JP2008023489A - 基板の処理装置 - Google Patents
基板の処理装置 Download PDFInfo
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- JP2008023489A JP2008023489A JP2006201149A JP2006201149A JP2008023489A JP 2008023489 A JP2008023489 A JP 2008023489A JP 2006201149 A JP2006201149 A JP 2006201149A JP 2006201149 A JP2006201149 A JP 2006201149A JP 2008023489 A JP2008023489 A JP 2008023489A
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F2201/00—Constructional arrangements not provided for in groups G02F1/00 - G02F7/00
- G02F2201/54—Arrangements for reducing warping-twist
Abstract
【解決手段】基板を所定の角度で傾斜させて搬送しながら処理液によって処理する基板の処理装置であって、
チャンバ3と、チャンバ内に設けられ基板の傾斜方向下側の背面を支持する支持ローラ14と、背面が支持ローラによって支持された基板の下端を外周面によって支持し回転駆動されて基板を所定方向に搬送する駆動ローラ17と、基板の傾斜方向上側の前面に処理液を噴射するノズル体62と、駆動ローラの近傍に配置され基板の搬送方向後方の下端部がノズル体から噴射される処理液の圧力を受けたときにその下端部が基板の背面側に湾曲するのを阻止する湾曲防止ローラ64を具備する。
【選択図】 図3
Description
チャンバと、
このチャンバ内に設けられ上記基板の傾斜方向下側の背面を支持する支持ローラと、
背面が上記支持ローラによって支持された上記基板の下端を外周面によって支持し回転駆動されて上記基板を所定方向に搬送する駆動ローラと、
上記基板の傾斜方向上側の前面に上記流体を噴射する流体供給手段と、
上記駆動ローラの近傍に配置され上記基板の搬送方向後方の下端部が上記流体供給手段から噴射される流体の圧力を受けたときにその下端部が上記基板の背面側に湾曲するのを阻止する湾曲防止ローラと
を具備したことを特徴とする基板の処理装置にある。
図1乃至図4はこの発明の第1の実施の形態を示す。図1はこの発明の処理装置の概略的構成を示す斜視図であって、この処理装置は装置本体1を有する。この装置本体1は分割された複数の処理ユニット、この実施の形態では第1乃至第5の処理ユニット1A〜1Eを分解可能に一列に連結してなる。
Claims (5)
- 基板を所定の角度で傾斜させて搬送しながら流体によって処理する基板の処理装置であって、
チャンバと、
このチャンバ内に設けられ上記基板の傾斜方向下側の背面を支持する支持ローラと、
背面が上記支持ローラによって支持された上記基板の下端を外周面によって支持し回転駆動されて上記基板を所定方向に搬送する駆動ローラと、
上記基板の傾斜方向上側の前面に上記流体を噴射する流体供給手段と、
上記駆動ローラの近傍に配置され上記基板の搬送方向後方の下端部が上記流体供給手段から噴射される流体の圧力を受けたときにその下端部が上記基板の背面側に湾曲するのを阻止する湾曲防止ローラと
を具備したことを特徴とする基板の処理装置。 - 上記湾曲防止ローラは、上記駆動ローラの上記基板の搬送方向に沿う直径の範囲内に設けられていることを特徴とする請求項1記載の基板の処理装置。
- 上記湾曲防止ローラは、上記基板の搬送方向上流側に設けられていることを特徴とする請求項1又は請求項2記載の基板の処理装置。
- 上記湾曲防止ローラは、上記基板の搬送方向上流側と下流側に設けられていることを特徴とする請求項1又は請求項2記載の基板の処理装置。
- 上記湾曲防止ローラは、回転軸線が上記基板の搬送方向において上記駆動ローラの回転軸線に直交する位置に設けられていることを特徴とする請求項1又は請求項2記載の基板の処理装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006201149A JP4820705B2 (ja) | 2006-07-24 | 2006-07-24 | 基板の処理装置 |
TW096125407A TWI453848B (zh) | 2006-07-24 | 2007-07-12 | 基板處理裝置 |
KR1020070072911A KR101408758B1 (ko) | 2006-07-24 | 2007-07-20 | 기판의 처리 장치 |
CN2007101386343A CN101114581B (zh) | 2006-07-24 | 2007-07-24 | 基板的处理装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006201149A JP4820705B2 (ja) | 2006-07-24 | 2006-07-24 | 基板の処理装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008023489A true JP2008023489A (ja) | 2008-02-07 |
JP4820705B2 JP4820705B2 (ja) | 2011-11-24 |
Family
ID=39022827
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006201149A Expired - Fee Related JP4820705B2 (ja) | 2006-07-24 | 2006-07-24 | 基板の処理装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4820705B2 (ja) |
KR (1) | KR101408758B1 (ja) |
CN (1) | CN101114581B (ja) |
TW (1) | TWI453848B (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010087435A1 (ja) * | 2009-02-02 | 2010-08-05 | シャープ株式会社 | 基板処理装置 |
US7906410B2 (en) | 2007-02-08 | 2011-03-15 | Panasonic Corporation | Method of manufacturing semiconductor chip using laser light and plasma dicing |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI512659B (zh) * | 2012-12-12 | 2015-12-11 | Mitake Information Corp | 基於Widget架構之金融報價更新狀態顯示裝置與方法 |
CN108569561A (zh) * | 2017-03-07 | 2018-09-25 | 湖北新谛玻璃科技有限公司 | 一种中空铝条玻璃生产工艺及其装置 |
CN109285804B (zh) * | 2017-07-21 | 2020-12-01 | 中芯国际集成电路制造(上海)有限公司 | 晶圆垂直稳定性校准系统及校准晶圆垂直稳定性的方法 |
JP7181013B2 (ja) * | 2018-06-20 | 2022-11-30 | Juki株式会社 | 電子部品実装装置及び電子部品実装方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6141257A (ja) * | 1984-08-02 | 1986-02-27 | Nec Corp | ダイヤルインタ−フエ−ス回路 |
JP2003218497A (ja) * | 2002-01-28 | 2003-07-31 | Tokyo Kakoki Kk | 基板処理装置 |
JP2004331349A (ja) * | 2003-05-09 | 2004-11-25 | Ulvac Japan Ltd | インライン式真空処理装置 |
JP2006110541A (ja) * | 2004-09-14 | 2006-04-27 | Shibaura Mechatronics Corp | 基板の処理装置及び処理方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3535707B2 (ja) * | 1997-08-28 | 2004-06-07 | 大日本スクリーン製造株式会社 | 基板処理装置 |
TW569288B (en) * | 2001-06-19 | 2004-01-01 | Tokyo Electron Ltd | Substrate processing apparatus, liquid processing apparatus and liquid processing method |
JP4091357B2 (ja) * | 2002-06-28 | 2008-05-28 | 大日本スクリーン製造株式会社 | 基板処理装置および基板洗浄方法 |
CN101615576B (zh) * | 2004-07-19 | 2012-07-04 | 三星电子株式会社 | 基板处理设备及使用其的基板处理方法 |
JP4568059B2 (ja) * | 2004-09-15 | 2010-10-27 | 芝浦メカトロニクス株式会社 | 基板の処理装置 |
-
2006
- 2006-07-24 JP JP2006201149A patent/JP4820705B2/ja not_active Expired - Fee Related
-
2007
- 2007-07-12 TW TW096125407A patent/TWI453848B/zh not_active IP Right Cessation
- 2007-07-20 KR KR1020070072911A patent/KR101408758B1/ko not_active IP Right Cessation
- 2007-07-24 CN CN2007101386343A patent/CN101114581B/zh not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6141257A (ja) * | 1984-08-02 | 1986-02-27 | Nec Corp | ダイヤルインタ−フエ−ス回路 |
JP2003218497A (ja) * | 2002-01-28 | 2003-07-31 | Tokyo Kakoki Kk | 基板処理装置 |
JP2004331349A (ja) * | 2003-05-09 | 2004-11-25 | Ulvac Japan Ltd | インライン式真空処理装置 |
JP2006110541A (ja) * | 2004-09-14 | 2006-04-27 | Shibaura Mechatronics Corp | 基板の処理装置及び処理方法 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7906410B2 (en) | 2007-02-08 | 2011-03-15 | Panasonic Corporation | Method of manufacturing semiconductor chip using laser light and plasma dicing |
WO2010087435A1 (ja) * | 2009-02-02 | 2010-08-05 | シャープ株式会社 | 基板処理装置 |
Also Published As
Publication number | Publication date |
---|---|
JP4820705B2 (ja) | 2011-11-24 |
KR101408758B1 (ko) | 2014-06-17 |
TW200818373A (en) | 2008-04-16 |
CN101114581A (zh) | 2008-01-30 |
TWI453848B (zh) | 2014-09-21 |
KR20080009645A (ko) | 2008-01-29 |
CN101114581B (zh) | 2010-07-28 |
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