TW201414561A - Laser scribing system - Google Patents

Abstract

A laser scribing system for removing portions of a thin film layer positioned on a large-area substrate is provided. The system includes a source laser, a diffractive optical element configured to produce one or more optical scribing beams from a laser beam provided by the source laser, a blocking element, a scattering element, or a combination thereof, the blocking element and the scattering element being positioned between the diffractive optical element and the large-area substrate and configured to block one or more portions of unwanted diffracted beams, one or more of the optical scribing beams, or a combination thereof, focusing optics configured to focus the optical scribing beams, and a control system configured to dynamically position the optical scribing beams with respect to the substrate and control the source laser, an alignment and spacing of the diffractive optical element, the blocking element, the scanning element, or the combination thereof, and the focusing optics.

Description

Laser marking system

This invention relates to laser scribing systems, and more particularly to laser scribing systems for fabricating large scale thin film solar cells. Furthermore, the present invention relates to the use of a laser scribing system for dividing a photovoltaic device into a plurality of segments.

Laser systems have been used to scribe various materials and to cut semiconductor wafers into individual components. Existing laser scribing systems typically operate on small scale devices and do not require passage through large areas of the substrate.

However, in the field of thin film photovoltaic cells, very large substrates (of at least about 0.75 square meters) must be processed. These large substrates create many logistical difficulties for substrate and laser positioning, calibration, and efficient formation of scribe lines. Typically, several laser beams are used to form the scribe line.

In addition, coordination between all components in a laser scribing system, from laser source to optical system, to substrate movement and movement of any laser head, must be accurately and quickly controlled to promote efficient processing throughput.

Moreover, when a multi-beam laser scribing system is used, the subsequent scribe lines must be precisely aligned with the previous scribe lines to produce the desired film cut of the segmentable device.

Active control of the position of the line has been described in the literature by the term "Dynamic Line Alignment (DSA)". The concept of the DSA measures the previous scribe line relative to the pre-defined scribe line layout in a static manner to determine the exact target position of the adjacent line, thereby compensating for any deviation in the target layout of the previous scribe line, thus Reduce the deviation of the scribe line. This type of dynamic scribe alignment poses many challenges to the laser scribing system. The scribing system must meet the strict festivals in mass production The takt time target (roughly the amount of time that must pass through two consecutive photovoltaic units to meet demand). Therefore DSA must occur without increasing the scribing process time and without adding a scribing tool to the laser scribing system. In addition, it is necessary to increase the yield to nearly 100% while reducing the scribe width and spacing to reduce the dead zone.

Based on the timing at which the position of the previously scribed line is detected, a distinction can be made between known scribe alignment proposals. The concept of DSA is to first scan the complete layout of a module, such as all P1 lines, and then calculate a layout containing the necessary corrections, for example, P2 next to P1, and scribe adjacent layouts in the next step, DSA The concept can achieve a reduction in dead zones, but it cannot meet the necessary tact time and cost requirements for advanced thin film photovoltaic processing.

It has been suggested in the past to scan the adjacent scribe line, such as the P1 line, before scribing the adjacent line, for example, before and during P2 next to P1. The scribe unit follows the scan unit, whereby the position is corrected based on the actual position of the adjacent scribe line previously drawn, and the range of operation is the same for both options. However, if the scanning of the previous scribe line, the dynamic correction of the processing head, and the line adjacent to the line next to the line just scanned are completed in a single sequence during the grading of the adjacent line, since it can be used for data processing and The timing of the position of the scribing head is limited, resulting in difficulty in accuracy and resolution.

In order to avoid the accuracy being too low during positioning, the time allowed to measure the previous scribe line and the new adjacent line is very short, which results in a relative amount of mathematical operations that can be used to analyze the data and smooth the axis movement. less. This leads to difficulties in recovery, possible oscillation problems, and limits the maximum line speed or increases the inaccuracy. For example, at a line speed of 2 m/s, in order to obtain good accuracy, only 2 ms may be available for the scan period calculation between subsequent position corrections, which makes the number of mathematical operations on a typical PLC controller limited. Therefore, these proposed solutions are not practical because they result in dynamic correction and limits on the speed of the scribing, both of which are unacceptable from the standpoint of the requirements of the film manufacturing system.

The second challenge that any dynamic line alignment system must address is the outliers of the previous line. Outliers can result from scratches on the glass/substrate, other glass/substrate defects, missing scribe lines, and the like. Any scan mode must be able to identify and process such outliers, otherwise such outliers will result in incorrect new line positions for adjacent lines after correction. For example, if the first point is an outlier and a continuous scribing speed is required to achieve the highest processing quality, The parallelism of the lines is negatively affected over a relatively long distance during fast (e.g., 1-3 m/s) scribing until the control system begins to correct valid data points. Furthermore, the same phenomenon will be more pronounced if the line is interrupted. Other examples include adjacent layouts that do not have the same starting and ending points, but are still aligned with each other by DSA, such as P3 aligning P2. The DSA algorithm must be able to handle this situation.

The third challenge is to make the DSA less corrective for the line. If the geometric error between the expected scribe line position and the actual scribe line position is large, it will result in a large shift in the movement perpendicular to the scribe line direction at the beginning of each scribe line. Depending on the dynamics of the movement, the parallelism of the scribe lines is negatively affected. These challenges are generally underestimated or overestimated in the literature, but in mass production close to 100% of production, all of these practical problems must be addressed in any dynamic alignment solution.

Therefore, in the art, improved dynamic alignment is required in laser scribing systems.

Another problem with laser scribing systems is the problem of multi-beam generation and its application to substrates. While many optical components can be used to generate several beams from a single laser source, a portion of these components, such as diffractive optical elements (DOE), are produced in addition to the desired number of beams for scribing. Higher order diffracted beams. Although the higher order diffracted beams do not have enough energy for scribing, in some cases they may carry 50% of the optical energy of the scribing beam. This energy may be sufficient to cause unintended irregularities (defects, structural local variations) of the target film in areas adjacent to the scribe line, for example, in the case of handling very sensitive films.

Accordingly, a need exists in the art to reduce the amount of unintended light reaching a film treated by a laser scribing system.

In addition, sometimes the beam to be used for a particular scribing process or processing step is less than the total number of beams produced. Therefore, there is a need in the art for a precisely controlled shutter system to control the passage of a desired beam.

The substantial problem with the movement of large substrates is with respect to substrate holding/clamping and positioning without causing substrate damage and substrate positioning inaccuracies. Accordingly, there is a need in the art for an improved substrate handling system in a laser scribing system.

Finally, the debris generated in the laser scribing process must be effectively removed without redeposition elsewhere in the film, or otherwise left to affect future processing and/or damage. And component quality products.

The above results have led to the need for improved laser scribing systems in the art to handle large surfaces Substrate, such as a large area of photovoltaic elements / components.

definition

A solar cell or a photovoltaic cell (PV cell) is an electronic component that directly converts light (essentially sunlight) into electrical energy by a photoelectric effect.

A thin film solar cell in a general sense comprises: on a support substrate, at least one pin junction formed by thin film deposition of a semiconductor compound, sandwiched between two electrodes or electrode layers. The pin junction or thin film photoelectric conversion unit comprises an intrinsic semiconductor compound layer interposed between a p-doped and an n-doped semiconductor compound layer. The term thin film indicates that the layer mentioned is deposited as a thin layer or film by treatment such as PECVD, LPCVD, PVD or the like. A thin layer essentially means a layer having a thickness of about 10 [mu]m or less, and in particular a layer of less than about 2 [mu]m.

A layout pattern having certain parameters and certain specific laser structuring process layers, which are interconnected or isolated cell.

The terms layer , coating , deposit , and film are used interchangeably throughout this disclosure to mean a film deposited in a vacuum processing apparatus, which may be CVD, LPCVD, plasma enhanced CVD (PECVD), or PVD (physical gas). Phase deposition).

A band consists of a number of lines (e.g., 1 to 7) that are simultaneously processed by a special multi-beam scribe head design, where the distance of the line represents the width of a segment such as a battery or contact window.

The effective value is a value within the allowable band.

The shutter comprises any mechanical element, or other element or method, in the sense of the present invention to block one or more laser beams.

The DOE, in the sense of the present invention, is a diffractive optical element that splits the incident beam into a number of beams that can be divided into desired and unwanted beam levels.

Means that the power of the beam irradiated to the relationship between the beam area, this line along the beam path (typically close to or within the beam focusing region) one specific position calculation.

In a general implementation, a laser scribing method using dynamic scribing alignment may include determining an expected scribing position for which thermal expansion and contraction have been considered, and formulating a first allowable band and a second allowable band, wherein the first allowable band And the second allowable band has a predetermined strip position around the determined expected scribing position, the scribing position is measured using the scanning unit, and the scribing position is determined to be within the first allowable band, and if the measured scribing position is at the Within the allowable band, determine whether the line position is within the second allowable band. If the measured line position is within the second allowable band, the measured line position is accepted and the line position is measured using the measured line position. If the measured scribing position is not within the first allowable band, the scribing position is set at the determined expected scribing position, and if the measured scribing position is not within the second allowable band, it is determined whether the measured scribing position is new. In the first scribing position in the scan, if the measured scribing position is the first scribing position, the measured scribing position is set to the position calculated according to the underline position only along one scan. And if the measured position is not the first scribing scribing position of the scribe position measurement is set to a position that is calculated based from the previous or subsequent scans along the dashed line position or a combination of.

In another overall implementation, a laser scribing system for removing portions of a thin film layer disposed on a large area substrate can include a laser source, a diffractive optical element for providing from a laser source The laser beam produces one or more optical scribe beams, a blocking element, a scattering element, or a combination thereof, the blocking element and the scattering element being placed between the diffractive optical element and the large area substrate, and To block one or more portions of the unwanted diffracted beam, one or more of the optical scribing beams, or a combination thereof, a focusing optic for concentrating the optical scribing beam, and a control system for The optical scribing beam is dynamically positioned relative to the substrate and controls the laser source, the alignment and spacing of the diffractive optical elements, the blocking element, the scanning element, or combination thereof, and the focusing optic.

The blocking element can comprise an optical shutter system comprising one or more optical shutter elements for reducing the number of optical scribe beams used.

The blocking element can comprise an optical shutter system comprising one or more optical shutter elements for blocking the passage of unwanted diffracted beams.

The shutter element can include a plurality of fingers to block unwanted diffracted beams from passing.

The optical inter-optical system can include a comb filter.

The shutter element can include a plurality of fingers to reduce the number of optical scribe beams used.

The scattering element can comprise a transparent region through which the optical scribe beam passes, and a scattering region through which the unwanted diffracted beam passes.

The scattering region may contain scattering particles to cause scattering of unwanted diffracted beams.

The scattering region can include a surface with a texture to cause unwanted diffracted beam scattering.

In another overall embodiment, a laser scribing system for removing portions of a film layer disposed on a large area substrate can include a platform having a separation region at a central portion thereof for The laser scribing head can be operated on the substrate from below the platform, and an air cushion is formed above the surface of the platform for lifting the substrate from the surface of the platform, wherein the platform comprises a plurality of channels, a gas An air cushion flowing in the channels to form an upper surface of the platform, and a clamping system for positioning a substrate to be operated by the scribing head, the clamping system including a mobile system for borrowing Moving the substrate by one or more first jigs in a direction orthogonal to a moving direction of the scribing head, the one or more first jigs being placed on one side of the platform, each of the first jigs comprising An adjustable upper jaw and a fixed lower jaw are disposed at a height equal to the air cushion above the surface, the lower jaw being adapted to allow the substrate to rest flat on the lower jaw.

The upper and lower jaws may comprise glass reinforced plastic.

The movement system of the clamping system is further configured to move the substrate away from the first clamps by the first clamps and one or more second clamps placed on opposite sides of the platform, the first clamps being The moving direction of the scribing head is fixed, and the second jig is bendable in the moving direction of the scribing head to make the substrate thermally expandable.

Each of the second clamps can include an adjustable upper jaw and a fixed lower jaw, the lower jaw being disposed at a height equal to an air cushion above the surface, the lower jaw being configured to make the substrate Place it flat on the lower jaw.

In another overall implementation, a laser scribing system for removing portions of a thin film layer disposed on a large area substrate can include a laser source, a scribing head for extracting from the laser source Receiving a laser beam and emitting one or more optical scribing beams therefrom, the scribing head comprising a diffractive optical element and a focusing optic for generating a laser beam from the received beam Or more optical scribing beams, wherein the focusing optics are used to concentrate the generated optical scribing beams, and one or more shutters are disposed on the outer portion of the scribing heads. Rotating parallel to the axis of the focused optical scribe beam and selectively blocking one or more of the focused optical scribe beams, and a control system for dynamically illuminating the optical scribe beam relative to the substrate Positioning, and controlling the laser source, the alignment and spacing of the diffractive optical elements, the shutters, and the focusing optics.

In another overall embodiment, a method of operating a laser scribing system for removing portions of a film layer disposed on a large area substrate is provided, the system including a laser source and a scribing head for Receiving a laser beam from the laser source and emitting one or more optical scribing beams therefrom, the scribing head comprising a diffractive optical element and a focusing optic for receiving from the receiving The laser beam produces one or more optical scribe beams for concentrating the generated optical scribe beam, one or more shutters disposed on an outer portion of the scribe head, the shutters For rotating about an axis substantially parallel to the focused optical scribe beam and selectively blocking one or more of the focused optical scribe beams, and a control system for aligning the optical scribe beam Dynamically locating the substrate, controlling the alignment of the laser source, the diffractive optical elements, and the focusing optics, and the focusing optics, the method includes identifying that the beam is not desired to be scribed by the focusing optical Scribing area, and One or more of the steps of rotating the shutter, such that the focused optical scribing beam is blocked from scribing in an area that is not desired to be lined by the focused optical scribing beam, when the shutter passes undesirably When focusing the area underlined by the optical scribe beam, the shutters continue to rotate so that the focused optical scribe beam is not blocked when the scribe has left the area not descended by the focused optical scribe beam .

In another overall embodiment, a laser scribing system for removing portions of a film layer disposed on a large area substrate can include a platform having a separation region at a central portion thereof for The scribing head is operable on the substrate from below the platform, and an exhaust system for removing the stripped material from the processing region of the substrate, the exhaust system including a nozzle at which the stripped material is removed Above the processing area and close to the processing area, the nozzle is used to move in the direction of the moving direction of the scribing head in front of the scribing head, and when the substrate is on the substrate by the scribing head The peeled material is removed from the treated area when the scribing is performed to effect the peeling of the material.

A first-rate linear jacket surrounds the nozzle, and the streamlined jacket is used to reduce the disturbance caused by the movement of the nozzle.

1‧‧‧Photovoltaic structure

2‧‧‧Transparent insulating substrate

3‧‧‧Transparent electrode layer

4‧‧‧Photoelectric conversion semiconductor layer

5‧‧‧Back electrode layer

6‧‧‧First isolation trench

7‧‧‧ slot

8‧‧‧Second isolation trench

100‧‧‧Laser marking system

110‧‧‧Laser source

112‧‧‧Laser beam

115‧‧‧ Spectroscope

120‧‧‧Diffractive optical components

122‧‧‧Optical line beam

124‧‧‧Unwanted diffracted beam

130‧‧‧scattering elements

132‧‧‧Transparent area

134‧‧‧scattering area

136‧‧‧scattered light

140‧‧‧Focus optics

150‧‧‧Control system

160‧‧‧ optical shutter

162‧‧‧Isolation line

164‧‧‧ optical shutter

170‧‧‧ scribe head

180‧‧‧Workpiece support

181‧‧‧Substrate

182‧‧‧Workpiece side clamping mechanism

184‧‧‧ platform

186‧‧‧ fixture

187‧‧‧ Lower jaw

188‧‧‧ air cushion

189‧‧‧Upper jaw

190‧‧‧Exhaust system

192‧‧‧ nozzle

194‧‧‧ aerodynamic shell

196‧‧‧Mobile system

282‧‧‧Clamping mechanism

286‧‧‧ fixture

287‧‧‧ Lower jaw

289‧‧‧Upper jaw

300‧‧‧vacuum unit

FIG. 1A schematically depicts an overview of a laser scribing system in accordance with an embodiment of the present invention.

FIG. 1B illustrates an example of a scribing head of a laser scribing system in accordance with an embodiment of the present invention.

Figure 2 schematically depicts a scribed substrate produced by the laser scribing system of Figure 1.

3A and 3B depict optical elements used to scatter unwanted diffracted light from a diffractive optical element.

4 depicts an optical shutter system that may alternatively be used in the laser scribing system of the present invention.

Figure 5 shows an overview of the outlier removal for dynamic alignment by the control system of the laser scribing system.

6A and 6B are respectively a perspective and side elevational view of a workpiece support of a laser scribing system in accordance with an embodiment of the present invention.

Figure 7A is a side elevational view showing an example of an exhaust system of a laser scribing system in accordance with an embodiment of the present invention.

Figure 7B is a cross-sectional view showing an example of a nozzle of an exhaust system of a laser scribing system according to a related example.

Figure 7C is a cross-sectional view showing an example of a streamlined nozzle of an exhaust system of a laser scribing system in accordance with an embodiment of the present invention.

1A and 1B, which depict an overview of a laser scribing system 100. A laser source 110 is provided. Various lasers can be used as the laser source 110. An exemplary laser source is available Includes pulsed laser and continuous wave laser. Laser source 110 can emit laser beam 112 in the infrared, visible, or ultraviolet spectral region. In one embodiment, the infrared laser is operated at a fundamental wavelength of 1064 nm in the infrared spectral region. Harmonics of this wavelength can be generated for electro-radiation processing using properly positioned multiplier or mixing crystals (not shown). For example, a second harmonic wavelength (532 nm in the green spectral region) and/or a third harmonic wavelength (355 nm in the ultraviolet spectral region) can be generated. In one embodiment, the plurality of generated harmonic wavelengths may be separated using a suitably placed dichroic mirror, optionally placed in beam splitter 115 for use, for example, in a plurality of scribing heads. For simplicity, FIGS. 1A and 1B show only a single scribe head 170, and other uses of different wavelengths provided by the laser source 110 may be added parallel to the scribe head 170. The optimum wavelength can be used for each film and/or processing step by selecting one of a plurality of scribing heads. The laser source 110 can be pulsed with a pulse length ranging from 1 picosecond to 50 nanoseconds and operated at a pulse repetition frequency ranging from 10 kHz to 10 MHz.

A diffractive optical element (DOE) 120 is placed downstream of the laser source 110 within the scribing head 170. It is noted that various optical components, including beam splitter 115, beam expander, focusing element, collimator, mirror, dichroic mirror, fiber optics, beam attenuator, etc. (not shown) can be positioned at laser source 110 and DOE. Between 120, depending on the spacing between the laser source 110 and the DOE 120, as well as the desired laser spot size and exposure. Additionally, it should be noted that the components of the system need not be placed along a single axis as depicted. Various optical axes can be constructed in accordance with the overall configuration and space requirements of the laser scribing system 100 using mirrors or other reflective elements, as well as optical fibers.

The DOE 120 produces a plurality of optical scribe beams 122 and an unwanted diffracted beam 124. The unwanted diffracted beam 124 contains high order diffracted light that does not contribute to scribing, but can damage unlined areas of the film. In an embodiment, all of the optical scribe beam beams 122 have substantially the same intensity. Although four beams are depicted, the DOE 120 can be used to create more or fewer optical scribe beams 122. The optical scribing beams 122 are oriented relative to each other at a constant angular spacing of a and are concentrated on the optical axis of the DOE 120.

Although the diffracted beam 124 that is not required (i.e., high order) is minimized by the design of the DOE 120, the unwanted diffracted beam 124 can still carry less than 40% of the total optical power of the optical scribing beam 122. To prevent this light from damaging the film to be treated, the scattering element 130 can be placed downstream of the DOE 120 in the scribing head 170. The scattering element 130 includes: a transparent region 132 (refer to Figure 3A), this region passes the optical scribing beam 122 unaffected. However, the unwanted diffracted beam 124 passes through the scattering region 134. In an embodiment, the scattering element 130 can be made of molten ceria, optical grade glass to allow for transmission of, for example, ultraviolet wavelengths. Other suitable materials can be used in other wavelength ranges, including various polymeric materials. The scattering region 134 can include a rough surface texture to scatter unwanted diffracted beams 124. Suitable surface textures can be produced by: a) mechanical treatment (eg sandblasting, engraving), b) optical treatment (eg laser treatment, eg laser marking), or c) chemical treatment (eg with or without With pattern etching).

It is noted that the above-described process for providing a rough surface texture is merely an exemplary technique, and any structure of the diffracted beam 124 that is not required for scattering can be used for the scattering element 130. For example, the scattering particles can be embedded within the material or attached to the scattering region 134 to cause scattering. In another embodiment, a different transport material than for the transparent region 132 can be used for the scattering region 134.

As shown in FIG. 3B, the transparent region 132 and the scattering region 134 can be configured in a concentric circular pattern. This is very useful when the DOE 120 is rotated by the optical axis of the wound system to change the direction of the beam pattern without the need to rotate the scattering element 130. The exemplary embodiment of Figure 3B is a DOE that produces four beams, but depending on the number of beams produced by the DOE, a smaller or larger number of concentric regions can be used.

The scattering element 130 can be a separate optical element or can be placed in a focusing lens, a cover glass of a focusing lens, or in a glass placed in front of or behind the focusing lens.

By using the scattering element 130, the unwanted radiation is reduced below the threshold affecting the process and material used to create the thin film solar module. Although a portion of the scattered light 136 can still diffuse into the processing region and interfere with other scattered light, it will not alter the film.

The optical scribing beam 122 from the DOE 120 is incident on the focusing optics 140 contained within the scribing head 170. The focusing optics 140 can include one or more objective lenses, collimating lenses, and other optical components for purifying the optical scribing beam 122 prior to processing the region. It is noted that the relative positions of focusing optics 140, DOE 120, and scattering element 130 can be varied relative to each other and to the substrate being processed using control system 150. In addition, control system 150 can be used to provide desired radiation and beam intensity distribution by controlling other portions of optical scribing system 100, such as the output power of laser source 110, the settings of any attenuators used, and the like. Control system 150 is further operable to select the pattern direction of optical scribing beam 122 relative to the optical axis.

In an embodiment, one or more optical shutters 160, 164 may be provided in the laser scribing system 100 and mounted to the exterior of the scribing head 170. The shutter 164 is rotatable about an axis substantially parallel to the optical scribe beam 122. The shutter can be rotated and fixed to selectively block the position of one or more optical scribe beams 122. A set of such shutters (not shown) may be used to selectively block the beam from each side of the linear pattern of optical scribe beam 122. In addition, shutter 164 can be used to cause existing features or structures on the "skip" substrate that should not be affected by the current scribing operation.

In Figure 4, element 162 is, for example, an isolated scribe line that travels around the entire module. The longitudinal scribe line used to divide the battery must not pass over the isolation scribe line in at least a portion of the patterns P1, P2, P3. As shown in FIG. 4, the shutter 164 can be used to easily "skip" the isolation line perpendicular to the current battery separation scribe line by rotating the shutter in synchronization with the scanning action (using the control system 150). 164. When the scribe head 170 passes through the isolation scribe line 162, the optical scribe beam 122 that may strike the isolation line is shielded by the shutter 164. The benefit is the precise end of the high speed long longitudinal scan that relaxes the short isolation scribe line 162, and therefore the requirement for "emergency deceleration" of the scribe head 170. Understandably, the same approach can be taken when the isolation scribe line 162 is placed near the beginning of the longitudinal scan. In this case, the shutter 164 causes the scribe head 170 to begin scanning outside the space enclosed by the scribe lines 162 (ie, stabilize the speed, obtain a dynamic lock of the existing pattern, etc.), then skip the scribe line 162 and continue Scan to divide the battery.

Shutter 164 can also be used for more mundane tasks, such as reducing the number of parallel spaced scribe lines near the edge of the substrate, with the remaining number of scribe lines being less than the number of optical scribe beams 122 in scribe head 170. In addition, the optical scribing beam pattern is such that all beams are used to create a single scribe line (usually a wide scribe line) by making the beam pattern only slightly non-parallel to the scribe line itself to make In the operation of the seating direction, a shutter 164 can be used to selectively block, for example, 1 or 2 beams to reduce the irradiation to the most suitable for some possibilities. The extent to which 4 beams are required to complete the film of the scribe line. This can also be done with the power of the set laser and/or any beam attenuator.

With further reference to FIG. 1B, the figure shows a second shutter 160 mounted on an arm that is substantially parallel to the other movable/rotatable shaft of the optical scribe beam 122. The second shutter 160 There is a comb shape, wherein the comb pattern, that is, the "finger", is used to block the unnecessary diffracted beam 124 so that the optical scribing beam 122 can pass between the comb-like "finger". The second shutter 160 can be used in place of or in conjunction with the scattering element 130. For example, if the scattering element 130 does not sufficiently scatter the unwanted diffracted beam 124, or is processing a very sensitive film, the second shutter 160 can be used in place of or in conjunction with the scattering element 130.

An alternative embodiment of the second shutter 160 can be used to control the optical scribe beam 122, like the shutter 164. For example, when the shutter 164 is unable to selectively block a portion of the intermediate beam in the linear pattern, the second shutter 160 can be used to selectively block one or more of its fingers in the middle of the pattern. One or more of the beams, while allowing the outer beam to diffuse and process. In this case, the shaft/motor on which the second shutter 160 is mounted can be rotated around the axis of the optical scribing beam pattern to not limit the use of the second shutter 160 when the beam pattern is rotated.

All shutters can optionally be provided with a cooling system to prevent heat and warpage, or other mechanical misalignment. In addition, the cooling of the shutter can suppress thermal currents formed in the air surrounding the processing region due to the large thermal gradient around the component at elevated temperatures. These currents can interfere with the capture of debris from the processing area. Alternatively, the shutter may include a mirror surface portion for directing an unwanted beam to the beam dump.

An example of a workpiece support 180 of the laser scribing system 100 illustrated in FIG. 1A is shown schematically in FIGS. 6A and 6B. The support member 180 includes a separate platform 184, wherein the scribing head 170 is located in a slot separating the two portions of the platform, and the support member 180 also includes a workpiece side gripping mechanism 182 disposed along a long side of the platform 184. In the clamping mechanism 182, the clamping elements are interchangeable. In other words, having different possible dimensions, regardless of the distance of the isolation line and/or the edge of the glass, sandwiching the clamping elements of the various modules outside of their active area, can be used to match different substrate configurations. The surface texture of the gripping elements is constructed in parallel (or perpendicular) to the direction of movement of the edges of the substrate 181 to ensure a better glass grip. In an embodiment, a special gripping material having high rigidity and friction for laser scribing treatment can be selected. For example, the clamping mechanism can be a glass reinforced plastic. The number of clamping units is variable depending on the size and shape of the substrate to be processed.

In an embodiment, along the long side of the platform 184, the clamping mechanism 182 can include two clamps 186 mounted to the mobile system. These jigs 186 drive the substrate 181 in the Y direction. The scribing head 170 moves in the X direction. In one embodiment, the laser scribing system 100 has one or more scribing heads 170 located below the platform 184 that process the glass with the membrane thereon (the surface away from the platform 184). The platform 184 is capable of processing the substrate film in a downward facing manner because the air cushion 188 provided through a passage (not shown) in the platform 184 allows air to pass therethrough and thus has no contact. The air cushion 188 supports the substrate during processing to smooth the transport of the substrate. The air cushion 188 maintains the substrate 181 at a fixed height and prevents the glass from being bent. The air cushion operates in conjunction with the side clamping mechanism 182 described above to rapidly move the glass in the Y-axis direction, and the movement in the X direction is performed by the scribing head 170. Alignment marks on the substrate are used with the imaging system to ensure high accuracy of substrate positioning. Moreover, in another alternative embodiment, the scribing head 170 can be mounted to a bracket above the platform 184 to scribe the film from above, i.e., without glass.

The clamp 186 of the clamping mechanism 182 is provided with sufficient flexibility to accommodate variations in glass thickness due to the movable upper clamping portion, or the upper jaw 189, and the fixed lower surface, or lower jaw 187. . Relative to the clamp 186, the lower jaw 187 of the clamp 186 is fixed at a height such that the base plate 181 is laid flat and extends into the clamp 186 for actual clamping while being at the level of the air cushion 188 above the surface of the platform 184. . The upper jaw 189 of the clamp 186 can be adjusted to accommodate variations in nominal glass thickness and to vary in thickness within the same substrate 181.

In one embodiment, when processing through the glass from below, the scribing head 170 is typically placed such that the film to be scored is at a level slightly below the focus of the laser beam. The beam intensity distribution is not a true Gaussian function due to optical defects, beam clipping, laser configurations, etc., but only about this. The optimal beam intensity distribution is achieved at a position slightly below the focus because the beam spreads out of focus and begins to deteriorate.

In the case of processing from above, the holder orientation can be reversed. In other words, the upper jaws 189, 289 can be secured to provide a precise point of reference for laser focusing, while the lower jaws 187, 287 can be resilient to accommodate thickness variations. The entirety of the air cushion 188, i.e., the pressure and flow of the buffer gas, and the control of the mobile system are accomplished by the control system 150 in close cooperation with the mobile system, which controls the rise of the scribing head 170 relative to the substrate.

In one embodiment, only two clamps 186 disposed along one long side of the platform 184 are used. This requires good clamping because sliding in the lateral direction (ie, the X direction) may result in The substrate is positioned obliquely (at an angle) with respect to the X and Y axes. Sliding the jig in the Y direction is generally not a problem because the movement and imaging system cooperate to maintain the proper Y position of the substrate in accordance with the alignment marks that are drawn into the substrate 181.

In one embodiment, there is no clamp on the side of the platform 184 relative to the clamp 186, which allows the substrate 181 to thermally expand or contract in the X direction. The moving and imaging system is aligned with the dynamic line to accommodate thermal expansion and contraction. It is important to note that this does not solve the X-slide and substrate tilt problems in the fixture. If clamped, the lower substrate surface remains fixed, as when the incident optical scribe beam 122 approaches the substrate 181 from below, the upper jaw 189 is movable to accommodate changes and/or changes in thickness of the substrate. The air cushion 188 is arranged to ensure that the substrate is maintained at the height set by the lower jaw 187. When the air cushion 188 provides contactless support of the active area during processing, the substrate area outside the active area is clamped to avoid contamination and damage to the solar module. The substrate 181 can be processed with the active layer on the bottom side because the laser scribing system 100 is not in contact with the substrate.

In another embodiment, another clamping mechanism 282 including two additional clamps 286 as shown in FIG. 6B can be added to the opposite long sides of the platform 184. These clamps 286 will be actively actuated by the mobile system in the Y direction. The "jaws" of the clamps will be identical in configuration to the clamp 186 because the jaws 287 below the clamp 286 are fixed to maintain the "floating" position of the substrate on the air cushion 188 (and thus concentrated) and above the clamp 286 The jaw 289 will be movable to accommodate a change in thickness. However, these clamps 286 will be bendable in the X direction to allow for thermal expansion and contraction of the substrate. They will provide sufficient clamping to prevent the substrate 181 from tilting, but will not exert an excessive biasing force in the X direction, which may cause the substrate to bend due to thermal expansion, or may cause tension due to substrate shrinkage.

Removal of the stripped material from the score line is performed by the exhaust system 190. In order to minimize interference from the workpiece and to ensure efficient removal of debris, the exhaust system 190 attempts to avoid causing disturbances in the processing zone. The nozzle 192 having the shape of an inverted L-shaped tube draws air from one side of the treatment zone by using a vacuum unit 300, or other inhalation device known to those skilled in the art. The short lateral "foot" of the L-shaped nozzle 192 is opened and placed adjacent to the substrate 181. The design of the nozzle 192 minimizes pressure loss to avoid disturbances and particle deposition along the exhaust wall. The nozzle area is typically configured to achieve an air flow rate of at least 10 m/s to 50 m/s. The nozzle angle is designed to avoid turbulence in the processing area and may have a between itself and the substrate The distance that can be changed.

Additionally, nozzle 192 can be used to follow optical scribing beam 122, for example, by mounting to a suitable movement system 196 that can be controlled by control system 150. In one embodiment, the movement system 196 allows the nozzle to follow the scribing head in the X direction as the processing zone of the substrate 181 moves with the movement of the scribing head below the platform, and thus can be maintained close to the substrate at all times. 181 location. In addition, in order to further avoid disturbances near the substrate 181 which can cause debris to be ejected from the collection space and redeposited on the substrate, special attention must be paid to streamlining all debris removal components in the pipeline to prevent recirculation eddy currents and disturbances. Development.

For example, if the scribing head 170 follows the exhaust system 190, the disturbance is less because the nozzle 192 lags behind the scribing head, so the processing area is not a "tailing" moving conduit. However, if the exhaust system 190 follows the scribing head 170 at a high speed as depicted in FIG. 7A, that is, at a speed of 1 to 3 m/s, the nozzle 192 having a simple circular cross section will create sufficient gas flow by itself. Disturbance of the pattern to cause debris to be ejected and redeposited. The exhaust system 190 is mounted on one side of the scribing head 170 and follows the scribing head 170. As shown in Fig. 7B, the disturbance caused by the movement of the exhaust system is particularly noticeable when the nozzle 192 is moved in the X direction before the scribing head 170. To alleviate this problem, as shown in Figure 7C, an aerodynamic housing 194 is applied around the nozzle 192 to reduce turbulence in its path.

Figure 2 depicts the scribed photovoltaic structure 1. The photovoltaic structure 1 can comprise an amorphous and/or microcrystalline germanium (or other photovoltaic material) film having a PIN or NIP junction structure aligned parallel to the surface of the film. The PIN/NIP structure may be interposed between the transparent film electrodes, and the transparent film electrodes may continuously extend on each of the plurality of regions on the main surface of the substrate such as the permeable substrate or the cover sheet.

Figure 2 shows slots 6, 7, and 8. The purpose of this structure is to create a monolithic photovoltaic module consisting of several electrically connected solar cells. The transparent electrode layer 3 is thus cut by the first isolation trench 6, which determines the width of the battery segment. During the manufacturing process, when the entire layer stack is stacked in the order of layer 3 - slot 6 - layer 4 - slot 7 - layer 5 - groove 8, the photoelectric conversion semiconductor layer 4 fills the groove 6. The grooves 7 filled with the material from the transparent back electrode layer 5 allow electrical contact between adjacent cells. The back electrode 5 of the photovoltaic structure 1 contacts the front electrode 3 of the adjacent cell. The back electrode layer 5 and the photoelectric conversion semiconductor 4 are finally divided by the second isolation trench 8. Laser stroke Line system 100 produces one or more of these slots.

The photovoltaic structure 1 can be processed, for example, by first depositing a transparent electrode layer 3 on a transparent insulating substrate 2, for example, by a LPCVD method, that is, low pressure chemical vapor deposition. The transparent electrode layer 3, also referred to as a transparent conductive oxide TCO, comprises, for example, ZnO, SnO2, and/or indium tin oxide ITO, which is then subjected to laser scribing to remove a portion of the transparent electrode layer 3. In order to form the first isolation trench 6, the first isolation trench 6 divides the transparent electrode layer 3 into a plurality of adjacent layers which are thus isolated.

Subsequently, on this patterned transparent electrode layer 3, the photoelectric conversion layer stack 4 is deposited by plasma enhanced CVD. The layer stack 4 comprises at least one p-type doped layer, an intrinsic i-layer, and an n-type doped layer such as a thin amorphous germanium. This operation can be repeated to form a multi-junction amorphous germanium thin film solar cell 1. Thus the p-i-n junction can be formed from a microcrystalline material or from a mixture of amorphous and microcrystalline materials to create the photoelectric conversion layer 4. The photoelectric conversion semiconductor layer 4 is then subjected to laser scribing to remove a portion of the photoelectric conversion semiconductor layer 4 to form a trench 7, which divides the photoelectric conversion semiconductor layer 4 into a plurality of such isolated layers 4.

Subsequently, the back electrode layer 5 is deposited to fill the trenches 7, and thereby a contact line is formed and also covers the photovoltaic conversion semiconductor layer 4. The back electrode layer 5 may also be a transparent conductive oxide TCO such as ZnO, SnO2, indium tin oxide ITO, or a metal layer such as aluminum, or a combination of such layers.

Finally, the photoelectric conversion semiconductor layer 4 and the back electrode layer 5 are subjected to laser scribing to form a second isolation trench 8, and the second isolation trench 8 divides the photoelectric conversion semiconductor layer 4 into a plurality of electrically connected photoactive layers 4 or segments. The photovoltaic structure 1 shown in Fig. 1 is thus processed. The TCO layer 3 is divided into a plurality of electrically isolated regions which are achieved by laser scribing of the grooves 6, across the entire photovoltaic structure 1 at intervals of 5-10 mm, and extending over the entire length thereof. After deposition, the photoelectric conversion semiconductor layer 4 is scribed by laser. The groove 7 which needs to be drawn into this layer is parallel to the initial groove in the TCO layer 3, typically 5-30 microns along its entire length, and as close as possible to the initial groove 6 between 10 and 150 um.

After depositing the back electrode layer 5, the laser system is used to form the second isolation trench 8, and the second isolation trench 8 simultaneously divides the back electrode layer 5 and the photoelectric conversion semiconductor layer 4 to complete the electrical interconnection of the plurality of segments. The groove 8 is scribed to be parallel to the initial groove 6 in the TCO layer 3, usually along its The entire length is 5-30 microns, and as close as possible to the grooves 7 in the photoelectric conversion semiconductor layer at a typical pitch of between 10 and 150 um.

The photovoltaic structure 1 having the series interconnection of the solar cell segments is generated, the leakage current of the photovoltaic structures 1 can be reduced, and the voltage generated by the entire battery panel is formed by the potential formed in each battery and the battery. The product of the number is given. Normally, a 1.4 m ² panel is divided into 50-200 cells, so that the output voltage of the overall panel is in the range of 30-200V.

In addition to those materials described in, for example, U.S. Patent No. 4,292,092 and Japanese Patent No. 59,172,274 (U.S. Patent No. 1985/4542578), many other materials can be used for the production of the thin film solar cell 1. Other equally effective devices are based on a photoelectric conversion semiconductor layer 4 based on cadmium telluride (CdTe), copper indium diselenide (CIS), copper indium gallium diselenide (CIGS), and crystalline bismuth glass (CSG). Production. A laser scribing system, such as the laser scribing system 100 of FIG. 1, is typically used to scribe grooves 6, 7, 8 in portions or all of layers 3, 4, 5 to create in such devices. A plurality of photovoltaic structures 1 having a series connection.

The optical scribing beam 122 used to scribe the grooves 6, 7, and 8 in the respective layers 3, 4, 5 may be applied from the coated side of the glass sheet, but may also be applied from the opposite side, in which case Next, the beam penetrates the glass before it interacts with the membrane. Thin film solar cells can also be fabricated on non-transparent substrates such as metal sheets. In this case, the irradiation is impossible to pass through the substrate 2, so all the scribing processes require the light beam to be incident from one side of the coating. In some other cases, the solar panel is fabricated on a flexible substrate 2, such as a thin metal or polymer sheet. In the former case, the irradiation may only come from one side of the coating. In the latter case, the irradiation may come from one side of the coating or through the substrate 2.

Placing the slot 6 on the photovoltaic structure 1 determines the width of the segment. The choice of the width of the segment, together with the size of the battery, is based on the desired electrical properties of the photovoltaic structure 1, for example, a wider segment causes an increased leakage current I _SC (SC = short circuit), which is narrower, ie more segments cause an increase Open circuit voltage Voc. Other considerations that may affect the width of the dividing slots 6, 7, 8 include: a battery layout configuration of a series connection, a parallel connection, or a combination of other battery connections, in a battery affected by the sheet resistance of the front 3 and back 5 electrode layer sheets Optimization of current loss.

The laser scribing system 100 can optionally utilize dynamic scribing alignment using the control system 150 to position the second scribing line along the first scribing line to form an accurate scribing line. For further For a description of the dynamic scribe line alignment, U.S. Patent Application Publication No. 2009/0324903 A1 is incorporated herein by reference.

A spatial arrangement of the scanning unit (i.e., machine vision unit, such as a camera) and the laser scribing head 170 is provided such that the two are mechanically coupled to each other. The scanning unit is capable of scanning the positions of the previously scribed lines for correcting the position of the laser scribe head 170 in the current laser scribing operation so that the scribe lines can be closely spaced, even if subjected to, for example, substrate holders. The effect of enthalpy, heat shrinkage or expansion of the substrate, and the like. The data measured by the scanning unit is analyzed for the expected line position, and the expected line position has been expanded by the thermal expansion of the glass before scribing. These expected scribe positions are then used within a particular outlier consideration and trend calculation to cause a final (and small) dynamic scribe correction item.

The scribing head 170 can include a plurality of scribing heads, each supporting a plurality of optical scribing beams 122. The distance between the optical scribing beams 122 is substantially equivalent to the width of the segments of the solar cell module. Thus, the passage of a laser scribing head 170 produces a complete strip having a plurality of segmented lines on the solar cell module, for example four if the scribing head contains four beams, such as the laser stroke of FIG. Line system 100.

The center-to-center distance between the mechanically coupled scanning unit and the scribing head is greater than or equal to the width of the complete strip, preferably, the distance is greater than 2 to 4 times the width of the complete strip. The line of the line A of the scribed strip and the line of the existing line B of the scribed line are simultaneously performed. At the beginning of the scribing process, several (eg, 2-4) test passes must be performed without scribing. The scribing and detection can be performed in both scribing directions because the measurement data is properly ordered.

This ensures that there is sufficient time for mathematical operations in the control system, such as data analysis, outlier algorithms, and approximations, without loss of accuracy or resolution. Ideally, there is only one scanning unit beside the laser scribing head 170. In the laser scribing head 170, correction is always made for a complete strip having, for example, four optical scribing beams 122. Since the change in distance between the four optical scribe beams 122 in a strip is negligible, this is an effective solution for the overall correction that we would like to compensate.

The scanning unit is an advanced machine imaging system, preferably a linear scanning or 2D array camera, combined with a telecentric mirror and an illumination system having an optimized wavelength that maximizes contrast. A line scan camera can be triggered internally, externally, or in sync with its position. Its detection specific The scribing in position and the location of the scribing is sent to the machine's control system 150, which minimizes data flow and enables high speed image processing. As a special embodiment, the camera recipe detects one or more of the scribe lines, for example, five scribe positions, detects outliers, and, if no outliers are detected, sends the average of the positions. Go to control system 150. This process increases the reliability of the scribing detection. Since the image is taken during the movement of the scanning unit and the scribing head 170, the image represents a scribing position of one tenth of a millimeter to several millimeters or more depending on the processing conditions. Therefore, also in the image capturing process, an average of 5 × 2 mm = 10 mm is generated without affecting the accuracy, because the laser scribing on the solar cell member has a short length ruler. Relatively good straightness.

In one embodiment, the dynamic scribe line alignment algorithm always expects to have estimated the scribe line position of the thermal expansion or contraction correction of the substrate at the time of scribing. By scanning the two aligned intersections from the P1 scribe line, thermal expansion or contraction can be detected for each substrate, and thus the current expansion or contraction of the module prior to beginning the scribe line can be detected. The determined thermal expansion or contraction is then applied to the target scribing layout provided to the laser scribing tool. Therefore, the difference (offset) between the expected and actual line positions is minimized, and mainly includes the inaccuracy of the machine previously processed by the scribing process. This usually results in a small correction of the dynamic scribing algorithm and is critical for fast and smooth scribing of adjacent lines, avoiding oscillations of the laser scribing head, and the like.

During the scribing of a particular strip, since the scanning and scribing units are connected at a fixed distance, the layout message of the recipe must provide a message as to which strip and which particular line is expected in the line of sight of the camera of the scanning unit. position.

Control system 150 analyzes the original existing scribe line position data of the scanning system to find outliers, whereby in the first example the outliers are defined as being outside the established first allowable band after calculating the overheat expansion or contraction. The scribe line position - preferably less than 0.5 mm - is located around the expected existing scribe line position. Outliers may result from scratches on the glass, other glass defects, missing score lines, and the like. Figure 5 depicts the outlier removal process. Due to the prediction of the position of the scribe line and the consideration of thermal expansion or contraction, this configurable allowable band is very small, resulting in an efficient method for quickly detecting outliers. Control system 150 can include a processor to calculate data.

In the first embodiment, the algorithm analyzes the original data of the existing outliers other than the first allowable band, and sets the invalid, ie, outlier, data points to the predicted target of the scribing Coordinates, while considering thermal expansion or contraction. Thereafter, in the second very small allowable band - preferably less than 50 μm - the remaining outlier position data points will be deleted by calculating at least the last and next valid positions (ie, effective non-outliers) The average between the scribe positions), and then the invalid outlier position is replaced by the calculated average position, and the calculated average position is thus automatically located within the second allowable band. The action of the laser dash head in the second allowable band follows the trend of the effective position data points. Further regression between valid scribe position data points can be performed to increase the accuracy and smoothness of the laser scribe head motion.

Especially for outliers at the beginning or end of a line, it is important to properly estimate the trend of the effective position data points. For example, if the first underline position of a new line is outside the first allowable band, the first outlier line position may be generated based on the linearity or other regression of the position of the subsequent data point. The possible positions are replaced (ie the next valid line position). This backward regression ensures the correct position of the first scribing position and the accuracy of the further data correction step.

A still further embodiment predicts the value of the first scribe position detection using the trend of the valid data points. The algorithm calculates the data set of the trend values by calculating the histogram and replaces the invalid value (outlier value) with the target position value. Thereafter, it performs linear regression to determine the most likely position from the effective scribe position as previously described.

By these methods, a complex layout with discontinuous lines (eg, the start and end of pattern 2, or pattern 2 of horizontal or vertical isolation lines) can be processed without the need for a scribing operation to stop (ie, moving the axis to stop), Parallelism can be added and takt time optimized for high speed processing.

While the foregoing invention has been described in terms of various embodiments, it is understood that The various embodiments of the invention, which are set forth in the claims below, are intended to be within the scope and spirit of the invention.

100‧‧‧Laser marking system

110‧‧‧Laser source

112‧‧‧Laser beam

115‧‧‧ Spectroscope

120‧‧‧Diffractive optical components

122‧‧‧Optical line beam

124‧‧‧Unwanted diffracted beam

130‧‧‧scattering elements

140‧‧‧Focus optics

150‧‧‧Control system

160‧‧‧ optical shutter

164‧‧‧ optical shutter

170‧‧‧ scribe head

180‧‧‧Workpiece support

190‧‧‧Exhaust system

Claims (18)

A laser scribing method using dynamic scribing alignment, comprising: determining an expected scribing position for which thermal expansion and contraction have been considered; formulating a first allowable band and a second allowable band, the first allowable band and the second allowable band having a predetermined strip position around the determined line position of the decision; measuring the line position using the scanning unit; determining whether the line position is within the first allowable band; if the measured line position is at the first tolerance In the tape, determining whether the line position is within the second allowable band; if the measured line position is within the second allowable band, accepting the measured line position and using the measured line position Line alignment; if the measured scribe line position is not within the first allowable band, the scribe line position is set at the determined expected scribe line position; if the measured scribe line position is not within the second allowable band, then Determining whether the measured scribing position is the first scribing position in the new scan; if the measured scribing position is the first scribing position, setting the measured scribing position according to only one along Scanning a position calculated by the scribing position; and if the measured scribing position is not the first scribing position, the measured scribing position is set to be based on a previous or subsequent scribing position along the scan or a combination thereof Calculated location. A laser scribing system for removing portions of a film layer disposed on a large area substrate, the system comprising: a laser source; a diffractive optical element for generating from a laser beam provided by the laser source One or more optical scribing beams; a blocking element, a scattering element, or a combination thereof, the blocking element and the scattering element being placed between the diffractive optical element and the large area substrate and for blocking unwanted diffraction One or more portions of an optical beam, one or more of the optical scribe beams, or a combination thereof; a focusing optic for concentrating the optical scribe beams; a control system for dynamically positioning the optical scribe beam relative to the substrate and controlling the laser source, the alignment and spacing of the diffractive optical elements, the blocking element, the scanning element, or a combination thereof, and The focusing optics. A laser scribing system for removing a portion of a film layer disposed on a large area substrate, as in claim 2, wherein the blocking element comprises an optical shutter system comprising one or more A shutter element for reducing the number of such optical scribe beams used. A laser scribing system for removing a portion of a film layer disposed on a large area substrate, as in claim 2, wherein the blocking element comprises an optical shutter system comprising one or more A shutter element for blocking the passage of the unwanted diffracted beams. A laser scribing system for removing a portion of a film layer disposed on a large-area substrate, as in claim 4, wherein the optical gate element includes a plurality of fingers for blocking the unwanted diffraction The beam passes through. A laser scribing system for removing a portion of a film layer placed on a large-area substrate, as in claim 3, wherein the optical shutter system comprises a comb filter. A laser scribing system for removing a portion of a film layer disposed on a large-area substrate, as in claim 3, wherein the optical gate element includes a plurality of fingers for reducing the optical strokes used The number of line beams. a laser scribing system for removing a portion of a film layer disposed on a large-area substrate, wherein the scattering element includes a plurality of transparent regions through which the optical scribing beams pass, and such Unwanted diffracted beams pass through the complex scattering regions. A laser scribing system for removing a portion of a film layer disposed on a large-area substrate, as in claim 8 wherein the scattering regions comprise scattering particles to cause such unwanted Scattering of the diffracted beam. A laser scribing system for removing a portion of a film layer disposed on a large-area substrate, as in claim 8 wherein the scattering regions comprise a surface having such unwanted diffraction The texture of the beam scattering. A laser scribing system for removing a portion of a film layer placed on a large-area substrate, the system comprising: a platform having a separation portion at a central portion thereof for enabling a laser scribing head to be The underside of the platform is operated on the substrate; an air cushion is formed above the surface of the platform, the air cushion is used to lift the substrate from the surface of the platform, the platform comprises a plurality of channels, and a gas system flows thereon a channel formed in the channel above the surface of the platform; and a clamping system for positioning the substrate to be operated by the scribing head, the clamping system including a movement system for More first jig moves the substrate in a direction orthogonal to a moving direction of the scribing head, the one or more first jigs are placed on one side of the platform, and each of the first jigs includes Adjusting the upper jaw and the fixed lower jaw, the lower jaw being disposed at a height equal to the air cushion above the surface, the lower jaw being configured to lay the substrate flat on the lower jaw . A laser scribing system for removing a portion of a film layer disposed on a large-area substrate, as in claim 11, wherein the upper jaw and the lower jaw comprise a glass reinforced plastic. A laser scribing system for removing a portion of a film layer placed on a large-area substrate, as in claim 11, wherein the moving system of the clamping system is further used by the first jig And one or more second clamps disposed on opposite sides of the platform move the substrate away from the first clamps, the first clamps are fixed in a moving direction of the scribing heads, and the second clamps are in the The direction of movement of the scribing head is bendable to allow the substrate to thermally expand. A laser scribing system for removing a portion of a film layer disposed on a large-area substrate, as in claim 13, wherein each of the second jigs includes an adjustable upper jaw and a fixed lower portion a jaw disposed at a height equal to the air cushion above the surface, the lower jaw being adapted to allow the substrate to lie flat on the lower jaw. A laser scribing system for removing portions of a film layer disposed on a large area substrate, the system comprising: a laser source; a scribing head for receiving a laser beam from the laser source and from there Generating one or more optical scribing beams, the scribing head comprising a diffractive optical element and a focusing optic for generating one or more optical scribing beams from the received laser beam, The focusing optics are used to concentrate the generated optical scribing beam; one or more shutters are disposed on an outer portion of the scribing head for winding substantially parallel to the focusing optics An axis of the scribe beam rotates and selectively blocks one or more of the focused optical scribe beams; and a control system for dynamically positioning the optical scribe beam relative to the substrate and controlling the ray A source, an alignment and spacing of the diffractive optical elements, the shutters, and the focusing optics. A method of operating a laser scribing system for removing portions of a film layer disposed on a large area substrate, the system including a laser source, a scribing head for receiving a laser beam from the laser source and Equivalent to one or more optical scribe lines, the scribe head comprising a diffractive optical element and a focusing optic for generating one or more optical scribe lines from the received laser beam a beam, the focusing optics for concentrating the generated optical scribe beam, one or more shutters, disposed on an outer portion of the scribe head, the shutters being used to be substantially parallel to the Focusing on an axis of the optical scribing beam and selectively blocking one or more of the focused optical scribing beams; and a control system for dynamically positioning the optical scribing beam relative to the substrate, and controlling The laser source, the alignment and spacing of the diffractive optical elements, the shutters, and the focusing optics, the method includes: identifying regions that are not desired to be scribed by the focused optical scribing beams; Rotating one or more of the shutters in a synchronized manner such that the focused optical scribing beams are blocked from scribing in regions that are not desired to be scribed by the focused optical scribing beams The shutters continue to rotate when the shutters are not desired to be scribed by the focused optical scribe beam, such that when the scribe has left undesired by the focused optical scribe beam The focused optical scribing beams are not blocked when the area is scribed. A laser scribing system for removing a portion of a film layer placed on a large-area substrate, the system comprising: a platform having a separation region at a central portion thereof for using a scribing head from the platform Operating on the substrate below; and an exhaust system for removing stripped material from the processing region of the substrate, the exhaust system including a nozzle above the treated region where the stripped material is removed and near In the processing area, the nozzle is used to move in the direction of the moving direction of the scribing head in front of the scribing head, and when the scribing head performs scribing on the substrate to generate the stripped material The stripped material is removed from the treatment zone. A laser scribing system for removing a portion of a film layer placed on a large-area substrate, wherein the first-line linear jacket surrounds the nozzle, and the streamlined jacket is used to reduce the nozzle Disturbance caused by the movement.