JPS57151939A - Positive type photosensitive resin composition - Google Patents

Positive type photosensitive resin composition

Info

Publication number
JPS57151939A
JPS57151939A JP3768981A JP3768981A JPS57151939A JP S57151939 A JPS57151939 A JP S57151939A JP 3768981 A JP3768981 A JP 3768981A JP 3768981 A JP3768981 A JP 3768981A JP S57151939 A JPS57151939 A JP S57151939A
Authority
JP
Japan
Prior art keywords
compound
unsatd
copolymer
photosensitive resin
resin composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3768981A
Other languages
Japanese (ja)
Other versions
JPH0145614B2 (en
Inventor
Yukihiro Hosaka
Yasuo Terasawa
Yoshiyuki Harita
Toko Harada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JSR Corp
Nippon Synthetic Chemical Industry Co Ltd
Original Assignee
Nippon Synthetic Chemical Industry Co Ltd
Japan Synthetic Rubber Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Synthetic Chemical Industry Co Ltd, Japan Synthetic Rubber Co Ltd filed Critical Nippon Synthetic Chemical Industry Co Ltd
Priority to JP3768981A priority Critical patent/JPS57151939A/en
Publication of JPS57151939A publication Critical patent/JPS57151939A/en
Publication of JPH0145614B2 publication Critical patent/JPH0145614B2/ja
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

PURPOSE:To enhance the adhesion to a substrate, the crack resistance, etc. by adding a copolymer of a conjugated diolefin compound, an unsatd. monoolefin compound and alpha,beta-ethylenic unsatd. carboxylic acid, and a 1,2-quinonediazido compound. CONSTITUTION:A positive type photosensitive resin composition contg. 5- 100pts.wt. 1,2-quinonediazido compound to 100pts.wt. copolymer with 500-5,000 number average mol. wt. is prepared. The copolymer consists of 5-60mol% conjugated diolefin such as 1,3-butadiene or isoprene, 25-90mol% unsatd. monoolefin compound and 5-25mol% alpha,beta-ethylenic unsatd. carboxylic acid. The composition is developed with an alkaline aqueous soln., especially an aqueous soln. of metal-free cyclic amine or quat. ammonium salt in the manufacture of an integrated circuit. The composition has superior adhesion to a silicon wafer and high photosensitivity and gives a coat hard to crack.
JP3768981A 1981-03-16 1981-03-16 Positive type photosensitive resin composition Granted JPS57151939A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3768981A JPS57151939A (en) 1981-03-16 1981-03-16 Positive type photosensitive resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3768981A JPS57151939A (en) 1981-03-16 1981-03-16 Positive type photosensitive resin composition

Publications (2)

Publication Number Publication Date
JPS57151939A true JPS57151939A (en) 1982-09-20
JPH0145614B2 JPH0145614B2 (en) 1989-10-04

Family

ID=12504532

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3768981A Granted JPS57151939A (en) 1981-03-16 1981-03-16 Positive type photosensitive resin composition

Country Status (1)

Country Link
JP (1) JPS57151939A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1988005928A1 (en) * 1987-02-02 1988-08-11 Nippon Paint Co., Ltd. Positive photosensitive resin composition and process for its production
WO2021192507A1 (en) * 2020-03-23 2021-09-30 三菱ケミカル株式会社 Acrylic polymer, curable composition, and cured product thereof

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5474432A (en) * 1977-10-25 1979-06-14 Eastman Kodak Co Method of developing photosensitive quinone diazide composition
JPS56122031A (en) * 1980-03-01 1981-09-25 Japan Synthetic Rubber Co Ltd Positive type photosensitive resin composition
JPS57120931A (en) * 1981-01-20 1982-07-28 Japan Synthetic Rubber Co Ltd Positive type photosensitive resin composition

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5474432A (en) * 1977-10-25 1979-06-14 Eastman Kodak Co Method of developing photosensitive quinone diazide composition
JPS56122031A (en) * 1980-03-01 1981-09-25 Japan Synthetic Rubber Co Ltd Positive type photosensitive resin composition
JPS57120931A (en) * 1981-01-20 1982-07-28 Japan Synthetic Rubber Co Ltd Positive type photosensitive resin composition

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1988005928A1 (en) * 1987-02-02 1988-08-11 Nippon Paint Co., Ltd. Positive photosensitive resin composition and process for its production
WO2021192507A1 (en) * 2020-03-23 2021-09-30 三菱ケミカル株式会社 Acrylic polymer, curable composition, and cured product thereof
JPWO2021192507A1 (en) * 2020-03-23 2021-09-30
CN114867761A (en) * 2020-03-23 2022-08-05 三菱化学株式会社 Acrylic polymer, curable composition, and cured product thereof
CN114867761B (en) * 2020-03-23 2024-02-09 三菱化学株式会社 Acrylic polymer, curable composition, and cured product thereof

Also Published As

Publication number Publication date
JPH0145614B2 (en) 1989-10-04

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