JP2005144325A - 液切り装置 - Google Patents
液切り装置 Download PDFInfo
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- JP2005144325A JP2005144325A JP2003385130A JP2003385130A JP2005144325A JP 2005144325 A JP2005144325 A JP 2005144325A JP 2003385130 A JP2003385130 A JP 2003385130A JP 2003385130 A JP2003385130 A JP 2003385130A JP 2005144325 A JP2005144325 A JP 2005144325A
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- substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02052—Wet cleaning only
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning In General (AREA)
- Weting (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
【解決手段】 基板10の全幅にわたってエアナイフによる液除去を行う直線状ノズル30,40を、基板10の搬送方向に2段に並べて配置する。直線状ノズル30,40を基板10の搬送方向に対して側方へ5〜30度の角度θ1で傾斜させる。直線状ノズル30,40の間隔Dを50〜300mmに設定する。直線状ノズル40からのエア吐出量を、直線状ノズル30からのエア吐出量と同一かこれより少なくする。エアナイフの垂直線に対する傾斜角度を、直線状ノズル30においては25〜30度、直線状ノズル40においては20〜25度とする。
【選択図】 図1
Description
20 基板搬送機構
30,40,50 スリットノズル
31,41,51 エアナイフ
Claims (5)
- 搬送される基板の表面に処理液を供給して各種の湿式処理を行う搬送式基板処理設備に使用されて、その基板の表面に残る処理液を除去する液切り装置において、基板の全幅にわたってエアナイフによる液除去を行う直線状ノズルを、基板の搬送方向に2段に並べて並列的に配置すると共に、それらの直線状ノズルを基板の搬送方向に対して同じ方向へ5〜30度の角度で傾斜させたことを特徴とする液切り装置。
- 2つの直線状ノズルは、各々のエアナイフが基板の搬送方向に対してカウンター方向に30〜60度の角度で傾斜して基板表面に衝突するように、垂直線に対して傾斜配置されている請求項1に記載の液切り装置。
- 2つの直線状ノズルの間隔が50〜300mmである請求項1に記載の液切り装置。
- 上流側の直線状ノズルが吐出するエア量が、下流側の直線状ノズルが吐出するエア量より多い請求項1に記載の液切り装置。
- 前記直線状ノズルはスリットノズルである請求項1に記載の液切り装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003385130A JP4057993B2 (ja) | 2003-11-14 | 2003-11-14 | 液切り装置 |
PCT/JP2004/016667 WO2005048336A1 (ja) | 2003-11-14 | 2004-11-10 | 液切り装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003385130A JP4057993B2 (ja) | 2003-11-14 | 2003-11-14 | 液切り装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005144325A true JP2005144325A (ja) | 2005-06-09 |
JP4057993B2 JP4057993B2 (ja) | 2008-03-05 |
Family
ID=34587349
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003385130A Expired - Fee Related JP4057993B2 (ja) | 2003-11-14 | 2003-11-14 | 液切り装置 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP4057993B2 (ja) |
WO (1) | WO2005048336A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100889343B1 (ko) * | 2007-09-27 | 2009-03-18 | 세메스 주식회사 | 나이프 어셈블리 및 이를 갖는 기판 처리 장치 |
KR20170093850A (ko) * | 2014-12-05 | 2017-08-16 | 레나 테크놀로지스 게엠베하 | 기판 처리 장치 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1803321B (zh) * | 2006-01-17 | 2010-05-12 | 友达光电股份有限公司 | 液刀机构 |
KR20200022501A (ko) * | 2017-07-14 | 2020-03-03 | 레나 테크놀로지스 게엠베하 | 건조 장치 및 기판 건조 방법 |
TWI799520B (zh) * | 2018-02-27 | 2023-04-21 | 美商康寧公司 | 用於乾化材料片的設備及方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11204489A (ja) * | 1998-01-12 | 1999-07-30 | Dainippon Screen Mfg Co Ltd | 基板乾燥装置及び基板乾燥方法 |
JP2000266465A (ja) * | 1999-03-17 | 2000-09-29 | Dainippon Screen Mfg Co Ltd | 基板乾燥装置および基板乾燥方法 |
JP2002231684A (ja) * | 2001-01-30 | 2002-08-16 | Takemoto Denki Seisakusho:Kk | 乾燥装置 |
TWI283441B (en) * | 2001-03-14 | 2007-07-01 | Sumitomo Precision Prod Co | Substrate treating device |
JP3754905B2 (ja) * | 2001-09-10 | 2006-03-15 | 東京エレクトロン株式会社 | 基板乾燥装置 |
-
2003
- 2003-11-14 JP JP2003385130A patent/JP4057993B2/ja not_active Expired - Fee Related
-
2004
- 2004-11-10 WO PCT/JP2004/016667 patent/WO2005048336A1/ja active Application Filing
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100889343B1 (ko) * | 2007-09-27 | 2009-03-18 | 세메스 주식회사 | 나이프 어셈블리 및 이를 갖는 기판 처리 장치 |
KR20170093850A (ko) * | 2014-12-05 | 2017-08-16 | 레나 테크놀로지스 게엠베하 | 기판 처리 장치 |
JP2017537858A (ja) * | 2014-12-05 | 2017-12-21 | レナ テクノロジー ゲーエムベーハーRENA Technologies GmbH | サブストレートを処理するための装置 |
KR102433121B1 (ko) | 2014-12-05 | 2022-08-16 | 레나 테크놀로지스 게엠베하 | 기판 처리 장치 |
Also Published As
Publication number | Publication date |
---|---|
WO2005048336A1 (ja) | 2005-05-26 |
JP4057993B2 (ja) | 2008-03-05 |
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