JP2005158911A - 搬送式基板処理装置 - Google Patents
搬送式基板処理装置 Download PDFInfo
- Publication number
- JP2005158911A JP2005158911A JP2003393368A JP2003393368A JP2005158911A JP 2005158911 A JP2005158911 A JP 2005158911A JP 2003393368 A JP2003393368 A JP 2003393368A JP 2003393368 A JP2003393368 A JP 2003393368A JP 2005158911 A JP2005158911 A JP 2005158911A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- cleaning
- liquid
- zone
- water
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
- B08B3/022—Cleaning travelling work
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
- G03F7/3042—Imagewise removal using liquid means from printing plates transported horizontally through the processing stations
- G03F7/3057—Imagewise removal using liquid means from printing plates transported horizontally through the processing stations characterised by the processing units other than the developing unit, e.g. washing units
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
Landscapes
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Nozzles (AREA)
- Coating Apparatus (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Cleaning In General (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
【解決手段】 搬送される基板10の表面に薬液を供給する薬液処理ゾーン20の下流側に、基板10の表面を粗洗浄する粗洗浄ゾーン30と、その表面を精密洗浄する精密洗浄ソーン40とを設ける。薬液処理ゾーン20の出口部に、基板10上に残存する薬液をエアナイフにより除去する液切り手段22を配置する。粗洗浄ゾーン30は、基板10の表面に洗浄水をカーテン状に供給する液膜式洗浄手段31と、液膜式洗浄手段31の下流側に配置され、洗浄水を薄膜状に噴出して基板上に残る洗浄液を置換する液ナイフによる液切り手段32とを組み合わせて構成されている。精密洗浄ソーン40では、基板10の表面にシャワーユニット41により洗浄水を大量散布し、その出口部では、基板10上に残存する洗浄水を液ナイフ式の液切り手段42により除去する。
【選択図】 図1
Description
20 剥離ゾーン
21 シャワーユニット
22 エアナイフによる液切り手段
30 粗洗浄ゾーン
31 液膜式洗浄手段
32 液ナイフによる液切り手段
40 精密洗浄ゾーン(シャワー式水洗ゾーン)
41 シャワーユニット
42 液ナイフによる液切り手段
50 搬送ローラ
Claims (3)
- 搬送される基板の表面に薬液を供給する薬液処理ゾーンと、薬液処理ゾーンから搬送されてくる基板の表面に洗浄水を散布して洗浄するシャワー式水洗ゾーンとを備えた搬送式基板処理装置において、前記薬液処理ゾーンと前記シャワー式水洗ゾーンとの間に、前記基板の表面に洗浄水をカーテン状に供給する液膜式洗浄手段と、前記液膜式洗浄手段の下流側に配置され、洗浄水を薄膜状に噴出して基板上に残る洗浄液を置換する液ナイフによる液切り手段とを組み合わせた粗洗浄ゾーンを設けたことを特徴とする搬送式基板処理装置。
- 前記薬液処理ゾーンの出口部に、基板上に残存する薬液をエアナイフにより除去する液切り手段を配置したことを特徴とする請求項1に記載の搬送式基板処理装置。
- 前記シャワー式洗浄ゾーンの出口部に、洗浄水を薄膜状に噴出して基板上に残る洗浄液を置換する液ナイフによる液切り手段を配置したことを特徴とする請求項1に記載の搬送式基板処理装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003393368A JP4365192B2 (ja) | 2003-11-25 | 2003-11-25 | 搬送式基板処理装置 |
PCT/JP2004/017350 WO2005053006A1 (ja) | 2003-11-25 | 2004-11-22 | 搬送式基板処理装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003393368A JP4365192B2 (ja) | 2003-11-25 | 2003-11-25 | 搬送式基板処理装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005158911A true JP2005158911A (ja) | 2005-06-16 |
JP4365192B2 JP4365192B2 (ja) | 2009-11-18 |
Family
ID=34631426
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003393368A Expired - Fee Related JP4365192B2 (ja) | 2003-11-25 | 2003-11-25 | 搬送式基板処理装置 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP4365192B2 (ja) |
WO (1) | WO2005053006A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103941562A (zh) * | 2014-05-09 | 2014-07-23 | 深圳市华星光电技术有限公司 | 显影机 |
CN106597817A (zh) * | 2017-01-05 | 2017-04-26 | 武汉华星光电技术有限公司 | 一种新型的显影单元 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104550157B (zh) * | 2014-12-24 | 2016-08-17 | 深圳市华星光电技术有限公司 | 清洗装置 |
CN105665397A (zh) * | 2016-03-17 | 2016-06-15 | 东旭科技集团有限公司 | 液晶玻璃基板清洗设备和方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09213669A (ja) * | 1996-02-05 | 1997-08-15 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
JPH1116871A (ja) * | 1997-06-20 | 1999-01-22 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
JPH1144877A (ja) * | 1997-07-24 | 1999-02-16 | Nec Kagoshima Ltd | 基板洗浄装置 |
JP2001108977A (ja) * | 1999-10-13 | 2001-04-20 | Matsushita Electric Ind Co Ltd | 液晶表示装置の製造装置およびその方法 |
JPWO2003071594A1 (ja) * | 2002-02-25 | 2005-06-16 | 住友精密工業株式会社 | 搬送式基板処理装置 |
-
2003
- 2003-11-25 JP JP2003393368A patent/JP4365192B2/ja not_active Expired - Fee Related
-
2004
- 2004-11-22 WO PCT/JP2004/017350 patent/WO2005053006A1/ja active Application Filing
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103941562A (zh) * | 2014-05-09 | 2014-07-23 | 深圳市华星光电技术有限公司 | 显影机 |
CN106597817A (zh) * | 2017-01-05 | 2017-04-26 | 武汉华星光电技术有限公司 | 一种新型的显影单元 |
Also Published As
Publication number | Publication date |
---|---|
JP4365192B2 (ja) | 2009-11-18 |
WO2005053006A1 (ja) | 2005-06-09 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4776380B2 (ja) | 処理装置及び処理方法 | |
WO2010087435A1 (ja) | 基板処理装置 | |
JP2011200819A (ja) | 搬送式基板処理装置における節水型洗浄システム | |
JP4675113B2 (ja) | 基板洗浄装置 | |
CN101219427A (zh) | 基板处理装置 | |
TW201536437A (zh) | 基板處理裝置、噴嘴以及基板處理方法 | |
JP2011071385A (ja) | 基板処理装置および基板処理方法 | |
JP4365192B2 (ja) | 搬送式基板処理装置 | |
JP2007117953A (ja) | 搬送処理装置 | |
JP2006255590A (ja) | 基板処理装置 | |
TW201802877A (zh) | 基板處理裝置 | |
JP2007103565A (ja) | 剥離液回収再利用システムおよび剥離液回収再利用方法 | |
JP4346967B2 (ja) | レジスト剥離装置 | |
WO2002073672A1 (fr) | Dispositif de traitement de substrat | |
JP4409901B2 (ja) | 残液除去装置 | |
JP3982812B2 (ja) | エアーナイフの洗浄方法、エアーナイフ及びウェットエッチング装置 | |
JP2000279900A (ja) | 化学処理装置 | |
TWI343842B (ja) | ||
JP2005064312A (ja) | 基板処理方法および基板処理装置 | |
JP2004016997A (ja) | 基板の処理装置及び処理方法 | |
JP2007073649A (ja) | レジスト剥離洗浄装置、レジスト剥離洗浄方法および基板製造方法 | |
JP2005144325A (ja) | 液切り装置 | |
JP2009279477A (ja) | 処理液除去装置、基板処理装置およびノズル間隔設定方法 | |
KR20030083129A (ko) | 플라즈마를 이용한 tft-lcd 세정방법 및 이를이용한 tft-lcd제조장비 | |
JP2002141269A (ja) | 基板処理装置および基板処理方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20060314 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20080930 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20081125 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20090428 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20090625 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20090728 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20090820 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120828 Year of fee payment: 3 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 4365192 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120828 Year of fee payment: 3 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120828 Year of fee payment: 3 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120828 Year of fee payment: 3 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130828 Year of fee payment: 4 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130828 Year of fee payment: 4 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
LAPS | Cancellation because of no payment of annual fees |