ES2787702T8 - Procedimiento de fabricación de una placa de circuito impreso con microrradiadores - Google Patents

Procedimiento de fabricación de una placa de circuito impreso con microrradiadores

Info

Publication number
ES2787702T8
ES2787702T8 ES16168787T ES16168787T ES2787702T8 ES 2787702 T8 ES2787702 T8 ES 2787702T8 ES 16168787 T ES16168787 T ES 16168787T ES 16168787 T ES16168787 T ES 16168787T ES 2787702 T8 ES2787702 T8 ES 2787702T8
Authority
ES
Spain
Prior art keywords
microradiators
circuit board
printed circuit
manufacturing process
printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
ES16168787T
Other languages
English (en)
Other versions
ES2787702T3 (es
Inventor
Kai Chiu Wu
Lam Wai Kin Raymond
Zheng Wang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rayben Tech Hk Ltd
Original Assignee
Rayben Tech Hk Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US14/861,495 external-priority patent/US10433414B2/en
Application filed by Rayben Tech Hk Ltd filed Critical Rayben Tech Hk Ltd
Application granted granted Critical
Publication of ES2787702T3 publication Critical patent/ES2787702T3/es
Publication of ES2787702T8 publication Critical patent/ES2787702T8/es
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/148—Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • H05K3/4605—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated made from inorganic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4623—Manufacturing multilayer circuits by laminating two or more circuit boards the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0278—Rigid circuit boards or rigid supports of circuit boards locally made bendable, e.g. by removal or replacement of material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/0909—Preformed cutting or breaking line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/063—Lamination of preperforated insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H05K3/0038—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material combined with laser drilling through a metal layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/26—Cleaning or polishing of the conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4635—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating flexible circuit boards using additional insulating adhesive materials between the boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4638—Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
ES16168787T 2015-09-22 2016-05-09 Procedimiento de fabricación de una placa de circuito impreso con microrradiadores Active ES2787702T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US14/861,495 US10433414B2 (en) 2010-12-24 2015-09-22 Manufacturing method of printing circuit board with micro-radiators

Publications (2)

Publication Number Publication Date
ES2787702T3 ES2787702T3 (es) 2020-10-16
ES2787702T8 true ES2787702T8 (es) 2020-11-05

Family

ID=55609999

Family Applications (1)

Application Number Title Priority Date Filing Date
ES16168787T Active ES2787702T3 (es) 2015-09-22 2016-05-09 Procedimiento de fabricación de una placa de circuito impreso con microrradiadores

Country Status (6)

Country Link
EP (1) EP3148298B1 (es)
JP (1) JP6506719B2 (es)
KR (1) KR101992924B1 (es)
CN (15) CN205491419U (es)
ES (1) ES2787702T3 (es)
TW (1) TWI635783B (es)

Families Citing this family (53)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105916291B (zh) * 2016-07-06 2018-05-08 四川海英电子科技有限公司 一种高密度互联印刷电路板的制作方法
CN109863593B (zh) * 2016-07-15 2022-11-04 乐健科技（珠海）有限公司 散热电路板、功率模块及制备散热电路板的方法
US10499500B2 (en) * 2016-11-04 2019-12-03 Flex Ltd. Circuit board with embedded metal pallet and a method of fabricating the circuit board
CN108235559A (zh) * 2016-12-21 2018-06-29 钰桥半导体股份有限公司 具有隔离件及桥接件的线路板及其制法
CN107079582A (zh) * 2017-01-22 2017-08-18 乐健科技（珠海）有限公司 电路基板及其制造方法、电路板及其制造方法
WO2018155585A1 (ja) * 2017-02-24 2018-08-30 日本電産エレシス株式会社 回路基板、モータ、制御装置および電動ポンプ
CN106887419B (zh) * 2017-02-27 2019-06-11 华为技术有限公司 蒸气腔连体散热器及电子装置
TWI657546B (zh) * 2017-05-25 2019-04-21 鈺橋半導體股份有限公司 設有電隔離件及基底板之線路板、其半導體組體及其製法
CN109413836B (zh) * 2017-08-15 2021-04-20 鹏鼎控股(深圳)股份有限公司 电路板及其制备方法
JP6783724B2 (ja) * 2017-08-22 2020-11-11 太陽誘電株式会社 回路基板
JP6745770B2 (ja) * 2017-08-22 2020-08-26 太陽誘電株式会社 回路基板
CN107592725A (zh) * 2017-08-31 2018-01-16 深圳崇达多层线路板有限公司 一种在高多层印刷线路板上埋铜块的方法
CN109427690A (zh) * 2017-09-05 2019-03-05 比亚迪股份有限公司 Mos管组件以及车载充电器
CN107507528A (zh) * 2017-09-16 2017-12-22 南京中高知识产权股份有限公司 一种超薄led显示屏组件及其制备方法
CN107734859B (zh) * 2017-11-20 2020-05-22 生益电子股份有限公司 一种pcb的制造方法及pcb
CN108091621A (zh) * 2017-12-21 2018-05-29 乐健科技（珠海）有限公司 内嵌开关芯片的器件模组及其制作方法
CN108055763A (zh) * 2018-01-16 2018-05-18 生益电子股份有限公司 一种pcb的制造方法及pcb
CN108055764B (zh) * 2018-01-16 2020-03-27 生益电子股份有限公司 一种pcb的制造方法及pcb
CN108055765A (zh) * 2018-01-16 2018-05-18 生益电子股份有限公司 一种pcb的制造方法及pcb
CN108200714A (zh) * 2018-01-16 2018-06-22 生益电子股份有限公司 一种pcb及其制造方法
CN108055767B (zh) * 2018-01-16 2020-05-05 生益电子股份有限公司 一种pcb及其制造方法
CN108055766A (zh) * 2018-01-16 2018-05-18 生益电子股份有限公司 一种pcb及其制造方法
TWI713419B (zh) 2018-02-09 2020-12-11 大陸商深南電路股份有限公司 一種印刷電路板及其製作方法和電子裝置
CN110139462B (zh) * 2018-02-09 2024-06-07 深南电路股份有限公司 一种印刷电路板及其制作方法和电子装置
CN108601206A (zh) * 2018-06-08 2018-09-28 深圳市景旺电子股份有限公司 一种嵌氮化铝pcb基板及其制作方法
CN112586093A (zh) * 2018-06-15 2021-03-30 Lg伊诺特有限公司 印刷电路板和包括该印刷电路板的相机装置
CN108882538B (zh) * 2018-07-17 2020-06-16 乐健科技（珠海）有限公司 电路板及其制备方法
US20220059744A1 (en) * 2018-10-03 2022-02-24 Citizen Electronics Co., Ltd. Inlay substrate and light emitting device using inlay substrate
CN209572202U (zh) * 2018-10-31 2019-11-01 奥特斯(中国)有限公司 半柔性部件承载件
GB2581501B (en) * 2019-02-19 2021-03-03 Oxis Energy Ltd Interconnection for a battery
JP2020178057A (ja) * 2019-04-19 2020-10-29 シチズン時計株式会社 回路基板及びその回路基板を用いた発光装置
CN111935946B (zh) * 2019-05-13 2023-07-04 群创光电股份有限公司 电子装置
TWI714195B (zh) * 2019-08-02 2020-12-21 信通交通器材股份有限公司 具有抗熱應力的系統級半導體雙面封裝電路板及製造方法
CN110572938A (zh) * 2019-08-20 2019-12-13 上海长园维安电子线路保护有限公司 具有过流过温保护特性的软硬结合保护板
CN112654131A (zh) * 2019-10-12 2021-04-13 深南电路股份有限公司 一种导热且电绝缘电路板的制作方法及其电路板
TWI724898B (zh) * 2020-05-14 2021-04-11 欣興電子股份有限公司 銅板結構、具埋入式銅塊的電路板及其製作方法
CN113677086B (zh) * 2020-05-15 2022-07-19 超毅科技有限公司 带币状物和介电层的印刷电路板
US11160160B1 (en) * 2020-08-06 2021-10-26 Multek Technologies Limited PCB for bare die mount and process therefore
CN114126187B (zh) * 2020-08-26 2024-05-10 宏恒胜电子科技（淮安）有限公司 具有内埋散热结构的线路板及其制作方法
CN112105142A (zh) * 2020-10-10 2020-12-18 华域视觉科技(上海)有限公司 混和电路板
CN112492743A (zh) * 2020-11-06 2021-03-12 龙南骏亚电子科技有限公司 一种多层印制电路板的散热结构
CN112512201B (zh) * 2020-11-24 2022-07-05 鹤山市世拓电子科技有限公司 一种内嵌相变散热器件的印刷电路板
US11439018B2 (en) 2020-12-29 2022-09-06 At&S Austria Technologie & Systemtechnik Aktiengesellschaft Component carrier and method of manufacturing the same
US11412618B2 (en) 2020-12-29 2022-08-09 At&S Austria Technologie & Systemtechnik Aktiengesellschaft Component carrier and method of manufacturing the same
CN112770546A (zh) * 2020-12-30 2021-05-07 深圳市合成快捷电子科技有限公司 一种高精度软硬结合线路板的制作方法
CN114828438A (zh) * 2021-01-22 2022-07-29 健鼎（无锡）电子有限公司 复合式电路板及其制造方法
CN113015339A (zh) * 2021-03-01 2021-06-22 鹤山市世拓电子科技有限公司 一种嵌埋陶瓷线路板的制作方法及嵌埋陶瓷线路板
CN115226299A (zh) 2021-04-20 2022-10-21 台达电子企业管理（上海）有限公司 载板及其适用的功率模块
CN113194636B (zh) * 2021-04-30 2022-03-15 生益电子股份有限公司 一种埋铜块电路板的制作方法
TWI792356B (zh) * 2021-06-17 2023-02-11 大陸商慶鼎精密電子（淮安）有限公司 電路板元件及電路板元件的製作方法
TWI810590B (zh) * 2021-06-18 2023-08-01 陳冠宇 電路板及其製作方法
CN113343535B (zh) * 2021-06-23 2022-04-01 复旦大学 一种高可靠性的嵌入式SiC功率器件封装设计方法
RU209220U1 (ru) * 2021-10-06 2022-02-07 Акционерное общество «НАУЧНО-ПРОИЗВОДСТВЕННАЯ КОМПАНИЯ «АТРОНИК» (АО «НПК «АТРОНИК») Модуль центрального процессора

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2413016A1 (fr) * 1977-12-26 1979-07-20 Radiotechnique Compelec Circuits imprimes multicouches a collecteur thermique incorpore
JPH08148601A (ja) * 1994-11-18 1996-06-07 Sumitomo Metal Ind Ltd 多層配線基板
US6376908B1 (en) * 1997-12-10 2002-04-23 Mitsubishi Gas Chemical Company, Inc. Semiconductor plastic package and process for the production thereof
JP3634735B2 (ja) * 2000-10-05 2005-03-30 三洋電機株式会社 半導体装置および半導体モジュール
TW536795B (en) 2001-05-30 2003-06-11 Apack Comm Inc Flip chip package of monolithic microwave integrated circuit
EP1276357A3 (de) * 2001-07-13 2004-08-25 Behr-Hella Thermocontrol GmbH Leiterplatte für elektrische Schaltungen
DE10234995A1 (de) * 2002-07-31 2004-02-12 Osram Opto Semiconductors Gmbh Leuchtdiodenanordnung mit thermischem Chipanschluß und Leuchtdiodenmodul
DE10258090B4 (de) * 2002-09-19 2009-01-29 Ruwel Ag Verfahren zur Herstellung von starr-flexiblen Leiterplatten und Leiterplatten mit mindestens einem starren Bereich und mindestens einem flexiblen Bereich
KR100602847B1 (ko) * 2004-02-27 2006-07-19 럭스피아 주식회사 방열판이 장착된 인쇄회로기판과 이 회로기판을 이용한발광다이오드 패캐지 및 그 제조방법
US20080179618A1 (en) * 2007-01-26 2008-07-31 Ching-Tai Cheng Ceramic led package
JP2009081342A (ja) * 2007-09-27 2009-04-16 Sharp Corp 多層プリント配線板とその製造方法
US20100139967A1 (en) * 2008-12-08 2010-06-10 Ibiden Co., Ltd. Wiring board and fabrication method therefor
CN101790290B (zh) * 2010-01-22 2012-05-23 东莞生益电子有限公司 埋入式高导热pcb板的制作方法
TW201218468A (en) * 2010-10-26 2012-05-01 Bridge Semiconductor Corp Semiconductor chip assembly with bump/base heat spreader and cavity in bump
TWI420999B (zh) * 2010-11-04 2013-12-21 Zhen Ding Technology Co Ltd 軟硬結合電路板之製作方法
CN103069936B (zh) * 2010-11-30 2016-04-27 乐健科技（珠海）有限公司 带有绝缘微散热器的印刷电路板
CN102026496A (zh) * 2010-12-24 2011-04-20 乐健线路板（珠海）有限公司 带有绝缘微散热器的印刷电路板的制备方法
TWI435393B (zh) * 2011-01-19 2014-04-21 Subtron Technology Co Ltd 封裝載板及其製作方法
TW201241969A (en) * 2011-04-08 2012-10-16 Unimicron Technology Corp Method for fabricating heat dissipation substrate
CN202384394U (zh) * 2011-12-29 2012-08-15 高新低碳能源科技股份有限公司 一种提高led光效的散热陶瓷基板
TWI489918B (zh) * 2012-11-23 2015-06-21 Subtron Technology Co Ltd 封裝載板
DE102013204889A1 (de) * 2013-03-20 2014-09-25 Robert Bosch Gmbh Leistungsmodul mit mindestens einem Leistungsbauelement
DE202014006215U1 (de) * 2014-07-31 2015-08-13 Kathrein-Werke Kg Leiterplatte mit gekühltem Baustein, insbesondere SMD-Baustein
CN104812174A (zh) * 2015-03-27 2015-07-29 深圳市五株科技股份有限公司 半固化片的盲孔或盲槽制作方法

Also Published As

Publication number Publication date
TW201713177A (zh) 2017-04-01
CN105472877B (zh) 2018-10-16
CN105472877A (zh) 2016-04-06
CN105764242B (zh) 2019-05-21
CN205546188U (zh) 2016-08-31
KR20170035331A (ko) 2017-03-30
CN105611724B (zh) 2018-08-10
KR101992924B1 (ko) 2019-09-30
CN105744726A (zh) 2016-07-06
CN205491419U (zh) 2016-08-17
ES2787702T3 (es) 2020-10-16
JP6506719B2 (ja) 2019-04-24
JP2017063177A (ja) 2017-03-30
CN105657959A (zh) 2016-06-08
CN205566793U (zh) 2016-09-07
CN105722311A (zh) 2016-06-29
CN205510524U (zh) 2016-08-24
CN105764242A (zh) 2016-07-13
CN205566792U (zh) 2016-09-07
CN105744725A (zh) 2016-07-06
CN105611724A (zh) 2016-05-25
CN205510523U (zh) 2016-08-24
CN105657959B (zh) 2019-05-21
CN105744726B (zh) 2019-09-03
CN205546189U (zh) 2016-08-31
CN105744725B (zh) 2019-05-21
EP3148298A1 (en) 2017-03-29
CN105722311B (zh) 2019-06-11
EP3148298B1 (en) 2020-02-12
CN205566794U (zh) 2016-09-07
TWI635783B (zh) 2018-09-11

Similar Documents

Publication Publication Date Title
ES2787702T8 (es) Procedimiento de fabricación de una placa de circuito impreso con microrradiadores
EP3183753A4 (en) Electronic circuit
EP3280051A4 (en) Electronic circuit
IL262577A (en) Sibling board
DE102017206911B8 (de) Gedruckter Schaltungskörper
EP3109222A4 (en) Ceramic circuit board
SG10201504364QA (en) Fabrication of multilayer circuit elements
PT3148299T (pt) Um artigo têxtil multicamada moldado por injeção compreendendo pistas de circuito condutor
FI20146084A (fi) Monitoimikaarilauta
IL256835A (en) Methods of manufacturing printed circuit boards
IL245215A0 (en) Thermal management of printed circuit board components
FI20135993L (fi) Piirikortti
HK1215509A1 (zh) 印刷電路板
GB2525184B (en) Electronic Circuit
TWM490721U (en) Rigid-flexible printed circuit board
LT3100836T (lt) Plokštės gamyba
KR20180084803A (ko) 회로 부재 접속용 수지 시트
IL251074A0 (en) Multi-layer sticker containing a flat electronic circuit
TWM534495U (en) Multilayer circuit board
GB2549276B (en) A mm wave circuit
ES1161458Y (es) Pastillero electronico
TWM533838U (en) Ceramic circuit board
AU2015353393B2 (en) Booster comprising a printed electronic circuit
GB201607682D0 (en) A circuit
HK1208091A1 (en) An electronic calculator having a timer function