CN205491419U - 印刷电路板及led光源模组 - Google Patents
印刷电路板及led光源模组 Download PDFInfo
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- CN205491419U CN205491419U CN201521143154.2U CN201521143154U CN205491419U CN 205491419 U CN205491419 U CN 205491419U CN 201521143154 U CN201521143154 U CN 201521143154U CN 205491419 U CN205491419 U CN 205491419U
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Abstract
本实用新型涉及一种印刷电路板及LED光源模组,该印刷电路板具有上表面和下表面、散热器、基板、位于上表面的多个电极焊盘、位于下表面的多个端子和位于下表面的热扩散器;其中,多个端子中的每一个均与多个电极焊盘中的至少一个电连接,热扩散器与散热器和基板连接。本实用新型所提供的LED光源模组包括印刷电路板以及与印刷电路板电连接和热连接的LED发光元件。
Description
相关申请的交叉引用
本申请是2012年9月14日提交的13/514,999号美国专利申请的部分继续申请,13/514,999号申请是2011年1月6日提交的PCT/CN11/70051号国际申请根据35U.S.C.§371进入国家阶段的申请,该国际申请要求2010年12月24日提交的201010604353.4号中国专利申请的优先权,上述所有申请均在此引入作为参考。
技术领域
本实用新型涉及一种印刷电路板及LED光源模组;更具体地讲,本实用新型涉及一种带有陶瓷散热器的印刷电路板及LED光源模组。
背景技术
印刷电路板(PCBs)是电子工业的重要部件之一,其被用作电子元件的机械支撑部件,并实现电子元件之间的电连接。另外,可以在印刷电路板上印刷元件的编号和图形,这为元件的插装、检查或维修提供了方便。几乎每种电子设备,例如电子手表、计算器、计算机、通讯电子设备、军用武器系统等等,都要用到印刷电路板。
LED装置通常被附接到印刷电路板上,且在工作过程中一般会释放大量热 量,这就要求与LED装置连接的印刷电路板具有良好的散热性能
201180037321.3号中国专利申请、2002/0180062号美国专利申请公布等公开了具有陶瓷散热器的印刷电路板,其中所描述的陶瓷散热器能够输出发热元件所产生的热量,但该散热器的热膨胀系数和作为印刷电路板的绝缘载体的树脂层的热膨胀系数之间存在显著差别。因此,有必要提供一种改进的印刷电路板设计。
发明内容
根据本实用新型一方面的印刷电路板,具有上表面和下表面,包括:散热器;基板;位于上表面的多个电极焊盘;位于下表面的多个端子,该多个端子中的每一个均与多个电极焊盘中的至少一个电连接;热扩散热,位于下表面并与散热器和基板连接。
作为一种具体实施方式,上述散热器包括陶瓷芯核。
优选地,上述多个电极焊盘中的至少一个与散热器和基板连接。
更优选地,上述多个电极焊盘中的每一个均与散热器和基板连接。
可选择地,印刷电路板的上表面还形成有导热焊盘。
作为一种优选实施方式,上述导热焊盘与散热器和基板连接。
具体地,上述基板可以包括位于多个树脂板之间的半固化片。
挠性印刷电路板还可以包括第二印刷电路板,该第二印刷电路板具有上表面和下表面、散热器、基板、位于上表面的多个电极焊盘、位于下表面的多个端子、以及位于下表面并连接至散热器和基板的热扩散器;其中,多个端子中的每一个均与多个电极焊盘中的至少一个连接;上述多个印刷电路板可以由位于每一个印刷电路板的上、下表面之间的挠性构件连接。
上述多个印刷电路板可以相隔一定距离但相互之间通过挠性构件保持连接。
根据本实用新型另一方面的LED光源模组包括LED发光元件和如上所述的任意一种印刷电路板,其中,LED发光元件与印刷电路板的电极焊盘电连接。
附图说明
以下参照附图和具体实施方式对本实用新型的主题及其各种优点作进一步的详细说明,其中:
图1A是根据本实用新型一实施例的散热器的横截面视图;
图1B是根据本实用新型一实施例的树脂板的横截面视图;
图1C是根据本实用新型一实施例的半固化片的横截面视图;
图2是根据本实用新型一实施例的印刷电路板的横截面视图,其包括图1A的散热器、图1B的树脂板和图1C的半固化片;
图3是图2的具有多余树脂的印刷电路板的横截面视图;
图4是图3的去除多余树脂的印刷电路板的横截面视图;
图5是图4的其中形成有多个通孔的印刷电路板的横截面视图;
图6是图5的其上形成有导电层的印刷电路板的横截面视图;
图7A是图6的根据本实用新型一实施例的导电层上形成有表面电路的印刷电路板的横截面视图;
图7B是图7A的印刷电路板的顶视图;
图7C是图7A的印刷电路板的底视图;
图7D是图7A的其上附接有LED的印刷电路板的横截面视图;
图7E是图2的印刷电路板中通孔的顶视图;
图8A是图6的根据本实用新型另一实施例的导电层上形成有表面电路的印刷电路板的横截面视图;
图8B是图8A的其上附接有多个LED的印刷电路板的横截面视图;
图9A是图6的根据本实用新型再一实施例的导电层上形成有表面电路的印刷电路板的横截面视图;
图9B是图9A的其上附接有LED的印刷电路板的横截面视图;
图10是根据本实用新型另一实施例的散热器的横截面视图;
图11是根据本实用新型另一实施例的印刷电路板的横截面视图;
图12是根据本实用新型再一实施例的树脂板的横截面视图;
图13是根据本实用新型另一实施例的印刷电路板的横截面视图;
图14是图13的树脂板的部分被去除后的印刷电路板的横截面视图;
图15是表示根据本实用新型的一种印刷电路板制备方法的流程图;
图16是图2的位于根据本实用新型一实施例的热压板之间的印刷电路板的横截面视图;
图17是图2的位于根据本实用新型另一实施例的热压板之间的印刷电路板的横截面视图。
具体实施方式
本实用新型一实施例的印刷电路板的制备方法,包括:如图15的步骤132所示,制备导热且电绝缘的散热器。如图1A所示,制备散热器包括在散热器10的上表面和下表面中的一个或两个上覆盖导电层111。在整个说明书中所使用的导电层可以是铜、金或任何其他导电材料。导热且电绝缘的散热器10可以包括 由陶瓷,如氧化铝陶瓷、氮化铝陶瓷、碳化硅陶瓷等等,所制成的芯核118。在图1A所示的实施例中,通过机械或者激光切割的方式切割上、下两个表面均覆盖有铜的氧化铝陶瓷板112,以获得上、下表面均覆盖有导电层111的导热且电绝缘的散热器10。导电层111完全延伸越过散热器的上、下表面至其边缘,这有助于降低散热器中的热应力,并阻止散热器和介电层之间发生分离。
图15中所示制备方法包括提供具有第一通孔211的有机树脂板的步骤134。如图1B所示,有机树脂板20覆盖有导电层221和222,且具有构造为用于接纳散热器10的第一通孔211。树脂板20可以是环氧树脂、纤维增强环氧树脂、FR4等材质。虽然图1B所示的有机树脂板在其两面均覆盖有导电层,但其也可以是根据需要在单面覆盖导电层。在图1B中,提供了双面FR4覆铜板20,其包括带有第一导电层221和第二导电层222的介电层21。第一通孔211通过机械或者激光钻孔的方式制备。第一导电层221是不具有电路图案的导电层。在一个实施例中,第一导电层221和导电层111具有相等的厚度,该厚度大约为1OZ。第二导电层222是具有电路图案(未示出)的导电层,该电路图案根据现有技术中的已知方法(例如蚀刻)而形成。
图15的方法包括在步骤136中提供具有第二通孔的半固化片。根据本实用新型一个实施例的印刷电路板包括最佳如图1C所示的半固化片30(例如prepreg),其具有第二通孔31。在一个实施例中,第二通孔31可以通过对半固化片30进行机械或者激光钻孔而制得。在其他实施例中,半固化片可以被制备为其中已经形成有第二通孔(例如通过在模具中成型等方式)。半固化片30可以包括没有完全固化的环氧树脂。图7E中示出了各个通孔和散热器之间的位置关系。散热器10具有相等或不相等的第一长度和宽度。第一通孔211大于散热器,且二者之间具有第一偏移量55,以允许散热器被放置在介电层21中。如图所示,第二通孔31大于第一通孔,且二者之间具有第二偏移量53。第一偏移 距离55优选为0.1mm至0.2mm,更优选为0.14mm至0.16mm。第二偏移距离53优选为0.05mm至0.15mm,更优选为0.09mm至0.11mm。
图15所示制备方法的步骤138包括:层叠树脂板和半固化片,并使其相互固定;将散热器放置在相应的通孔内。如图2所示,树脂板20位于半固化片30的每一侧;第一通孔211和第二通孔31对齐,且树脂板20和半固化片30临时性或永久性地结合在一起(例如通过绑定、胶粘、焊接、夹持、使用连接器连接等方式)。上述制备方法进一步包括将散热器10放置在通孔内,以制备层压印刷电路板224。如图2所示,具有电路图案的导电层222放置为相邻于半固化片30,从而被设置在印刷电路板的内部。换句话说,在该步骤之前,印刷电路板的所有内部电路都是已经制备好的。
图15的方法包括在步骤140中对层压印刷电路板224进行热压。热压包括在层压印刷电路板224的相对表面施加压力,并同时加热层压印刷电路板224。在压力作用下,层压印刷电路板224的厚度减小,使得导电层111和221的表面基本上或大致平齐。加热层压印刷电路板224使得半固化片30中未固化的环氧树脂填充散热器10和树脂板20之间的间隙226(如图2所示),并流动至导电层111和221的表面。半固化片的可流动性与其环氧树脂的含量正相关。在一些实施例中,设置为相邻于树脂板的半固化片的环氧树脂含量可以为大约60-75wt%,更优选为65-70wt%。相对较高的可流动性有助于半固化片基本上或完全填充间隙226。如图3所示,散热器10和树脂板20由于热压而形成固定连接。
图16示出了可以用于热压步骤的装置的一个实施例。该装置包括离型膜2和挠性的硬质层1(例如金属、塑料、铜和铝),其中,硬质层1的厚度为大约0.05mm至0.3mm。离型膜2和挠性硬质层1被设置在层压印刷电路板224的两侧,且离型膜2相邻于印刷电路板。挠性硬质层1可以在热压过程中提高层压 印刷电路板224的平整度,使得在热压步骤后,第一导电层221和位于散热器10表面的导电层111如图3所示共面。
如图3所示,在热压步骤中,多余树脂38可能流动至印刷电路板的表面。因此,上述制备方法包括如图15的步骤142中所描述的去除溢流至印刷电路板表面的固化树脂38。在一个实施例中,这可以通过研磨固化树脂38来实现,在研磨固化树脂38时,通常同时对导电层111和221进行研磨。如图4所示,研磨步骤还可以有助于确保固化树脂38、导电层111和221的表面基本上或大致平齐。在其他实施例中,固化树脂可以通过其他方法(例如化学的)去除。
如图15的步骤144中所描述,作为上述制备过程的一部分,钻穿层压印刷电路板224而得到多个通孔51。如下所述,图5中所示的多个通孔51提供了在全部导电层之间建立电连接的路径。
图15描述的方法包括在印刷电路板上镀覆导电层。如图6所示,导电层611形成在固化树脂38以及导电层111和221的表面,在通孔51的内壁还形成有导电层612。在一个实施例中,导电层611和612可以通过首先化学沉积底铜层,然后采用电镀法在底铜层上沉积加厚铜而形成。当然,如前所述,可以利用其它导电材料来替代铜。本实用新型并不限于采用上述的导电层制备方法,而是可以使用现有技术中任意的已知导电层制备方法。
在图15的步骤148中制备表面电路。如图7A-C所示,在层压印刷电路板224上制备该表面电路。一般地,采用图形蚀刻的方法(图形化处理)制备表面电路,以在印刷电路板224的上、下表面形成相应的导电图案。如图7A-C所示,对印刷电路板上表面的导电层111、221和611进行图形化处理,以得到正极焊盘71、负极焊盘72和导热焊盘73。焊盘71、72和73全部延伸穿过导电层221和611至散热器10和树脂板20的介电层21的表面。此外,对印刷电路板下表面的导电层进行图形化处理,以得到第一端子81、第二端子82和热扩散图案 83。图形蚀刻使得热扩散图案83与第一端子81和第二端子82分离,且热扩散图案83延伸至散热器10和介电层21的表面。
上述方法包括在图15的步骤149中将LED连接至印刷电路板。如图7D所示,LED装置包括正电极91、负电极92和热沉93。正电极91、负电极92和热沉93分别连接(例如通过焊接、点胶)至正极焊盘71、负极焊盘72和导热焊盘73,从而得到LED模组。LED装置所产生的热量可以通过导热焊盘73、散热器10和热扩散图案83进行扩散。
上述方法可以进一步包括在印刷电路板的上表面或者下表面连接LED驱动电路或控制电路元件。这些电路可以包括驱动电路、调光电路、电压控制电路、电流控制电路、色彩控制电路、温度保护电路,等等。上述方法还可以包括在印刷电路板上形成这些电路的步骤。
图8A示出了另一实施例的印刷电路板801。印刷电路板801的某些方面及其制备方法与图1至7D的描述相类似,故仅对该实施例与前述实施例的区别进行说明。与印刷电路板224相比,图8A-8B所示的印刷电路板801的上表面具有不同的导电图案。可以进行如前所述的图形化处理工艺,但略去导热焊盘而制备多个正极焊盘71和多个负极焊盘72。多个正极焊盘71和多个负极焊盘72中的至少一个延伸至散热器10和介电层21的表面。多个LED装置的正电极和负电极可以分别连接至正极焊盘71和负极焊盘72,从而得到具有多个LED的LED模组。
换句话说,印刷电路板224(图7D)适用于具有三个引脚/电极的LED装置,印刷电路板801(图8B)适用于具有两个引脚/电极的LED装置(例如倒装LED芯片)。
另外,本申请的某些或全部实施例中的印刷电路板特别适用于安装或封装有硅基板/芯片的LED装置。这是因为,硅和陶瓷具有相对接近的热膨胀系数, 从而能够避免或减少由于LED装置和印刷电路板之间热膨胀系数不匹配而导致的各种结构和热扩散缺陷。因此,与以前的现有方法相比,根据本实用新型所描述的方法而制备的产品具有增强的稳定性。
图9A-9B示出了另一实施例的印刷电路板。印刷电路板901下表面的导电图案略去了前述的热扩散图案,而是代之以对印刷电路板下表面的导电层111、221和611进行图形化处理,从而得到第一端子81和第二端子82;其中,第一端子81和第二端子82延伸至散热器10和介电层21的表面。
如图10所示,可以在切割板112之前对散热器10的导电层111进行蚀刻,该蚀刻在散热器10的边缘和导电层111之间形成间隙126。在散热器的制备过程中进行该蚀刻步骤还消除了来自于导电层的任何因机械切割工艺而产生的毛刺,从而提高了生产效率。
图11示出了具有散热器10和树脂板的印刷电路板1001,其中,散热器10没有形成如前述实施例中所描述的导电层111,且树脂板没有形成如前述实施例中所描述的导电层221和222。相反地,树脂板的介电层21与半固化片30直接连接。根据如前所述的方法在介电层的外表面形成导电层611。
图12-14示出了另一实施例的印刷电路板,其将挠性部分和刚性部分相组合。如图13所示,印刷电路板1020包括位于第一和第二半固化片30之间的挠性电路板40。挠性电路板40具有分别与树脂板中的第一通孔和半固化片中的第二通孔相对齐的第三通孔。挠性电路板40与印刷电路板1020的挠性部分43相对应的表面设置有保护膜(未示出)。
如图12所示,树脂板220中形成有凹陷部212(例如,通过机械或激光切割),凹陷部212形成印刷电路板1020的挠性部分的边界。虽然凹陷部通常在树脂板的制备过程中形成,但其也可以在印刷电路板组装之后切割得到。树脂板220还包括用于容纳多个散热器10的多个第一通孔211。组装印刷电路板之 前,在半固化片30中制备对应于所期望的印刷电路板1020的挠性部分43的余隙孔。
半固化片30中与所期望的挠性部分相对应的余隙孔大于最终的挠性部分43,以阻止或减少环氧树脂流动至挠性部分43。相邻于挠性电路板的半固化片可以具有比位于树脂板之间的半固化片更低的可流动性。例如,相邻于挠性电路板的半固化片中环氧树脂的含量可以为大约40-55wt%,更优选为45-50wt%。相对较低的可流动性有助于在减少或避免半固化片流动至挠性区域43表面的条件下使得半固化片填充间隙226。
如图14所示,通过机械或激光切割去除刚性印刷电路板对应于挠性部分43的部分,由此所得到的印刷电路板1020具有第一刚性部分1022、第二刚性部分1024以及将二者所分开的挠性部分43。第一刚性部分1022和第二刚性部分1024通过挠性电路板40相互连接。挠性印刷电路板1020可以具有形成在其上的如前所述的表面电路,且可以具有附接至其上的LED。
图17示出了可以用于热压步骤的装置的另一实施例。该实施例中,在硬质层1的外侧进一步设置弹性材料层3。弹性层3可以是硅胶或其他类似材料。
另一实施例的印刷电路板可以包括单层或多层的挠性印刷电路板以及单层或多层的刚性印刷电路板。在该实施例中,可以使用不同的半固化片。例如,相邻于挠性电路板的半固化片可以具有比位于树脂板之间的半固化片更低的可流动性。
虽然在此参照特定的实施例描述了本实用新型,但应当理解的是,这些实施例仅用于阐述本实用新型的原理和应用。因此,应当理解的是,在不脱离所附权利要求定义的本发明的精神和范围的条件下,可以对所描述的实施例进行各种各样的改变并设计出其他多种布置。
Claims (8)
1.一种印刷电路板,具有上表面和下表面,包括:
散热器;
基板;
位于所述上表面的多个电极焊盘;
位于所述下表面的多个端子;其中,所述多个端子中的每一个均与所述多个电极焊盘中的至少一个电连接;
其特征在于:
热扩散器,位于所述下表面并与所述散热器和所述基板连接。
2.如权利要求1所述的印刷电路板,其特征在于:所述散热器包括陶瓷芯核。
3.如权利要求2所述的印刷电路板,其特征在于:所述多个电极焊盘中的至少一个与所述散热器和所述基板连接。
4.如权利要求3所述的印刷电路板,其特征在于:所述多个电极焊盘中的每一个均与所述散热器和所述基板连接。
5.如权利要求1所述的印刷电路板,其特征在于:所述印刷电路板的上表面还形成有导热焊盘。
6.如权利要求5所述的印刷电路板,其特征在于:所述导热焊盘与所述散热器和所述基板连接。
7.如权利要求1所述的印刷电路板,其特征在于:所述基板包括位于多个树脂板之间的半固化片。
8.一种LED光源模组,包括LED发光元件,其特征在于:所述LED光源模组还包括如权利要求1至7任一项所述的印刷电路板,所述LED发光元件与所述多个电极焊盘电连接。
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JP6506719B2 (ja) | 2019-04-24 |
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CN105744725A (zh) | 2016-07-06 |
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