CN102076165A - 双层高散热夹芯金属基印刷电路板 - Google Patents
双层高散热夹芯金属基印刷电路板 Download PDFInfo
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- CN102076165A CN102076165A CN2011100321051A CN201110032105A CN102076165A CN 102076165 A CN102076165 A CN 102076165A CN 2011100321051 A CN2011100321051 A CN 2011100321051A CN 201110032105 A CN201110032105 A CN 201110032105A CN 102076165 A CN102076165 A CN 102076165A
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- circuit board
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CN2011100321051A CN102076165A (zh) | 2011-01-30 | 2011-01-30 | 双层高散热夹芯金属基印刷电路板 |
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CN2011100321051A CN102076165A (zh) | 2011-01-30 | 2011-01-30 | 双层高散热夹芯金属基印刷电路板 |
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Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103582291A (zh) * | 2012-08-02 | 2014-02-12 | 中兴通讯股份有限公司 | 一种金属基印制电路板及电子设备 |
CN103661171A (zh) * | 2013-12-23 | 2014-03-26 | 重庆集诚汽车电子有限责任公司 | 基于pcb铜箔的大功率走线结构 |
CN104994706A (zh) * | 2015-06-30 | 2015-10-21 | 苏州旭创科技有限公司 | Pcb基板及具有其的光模块 |
US11224118B2 (en) | 2019-12-17 | 2022-01-11 | Saft America | Bussing and printed circuit board integration with power electronics |
CN114867185A (zh) * | 2022-03-14 | 2022-08-05 | 江苏耀鸿电子有限公司 | 一种散热高频ic封装用载板及其制备工艺 |
CN117915555A (zh) * | 2024-02-06 | 2024-04-19 | 珠海精路电子有限公司 | 一种具有立体结构的金属基层压板及其加工工艺 |
Citations (9)
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CN1159133A (zh) * | 1996-01-18 | 1997-09-10 | 三星航空产业株式会社 | 印制线路板的金属基片的制造方法 |
US6518509B1 (en) * | 1999-12-23 | 2003-02-11 | International Business Machines Corporation | Copper plated invar with acid preclean |
CN1553760A (zh) * | 2003-05-26 | 2004-12-08 | 王立华 | 铝或镁或其合金基高散热孔金属化印制线路板及制造方法 |
CN1627489A (zh) * | 2003-12-10 | 2005-06-15 | 玄基光电半导体股份有限公司 | 半导体芯片承载基板及其制造方法 |
CN1764339A (zh) * | 2004-10-22 | 2006-04-26 | 吴裕朝 | 照明装置及用于照明装置的印刷电路板 |
CN1802069A (zh) * | 2005-01-05 | 2006-07-12 | 照敏企业股份有限公司 | 具高导热基板及其制程 |
CN101212862A (zh) * | 2006-12-29 | 2008-07-02 | 高陆股份有限公司 | 高导热导电载板 |
CN201893993U (zh) * | 2010-12-04 | 2011-07-06 | 廖萍涛 | 一种双面金属基线路板 |
CN201957332U (zh) * | 2011-01-30 | 2011-08-31 | 乐健线路板(珠海)有限公司 | 双层高散热夹芯金属基印刷电路板 |
-
2011
- 2011-01-30 CN CN2011100321051A patent/CN102076165A/zh active Pending
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
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CN1159133A (zh) * | 1996-01-18 | 1997-09-10 | 三星航空产业株式会社 | 印制线路板的金属基片的制造方法 |
US6518509B1 (en) * | 1999-12-23 | 2003-02-11 | International Business Machines Corporation | Copper plated invar with acid preclean |
CN1553760A (zh) * | 2003-05-26 | 2004-12-08 | 王立华 | 铝或镁或其合金基高散热孔金属化印制线路板及制造方法 |
CN1627489A (zh) * | 2003-12-10 | 2005-06-15 | 玄基光电半导体股份有限公司 | 半导体芯片承载基板及其制造方法 |
CN1764339A (zh) * | 2004-10-22 | 2006-04-26 | 吴裕朝 | 照明装置及用于照明装置的印刷电路板 |
CN1802069A (zh) * | 2005-01-05 | 2006-07-12 | 照敏企业股份有限公司 | 具高导热基板及其制程 |
CN101212862A (zh) * | 2006-12-29 | 2008-07-02 | 高陆股份有限公司 | 高导热导电载板 |
CN201893993U (zh) * | 2010-12-04 | 2011-07-06 | 廖萍涛 | 一种双面金属基线路板 |
CN201957332U (zh) * | 2011-01-30 | 2011-08-31 | 乐健线路板(珠海)有限公司 | 双层高散热夹芯金属基印刷电路板 |
Non-Patent Citations (1)
Title |
---|
天津大学化工系电化学教研室: "《电镀》", 30 September 1974, article ""第九章 非金属电镀"", pages: 251-268 * |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103582291A (zh) * | 2012-08-02 | 2014-02-12 | 中兴通讯股份有限公司 | 一种金属基印制电路板及电子设备 |
CN103582291B (zh) * | 2012-08-02 | 2017-07-14 | 中兴通讯股份有限公司 | 一种金属基印制电路板及电子设备 |
CN103661171A (zh) * | 2013-12-23 | 2014-03-26 | 重庆集诚汽车电子有限责任公司 | 基于pcb铜箔的大功率走线结构 |
CN103661171B (zh) * | 2013-12-23 | 2016-04-13 | 重庆集诚汽车电子有限责任公司 | 基于pcb铜箔的大功率走线结构 |
CN104994706A (zh) * | 2015-06-30 | 2015-10-21 | 苏州旭创科技有限公司 | Pcb基板及具有其的光模块 |
CN104994706B (zh) * | 2015-06-30 | 2017-11-28 | 苏州旭创科技有限公司 | Pcb基板及具有其的光模块 |
US11224118B2 (en) | 2019-12-17 | 2022-01-11 | Saft America | Bussing and printed circuit board integration with power electronics |
CN114867185A (zh) * | 2022-03-14 | 2022-08-05 | 江苏耀鸿电子有限公司 | 一种散热高频ic封装用载板及其制备工艺 |
CN114867185B (zh) * | 2022-03-14 | 2023-08-01 | 江苏耀鸿电子有限公司 | 一种散热高频ic封装用载板及其制备工艺 |
CN117915555A (zh) * | 2024-02-06 | 2024-04-19 | 珠海精路电子有限公司 | 一种具有立体结构的金属基层压板及其加工工艺 |
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C53 | Correction of patent of invention or patent application | ||
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Address after: Doumen Xinqing Technology Industrial Park West District Po Road 519180 Guangdong city of Zhuhai province No. 8 Applicant after: Lejian Technology (Zhuhai) Co., Ltd. Address before: Doumen Xinqing Technology Industrial Park West District Po Road 519180 Guangdong city of Zhuhai province No. 8 Applicant before: Happy circuit board (Zhuhai) Co., Ltd. |
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Free format text: CORRECT: APPLICANT; FROM: LEJIAN CIRCUIT BOARD (ZHUHAI) CO., LTD. TO: RAYBEN TECHNOLOGY (ZHUHAI) CO., LTD. |
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Application publication date: 20110525 |