ES2089534T3 - Metodo para fabricar un panel de circuito impreso de capas multiples. - Google Patents
Metodo para fabricar un panel de circuito impreso de capas multiples.Info
- Publication number
- ES2089534T3 ES2089534T3 ES92911019T ES92911019T ES2089534T3 ES 2089534 T3 ES2089534 T3 ES 2089534T3 ES 92911019 T ES92911019 T ES 92911019T ES 92911019 T ES92911019 T ES 92911019T ES 2089534 T3 ES2089534 T3 ES 2089534T3
- Authority
- ES
- Spain
- Prior art keywords
- substrate
- traces
- pct
- basic
- basic substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
- H05K3/4655—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern by using a laminate characterized by the insulating layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/0287—Unidirectional or parallel fibers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
- H05K2203/0759—Forming a polymer layer by liquid coating, e.g. a non-metallic protective coating or an organic bonding layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49158—Manufacturing circuit on or in base with molding of insulated base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249924—Noninterengaged fiber-containing paper-free web or sheet which is not of specified porosity
- Y10T428/24994—Fiber embedded in or on the surface of a polymeric matrix
- Y10T428/24995—Two or more layers
- Y10T428/249951—Including a free metal or alloy constituent
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249994—Composite having a component wherein a constituent is liquid or is contained within preformed walls [e.g., impregnant-filled, previously void containing component, etc.]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Laminated Bodies (AREA)
Abstract
SE DESCRIBE UN PROCESO PARA REALIZAR UN PANEL DE HILO METALICO IMPRESO MULTILAMINADO QUE COMPRENDE AL MENOS TRES SUPERFICIES DEL MISMO, Y QUE PROCESA, POR MEDIO DE LAMINACIONES BAJO PRESION, UN SUSTRATO BASICO TRATADO (8) BASADO EN UN MATERIAL SINTETICO UDREFORZADO, PROVISTO EN CADA SUPERFICIE CON TRAZADOS (7), SE COMBINA CON UN SUSTRATO DE APOYO (9), DONDE DURANTE EL PROCESO DE LAMINACION ESTE SUSTRATO SE AÑADE AL BASICO, Y COMPRENDE UNA LAMINA DE NUCLEO TRATADA UD-REFORZADA PROVISTA AL MENOS EN EL LADO DE CARA A LOS TRAZOS DE CONDUCCION DE UN SUSTRATO BASICO CON UNA LAMINA ADHESIVA (CIRCULABLE) PLASTICAMENTE DEFORMABLE (15), Y TAL PRESION SE EJERCE SOBRE EL LAMINADO PARA TRAER LA LAMINA DE NUCLEO TRATADO DEL SUSTRATO DE APOYO EN CONTACTO O CASI EN CONTACTO CON LOS TRAZADOS CONDUCTORES, Y EL ESPACIO ENTRE ESOS TRAZADOS SE RELLENA CON EL MATERIAL ADHESIVO, UNIENDO EL SUSTRATO BASICO Y EL SUSTRATO DE APOYO.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL9100958 | 1991-06-04 |
Publications (1)
Publication Number | Publication Date |
---|---|
ES2089534T3 true ES2089534T3 (es) | 1996-10-01 |
Family
ID=19859321
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES92911019T Expired - Lifetime ES2089534T3 (es) | 1991-06-04 | 1992-05-19 | Metodo para fabricar un panel de circuito impreso de capas multiples. |
Country Status (12)
Country | Link |
---|---|
US (2) | US5592737A (es) |
EP (1) | EP0587634B1 (es) |
JP (1) | JP2612529B2 (es) |
AT (1) | ATE139661T1 (es) |
AU (1) | AU660463B2 (es) |
BR (1) | BR9206094A (es) |
CA (1) | CA2110679A1 (es) |
DE (1) | DE69211693T2 (es) |
ES (1) | ES2089534T3 (es) |
RU (1) | RU2126612C1 (es) |
TW (1) | TW210422B (es) |
WO (1) | WO1992022192A1 (es) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
ES2138909A1 (es) * | 1997-09-10 | 2000-01-16 | Aismalibar Sa | Material laminar compuesto para placas de circuito impreso. |
Families Citing this family (39)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW244340B (es) * | 1992-07-21 | 1995-04-01 | Akzo Nv | |
TW259925B (es) * | 1994-01-26 | 1995-10-11 | Akzo Nobel Nv | |
JPH09510407A (ja) * | 1994-01-26 | 1997-10-21 | アンプ−アクゾ リンラム ブイオーエフ | 複合ラミネートを作る方法およびそうして作られたpwb基板 |
US6016598A (en) * | 1995-02-13 | 2000-01-25 | Akzo Nobel N.V. | Method of manufacturing a multilayer printed wire board |
US5806177A (en) * | 1995-10-31 | 1998-09-15 | Sumitomo Bakelite Company Limited | Process for producing multilayer printed circuit board |
US5847324A (en) * | 1996-04-01 | 1998-12-08 | International Business Machines Corporation | High performance electrical cable |
US5892661A (en) * | 1996-10-31 | 1999-04-06 | Motorola, Inc. | Smartcard and method of making |
WO1998056220A1 (fr) * | 1997-06-06 | 1998-12-10 | Ibiden Co., Ltd. | Plaquette de circuit simple face et procede de fabrication de ladite plaquette |
US6090474A (en) * | 1998-09-01 | 2000-07-18 | International Business Machines Corporation | Flowable compositions and use in filling vias and plated through-holes |
US6207904B1 (en) | 1999-06-02 | 2001-03-27 | Northrop Grumman Corporation | Printed wiring board structure having continuous graphite fibers |
US6340796B1 (en) | 1999-06-02 | 2002-01-22 | Northrop Grumman Corporation | Printed wiring board structure with integral metal matrix composite core |
US6361146B1 (en) | 1999-06-15 | 2002-03-26 | Lexmark International, Inc. | Adhesive bonding laminates |
US6210522B1 (en) | 1999-06-15 | 2001-04-03 | Lexmark International, Inc. | Adhesive bonding laminates |
US6762249B1 (en) * | 1999-08-25 | 2004-07-13 | Hitachi Chemical Company, Ltd. | Wiring-connecting material and process for producing circuit board with the same |
US6489012B1 (en) * | 1999-10-20 | 2002-12-03 | Samsung Electro-Mechanics Co., Ltd | Printed circuit board for RAMBUS |
US6485892B1 (en) | 1999-12-17 | 2002-11-26 | International Business Machines Corporation | Method for masking a hole in a substrate during plating |
US6729023B2 (en) * | 2000-05-26 | 2004-05-04 | Visteon Global Technologies, Inc. | Method for making a multi-layer circuit board assembly having air bridges supported by polymeric material |
EP1194020A3 (en) * | 2000-09-27 | 2004-03-31 | Matsushita Electric Industrial Co., Ltd. | Resin board, manufacturing process for resin board, connection medium body, circuit board and manufacturing process for circuit board |
JP3760771B2 (ja) * | 2001-01-16 | 2006-03-29 | 松下電器産業株式会社 | 回路形成基板および回路形成基板の製造方法 |
JP4125644B2 (ja) * | 2002-07-05 | 2008-07-30 | 松下電器産業株式会社 | 多層回路基板の形成方法および多層回路基板 |
US6819373B2 (en) * | 2002-10-03 | 2004-11-16 | International Business Machines Corporation | Lamination of liquid crystal polymer dielectric films |
US6762073B1 (en) | 2003-02-24 | 2004-07-13 | Donald P. Cullen | Method of fabricating electronic interconnect devices using direct imaging of dielectric composite material |
DE602004005598T2 (de) * | 2003-07-08 | 2008-01-24 | Viasystems Group, Inc. | Verfahren zur herstellung einer midplane |
US20060003624A1 (en) * | 2004-06-14 | 2006-01-05 | Dow Richard M | Interposer structure and method |
KR100688768B1 (ko) * | 2004-12-30 | 2007-03-02 | 삼성전기주식회사 | 칩 내장형 인쇄회로기판 및 그 제조 방법 |
KR100688769B1 (ko) * | 2004-12-30 | 2007-03-02 | 삼성전기주식회사 | 도금에 의한 칩 내장형 인쇄회로기판 및 그 제조 방법 |
WO2006080073A1 (ja) * | 2005-01-27 | 2006-08-03 | Matsushita Electric Industrial Co., Ltd. | 多層回路基板の製造方法、多層回路基板 |
JP4689375B2 (ja) * | 2005-07-07 | 2011-05-25 | 富士通株式会社 | 積層基板および該積層基板を有する電子機器 |
KR101121616B1 (ko) | 2006-07-21 | 2012-03-13 | 히다치 가세고교 가부시끼가이샤 | 회로 접속 재료, 회로 부재의 접속 구조 및 회로 부재의 접속 방법 |
CN101543150B (zh) * | 2006-11-10 | 2012-11-28 | 日本电气株式会社 | 多层布线基板 |
EP2135494A1 (de) * | 2007-03-19 | 2009-12-23 | Buhmann, Robert | Elektrische leiterbahnen enthaltende paneel-vorrichtungen sowie verfahren zu deren herstellung |
WO2008139701A1 (ja) * | 2007-04-27 | 2008-11-20 | Panasonic Corporation | 電子部品実装体及びハンダバンプ付き電子部品並びにそれらの製造方法 |
US7886414B2 (en) * | 2007-07-23 | 2011-02-15 | Samsung Electro-Mechanics Co., Ltd. | Method of manufacturing capacitor-embedded PCB |
GB2461017B (en) * | 2008-03-28 | 2010-04-28 | Beru F1 Systems Ltd | A connector and electrical tracks assembly |
US8123888B2 (en) * | 2009-04-28 | 2012-02-28 | Schlumberger Technology Corporation | Fiber reinforced polymer oilfield tubulars and method of constructing same |
US8693203B2 (en) * | 2011-01-14 | 2014-04-08 | Harris Corporation | Method of making an electronic device having a liquid crystal polymer solder mask laminated to an interconnect layer stack and related devices |
JP6041731B2 (ja) * | 2013-03-27 | 2016-12-14 | 新光電気工業株式会社 | インターポーザ、及び電子部品パッケージ |
RU2549338C2 (ru) * | 2013-05-23 | 2015-04-27 | Юрий Вячеславович Ивлиев | Светильник светодиодный уличный |
KR102086098B1 (ko) * | 2013-07-03 | 2020-03-09 | 삼성디스플레이 주식회사 | 표시 장치 |
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US3473992A (en) * | 1966-03-09 | 1969-10-21 | Westinghouse Electric Corp | Manufacture of flexible foil clad laminates |
US3756891A (en) * | 1967-12-26 | 1973-09-04 | Multilayer circuit board techniques | |
US3969177A (en) * | 1974-06-24 | 1976-07-13 | International Business Machines Corporation | Laminating method |
US4201616A (en) * | 1978-06-23 | 1980-05-06 | International Business Machines Corporation | Dimensionally stable laminated printed circuit cores or boards and method of fabricating same |
JPS55133597A (en) * | 1979-04-06 | 1980-10-17 | Hitachi Ltd | Multilayer circuit board |
DE3240754A1 (de) * | 1981-11-06 | 1983-05-19 | Sumitomo Bakelite Co. Ltd., Tokyo | Gedruckte schaltung mit mehreren schichten und verfahren zu deren herstellung |
US4606787A (en) * | 1982-03-04 | 1986-08-19 | Etd Technology, Inc. | Method and apparatus for manufacturing multi layer printed circuit boards |
US4404059A (en) * | 1982-05-26 | 1983-09-13 | Livshits Vladimir I | Process for manufacturing panels to be used in microelectronic systems |
US4501787A (en) * | 1983-04-29 | 1985-02-26 | Westinghouse Electric Corp. | Flame retardant B-staged epoxy resin prepregs and laminates made therefrom |
US4659425A (en) * | 1986-02-03 | 1987-04-21 | Ibm Corporation | Continuous process for the manufacture of printed circuit boards |
US4943334A (en) * | 1986-09-15 | 1990-07-24 | Compositech Ltd. | Method for making reinforced plastic laminates for use in the production of circuit boards |
US4875282A (en) * | 1987-09-18 | 1989-10-24 | Trw Inc. | Method of making multilayer printed circuit board |
US4814945A (en) * | 1987-09-18 | 1989-03-21 | Trw Inc. | Multilayer printed circuit board for ceramic chip carriers |
EP0321977B1 (en) * | 1987-12-23 | 1992-08-19 | Mitsubishi Gas Chemical Company, Inc. | Laminating material for printed circuit board of low dielectric constant |
US4847136A (en) * | 1988-03-21 | 1989-07-11 | Hughes Aircraft Company | Thermal expansion mismatch forgivable printed wiring board for ceramic leadless chip carrier |
JPH01283996A (ja) * | 1988-05-11 | 1989-11-15 | Mitsubishi Electric Corp | 多層プリント配線板 |
US5153987A (en) * | 1988-07-15 | 1992-10-13 | Hitachi Chemical Company, Ltd. | Process for producing printed wiring boards |
US5045381A (en) * | 1988-09-30 | 1991-09-03 | Hitachi, Ltd. | Thermosetting resin composition, printed circuit board using the resin composition and process for producing printed circuit board |
US5031308A (en) * | 1988-12-29 | 1991-07-16 | Japan Radio Co., Ltd. | Method of manufacturing multilayered printed-wiring-board |
JPH02237197A (ja) * | 1989-03-10 | 1990-09-19 | Hitachi Ltd | 多層回路基板及びその製造方法並びにその用途 |
US5282312A (en) * | 1991-12-31 | 1994-02-01 | Tessera, Inc. | Multi-layer circuit construction methods with customization features |
US5261153A (en) * | 1992-04-06 | 1993-11-16 | Zycon Corporation | In situ method for forming a capacitive PCB |
US5350621A (en) * | 1992-11-30 | 1994-09-27 | Allied-Signal Inc. | System of electronic laminates with improved registration properties |
-
1992
- 1992-05-18 TW TW081103853A patent/TW210422B/zh active
- 1992-05-19 DE DE69211693T patent/DE69211693T2/de not_active Expired - Fee Related
- 1992-05-19 AU AU17763/92A patent/AU660463B2/en not_active Ceased
- 1992-05-19 JP JP4509780A patent/JP2612529B2/ja not_active Expired - Lifetime
- 1992-05-19 US US08/157,077 patent/US5592737A/en not_active Expired - Fee Related
- 1992-05-19 EP EP92911019A patent/EP0587634B1/en not_active Expired - Lifetime
- 1992-05-19 WO PCT/EP1992/001133 patent/WO1992022192A1/en active IP Right Grant
- 1992-05-19 BR BR9206094A patent/BR9206094A/pt not_active IP Right Cessation
- 1992-05-19 AT AT92911019T patent/ATE139661T1/de not_active IP Right Cessation
- 1992-05-19 RU RU93058543A patent/RU2126612C1/ru active
- 1992-05-19 CA CA002110679A patent/CA2110679A1/en not_active Abandoned
- 1992-05-19 ES ES92911019T patent/ES2089534T3/es not_active Expired - Lifetime
-
1995
- 1995-06-07 US US08/483,427 patent/US5633072A/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
ES2138909A1 (es) * | 1997-09-10 | 2000-01-16 | Aismalibar Sa | Material laminar compuesto para placas de circuito impreso. |
Also Published As
Publication number | Publication date |
---|---|
ATE139661T1 (de) | 1996-07-15 |
AU660463B2 (en) | 1995-06-29 |
JP2612529B2 (ja) | 1997-05-21 |
US5633072A (en) | 1997-05-27 |
EP0587634B1 (en) | 1996-06-19 |
BR9206094A (pt) | 1994-08-02 |
DE69211693D1 (de) | 1996-07-25 |
US5592737A (en) | 1997-01-14 |
AU1776392A (en) | 1993-01-08 |
TW210422B (es) | 1993-08-01 |
DE69211693T2 (de) | 1997-01-23 |
EP0587634A1 (en) | 1994-03-23 |
JPH06507757A (ja) | 1994-09-01 |
RU2126612C1 (ru) | 1999-02-20 |
WO1992022192A1 (en) | 1992-12-10 |
CA2110679A1 (en) | 1992-12-10 |
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