CN103069936B - 带有绝缘微散热器的印刷电路板 - Google Patents
带有绝缘微散热器的印刷电路板 Download PDFInfo
- Publication number
- CN103069936B CN103069936B CN201180037321.3A CN201180037321A CN103069936B CN 103069936 B CN103069936 B CN 103069936B CN 201180037321 A CN201180037321 A CN 201180037321A CN 103069936 B CN103069936 B CN 103069936B
- Authority
- CN
- China
- Prior art keywords
- printed circuit
- circuit board
- pcb
- heat radiator
- insulation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000009413 insulation Methods 0.000 title claims abstract description 63
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 31
- 229910052802 copper Inorganic materials 0.000 claims abstract description 31
- 239000010949 copper Substances 0.000 claims abstract description 31
- 230000004888 barrier function Effects 0.000 claims abstract description 13
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 9
- 239000000919 ceramic Substances 0.000 claims description 6
- 229910017083 AlN Inorganic materials 0.000 claims description 3
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 claims description 3
- 229910003460 diamond Inorganic materials 0.000 claims description 3
- 239000010432 diamond Substances 0.000 claims description 3
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 3
- 238000012546 transfer Methods 0.000 abstract description 4
- 238000002955 isolation Methods 0.000 abstract description 3
- 239000011810 insulating material Substances 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0187—Dielectric layers with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
- Led Device Packages (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201180037321.3A CN103069936B (zh) | 2010-11-30 | 2011-01-05 | 带有绝缘微散热器的印刷电路板 |
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201010564877.5 | 2010-11-30 | ||
CN201010564877 | 2010-11-30 | ||
CN2010105648775 | 2010-11-30 | ||
PCT/CN2011/070042 WO2012071795A1 (zh) | 2010-11-30 | 2011-01-05 | 带有绝缘微散热器的印刷电路板 |
CN201180037321.3A CN103069936B (zh) | 2010-11-30 | 2011-01-05 | 带有绝缘微散热器的印刷电路板 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103069936A CN103069936A (zh) | 2013-04-24 |
CN103069936B true CN103069936B (zh) | 2016-04-27 |
Family
ID=43960166
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201180037321.3A Active CN103069936B (zh) | 2010-11-30 | 2011-01-05 | 带有绝缘微散热器的印刷电路板 |
CN2011100070180A Pending CN102056418A (zh) | 2010-11-30 | 2011-01-14 | 带有绝缘微散热器的印刷电路板的制备方法 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2011100070180A Pending CN102056418A (zh) | 2010-11-30 | 2011-01-14 | 带有绝缘微散热器的印刷电路板的制备方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20120241810A1 (zh) |
EP (1) | EP2621256A4 (zh) |
CN (2) | CN103069936B (zh) |
WO (1) | WO2012071795A1 (zh) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10433414B2 (en) * | 2010-12-24 | 2019-10-01 | Rayben Technologies (HK) Limited | Manufacturing method of printing circuit board with micro-radiators |
CN102202459A (zh) * | 2011-05-27 | 2011-09-28 | 乐健线路板(珠海)有限公司 | 带有金属微散热器的印刷电路板 |
CN102291938B (zh) * | 2011-05-27 | 2012-11-14 | 乐健线路板(珠海)有限公司 | 带有金属微散热器的印刷电路板的制备方法 |
US20130314920A1 (en) * | 2012-05-25 | 2013-11-28 | Myung Ho Park | Direct Heat Sink Technology for LEDs and Driving Circuits |
CN104105357A (zh) * | 2014-07-31 | 2014-10-15 | 开平依利安达电子第三有限公司 | 一种将铜块压入pcb电路板的方法及其应用 |
CN107926114B (zh) * | 2015-09-03 | 2021-08-06 | 亮锐控股有限公司 | 制作led设备的方法 |
CN205491419U (zh) * | 2015-09-22 | 2016-08-17 | 乐健集团有限公司 | 印刷电路板及led光源模组 |
DE102016122014A1 (de) * | 2016-11-16 | 2018-05-17 | Epcos Ag | Leistungsmodul mit verringerter Defektanfälligkeit und Verwendung desselben |
CN108172675A (zh) * | 2017-10-31 | 2018-06-15 | 马瑞利汽车零部件(芜湖)有限公司 | 汽车车灯pcb板散热结构 |
CN108039341B (zh) * | 2018-01-11 | 2023-11-03 | 安徽电气工程职业技术学院 | 一种双面冷却式三维结构功率模块 |
BE1026115B1 (nl) * | 2018-03-19 | 2019-10-17 | Dk Ceramic Circuits Bvba | Verbinding via pin |
CN109561573A (zh) * | 2018-12-04 | 2019-04-02 | 深圳众力新能源科技有限公司 | 一种散热型pcb电路板结构 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5959256A (en) * | 1995-01-23 | 1999-09-28 | Mitsui Mining & Smelting Co., Ltd. | Multilayer printed wiring board |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4993148A (en) * | 1987-05-19 | 1991-02-19 | Mitsubishi Denki Kabushiki Kaisha | Method of manufacturing a circuit board |
US5268064A (en) * | 1992-02-04 | 1993-12-07 | Trimble Navigation Limited | Copper clad epoxy printed circuit board suitable for microwave frequencies encountered in GPS receivers |
US5285352A (en) * | 1992-07-15 | 1994-02-08 | Motorola, Inc. | Pad array semiconductor device with thermal conductor and process for making the same |
JPH0669613A (ja) * | 1992-08-20 | 1994-03-11 | Ibiden Co Ltd | プリント配線板 |
TW536795B (en) * | 2001-05-30 | 2003-06-11 | Apack Comm Inc | Flip chip package of monolithic microwave integrated circuit |
DE202004006870U1 (de) * | 2004-04-29 | 2005-06-09 | Fuba Printed Circuits Gmbh | Leiterplatte |
JP4962228B2 (ja) * | 2006-12-26 | 2012-06-27 | 株式会社ジェイテクト | 多層回路基板およびモータ駆動回路基板 |
US20080179618A1 (en) * | 2007-01-26 | 2008-07-31 | Ching-Tai Cheng | Ceramic led package |
DE102007037297A1 (de) * | 2007-08-07 | 2009-02-19 | Continental Automotive Gmbh | Schaltungsträgeraufbau mit verbesserter Wärmeableitung |
DE102008016458A1 (de) * | 2008-03-31 | 2009-10-01 | Osram Gesellschaft mit beschränkter Haftung | Leiterplatte |
JP2010073767A (ja) * | 2008-09-17 | 2010-04-02 | Jtekt Corp | 多層回路基板 |
CN101494949A (zh) * | 2009-03-04 | 2009-07-29 | 腾辉电子(苏州)有限公司 | 高频覆铜箔基板,其半固化片及降低覆铜箔基板信号损失的方法 |
TWM366757U (en) * | 2009-04-27 | 2009-10-11 | Forward Electronics Co Ltd | AC LED packaging structure |
TW201041093A (en) * | 2009-05-15 | 2010-11-16 | High Conduction Scient Co Ltd | Section-difference type ceramics base copper-clad laminate set and manufacturing method thereof |
KR101077340B1 (ko) * | 2009-12-15 | 2011-10-26 | 삼성전기주식회사 | 기판 제조용 캐리어 부재 및 이를 이용한 기판의 제조방법 |
TWI469289B (zh) * | 2009-12-31 | 2015-01-11 | 矽品精密工業股份有限公司 | 半導體封裝結構及其製法 |
CN101790290B (zh) * | 2010-01-22 | 2012-05-23 | 东莞生益电子有限公司 | 埋入式高导热pcb板的制作方法 |
CN101841974A (zh) * | 2010-05-12 | 2010-09-22 | 珠海市荣盈电子科技有限公司 | 电镀法制作高导热性电路板的方法及高导热性电路板 |
CN101841975B (zh) * | 2010-05-12 | 2012-07-04 | 珠海市荣盈电子科技有限公司 | 热压法制作高导热性电路板的方法及高导热性电路板 |
-
2011
- 2011-01-05 US US13/514,998 patent/US20120241810A1/en not_active Abandoned
- 2011-01-05 WO PCT/CN2011/070042 patent/WO2012071795A1/zh active Application Filing
- 2011-01-05 EP EP11845874.4A patent/EP2621256A4/en not_active Withdrawn
- 2011-01-05 CN CN201180037321.3A patent/CN103069936B/zh active Active
- 2011-01-14 CN CN2011100070180A patent/CN102056418A/zh active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5959256A (en) * | 1995-01-23 | 1999-09-28 | Mitsui Mining & Smelting Co., Ltd. | Multilayer printed wiring board |
Also Published As
Publication number | Publication date |
---|---|
CN103069936A (zh) | 2013-04-24 |
US20120241810A1 (en) | 2012-09-27 |
WO2012071795A9 (zh) | 2013-02-14 |
WO2012071795A1 (zh) | 2012-06-07 |
CN102056418A (zh) | 2011-05-11 |
EP2621256A1 (en) | 2013-07-31 |
EP2621256A4 (en) | 2017-04-26 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C53 | Correction of patent of invention or patent application | ||
CB02 | Change of applicant information |
Address after: Doumen Xinqing Technology Industrial Park West District Po Road 519180 Guangdong city of Zhuhai province No. 8 Applicant after: RAYBEN TECHNOLOGIES (ZHUHAI) Ltd. Address before: Doumen New Technology Industrial Park, West Po Road 519180 Guangdong city of Zhuhai province No. 8 Applicant before: Rayben Technologies (HK) Ltd. |
|
COR | Change of bibliographic data |
Free format text: CORRECT: APPLICANT; FROM: LEJIAN CIRCUIT BOARD (ZHUHAI) CO., LTD. TO: RAYBEN TECHNOLOGY (ZHUHAI) CO., LTD. |
|
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
EE01 | Entry into force of recordation of patent licensing contract | ||
EE01 | Entry into force of recordation of patent licensing contract |
Application publication date: 20130424 Assignee: Hengqin Financial Investment International Finance Leasing Co.,Ltd. Assignor: RAYBEN TECHNOLOGIES (ZHUHAI) Ltd. Contract record no.: X2022980020419 Denomination of invention: Printed circuit board with insulated micro radiator Granted publication date: 20160427 License type: Exclusive License Record date: 20221108 |
|
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Printed circuit board with insulated micro radiator Effective date of registration: 20221111 Granted publication date: 20160427 Pledgee: Hengqin Financial Investment International Finance Leasing Co.,Ltd. Pledgor: RAYBEN TECHNOLOGIES (ZHUHAI) Ltd. Registration number: Y2022980021699 |
|
EC01 | Cancellation of recordation of patent licensing contract | ||
EC01 | Cancellation of recordation of patent licensing contract |
Assignee: Hengqin Financial Investment International Finance Leasing Co.,Ltd. Assignor: RAYBEN TECHNOLOGIES (ZHUHAI) Ltd. Contract record no.: X2022980020419 Date of cancellation: 20240118 |
|
PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Granted publication date: 20160427 Pledgee: Hengqin Financial Investment International Finance Leasing Co.,Ltd. Pledgor: RAYBEN TECHNOLOGIES (ZHUHAI) Ltd. Registration number: Y2022980021699 |