-11 | 2007-09-13 | Nelson Curt L | Laser delamination of thin metal film using sacrificial polymer layer |
US20080047599A1 (en) * | 2006-03-18 | 2008-02-28 | Benyamin Buller | Monolithic integration of nonplanar solar cells |
US20070215195A1 (en) * | 2006-03-18 | 2007-09-20 | Benyamin Buller | Elongated photovoltaic cells in tubular casings |
US20100326429A1 (en) * | 2006-05-19 | 2010-12-30 | Cumpston Brian H | Hermetically sealed cylindrical solar cells |
US7235736B1 (en) | 2006-03-18 | 2007-06-26 | Solyndra, Inc. | Monolithic integration of cylindrical solar cells |
US20080302418A1 (en) * | 2006-03-18 | 2008-12-11 | Benyamin Buller | Elongated Photovoltaic Devices in Casings |
US20070215197A1 (en) * | 2006-03-18 | 2007-09-20 | Benyamin Buller | Elongated photovoltaic cells in casings |
US8183458B2 (en) | 2007-03-13 | 2012-05-22 | Solyndra Llc | Photovoltaic apparatus having a filler layer and method for making the same |
US20090014055A1 (en) * | 2006-03-18 | 2009-01-15 | Solyndra, Inc. | Photovoltaic Modules Having a Filling Material |
KR20070101917A (en) * | 2006-04-12 | 2007-10-18 | 엘지전자 주식회사 | Thin-film solar cell and fabrication method thereof |
US8829336B2 (en) * | 2006-05-03 | 2014-09-09 | Rochester Institute Of Technology | Nanostructured quantum dots or dashes in photovoltaic devices and methods thereof |
US20100132765A1 (en) * | 2006-05-19 | 2010-06-03 | Cumpston Brian H | Hermetically sealed solar cells |
US20080029152A1 (en) * | 2006-08-04 | 2008-02-07 | Erel Milshtein | Laser scribing apparatus, systems, and methods |
US7879685B2 (en) * | 2006-08-04 | 2011-02-01 | Solyndra, Inc. | System and method for creating electric isolation between layers comprising solar cells |
US20080083449A1 (en) * | 2006-10-06 | 2008-04-10 | Solyndra, Inc., A Delaware Corporation | Sealed photovoltaic apparatus |
JP2010506405A (en) * | 2006-10-06 | 2010-02-25 | ソルインドラ,インコーポレーテッド | Sealed photovoltaic device |
US8008421B2 (en) | 2006-10-11 | 2011-08-30 | Konarka Technologies, Inc. | Photovoltaic cell with silole-containing polymer |
US8008424B2 (en) | 2006-10-11 | 2011-08-30 | Konarka Technologies, Inc. | Photovoltaic cell with thiazole-containing polymer |
WO2008083042A2 (en) * | 2006-12-29 | 2008-07-10 | Bp Corporation North America Inc. | Photovoltaic modules with a transparent material having a camouflaged pattern |
US20080178927A1 (en) * | 2007-01-30 | 2008-07-31 | Thomas Brezoczky | Photovoltaic apparatus having an elongated photovoltaic device using an involute-based concentrator |
US20080196759A1 (en) * | 2007-02-16 | 2008-08-21 | Thomas Brezoczky | Photovoltaic assembly with elongated photovoltaic devices and integrated involute-based reflectors |
US8476097B2 (en) * | 2007-08-30 | 2013-07-02 | Oerlikon Solar Ag, Trubbach | Method for manufacturing and scribing a thin-film solar cell |
US20090078303A1 (en) * | 2007-09-24 | 2009-03-26 | Solyndra, Inc. | Encapsulated Photovoltaic Device Used With A Reflector And A Method of Use for the Same |
DE102008005284A1 (en) * | 2008-01-19 | 2009-07-30 | Schott Solar Gmbh | Method and production of a photovoltaic module |
DE102008006166A1 (en) * | 2008-01-26 | 2009-07-30 | Schott Solar Gmbh | Method for producing a photovoltaic module |
US20090211633A1 (en) * | 2008-02-21 | 2009-08-27 | Konarka Technologies Inc. | Tandem Photovoltaic Cells |
GB2457720A (en) * | 2008-02-23 | 2009-08-26 | Philip Thomas Rumsby | Method for laser processing on the opposite sides of thin transparent substrates |
DE102008015807A1 (en) * | 2008-03-27 | 2009-10-22 | Schott Solar Gmbh | Process for structuring the zinc oxide front electrode layer of a photovoltaic module |
GB2459274A (en) * | 2008-04-15 | 2009-10-21 | Renewable Energy Corp Asa | Wafer based solar panels |
DE212009000047U1 (en) * | 2008-04-18 | 2011-03-17 | Oerlikon Trading Ag, Trübbach | Photovoltaic device |
WO2010009436A2 (en) | 2008-07-17 | 2010-01-21 | Uriel Solar Inc. | High power efficiency, large substrate, polycrystalline cdte thin film semiconductor photovoltaic cell structures grown by molecular beam epitaxy at high deposition rate for use in solar electricity generation |
JP5506258B2 (en) * | 2008-08-06 | 2014-05-28 | キヤノン株式会社 | Rectifier element |
US8455606B2 (en) * | 2008-08-07 | 2013-06-04 | Merck Patent Gmbh | Photoactive polymers |
KR20100021045A (en) * | 2008-08-14 | 2010-02-24 | 주성엔지니어링(주) | Thin film type solar cell and method for manufacturing the same |
US20100323471A1 (en) * | 2008-08-21 | 2010-12-23 | Applied Materials, Inc. | Selective Etch of Laser Scribed Solar Cell Substrate |
JP2012504350A (en) * | 2008-09-29 | 2012-02-16 | シンシリコン・コーポレーション | Integrated solar module |
WO2012058652A2 (en) | 2010-10-29 | 2012-05-03 | Drexel University | Tunable electro-optic filter stack |
WO2012037445A2 (en) | 2010-09-17 | 2012-03-22 | Drexel University | Novel applications for alliform carbon |
CN102598286A (en) * | 2009-09-06 | 2012-07-18 | 张晗钟 | Tubular photovoltaic device and method of making |
CN102782882A (en) * | 2009-09-18 | 2012-11-14 | 欧瑞康太阳能股份公司(特吕巴赫) | High efficiency micromorph tandem cells |
JP5813654B2 (en) * | 2009-12-10 | 2015-11-17 | ウリエル ソーラー インコーポレイテッド | High power efficiency polycrystalline CdTe thin film semiconductor photovoltaic cell structure for use in photovoltaic power generation |
CN102117815B (en) * | 2010-01-06 | 2012-12-26 | 京东方科技集团股份有限公司 | Solar battery assembly and preparation method thereof |
DE202010013161U1 (en) | 2010-07-08 | 2011-03-31 | Oerlikon Solar Ag, Trübbach | Laser processing with several beams and suitable laser optics head |
GB201014778D0 (en) | 2010-09-06 | 2010-10-20 | Baird Brian W | Picosecond laser beam shaping assembly and a method of shaping a picosecond laser beam |
US8563347B2 (en) | 2010-11-17 | 2013-10-22 | E I Du Pont De Nemours And Company | Method for producing a thin-film photovoltaic cell having an etchant-resistant electrode and an integrated bypass diode and a panel incorporating the same |
KR20120095786A (en) * | 2011-02-21 | 2012-08-29 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | Photoelectric conversion device |
US9912290B2 (en) | 2012-06-18 | 2018-03-06 | Sunpower Corporation | High current burn-in of solar cells |
TW201414561A (en) | 2012-06-20 | 2014-04-16 | Tel Solar Ag | Laser scribing system |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USRE27772E (en) * | 1971-10-15 | 1973-10-02 | Method of manufacturing thin film components | |
DE2837315A1 (en) * | 1977-09-06 | 1979-03-15 | Nat Semiconductor Corp | PROCESS FOR CHANGING THE CONDUCTIVITY OF A SEMICONDUCTOR LAYER IN A SEMICONDUCTOR BODY |
DE2839038A1 (en) * | 1977-09-08 | 1979-03-22 | Photon Power Inc | METHOD FOR PRODUCING A SERIAL ARRANGEMENT OF BARRIER PHOTOCELLS, AND PHOTOCELL ARRANGEMENT OR BATTERY PRODUCED BY THIS METHOD |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3483038A (en) * | 1967-01-05 | 1969-12-09 | Rca Corp | Integrated array of thin-film photovoltaic cells and method of making same |
US3553421A (en) * | 1968-11-07 | 1971-01-05 | Arthur L Schawlow | Method of and apparatus for erasing |
US4064521A (en) * | 1975-07-28 | 1977-12-20 | Rca Corporation | Semiconductor device having a body of amorphous silicon |
US4044222A (en) * | 1976-01-16 | 1977-08-23 | Western Electric Company, Inc. | Method of forming tapered apertures in thin films with an energy beam |
JPS52108780A (en) * | 1976-03-08 | 1977-09-12 | Seiko Epson Corp | Manufacture for solar cell |
US4081653A (en) * | 1976-12-27 | 1978-03-28 | Western Electric Co., Inc. | Removal of thin films from substrates by laser induced explosion |
US4125757A (en) * | 1977-11-04 | 1978-11-14 | The Torrington Company | Apparatus and method for laser cutting |
US4167015A (en) * | 1978-04-24 | 1979-09-04 | Rca Corporation | Cermet layer for amorphous silicon solar cells |
DE2827049A1 (en) * | 1978-06-20 | 1980-01-10 | Siemens Ag | SOLAR CELL BATTERY AND METHOD FOR THEIR PRODUCTION |
US4181538A (en) * | 1978-09-26 | 1980-01-01 | The United States Of America As Represented By The United States Department Of Energy | Method for making defect-free zone by laser-annealing of doped silicon |
US4214918A (en) * | 1978-10-12 | 1980-07-29 | Stanford University | Method of forming polycrystalline semiconductor interconnections, resistors and contacts by applying radiation beam |
US4229232A (en) * | 1978-12-11 | 1980-10-21 | Spire Corporation | Method involving pulsed beam processing of metallic and dielectric materials |
US4228570A (en) * | 1979-10-15 | 1980-10-21 | Photon Power, Inc. | Electroding preparation apparatus |
-
1980
- 1980-06-02 US US06/156,081 patent/US4292092A/en not_active Expired - Lifetime
-
1981
- 1981-05-29 DE DE3121350A patent/DE3121350C2/en not_active Expired - Lifetime
- 1981-06-01 GB GB8116735A patent/GB2077038B/en not_active Expired
- 1981-06-01 FR FR8110817A patent/FR2483686B1/en not_active Expired
- 1981-06-02 JP JP8554181A patent/JPS5712568A/en active Granted
-
1985
- 1985-12-30 MY MY783/85A patent/MY8500783A/en unknown
-
1986
- 1986-10-16 HK HK784/86A patent/HK78486A/en not_active IP Right Cessation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USRE27772E (en) * | 1971-10-15 | 1973-10-02 | Method of manufacturing thin film components | |
DE2837315A1 (en) * | 1977-09-06 | 1979-03-15 | Nat Semiconductor Corp | PROCESS FOR CHANGING THE CONDUCTIVITY OF A SEMICONDUCTOR LAYER IN A SEMICONDUCTOR BODY |
DE2839038A1 (en) * | 1977-09-08 | 1979-03-22 | Photon Power Inc | METHOD FOR PRODUCING A SERIAL ARRANGEMENT OF BARRIER PHOTOCELLS, AND PHOTOCELL ARRANGEMENT OR BATTERY PRODUCED BY THIS METHOD |
Also Published As
Publication number | Publication date |
---|---|
JPH0472392B2 (en) | 1992-11-18 |
GB2077038A (en) | 1981-12-09 |
FR2483686B1 (en) | 1986-03-21 |
GB2077038B (en) | 1984-01-25 |
US4292092A (en) | 1981-09-29 |
DE3121350C2 (en) | 1995-08-17 |
HK78486A (en) | 1986-10-24 |
DE3121350A1 (en) | 1982-07-08 |
MY8500783A (en) | 1985-12-31 |
JPS5712568A (en) | 1982-01-22 |
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