WO2010087435A1 - 基板処理装置 - Google Patents
基板処理装置 Download PDFInfo
- Publication number
- WO2010087435A1 WO2010087435A1 PCT/JP2010/051228 JP2010051228W WO2010087435A1 WO 2010087435 A1 WO2010087435 A1 WO 2010087435A1 JP 2010051228 W JP2010051228 W JP 2010051228W WO 2010087435 A1 WO2010087435 A1 WO 2010087435A1
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- WO
- WIPO (PCT)
- Prior art keywords
- cleaning chamber
- substrate
- chamber
- cleaning
- processing apparatus
- Prior art date
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
- B08B3/022—Cleaning travelling work
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
Definitions
- the present invention relates to a substrate processing apparatus for supplying a chemical solution or a cleaning solution to a substrate such as a glass substrate used for a liquid crystal display panel while conveying the substrate.
- liquid crystal display panels have been widely used as display units for home appliances such as computers and televisions.
- a liquid crystal display panel has a configuration in which a pair of glass substrates composed of a thin film transistor (TFT) substrate and a color filter (CF) substrate are arranged in parallel to face each other at a predetermined interval, and liquid crystal is filled between the substrates. I am doing.
- TFT thin film transistor
- CF color filter
- the glass substrate surface is sequentially subjected to a plurality of processing steps such as a film forming process on a glass substrate surface, a resist film forming process, an exposure process, a resist developing process, an etching process, and a resist stripping process.
- a TFT or the like is formed on the substrate.
- a method is employed in which a metal film is formed on the surface of the glass substrate by a film forming process and then this metal film is etched into a predetermined pattern.
- a resist which is a photosensitive resin is used as a mask in the etching process, and the resist is removed by a peeling process after the etching process.
- a stripping treatment apparatus that supplies a stripping solution to the front and back surfaces of the glass substrate by a shower method is employed.
- a general resist stripping apparatus has a configuration in which a plurality of stripping chambers are arranged side by side, and a glass substrate is sequentially transported from the neutral chamber to the stripping chambers one by one, and the resist stripping process using a stripping solution is performed. After the resist stripping process is performed, the wafer is transported to the cleaning chamber and washed with pure water. In this case, the glass substrate is transported through each peeling chamber from a neutral chamber disposed on the most upstream side of the resist stripping apparatus toward a cleaning chamber disposed on the most downstream side.
- FIG. 7 shows a schematic configuration of the peeling chamber 90 and the cleaning chamber 100 provided in the resist peeling apparatus 201 as viewed from the front
- FIG. 8 shows a cross-sectional view taken along line BB of FIG.
- the resist stripping apparatus 201 is tilted at an angle of, for example, 15 degrees from the upright state in which the glass substrate 2 is erected vertically to the back surface 2b side, that is, at an angle of 75 degrees with respect to the horizontal direction. It is an apparatus that removes resist while being conveyed in a standing state.
- the separation chamber 90 and the cleaning chamber 100 are partitioned by a partition wall 101, and the partition wall 101 is provided with a substrate insertion port 101 a that opens in a slit shape.
- the peeling chamber 90 is provided with a peeling liquid discharge bar 7 for supplying a peeling liquid to the front surface 2 a and the back surface 2 b of the glass substrate 2.
- Air jet bars 12 are provided in the vicinity of the upstream and downstream sides of the substrate insertion port 101a, and high pressure air is jetted from the air jet bar 12 to adhere to the front surface 2a and the back surface 2b of the glass substrate 2. By removing the stripping solution, the stripping solution is prevented from being brought into the adjacent cleaning chamber 100.
- the cleaning chamber 100 is divided into two chambers, a rough cleaning chamber 103 on the upstream side and a precision cleaning chamber 104 on the downstream side, by a partition plate 106 erected on the bottom wall 105.
- 103 and 104 include two front-side pure water discharge bars 18 for supplying pure water 5 to the front surface 2a of the glass substrate 2, and one back-side pure water discharge for supplying pure water 5 to the back surface 2b of the glass substrate 2.
- a bar 19 is arranged.
- Each of the pure water discharge bars 18 and 19 is provided with a plurality of nozzles 18a and 19a for discharging the pure water 5 in a shower shape.
- the glass substrate 2 is transferred to the cleaning chambers 103 and 104 while supporting the back surface 2 b of the glass substrate 2 and the lower end of the glass substrate 2.
- a plurality of transport rollers 10 are provided along the transport direction.
- the support roller 9 is disposed on the back surface 2b side which is the lower side of the inclination direction of the glass substrate 2, and its axis is parallel to the glass substrate 2 to be conveyed, that is, inclined at an angle of 75 degrees.
- the support roller 9 is rotatably supported by a roller shaft 9a by a ball bearing 9b, and the roller shaft 9a has an upper end and a lower end on the upper wall 107 and the lower wall 108 of the cleaning chamber 100. It is fixed.
- a plurality of roller shafts 9a are provided at predetermined intervals along the transport direction.
- roller shaft 9a is supported by the front end of the roller shaft support plate 110 standing on the rear wall 109 of the cleaning chamber 100 to prevent eccentricity. It is designed not to slip.
- the roller shaft support plate 110 has a plurality of openings 110 a through which pure water 5 that flows down the rear wall 109 of the cleaning chamber 100 passes.
- the pure water 5 that has flowed down the rear wall 109 and the front wall 111 of the cleaning chamber 100 is discharged from the drain ports 21 and 22 formed in the bottom wall 105 of each cleaning chamber 103.
- the conveyance roller 10 that supports the lower end of the glass substrate 2 is fixed to one end of the drive shaft 10a.
- a gear 10 b is attached to the other end of the drive shaft 10 a, and a gear 11 b that meshes with the gear 10 b is attached to the rotating shaft 11 a of the motor 11.
- the glass substrate 2 can be transported by a frictional force generated between the transport roller 10 and the lower end of the glass substrate 2.
- Air is blown to the front surface 2a and back surface 2b of the glass substrate 2 conveyed from the peeling chamber 90 to the cleaning chamber 100 by the air blowing bar 12 arranged on the upstream side of the partition wall 101, and the attached peeling liquid is removed. It has been broken.
- the removal of the stripping solution by the air ejection bar 12 prevents the glass substrate 2 from being greatly bent and brought into contact with the substrate insertion port 101a of the partition wall 101, so that the pressure of the ejected air cannot be increased. A considerable amount of the stripping solution remains on the front surface 2 a and the back surface 2 b of 2 and is brought into the cleaning chamber 100 together with the glass substrate 2.
- the upstream rough cleaning chamber 103 Due to the stripping solution brought into the cleaning chamber 100, the upstream rough cleaning chamber 103 generates a mixed solution (concentrated drainage) H of the stripping solution and the pure water 5 having a high mixing ratio of the stripping solution, and the downstream side In the precision cleaning chamber 104, since the stripping solution is appropriately removed in the rough cleaning chamber 13, a mixed solution (diluted waste liquid) L of the stripping solution and the pure water 5 with a low mixing rate of the stripping solution is generated. .
- the concentrated drainage H collected from the drainage port 21 of the rough cleaning chamber 103 is discarded. Specifically, the concentrated effluent H is boiled by a boiler, turned into powdery waste, and then discarded.
- the diluted drainage L collected from the drainage port 22 of the precision cleaning chamber 104 can remove the stripping solution component relatively easily by bacteria or the like, pure water used in the cleaning chamber 100 is used. It is used again as 5.
- the diluted effluent L is once collected in the collection tank 25, purified by bacteria, etc., and sent again to the pure water discharge bars 18 and 19 through the pump 26 and the filter 27.
- the following patent document is mentioned as a prior art document relevant to this invention.
- the discharged pure water 5 is discharged from the glass substrate 2.
- the concentrated drainage H mixed with the stripping solution remaining on the front surface 2a and the back surface 2b is discharged from the drainage port 21 of the bottom wall 105 of the rough cleaning chamber 103.
- the upstream end 2c of the glass substrate 2 passes through the pure water discharge bars 18 and 19 and the downstream end 2d of the next glass substrate 2 is conveyed to the positions of the pure water discharge bars 18 and 19,
- the discharged pure water 5 hits the rear wall 109 and the front wall 111 without passing through the glass substrate 2 and flows down.
- the pure water 5 that flows down the rear wall 109 and the front wall 111 without passing through the glass substrate 2 is discharged from the drain port 21 of the bottom wall 105 with almost no stripping liquid contained therein.
- the discharged concentrated effluent H is diluted, and as a result, the amount of liquid to be boiled by a boiler for disposal increases, resulting in an increase in cost.
- the problem to be solved by the present invention is to reduce the concentrated drainage discharged from the cleaning chamber in the substrate processing apparatus provided with a cleaning chamber for supplying a cleaning solution such as pure water to the chemical-treated substrate, It is an object of the present invention to provide a substrate processing apparatus capable of improving the utilization efficiency of diluted waste liquid collected from a cleaning chamber.
- a substrate processing apparatus includes a substrate transport unit that transports a substrate by tilting the substrate from an upright state to a back surface side by a predetermined angle, and discharges a cleaning liquid onto the substrate surface transported by the substrate transport unit.
- the substrate processing apparatus comprising a cleaning chamber for supplying a cleaning liquid by means, the cleaning chamber is divided into an upstream rough cleaning chamber and a downstream precision cleaning chamber by a partition plate standing on the bottom wall, The bottom wall of each of the rough cleaning chamber and the fine cleaning chamber is provided with a drain port, and the rough cleaning chamber receives the cleaning liquid discharged from the cleaning liquid discharging means and not passing through the substrate surface.
- a recovery tub is provided so as to incline downward toward the precision cleaning chamber, and a discharge port of the recovery tub for discharging the cleaning liquid flowing in the recovery tub faces the precision cleaning chamber beyond the partition plate. Is provided as It is intended to be subject matter of.
- the upstream rough cleaning chamber flows down from the cleaning liquid discharging means without passing through the substrate surface, that is, without hitting the surface of the substrate to which, for example, a chemical solution is attached.
- a recovery tank for receiving the cleaning liquid is provided so as to incline downward toward the downstream side of the precision cleaning chamber, and a recovery port for discharging the cleaning liquid flowing in the recovery tank has a rough cleaning chamber and a precision cleaning chamber.
- the upstream end of the substrate to be transported passes through the cleaning liquid discharge means of the rough cleaning chamber so that it can be separated from the partition plate erected on the bottom wall to face the precision cleaning chamber. Until the downstream end of the next substrate is transported to the position of the cleaning liquid discharge means, the cleaning liquid discharged and discharged from the cleaning liquid discharge means is received by the recovery tank and guided into the precision cleaning chamber and discharged. To be done That.
- the concentrated drainage liquid recovered from the drainage port provided in the bottom wall of the rough cleaning chamber is not diluted by the cleaning liquid that flows down without passing through the substrate surface, so that the amount of liquid that needs to be disposed of can be reduced. it can.
- the cleaning liquid received by the recovery tank is discharged to the precision cleaning chamber, the reusable diluted drainage recovered from the drainage port provided on the bottom wall of the precision cleaning chamber can be increased. In addition, it is possible to improve the utilization efficiency of the diluted drainage recovered from the cleaning chamber.
- the substrate transport means includes a plurality of support rollers that support the back surface of the substrate and a plurality of transport rollers that transport while supporting the lower end of the substrate, and the support rollers are rotatable about a roller shaft.
- an intermediate portion of the roller shaft is supported in contact with a front end edge of a roller shaft support plate erected on the rear wall of the rough cleaning chamber, and the roller shaft support plate
- An opening through which cleaning water that flows down the rear wall of the rough cleaning chamber is formed, and the recovery tub is disposed below the opening, so that the rough cleaning chamber can be disposed without passing through the substrate surface.
- the washing water flowing down the rear wall is received by the recovery rod without being blocked by the roller shaft support plate provided for preventing the eccentricity of the roller shaft.
- the rear end portion of the recovery rod is fixed to the rear wall of the rough cleaning chamber, and the front end portion is fixed to the roller shaft support plate. If it is fixed to the rear wall of the chamber and the front end is fixed to the roller shaft via a bracket, it is easy to attach the recovery rod to the rough cleaning chamber, and the front and rear ends of the recovery rod Since the portion is fixed, it is possible to prevent the collection basket from being bent due to the weight of the cleaning liquid flowing in the collection basket.
- a cleaning liquid discharge means for supplying a cleaning liquid to the back surface of the substrate is further provided.
- a chemical processing chamber that is partitioned from the cleaning chamber via a partition wall and supplies a chemical solution to the substrate surface, and the substrate is inserted into the partition wall in a slit shape.
- air jetting means for jetting air on the substrate surface is provided in the vicinity of the upstream side and the downstream side of the mouth.
- the chemical solution may be a stripping solution for stripping the resist formed on the substrate surface, or the cleaning solution may be pure water.
- the upstream end of the transported substrate passes through the cleaning liquid discharge means of the rough cleaning chamber, and the downstream end of the next substrate is transferred to the position of the cleaning liquid discharge means.
- the cleaning liquid discharged from the cleaning liquid discharging means and not passing through the substrate surface is received by the recovery tank, guided to the precision cleaning chamber, and discharged, so that the drain port provided on the bottom wall of the rough cleaning chamber Since the concentrated waste liquid recovered from the liquid is not diluted by the cleaning liquid that flows down without passing through the substrate surface, the amount of the concentrated waste liquid that needs to be discarded can be reduced.
- the cleaning liquid received by the recovery tank is discharged to the precision cleaning chamber, the reusable diluted drainage recovered from the drain outlet provided on the bottom wall of the precision cleaning chamber can be increased. In addition, it is possible to improve the utilization efficiency of the diluted drainage recovered from the cleaning chamber.
- FIG. 3 is a cross-sectional view taken along the line AA of the rough washing chamber in FIG. 2. It is the figure which showed schematic structure of the air ejection bar with which the resist peeling apparatus of FIG. 1 is provided.
- FIG. 3 is a cross-sectional view taken along the line AA of the rough cleaning chamber of FIG.
- FIG. 8 is a view showing a cross section taken along line BB of the rough cleaning chamber of FIG.
- FIG. 8 is a cross-sectional view taken along line BB of the rough cleaning chamber of FIG. 7 and shows a state in which pure water flows down the rear wall of the rough cleaning chamber.
- the substrate processing apparatus of this embodiment is a resist peeling apparatus used when manufacturing the glass substrate for liquid crystal display panels.
- the resist stripping apparatus 1 shown in FIG. 1 is in a state where the glass substrate 2 is tilted at an angle of, for example, 15 degrees from the upright state in which the glass substrate 2 is vertically erected, that is, at an angle of 75 degrees with respect to the horizontal direction.
- the stripping solution 4 is supplied to the resist formed on the surface 2a of the glass substrate 2 while being conveyed in the state.
- the resist stripping apparatus 1 has a configuration in which a plurality of stripping chambers 40 to 90 are arranged side by side, and the glass substrate 2 is transferred from the neutral chamber 30 to the stripping chambers 40 to 90 one by one. Then, a resist stripping process using the stripping solution 4 is performed.
- the separation chambers 40 to 90 are partitioned by partition walls 51 to 91, and the partition walls 51 to 91 are provided with substrate insertion openings 51a to 91a that are opened in a slit shape.
- the neutral chamber 30 and the separation chamber 40 are partitioned by a partition wall 41, and the separation chamber 90 and the cleaning chamber 100 are partitioned by a partition wall 101.
- the partition walls 41 and 101 are opened in a slit shape. Substrate insertion openings 41a and 101a are provided.
- the partition wall 31 on the upstream side of the neutral chamber 30 is provided with a substrate insertion port 31a that opens in a slit shape.
- Shutters 3 and 3 are provided at the upstream and downstream substrate insertion openings 31 a and 41 a of the neutral chamber 30, and the substrate insertion openings 31 a and 41 a can be closed by the shutters 3 and 3.
- the partition wall 102 on the downstream side of the cleaning chamber 100 is provided with a substrate insertion opening 102 a that is opened in a slit shape, and the substrate insertion opening 102 a can be closed by the shutter 3.
- Each stripping chamber 40 to 90 is provided with an air ejection bar 12, and high pressure air is ejected from the air ejection bar 12 to remove the stripping solution 4 adhering to the front surface 2 a and the back surface 2 b of the glass substrate 2. Has been done.
- the air ejection bar 12 is arranged so as to be orthogonal to the conveyance direction of the glass substrate 2. As shown in FIG. 5, such an air ejection bar 12 has an air storage chamber 12b that temporarily retains the air supplied from the air supply port 12a, and communicates with the air storage chamber 12b. A slit-shaped air outlet 12c for ejecting air linearly to the glass substrate 2 is formed. An air pump (not shown) is connected to the air supply port 12a of the air ejection bar 12 to supply compressed air.
- Such an air ejection bar 12 is, for example, in the vicinity of the downstream side of the substrate insertion port 91a formed in the partition wall 91 so that the stripping solution 4 used in the stripping chamber 90 is not brought into the adjacent stripping chamber 80. Is arranged. Similarly, the air ejection bar 12 is provided on the upstream side of the substrate insertion port 101 a formed in the partition wall 101 so that the stripping solution 4 used in the stripping chamber 90 is not brought into the adjacent cleaning chamber 100. It is arranged in the vicinity.
- the stripping solution 4 supplied to the glass substrate 2 the shorter the time required for stripping the resist.
- the stripping solution 4 The temperature is set to a high temperature of 80 ° C.
- the stripping solution 4 supplied to the stripping chambers 40 to 90 is supplied from the storage tank 6 via the pump 14 to the glass substrate 2 in a shower form from the stripping solution supply bar 7.
- the storage tank 6 is provided with a stripping solution heating means 8 for heating the stripping solution 4.
- the stripping solution heating means 8 includes a steam pipe 8a, and the steam pipe 8a is immersed in the stripping liquid 4 to raise the temperature of the stripping liquid 4 in the storage tank 6 to 80 ° C. In this case, high-temperature steam flows in the steam pipe 8a.
- the stripping liquid discharge bar 7 is arranged so as to be orthogonal to the conveying direction of the glass substrate 2, and the stripping liquid 4 is transferred from the stripping liquid discharge nozzle 7a to the front surface 2a and the back surface 2b of the glass substrate 2. Supply in shower form.
- a plurality of stripping liquid discharge bars 7 are provided at predetermined intervals along the transport direction.
- the stripping solution discharge bar 7 is connected to the storage tank 6 by a stripping solution supply pipe 13 as shown in FIG. 1, and the stripping solution 4 is sent to the stripping solution discharge bar 7 by a pump 14.
- a filter for filtering the stripping liquid 4 passing through the stripping liquid supply pipe 13 and the flow rate of the stripping liquid 4 are provided in the middle of the stripping liquid supply pipe 13 between the pump 14 and the stripping liquid discharge bar 7.
- a flow rate adjusting valve or the like for adjusting the flow rate is provided.
- a drainage port 15 is formed in the bottom walls 42 to 92 of the separation chambers 40 to 90, and is connected to the storage tank 6 through the drainage pipe 16.
- the stripping solution 4 collected through the drainage pipe 16 is temporarily stored in the storage tank 6 and then sent to the stripping solution discharge bar 7 again by the pump 14.
- each of the separation chambers 40 to 90 is forcibly exhausted from the exhaust port (not shown) formed in the upper wall by an exhaust means (not shown).
- an exhaust means not shown.
- Such exhaust is performed in order to prevent, for example, the vapor or mist of the stripping solution 4 used in the stripping chamber 90 and foreign matter contained therein from leaking into the adjacent stripping chamber 80 or the cleaning chamber 100. Is called. This is because, when a large amount of foreign matter is generated in a specific peeling chamber, if the foreign matter enters another peeling chamber or cleaning chamber, the entire resist peeling apparatus 1 is maintained.
- the glass substrate 2 that has passed through each of the peeling chambers 40 to 90 is transported to the cleaning chamber 100, and the front surface 2a and the back surface 2b of the glass substrate 2 are washed with pure water 5, and then in a substrate drying chamber (not shown) by air, etc. Drying is performed.
- the cleaning chamber 100 is divided into two chambers, a rough cleaning chamber 103 on the upstream side and a precision cleaning chamber 104 on the downstream side, by a partition plate 106 erected on the bottom wall 105.
- the chambers 103 and 104 include two front-side pure water discharge bars 18 that supply the pure water 5 to the front surface 2a of the glass substrate 2, and one back-side pure water that supplies the pure water 5 to the back surface 2b of the glass substrate 2.
- a discharge bar 19 is provided.
- Each of the pure water discharge bars 18 and 19 is provided with a plurality of nozzles 18a and 19a for discharging the pure water 5 in a shower shape.
- the front-side pure water discharge bar 18 is arranged to face the front surface 2 a of the glass substrate 2
- the back-side pure water discharge bar 19 is arranged to face the back surface 2 b of the glass substrate 2. Yes.
- one back-side pure water discharge bar 19 is disposed at the center between the two front-side pure water discharge bars 18 and 18.
- FIG. 3 is a perspective view showing a state in which the air ejection bar 12, the front-side pure water discharge bar 18, and the back-side pure water discharge bar 19 are omitted for simplification of the drawing.
- the support roller 9 is disposed on the back surface 2a side which is the lower side in the inclination direction of the glass substrate 2, and its axis is parallel to the glass substrate 2 to be conveyed, that is, inclined at an angle of 75 degrees.
- the support roller 9 is rotatably supported on a roller shaft 9a by a ball bearing 9b, and the upper and lower ends of the roller shaft 9a are the upper wall 107 and the lower wall of the cleaning chamber 100. 108 is fixed.
- a plurality of roller shafts 9a are provided at predetermined intervals along the conveyance direction of the glass substrate 2.
- roller shaft 9a is supported by the front end of the roller shaft support plate 110 standing on the rear wall 109 of the cleaning chamber 100 to prevent eccentricity. It is designed not to slip.
- the roller shaft support plate 110 is formed with a plurality of openings 110a through which pure water 5 flowing down the rear wall 109 of the cleaning chamber 100 passes.
- the transport roller 10 that supports the lower end of the glass substrate 2 is fixed to one end of the drive shaft 10a.
- a gear 10 b is attached to the other end of the drive shaft 10 a, and a gear 11 b that meshes with the gear 10 b is attached to the rotating shaft 11 a of the motor 11.
- the glass substrate 2 can be transported by a frictional force generated between the transport roller 10 and the lower end of the glass substrate 2.
- a drainage port 21 is formed in the bottom wall 105 of the rough cleaning chamber 103.
- a concentrated drainage H is produced in which the stripping solution 4 brought in by the glass substrate 2 transported from the adjacent stripping chamber 90 and the pure water 5 for washing away the stripping solution 4 are mixed.
- the concentrated drainage H is discharged from the drainage port 21.
- a concentrated drainage pipe 23 is connected to the drainage port 21 of the rough cleaning chamber 103, and the concentrated drainage H recovered through the concentrated drainage pipe 23 is supplied to a boiler or the like. It is turned into powdery waste at the disposal facility provided and discarded.
- a drain port 22 is formed in the bottom wall 105 of the precision cleaning chamber 104.
- a diluted drainage liquid L having a lower mixing ratio of the stripping solution 4 than the concentrated drainage solution H is generated.
- the diluted drainage L is discharged from the drainage port 22.
- a diluted drainage pipe 24 is connected to the drainage port 22 of the precision cleaning chamber 104, and the diluted drainage L is collected in the collection tank 25 through the diluted drainage pipe 24. .
- the diluted waste liquid L recovered in the recovery tank 25 is purified by bacteria or the like, and is sent again to the pure water discharge bars 18 and 19 through the pump 26, the filter 27, and the pure water supply pipe 20. It has become.
- a recovery tub 112 that receives the pure water 5 that falls on the rear wall 109 of the rough cleaning chamber 103 is provided so as to incline downward toward the precision cleaning chamber 104 on the downstream side.
- the recovery basket 112 has an upstream end 2 c of the glass substrate 2 that is transported passes through the front pure water discharge bar 18 provided in the rough cleaning chamber 103, and the downstream end of the next glass substrate.
- the pure water 5 discharged from the front-side pure water discharge bar 18 and flowing against the rear wall 109 of the rough cleaning chamber 103 is formed in the bottom wall 105 as it is until 2d is conveyed to the front-side pure water discharge bar 18.
- the pure water 5 that flows down the rear wall 109 of the rough cleaning chamber 103 is received by the recovery tank 112, and the received pure water 5 is sent to the precision cleaning chamber 104. Can be led.
- the recovery rod 112 is provided below the roller shaft support plate 110 disposed above and below the roller shaft support plate 110 disposed below, and the upper surface of the roller shaft support plate 110. It is also provided between the lower roller shaft support plate 110.
- the recovery rod 112 is formed by bending a metal plate so that the cross section is substantially L-shaped, and has a bottom portion 112a inclined downward toward the precision cleaning chamber 104 on the downstream side.
- a rear mounting portion 112 b protruding upward is provided at the rear end of the bottom portion 112 a, and the rear mounting portion 112 b is fixed to the rear wall 109 of the rough cleaning chamber 103 by a fixing screw 28. Further, a front side mounting portion 112c protruding toward the front side is provided at the front end of the bottom portion 112a.
- the recovery rod 112 disposed below the upper roller shaft support plate 110 and below the lower roller shaft support plate 110 has a front mounting portion 112c attached to the roller shaft support plate 110 by a fixing screw 28. It is fixed.
- the recovery rod 112 disposed between the upper roller shaft support plate 110 and the lower roller shaft support plate 110 has a front mounting portion 112c fixed to the roller shaft 9a by a bracket 29.
- the front mounting portion 112 c is fixed to the rear end of the bracket 29 by the fixing screw 28, and the front end of the bracket 29 holds the roller shaft 9 a, so that the front mounting portion 112 c of the recovery rod 112 is interposed via the bracket 29.
- the roller shaft 9a is fixed.
- the upstream end of the recovery tank 112 is closed, and an open discharge port 112d is formed at the downstream end.
- the recovery rod 112 is formed longer than the roller shaft support plate 110, and the upstream end of the recovery rod 112 is disposed upstream of the upstream end of the roller shaft support plate 110, and the recovery rod 112
- the downstream end of 112 is disposed downstream of the downstream end of the roller shaft support plate 110.
- the recovery tank 112 can receive the pure water 5 flowing down from the opening 110a of the roller shaft support plate 110, as well as the pure water 5 flowing down from the upstream end of the roller shaft support plate 110, Pure water 5 overflowing from the downstream end can also be received.
- the discharge port 112d of the collection basket 112 is disposed so as to face the precision cleaning chamber 104 beyond the partition plate 106. All of the flowing pure water 5 flows down to the bottom wall 105 of the precision cleaning chamber 104.
- the pure water 5 discharged from the front-side pure water discharge bar 18 provided facing the front surface 2a of the glass substrate 2 slightly inclined from the upright state to the back surface 2b side is shown in FIG.
- the pure water 5 flowing down the rear wall 109 is Since it is blocked by the recovery tank 112, it is prevented from being discharged from the drain port 22 provided in the bottom wall 105 of the rough cleaning chamber 103 as shown in FIG.
- the concentrated drainage H collected from the drainage port 21 provided in the bottom wall 105 of the rough cleaning chamber 103 is discharged from the front-side pure water discharge bar 18 and does not pass through the surface 2a of the glass substrate 2 later. Since it is not diluted with the pure water 5 flowing down the wall 109, the amount of the concentrated waste liquid H that needs to be discarded can be reduced, and the cost for the disposal can be reduced.
- the pure water 5 flowing down the rear wall 109 of the rough cleaning chamber 103 is discharged to the precision cleaning chamber 104 by the recovery tank 112, so that it is recovered from the drain port 22 provided on the bottom wall 105 of the precision cleaning chamber 104.
- the reusable diluted drainage L can be increased, and as a result, the utilization efficiency of the diluted drainage L recovered from the cleaning chamber 100 can be improved.
- the present invention is not limited to such an embodiment, and it is needless to say that the present invention can be implemented in various modes without departing from the gist of the present invention.
- the present invention is applied to the resist stripping apparatus.
- the cleaning liquid is supplied to the substrate and the water washing process is performed.
- the present invention can be applied to any substrate processing apparatus. Further, the configuration and the number of peeling chambers and cleaning chambers as chemical processing chambers are not limited to the above-described embodiment.
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- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Liquid Crystal (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
Description
Claims (8)
- 基板を直立状態から裏面側に所定角度傾倒させて搬送する基板搬送手段と、該基板搬送手段により搬送される前記基板表面に洗浄液吐出手段により洗浄液を供給する洗浄室とを備えた基板処理装置において、前記洗浄室は、底壁に立設された仕切板により上流側の粗洗浄室と下流側の精密洗浄室とに区切られ、前記粗洗浄室と前記精密洗浄室のぞれぞれの底壁には排液口が設けられると共に、前記粗洗浄室には、前記洗浄液吐出手段から吐出され前記基板表面を経由しない洗浄液を受ける回収樋が、前記精密洗浄室側に向かって下傾するように設けられ、前記回収樋内を流れる洗浄液を排出する該回収樋の排出口が、前記仕切板を越えて前記精密洗浄室内に臨むように設けられていることを特徴とする基板処理装置。
- 前記基板搬送手段は、前記基板の裏面を支持する複数の支持ローラと、前記基板の下端を支持しつつ搬送する複数の搬送ローラとを備え、前記支持ローラはローラ軸に回転自在に軸支されると共に、該ローラ軸の途中部位が、前記粗洗浄室の後壁に立設されたローラ軸支持板の前端縁に当接されて支持されており、前記ローラ軸支持板には前記粗洗浄室の後壁を流れ落ちる洗浄水が通る開口部が形成されると共に、該開口部の下方に前記回収樋が配置されていることを特徴とする請求項1に記載の基板処理装置。
- 前記回収樋の後端部が前記粗洗浄室の後壁に固定されると共に、前端部が前記ローラ軸支持板に固定されていること特徴とする請求項2に記載の基板処理装置。
- 前記回収樋の後端部が前記粗洗浄室の後壁に固定されると共に、前端部が前記ローラ軸にブラケットを介して固定されていることを特徴とする請求項2に記載の基板処理装置。
- 前記基板裏面に洗浄液を供給する洗浄液吐出手段が更に備えられていることを特徴とする請求項1から4のいずれか一項に記載の基板処理装置。
- 前記洗浄室の上流側には、該洗浄室とは隔壁を介して仕切られて前記基板表面に薬液を供給する薬液処理室を備えると共に、前記隔壁にスリット状に開口形成された基板挿通口の上流側および下流側の近傍には前記基板表面にエアを噴出するエア噴出手段が備えられていることを特徴とする請求項1から5のいずれか一項に記載の基板処理装置。
- 前記薬液は前記基板表面に形成されたレジストを剥離する剥離液であることを特徴とする請求項6に記載の基板処理装置。
- 前記洗浄液は純水であることを特徴とする請求項1から7のいずれか一項に記載の基板処理装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/147,353 US20120006485A1 (en) | 2009-02-02 | 2010-01-29 | Substrate treatment device |
JP2010548563A JP5133428B2 (ja) | 2009-02-02 | 2010-01-29 | 基板処理装置 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP2009021201 | 2009-02-02 | ||
JP2009-021201 | 2009-02-02 |
Publications (1)
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WO2010087435A1 true WO2010087435A1 (ja) | 2010-08-05 |
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PCT/JP2010/051228 WO2010087435A1 (ja) | 2009-02-02 | 2010-01-29 | 基板処理装置 |
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US (1) | US20120006485A1 (ja) |
JP (1) | JP5133428B2 (ja) |
WO (1) | WO2010087435A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2018230457A1 (ja) * | 2017-06-13 | 2018-12-20 | シャープ株式会社 | 基板処理装置 |
Families Citing this family (11)
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KR101982206B1 (ko) * | 2012-09-20 | 2019-05-27 | 삼성디스플레이 주식회사 | 기판 세정 장치 |
KR101654293B1 (ko) * | 2013-01-16 | 2016-09-06 | 주식회사 잉크테크 | 습식 공정 챔버 및 이를 포함하는 습식 공정 장치 |
KR20150057379A (ko) * | 2013-11-19 | 2015-05-28 | 삼성디스플레이 주식회사 | 기판 세정 장치 |
KR102338076B1 (ko) * | 2014-10-06 | 2021-12-13 | 삼성디스플레이 주식회사 | 기판 처리 장치 및 이를 이용한 기판 처리 방법 |
JP6783233B2 (ja) * | 2014-12-05 | 2020-11-11 | レナ テクノロジー ゲーエムベーハーRENA Technologies GmbH | サブストレートを処理するための装置 |
EP3035375B1 (en) * | 2014-12-19 | 2017-05-03 | ATOTECH Deutschland GmbH | Treating module of an apparatus for horizontal wet-chemical treatment of large-scale substrates |
CN104681471B (zh) * | 2015-03-12 | 2017-09-15 | 京东方科技集团股份有限公司 | 湿法刻蚀设备 |
CN106623320B (zh) * | 2015-10-30 | 2019-02-15 | 扬昕科技(苏州)有限公司 | 清洗设备及清洗方法 |
TWM547943U (zh) * | 2017-05-22 | 2017-09-01 | G-Winner Environmental Protection Co Ltd | 洗滌機結構改良 |
WO2019043947A1 (ja) * | 2017-09-04 | 2019-03-07 | シャープ株式会社 | エッチング装置、および表示装置の製造方法 |
CN115069637B (zh) * | 2022-05-09 | 2024-05-17 | 四川中雅科技有限公司 | 一种铝薄膜清洗装置 |
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- 2010-01-29 WO PCT/JP2010/051228 patent/WO2010087435A1/ja active Application Filing
- 2010-01-29 US US13/147,353 patent/US20120006485A1/en not_active Abandoned
- 2010-01-29 JP JP2010548563A patent/JP5133428B2/ja not_active Expired - Fee Related
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JPH11162919A (ja) * | 1997-11-27 | 1999-06-18 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
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JPWO2010087435A1 (ja) | 2012-08-02 |
US20120006485A1 (en) | 2012-01-12 |
JP5133428B2 (ja) | 2013-01-30 |
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