ES2135914T3 - Procedimiento para la separacion de films. - Google Patents
Procedimiento para la separacion de films.Info
- Publication number
- ES2135914T3 ES2135914T3 ES96929287T ES96929287T ES2135914T3 ES 2135914 T3 ES2135914 T3 ES 2135914T3 ES 96929287 T ES96929287 T ES 96929287T ES 96929287 T ES96929287 T ES 96929287T ES 2135914 T3 ES2135914 T3 ES 2135914T3
- Authority
- ES
- Spain
- Prior art keywords
- resist
- pct
- printed circuit
- detachment
- stage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
- G03F7/422—Stripping or agents therefor using liquids only
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/041—Cleaning travelling work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
- Y10T156/1111—Using solvent during delaminating [e.g., water dissolving adhesive at bonding face during delamination, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
- Y10T156/1168—Gripping and pulling work apart during delaminating
- Y10T156/1189—Gripping and pulling work apart during delaminating with shearing during delaminating
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Electroplating Methods And Accessories (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Laminated Bodies (AREA)
- Materials For Medical Uses (AREA)
Abstract
SE DESCRIBE UN PROCESO Y UN DISPOSITIVO PARA LA DISOLUCION QUIMICA UNIFORME DE CAPAS DE PINTURA PROTECTORA, EN FORMA DE PARTICULAS FACILMENTE FILTRABLES, DE SUPERFICIES DE MATERIAL GALVANICO CON FORMA DE PLACA. LA APLICACION PRIMORDIAL DEL PROCESO ES EN INSTALACIONES DE PROCESO CONTINUO HORIZONTALES EN LA TECNICA DE CIRCUITOS IMPRESOS. DE ACUERDO CON EL ESTADO DE LA TECNICA SE UTILIZAN PROCESOS DE INYECCION Y NEBULIZACION PARA LA ELIMINACION DE PINTURA PROTECTORA. UNA DESVENTAJA ES, ENTRE OTRAS, LA POCA DURACION DEL BAÑO DEBIDA A LAS PINTURAS PROTECTORAS NO FILTRADAS TOTALMENTE DE LA DISOLUCION. DE ACUERDO CON LA INVENCION SE DISUELVE LA PINTURA PROTECTORA DE LA SUPERFICIE DE LA PLACA DE CIRCUITO IMPRESO CON UN LIQUIDO DE TRATAMIENTO SOLO LIGERAMENTE FLUIDO. EN LA PRIMERA ETAPA DEL PROCESO SE APORTA UNA GRAN CANTIDAD DE LIQUIDO DE TRATAMIENTO SOBRE LA SUPERFICIE DE LA PLACA DE CIRCUITO IMPRESO PARA SU REMOJO, MEDIANTE TOBERAS LONGITUDINALES. EN LA SEGUNDA ETAPA SE UTILIZAN TOBERAS QUE PRESENTAN PREFERIBLEMENTE ZONAS DE PRESION Y DE ASPIRACION, PARA LA DISOLUCION DE LA PELICULA. EL TRATAMIENTO POSTERIOR SE REALIZA POR BAÑO CON AYUDA DE CORRIENTES INTENSAS. CON UN LAVADO MULTIETAPA EN CASCADA, EL PROCESO TRABAJA SIN AGUAS RESIDUALES Y CON UNA LARGA DURACION DEL DISOLVENTE. LA PINTURA PROTECTORA DISUELTA DE LA SUPERFICIE SE ALIMENTA RAPIDAMENTE, A TRAVES DE UN RECORRIDO CORTO, A UN FILTRO DE SOLIDOS Y SE SEPARA DEL DISOLVENTE ANTES DE SU DISOLUCION. LA PELICULA SE FILTRA CASI TOTALMENTE Y PRACTICAMENTE SECA.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19530989A DE19530989C1 (de) | 1995-08-23 | 1995-08-23 | Verfahren zum Filmstrippen |
Publications (1)
Publication Number | Publication Date |
---|---|
ES2135914T3 true ES2135914T3 (es) | 1999-11-01 |
Family
ID=7770176
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES96929287T Expired - Lifetime ES2135914T3 (es) | 1995-08-23 | 1996-08-21 | Procedimiento para la separacion de films. |
Country Status (8)
Country | Link |
---|---|
US (1) | US6059919A (es) |
EP (1) | EP0830642B1 (es) |
JP (1) | JP4035165B2 (es) |
AT (1) | ATE182694T1 (es) |
CA (1) | CA2226520A1 (es) |
DE (2) | DE19530989C1 (es) |
ES (1) | ES2135914T3 (es) |
WO (1) | WO1997008589A1 (es) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1133506A (ja) * | 1997-07-24 | 1999-02-09 | Tadahiro Omi | 流体処理装置及び洗浄処理システム |
TW464970B (en) * | 1999-04-21 | 2001-11-21 | Sharp Kk | Ultrasonic cleaning device and resist-stripping device |
JP2002075947A (ja) | 2000-08-30 | 2002-03-15 | Alps Electric Co Ltd | ウェット処理装置 |
JP2006088033A (ja) * | 2004-09-24 | 2006-04-06 | Future Vision:Kk | ウェット処理装置 |
KR101226514B1 (ko) | 2006-06-22 | 2013-01-25 | 엘지디스플레이 주식회사 | 박막트랜지스터 제조방법 |
GB0718840D0 (en) * | 2007-09-26 | 2007-11-07 | Eastman Kodak Co | Method of patterning vapour deposition by printing |
GB0718839D0 (en) * | 2007-09-26 | 2007-11-07 | Eastman Kodak Co | method of patterning a mesoporous nano particulate layer |
CN102350860B (zh) * | 2011-07-06 | 2014-04-09 | 奥士康精密电路(惠州)有限公司 | 一种pcb板制备过程中改善油墨入孔的方法 |
KR101414402B1 (ko) * | 2012-06-05 | 2014-07-01 | 노바테크 (주) | 필름 박리 방법 및 필름 박리 시스템 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3450262A (en) * | 1966-12-20 | 1969-06-17 | Gene Hirs | Method of filtering |
ES428207A1 (es) * | 1973-07-12 | 1976-07-16 | Burke | Procedimiento y aparato para el tratamiento de fluidos. |
US3958587A (en) * | 1974-12-19 | 1976-05-25 | Buckbee-Mears Company | Manifold for fluid distribution and removal |
DE3002732A1 (de) * | 1980-01-25 | 1981-08-13 | Siemens AG, 1000 Berlin und 8000 München | Horizontal-durchlauf-tauchbad |
DE3011061C2 (de) * | 1980-03-21 | 1983-12-22 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zur Intensivierung von Spül- und Reinigungsprozessen für Perforationen in Formstücken in Spül- und Reinigungsautomaten |
DE3201880A1 (de) * | 1982-01-22 | 1983-08-04 | Egbert 6106 Erzhausen Kühnert | Verfahren zum rueckstandsfreien entschichten von leiterplatten und vorrichtung zur durchfuehrung des verfahrens |
US4784169A (en) * | 1984-01-13 | 1988-11-15 | Chemcut Corporation | Apparatus for treating articles with solution to remove solids and then filtering the solution |
DE8401675U1 (de) * | 1984-01-21 | 1985-10-10 | Theimer, Siegfried, 6484 Birstein | Durchlaufentwicklungsgerät |
DE3528575A1 (de) * | 1985-08-06 | 1987-02-19 | Schering Ag | Verfahren und einrichtung zur reinigung, aktivierung und/oder metallisierung von bohrloechern in horizontal gefuehrten leiterplatten |
KR950014323B1 (ko) * | 1986-07-23 | 1995-11-24 | 스미도모쥬기가이고오교오 가부시기가이샤 | 포토레지스트 폐액의 처리방법 |
US4810390A (en) * | 1986-10-10 | 1989-03-07 | Ciba-Geigy Corporation | Separation and purification of pigment suspensions and suspensions of pigment intermediates by a membrane separation process |
US4938257A (en) * | 1986-11-21 | 1990-07-03 | Teledyne Industries, Inc. | Printed circuit cleaning apparatus |
DE8703114U1 (de) * | 1987-02-25 | 1987-04-09 | Schering AG, 1000 Berlin und 4709 Bergkamen | Einrichtung zur Reinigung oder chemischen Behandlung von Werkstücken |
DE3916694A1 (de) * | 1989-05-23 | 1990-11-29 | Schering Ag | Anordnung zur chemischen behandlung und/oder reinigung von gut, insbesondere von mit bohrungen versehenen leiterplatten, sowie dazugehoeriges verfahren |
US5063951A (en) * | 1990-07-19 | 1991-11-12 | International Business Machines Corporation | Fluid treatment device |
DE4141403A1 (de) * | 1991-12-16 | 1993-06-17 | Hoechst Ag | Verfahren zum entschichten von lichtvernetzten photoresistschablonen |
US5294259A (en) * | 1992-05-18 | 1994-03-15 | International Business Machines Corporation | Fluid treatment device |
JP3320549B2 (ja) * | 1994-04-26 | 2002-09-03 | 岩手東芝エレクトロニクス株式会社 | 被膜除去方法および被膜除去剤 |
DE4432402C2 (de) * | 1994-08-30 | 1998-07-02 | Ersa Loettechnik Gmbh | Schwall-Lötdüse zum flußmittelfreien Löten |
JPH09103732A (ja) * | 1995-09-06 | 1997-04-22 | Internatl Business Mach Corp <Ibm> | 流体供給装置 |
-
1995
- 1995-08-23 DE DE19530989A patent/DE19530989C1/de not_active Expired - Fee Related
-
1996
- 1996-08-21 DE DE59602561T patent/DE59602561D1/de not_active Expired - Lifetime
- 1996-08-21 AT AT96929287T patent/ATE182694T1/de active
- 1996-08-21 CA CA002226520A patent/CA2226520A1/en not_active Abandoned
- 1996-08-21 JP JP50980697A patent/JP4035165B2/ja not_active Expired - Lifetime
- 1996-08-21 ES ES96929287T patent/ES2135914T3/es not_active Expired - Lifetime
- 1996-08-21 WO PCT/EP1996/003662 patent/WO1997008589A1/de active IP Right Grant
- 1996-08-21 US US09/011,253 patent/US6059919A/en not_active Expired - Lifetime
- 1996-08-21 EP EP96929287A patent/EP0830642B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
WO1997008589A1 (de) | 1997-03-06 |
EP0830642B1 (de) | 1999-07-28 |
JP2000500242A (ja) | 2000-01-11 |
CA2226520A1 (en) | 1997-03-06 |
JP4035165B2 (ja) | 2008-01-16 |
DE19530989C1 (de) | 1997-03-13 |
ATE182694T1 (de) | 1999-08-15 |
EP0830642A1 (de) | 1998-03-25 |
DE59602561D1 (de) | 1999-09-02 |
US6059919A (en) | 2000-05-09 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
ES2135914T3 (es) | Procedimiento para la separacion de films. | |
KR20100037037A (ko) | 나노 여과에 의한 레지스트 박리액 연속 사용 시스템 | |
KR100386438B1 (ko) | 포토레지스트 현상액 및 제막액의 회수장치 및 회수방법 | |
WO1998017483B1 (en) | Apparatus and method for recovering photoresist developers and strippers | |
JP2002515318A (ja) | フォトレジスト現像液及び膜剥し液を回収するための装置及び方法 | |
US6841074B2 (en) | Method and apparatus of purifying an electrolyte | |
JPS5865433A (ja) | アルカリ型感光性フイルムの現像又ははく離方法および現像又ははく離装置 | |
JP2873095B2 (ja) | カチオン電着塗装における最終水洗槽廃液の処理方法 | |
KR20140001903U (ko) | 레지스트층의 박막화 장치 | |
US6077359A (en) | Procedure and device for the chemical and electrolytic treatment of printed circuit boards and conductor films | |
WO2006137194A1 (ja) | 基体表面上の有機被膜の除去方法および除去装置 | |
JP2005005587A (ja) | レジスト剥離装置 | |
JP2004298680A (ja) | フォトレジスト現像の廃液処理方法 | |
JP2005158911A (ja) | 搬送式基板処理装置 | |
JP4409901B2 (ja) | 残液除去装置 | |
KR20180003402U (ko) | 레지스트층의 박막화 장치 | |
JP3160609B2 (ja) | 膜装置及び膜処理装置 | |
JPH0496291A (ja) | プリント配線板の洗浄方法及びその装置 | |
JP2003283111A (ja) | プリント配線板の洗浄方法 | |
JP2008013270A (ja) | 軟性基板材の表面処理装置 | |
JPH06154717A (ja) | 洗浄装置 | |
CN115087234A (zh) | 一种pcb的制作方法、pcb水洗设备及水循环系统 | |
JP2005004101A (ja) | 平版印刷版の現像装置 | |
JPS6260897A (ja) | カチオン電着における透過膜の洗浄方法 | |
JPH07241501A (ja) | 印刷配線板用自吸式液切り装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
FG2A | Definitive protection |
Ref document number: 830642 Country of ref document: ES |