FR2477294A1 - Composition de resine photosensible du type positif - Google Patents

Composition de resine photosensible du type positif Download PDF

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Publication number
FR2477294A1
FR2477294A1 FR8104081A FR8104081A FR2477294A1 FR 2477294 A1 FR2477294 A1 FR 2477294A1 FR 8104081 A FR8104081 A FR 8104081A FR 8104081 A FR8104081 A FR 8104081A FR 2477294 A1 FR2477294 A1 FR 2477294A1
Authority
FR
France
Prior art keywords
copolymer
composition
acid
composition according
compound
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR8104081A
Other languages
English (en)
French (fr)
Other versions
FR2477294B1 (OSRAM
Inventor
Yoshihiro Hosaka
Yoichi Kamoshida
Yoshiyuki Harita
Kunihiro Harada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JSR Corp
Original Assignee
Japan Synthetic Rubber Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Japan Synthetic Rubber Co Ltd filed Critical Japan Synthetic Rubber Co Ltd
Publication of FR2477294A1 publication Critical patent/FR2477294A1/fr
Application granted granted Critical
Publication of FR2477294B1 publication Critical patent/FR2477294B1/fr
Granted legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/22—Compounds containing nitrogen bound to another nitrogen atom
    • C08K5/27—Compounds containing a nitrogen atom bound to two other nitrogen atoms, e.g. diazoamino-compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/22—Compounds containing nitrogen bound to another nitrogen atom
    • C08K5/27—Compounds containing a nitrogen atom bound to two other nitrogen atoms, e.g. diazoamino-compounds
    • C08K5/28—Azides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/315—Compounds containing carbon-to-nitrogen triple bonds
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/106—Binder containing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/106—Binder containing
    • Y10S430/108—Polyolefin or halogen containing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/106—Binder containing
    • Y10S430/111—Polymer of unsaturated acid or ester

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Materials For Photolithography (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
FR8104081A 1980-03-01 1981-03-02 Composition de resine photosensible du type positif Granted FR2477294A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2562980A JPS56122031A (en) 1980-03-01 1980-03-01 Positive type photosensitive resin composition

Publications (2)

Publication Number Publication Date
FR2477294A1 true FR2477294A1 (fr) 1981-09-04
FR2477294B1 FR2477294B1 (OSRAM) 1983-03-11

Family

ID=12171151

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8104081A Granted FR2477294A1 (fr) 1980-03-01 1981-03-02 Composition de resine photosensible du type positif

Country Status (7)

Country Link
US (1) US4384037A (OSRAM)
JP (1) JPS56122031A (OSRAM)
DE (1) DE3107526C2 (OSRAM)
FR (1) FR2477294A1 (OSRAM)
GB (1) GB2073756B (OSRAM)
IT (1) IT1170762B (OSRAM)
NL (1) NL8100969A (OSRAM)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0194824A3 (en) * 1985-03-08 1988-01-13 Nippon Paint Co., Ltd. A method for preparing a printed circuit board
WO1989007786A1 (en) * 1988-02-17 1989-08-24 Tosoh Corporation Photoresist composition
EP0301101A4 (en) * 1987-02-02 1990-02-22 Nippon Paint Co Ltd POSITIVE PHOTO-SENSITIVE RESIN PREPARATION.
EP0388484A1 (de) * 1989-03-20 1990-09-26 Siemens Aktiengesellschaft Hochauflösender Photoresist
EP0388483A1 (de) * 1989-03-20 1990-09-26 Siemens Aktiengesellschaft Verfahren zum Erzeugen einer Photoresiststruktur

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57120931A (en) * 1981-01-20 1982-07-28 Japan Synthetic Rubber Co Ltd Positive type photosensitive resin composition
JPS57151939A (en) * 1981-03-16 1982-09-20 Japan Synthetic Rubber Co Ltd Positive type photosensitive resin composition
DE3305923C2 (de) * 1983-02-21 1986-10-30 Siemens AG, 1000 Berlin und 8000 München Verfahren zum Vorbacken von mit Positiv-Fotolack auf der Basis von Naphtoquinondiazid und Phenolformaldehydharz beschichteten Substraten
US4556629A (en) * 1983-12-21 1985-12-03 Morton Thiokol, Inc. Developer composition for positive photoresists using solution with cyclic quaternary ammonium hydroxides
US4606999A (en) * 1983-12-21 1986-08-19 Thiokol Corporation Development of positive photoresists using cyclic quaternary ammonium hydroxides
DE3528929A1 (de) * 1985-08-13 1987-02-26 Hoechst Ag Strahlungsempfindliches gemisch, dieses enthaltendes strahlungsempfindliches aufzeichnungsmaterial und verfahren zur herstellung von reliefbildern
EP0265387B1 (en) * 1986-10-23 1995-11-15 Ciba-Geigy Ag Method of forming images
DE3722923A1 (de) * 1987-07-10 1989-01-19 Siemens Ag Photoresistfolie als kleber fuer die verbindung von zwei flachen teilen
JP2538081B2 (ja) * 1988-11-28 1996-09-25 松下電子工業株式会社 現像液及びパタ―ン形成方法
JPH0389353A (ja) * 1989-09-01 1991-04-15 Nippon Paint Co Ltd ポジ型感光性樹脂組成物
JP2712700B2 (ja) * 1990-01-30 1998-02-16 松下電器産業株式会社 パターン形成方法
US5362597A (en) * 1991-05-30 1994-11-08 Japan Synthetic Rubber Co., Ltd. Radiation-sensitive resin composition comprising an epoxy-containing alkali-soluble resin and a naphthoquinone diazide sulfonic acid ester
US5624781A (en) * 1993-05-28 1997-04-29 Kansai Paint Co., Ltd. Positive type anionic electrodeposition photo-resist composition and process for pattern formation using said composition
US5876899A (en) * 1996-09-18 1999-03-02 Shipley Company, L.L.C. Photoresist compositions
JP2000347397A (ja) 1999-06-04 2000-12-15 Jsr Corp 感放射線性樹脂組成物およびその層間絶縁膜への使用
KR20100025596A (ko) * 2001-02-27 2010-03-09 롬 앤드 하스 일렉트로닉 머트어리얼즈, 엘.엘.씨 신규 폴리머, 폴리머 합성 방법 및 포토레지스트 조성물
JP4315013B2 (ja) 2003-08-01 2009-08-19 Ｊｓｒ株式会社 感放射線性樹脂組成物、層間絶縁膜およびマイクロレンズ、ならびにそれらの製造方法
JP5045064B2 (ja) 2006-11-02 2012-10-10 Ｊｎｃ株式会社 アルカリ可溶性重合体及びそれを用いたポジ型感光性樹脂組成物
KR101506535B1 (ko) 2007-02-28 2015-03-27 제이엔씨 주식회사 포지티브형 감광성 수지 조성물
JP5115205B2 (ja) * 2008-01-15 2013-01-09 Ｊｎｃ株式会社 ポジ型感光性重合体組成物
WO2010014274A1 (en) * 2008-07-31 2010-02-04 3M Innovative Properties Company Fluoropolymer compositions and method of making and using thereof
CN102164999B (zh) * 2008-07-31 2014-05-14 3M创新有限公司 叠氮化物组合物及其制备和使用方法
JP2010250109A (ja) 2009-04-16 2010-11-04 Fujifilm Corp ポジ型感光性組成物、並びに透明導電膜、表示素子及び集積型太陽電池
JP5338532B2 (ja) 2009-07-13 2013-11-13 Ｊｎｃ株式会社 ポジ型感光性組成物

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1547437A (fr) * 1966-06-09 1968-11-29 Eastman Kodak Co Produits photogaraphiques pour préparer des images métalliques gravées
FR2037095A1 (OSRAM) * 1969-02-17 1970-12-31 Gaf Corp
FR2350625A1 (fr) * 1976-05-06 1977-12-02 Japan Synthetic Rubber Co Ltd Compositions photosensibles et cliches d'impression contenant une telle composition
US4102686A (en) * 1977-02-25 1978-07-25 Polychrome Corporation Lithographic photosensitive compositions comprising acrylonitrile-butadiene-styrene terpolymer and novolak resin

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3551154A (en) * 1966-12-28 1970-12-29 Ferrania Spa Light sensitive article comprising a quinone diazide and polymeric binder
US3900325A (en) * 1972-06-12 1975-08-19 Shipley Co Light sensitive quinone diazide composition with n-3-oxohydrocarbon substituted acrylamide
JPS5114042B2 (OSRAM) * 1972-06-12 1976-05-06
JPS5024641B2 (OSRAM) * 1972-10-17 1975-08-18
US4164421A (en) * 1972-12-09 1979-08-14 Fuji Photo Film Co., Ltd. Photocurable composition containing an o-quinonodiazide for printing plate
US4141733A (en) * 1977-10-25 1979-02-27 Eastman Kodak Company Development of light-sensitive quinone diazide compositions
US4177074A (en) * 1978-01-25 1979-12-04 E. I. Du Pont De Nemours And Company Butadiene/acrylonitrile photosensitive, elastomeric polymer compositions for flexographic printing plates
JPS55527A (en) * 1978-06-16 1980-01-05 Fuji Photo Film Co Ltd Photosensitive planographic plate

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1547437A (fr) * 1966-06-09 1968-11-29 Eastman Kodak Co Produits photogaraphiques pour préparer des images métalliques gravées
FR2037095A1 (OSRAM) * 1969-02-17 1970-12-31 Gaf Corp
US3637384A (en) * 1969-02-17 1972-01-25 Gaf Corp Positive-working diazo-oxide terpolymer photoresists
FR2350625A1 (fr) * 1976-05-06 1977-12-02 Japan Synthetic Rubber Co Ltd Compositions photosensibles et cliches d'impression contenant une telle composition
US4102686A (en) * 1977-02-25 1978-07-25 Polychrome Corporation Lithographic photosensitive compositions comprising acrylonitrile-butadiene-styrene terpolymer and novolak resin
FR2382024A1 (fr) * 1977-02-25 1978-09-22 Polychrome Corp Reserves photographiques et plaques d'impression lithographique ameliorees

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0194824A3 (en) * 1985-03-08 1988-01-13 Nippon Paint Co., Ltd. A method for preparing a printed circuit board
EP0301101A4 (en) * 1987-02-02 1990-02-22 Nippon Paint Co Ltd POSITIVE PHOTO-SENSITIVE RESIN PREPARATION.
WO1989007786A1 (en) * 1988-02-17 1989-08-24 Tosoh Corporation Photoresist composition
US5212043A (en) * 1988-02-17 1993-05-18 Tosho Corporation Photoresist composition comprising a non-aromatic resin having no aromatic structures derived from units of an aliphatic cyclic hydrocarbon and units of maleic anhydride and/or maleimide and a photosensitive agent
EP0388484A1 (de) * 1989-03-20 1990-09-26 Siemens Aktiengesellschaft Hochauflösender Photoresist
EP0388483A1 (de) * 1989-03-20 1990-09-26 Siemens Aktiengesellschaft Verfahren zum Erzeugen einer Photoresiststruktur

Also Published As

Publication number Publication date
GB2073756B (en) 1984-06-27
FR2477294B1 (OSRAM) 1983-03-11
JPS56122031A (en) 1981-09-25
IT8147903A0 (it) 1981-02-27
US4384037A (en) 1983-05-17
IT1170762B (it) 1987-06-03
JPH0145053B2 (OSRAM) 1989-10-02
GB2073756A (en) 1981-10-21
DE3107526C2 (de) 1985-07-11
NL8100969A (nl) 1981-10-01
DE3107526A1 (de) 1981-12-24

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ST Notification of lapse