EP3366804B1 - Box coating apparatus for vacuum coating of substrates, in particular spectacle lenses - Google Patents
Box coating apparatus for vacuum coating of substrates, in particular spectacle lenses Download PDFInfo
- Publication number
- EP3366804B1 EP3366804B1 EP17000280.2A EP17000280A EP3366804B1 EP 3366804 B1 EP3366804 B1 EP 3366804B1 EP 17000280 A EP17000280 A EP 17000280A EP 3366804 B1 EP3366804 B1 EP 3366804B1
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- European Patent Office
- Prior art keywords
- shield
- shutter portion
- shutter
- coating apparatus
- arrangement
- Prior art date
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Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/0635—Carbides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/52—Means for observation of the coating process
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
-
- G—PHYSICS
- G02—OPTICS
- G02C—SPECTACLES; SUNGLASSES OR GOGGLES INSOFAR AS THEY HAVE THE SAME FEATURES AS SPECTACLES; CONTACT LENSES
- G02C7/00—Optical parts
- G02C7/02—Lenses; Lens systems ; Methods of designing lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
- B29D11/00—Producing optical elements, e.g. lenses or prisms
- B29D11/00865—Applying coatings; tinting; colouring
Definitions
- the present invention generally relates to a box coating apparatus for vacuum coating of substrates according to the preamble portion of claim 1.
- Such apparatus generally serves the purpose of high vacuum deposition of multilayer thin films on substrates of various materials, both organic and inorganic, usually used in optical applications.
- the present invention relates to a box coating apparatus for vacuum coating of spectacle lenses, which shall be used within the frame of large-scale production of spectacle lenses.
- the box coating apparatus serves the purpose of applying a multilayer antireflection (AR) coating on the spectacle lenses in order to provide the latter with a low residual reflection and a desired color.
- AR multilayer antireflection
- It can however also be used for other coating purposes, e.g., for applying on top of such AR coating a top coating (TC) selected from a group comprising hydrophobic, oleophobic and dust repelling coatings.
- TC top coating
- the coating technology at issue - that is known per se - is a physical vapor deposition (PVD) process, to be more precise a coating process by thermal evaporation.
- PVD physical vapor deposition
- the critical parameters of such a coating technology are mainly the average speed of the evaporated particles and their angular distribution.
- the base pressure must be kept in the high vacuum range to minimize the number of impact events between the evaporant particles and the residual gases in the vacuum chamber where the process takes place. High vacuum allows the particles to have a sufficiently "mean free path" for the thin film to grow at the substrate level.
- High vacuum also ensures that, as the evaporated material is transported from the evaporator to the surfaces being coated, it does not (or to a very limited extent only) undergo chemical reactions with gases in the chamber. For these reasons the chamber needs to be pumped down to, e.g., about 3 ⁇ 10 -3 Pa before coating is begun.
- the pumping down of the vacuum chamber however entails the problems explained in the following.
- Figs. 12 to 14 show a previously known box coating apparatus 10 - namely the box coating apparatus "1200 DLX box coater” available from the present applicant Satisloh AG, Switzerland - in a partly simplified or schematic manner.
- the basic structure and functions of such box coating apparatus 10 are descripted in the brochure " An Introduction To The Coating Of Ophthalmic Lenses", 2nd Edition 2006 , available from the present applicant, to which explicit reference shall be made at this point and which forms the preamble portion of claim 1.
- the box coating apparatus 10 basically has a vacuum chamber 12 which contains an evaporation source 14 and a substrate holder 16 for holding a plurality of substrates (not shown) in a known manner.
- the substrate holder 16 is formed as a dome disposed vis-à-vis to the evaporation source 14 and rotatable by a dome rotary drive 18 (omitted in Fig. 14 ) about an axis of rotation R which passes through the evaporation source 14, so that the substrates held by the substrate holder 16 on a plurality of circles can be moved on circular paths about the axis of rotation R with a respective constant spacing relative to the evaporation source 14.
- the Meissner trap 20 essentially has a coil 24 (cf. Fig. 14 ) that can be held either at a temperature below -100° C or at room temperature.
- a coil 24 cf. Fig. 14
- the greater part of the residual gas - as much as 90% - is water vapor. Free water vapor would take a long time to remove and hence would result in long process cycles. To avoid this effect, water molecules are frozen to the trap surface, where they remain throughout the process. The water is released (evaporated) and pumped out only after coating is complete.
- Substrate heaters 22 are typically provided in case glass lenses are to be coated with typical materials such as MgF 2 . In such case the substrates must be heated to about 300°C by the substrate heaters in order to obtain excellent coating quality. Heaters however can also serve to degas the coating system in regular intervals.
- Fig. 14 Still further procedural equipment for generating the vacuum in the box coating apparatus 10 can be taken from Fig. 14 and is generally denoted with the reference sign 25 (pumping arrangement) in Fig. 14 .
- a high vacuum valve mechanism 26 sensitive to thin film depositions as well, is mounted in a chamber appendage 28 to the vacuum chamber 12 - also known as "high vacuum valve region" of the box coating apparatus 10 - and can be operated, i.e. opened and closed via a valve actuator 30.
- An efficient Roots pump 32 and rotary vane pump 34 combination is connected to the chamber appendage 28 through a roughing (fore vacuum) valve 36.
- a cooling baffle 38 and an oil diffusion pump 40 are arranged below the high vacuum valve 26.
- the cooling baffle 38 is mounted above the oil diffusion pump 40. Further, a bypass valve 42 with a direct connection to the rotary pumps 32, 34 is located on the fore vacuum side of the oil diffusion pump 40.
- a control system (not shown) actuates the valves 26, 36 and 42 in the correct order when the vacuum chamber 12 is being pumped down by the pumping arrangement 25, wherein the sequence of operations basically is as follows: When all pumps 32, 34, 40 and the cooling baffle 38 are ready for operation, the roughing valve 36 is opened and the Roots pump 32 and rotary vane pump 34 combination initially pumps the vacuum chamber 12 down to some 5 Pa. If the fore vacuum pressure of the oil diffusion pump 40 should rise beyond a programmed limit during this step, the roughing valve 36 is closed and the bypass valve 42 is opened until the pressure limit is reached again. The initial configuration is then restored. When the pressure in the vacuum chamber 12 drops to 5 Pa, the roughing valve 36 to the vacuum chamber 12 is closed and the bypass valve 42 to the oil diffusion pump 40 is opened.
- the high vacuum valve 26 is opened shortly after this and the vacuum chamber 12 is then pumped down by the oil diffusion pump 40 until the initial pressure of the process (high vacuum) is attained.
- the Meissner trap 20 cooling is turned on in order to boost the pump capacity for water vapor.
- the maximum initial pressure for the vapor-deposition process typically is 3 ⁇ 10 -3 Pa.
- the Meissner trap 20 is heated again after the deposition process, the high vacuum valve 26 is closed, and the vacuum chamber 12 is let down to atmosphere with an air inlet valve (not shown).
- full and fixed shields 44, 46 or masks are provided in the vacuum chamber 12 at positions facing the evaporation source 14 so as to shield the respective equipment against the evaporant particles travelling through the vacuum chamber 12 during the coating process.
- these shields 44, 46 have been omitted in Fig. 13 for illustrative purposes. According to Fig.
- the shield 44 for the Meissner trap 20 is composed of solid steel sheets forming a continuous wall in front of the Meissner trap 20, whereas the shield 46 for the high vacuum valve 26 is arranged at the entrance of the chamber appendage 28 and formed like a lamella grid with a fixed lamella angle so that the respective lamella portions directly face the evaporation source 14, as can be seen best in Fig. 14 .
- parts of housings 48 of the substrate heaters 22 shield the actual heating elements (not shown) thereof against undesired deposition of the evaporated material.
- the known shields 44, 46 and housings 48 safely protect the sensitive components against undesired contamination and related malfunctions, they also form a "rugged" interior surface portion of the vacuum chamber 12 with undercut areas and winding gas or vapor ways.
- This "rugged" interior surface portion of the vacuum chamber 12 however entails a certain gas/vapor flow resistance, so that the "pumping down" of the vacuum chamber 12 to the above-mentioned process vacuum can be quite time-consuming.
- JP 2007-332433 A discloses a vacuum vapor-deposition apparatus comprising two evaporation sources, wherein a shutter is provided which is pivotable about a rotary shaft between the evaporation sources for selectively covering one of the evaporation sources.
- the vacuum chamber of a vacuum vapor-deposition apparatus is divided by a wall into a first chamber volume and a second chamber volume. Assigned to each chamber volume are a respective pumping unit and a respective evaporation source (source of material).
- the wall has a recess centered with respect to the evaporation path between the evaporation source assigned to one of said chamber volumes and the substrate holder.
- the recess can be tightly plugged or cleared by a toggling mask actuated by an external toggling device.
- the closed shutter/mask serves to prevent contamination of one of the evaporation sources during operation of the other of the evaporation sources.
- document JP 2010-106289 A discloses a vacuum vapor-deposition apparatus comprising a shutter that can be rotated by a shutter drive mechanism about a rotary shaft between a shielding position in which it blocks the evaporation path between an evaporation source (crucible) and the substrates held by a substrate holder, and an open position in which it clears the evaporation path.
- the shutter is intended to either prevent deposition of the vaporized material on the substrates under unstable evaporation conditions, e.g. at the very beginning of the evaporation process, or allow deposition of the vaporized material on the substrates once the evaporation is stable, in order to achieve film formation of constant high quality on the substrates.
- documents US 5,413,688 , JP 10-251844 A , JP 61-64880 A and KR 10-2014-0081194 show further shutter arrangements in a chamber for vacuum vapor-deposition, which serve to shield of a viewport, a quartz sensor, film thickness monitor heads and a crystal sensor, respectively, with respect to the evaporation source.
- the invention accordingly has the object, starting from the prior art as outlined above and shown in Figs. 12 to 14 for instance, of creating a box coating apparatus for vacuum coating of substrates, in particular spectacle lenses, which is configured for enhancing vacuum procedures while keeping a high level of protection of sensitive parts of the apparatus from the deposition process, so that the box coating apparatus is especially suitable to be deployed within the frame of large-scale production of spectacle lenses.
- a box coating apparatus for vacuum coating of substrates in particular spectacle lenses, which comprises a vacuum chamber that can be evacuated by a pumping arrangement and contains an evaporation source for evaporating coating material, wherein a substrate holder for holding a plurality of substrates is disposed vis-à-vis to the evaporation source in the vacuum chamber so that coating material evaporated by the evaporation source can impinge on substrates held by the substrate holder, and wherein, besides the evaporation source and the substrate holder, at least one further functional component is provided, namely at least a Meissner trap and/or a high vacuum valve mechanism, to which in the vacuum chamber a shield arrangement is assigned, that is located between the evaporation source and the functional component so as to prevent coating material evaporated by the evaporation source from impinging on the functional component - the shield arrangement assigned to the Meissner trap and/or the high vacuum valve mechanism comprises a shutter portion which can selectively be transferred from a
- cover and “clear” in particular shall not be understood to be limiting as to the spatial order of the shutter portion and the remainder of the shield arrangement at issue with respect to the evaporation source.
- the shutter portion could also be located in front of the remainder of the shield arrangement as seen from the evaporation source toward the shield arrangement, or within the passage way leading through the shield arrangement.
- the basic idea of the present invention is to cover or shield one or more of the functional components of the box coating apparatus other than the evaporation source and the substrate holder, including at least the Meissner trap and/or the high vacuum valve mechanism, i.e. the functional components comprised in the pumping system of the box coating apparatus that are sensitive to thin film depositions, with an "intelligent mask system" that can be open or close depending on the process phase.
- the shutter portion of the shield arrangement can be kept completely open, i.e. remain in the open pumping position with a substantially cleared passage way for gases and vapor through the shield arrangement, thereby maximizing the conductance towards the pumping arrangement and therefore also increasing the speed of the pumping arrangement.
- the functional component at issue forms part of a group of functional components comprising at least the Meissner trap and the high vacuum valve mechanism, but not forming part of the invention also a heating device, a vacuum gauge, a deposition sensor device and/or an operator viewport into the vacuum chamber, also depending on the field of application of the box coating apparatus.
- the two main functional components of the box coating apparatus to be shielded with such an "intelligent mask system" are both the Meissner trap and the high vacuum valve region including the high vacuum valve mechanism.
- these two functional components have been protected by means of full and fixed masks as described before. This of course helps in preventing any deposition on the two sensitive functional components but is not an optimized solution that maximizes pumping speed during the pumping down phase.
- a related advantage of using the shield arrangement according to the invention for the Meissner trap lies in the fact that the efficiency of the Meissner trap can be increased because the passage way through the assigned shield arrangement, once cleared by the shutter portion, increases the likelihood that, within a given period of time, water molecules reach the trap surface and are frozen to it.
- a heating device e.g. electrical resistive top heaters that are used for heating up the vacuum chamber for vacuum leak tests or the like, can be uncovered during the pumping down phase and then can be masked and protected during the deposition with a further shield arrangement according to the invention.
- a vacuum gauge can be protected by a further shield arrangement according to the invention unless when fully exposed during process steps that require gas injection.
- a movable shutter portion of a further shield arrangement according to the invention can be opened and closed with optimized timings in order to minimize the exposition of the sensor to the deposition while sampling the deposition rate with a suitable frequency.
- a movable shutter portion of a further shield arrangement according to the invention can protect an operator viewport from deposition, and can be removed when the operator needs to look inside the vacuum chamber.
- the shield arrangement can further have at least one fixed shield element provided with at least one aperture, whereas the shutter portion comprises at least one movable shutter element provided with at least one masking area which is adapted in size and geometry to substantially cover the aperture in the shield element, wherein the shutter element can be moved relative to the shield element in order to selectively cover the aperture of the shield element with the masking area of the shutter element in the shielding position of the shutter portion, or uncover the aperture of the shield element by the masking area of the shutter element in the pumping position of the shutter portion so as to substantially clear the passage way through the aperture.
- the shutter element can be arranged either in front of the shield element or behind the shield element, the latter being currently preferred.
- This arrangement with complementary elements at any rate allows to switch between two positions, namely a maximum opening area or passage way and a minimal opening area or passage way (some minimal space between the shield element and the shutter element will always be there).
- the movement actuation however could also allow intermediate relative positioning of the two elements in order to regulate the conductance/protection level continuously.
- the shutter element of the shutter portion is preferably arranged to be linearly moved relative to the shield element of the shield arrangement.
- the shutter element can be arranged to be linearly movable toward and away from the shield element to cover or clear the passage way.
- the shutter element of the shutter portion is arranged to be moved in parallel with the shield element of the shield arrangement. This can be either an up/down movement of the shutter element, a lateral movement or any oblique movement thereof, also depending on the available installation situation and space.
- the shield arrangement can further have at least one fixed shield element provided with at least one opening area, whereas the shutter portion comprises at least one slat element which is located in or adjacent to (i.e.
- the opening area in front of or behind) the opening area and arranged to be pivoted about a pivot axis that is oriented transverse with respect to the opening area, wherein the slat element has a wide face side and a narrow edge side and can be pivoted about the pivot axis into a state in which its face side essentially faces the evaporation source in the shielding position of the shutter portion, or into a state in which a surface area of its edge side only restricts a free cross-section of the opening area of the shield element in the pumping position of the shutter portion so as to substantially clear the passage way through the opening area.
- this lamella-type arrangement in which the at least one slat element and the opening area of the shield element are complementary sized and shaped, at any rate allows to switch between two positions, namely a maximum opening cross-section or passage way (free cross-section through the fixed shield element minus the surface area of the narrow edge side of the slat element) and a minimal opening cross-section or passage way (some minimal gap between the slat element and the shield element will always be there).
- the movement actuation however could again also allow intermediate relative positioning of the two elements in order to regulate the conductance/protection level as desired.
- the shutter portion can comprise at least two slat elements located in or adjacent to the opening area and arranged to be pivoted about pivot axes extending in parallel and oriented transverse with respect to the opening area.
- the shutter portion can have a set of complementary slat elements as shields rotating all in the same direction (similarly to venetian blinds), or a set of complementary slat elements as shields rotating in different directions, or a set of slat elements as shields some fixed and some rotating, wherein all these arrangements allow to modify configuration, shape and total conductance of the shield (from a maximum open area to a minimum one, passing through intermediate positions) by rotating the slat elements either independently or dependently from each other.
- the slat elements of a set of slat elements are coupled by a connecting piece to be pivotable about their respective pivot axes at the same time and in the same direction of rotation. This also facilitates setting of a passage way with a defined cross-sectional area and main orientation.
- At least one slat element is biased by a spring element into the state in which a surface area of its edge side only restricts the free cross-section of the opening area of the shield element in the pumping position of the shutter portion. Accordingly, the open pumping position of the shutter portion is set as the normal condition so that the shutter portion needs to be operated only in case the related functional component is to be protected against deposition of the evaporated material.
- a corresponding spring bias can be provided for at least one of the movable shutter elements of the shield arrangement according to the above described first alternative.
- the shutter portion could be a solid flag that can change angular position about a vertically extending axis in front of the functional component to be protected.
- the shutter portion could be similar to camera (optical) mechanical shutters.
- the movable shutter portions could never have a fully closed gap with the remainder of the shield arrangement. A minimum opening will always be there since the parts at issue are not necessarily closing on each other with sealing measures (O-rings or gaskets), which are neither provided for nor necessary.
- the shutter portion or at least a part thereof can automatically be transferred from its closed shielding position to its open pumping position, and vice versa.
- automatic operation of the shield arrangement advantageously allows for remote control and preprogrammed routines as are desirable in the mass production of spectacle lenses in particular.
- the shutter portion or at least a part thereof can be operatively connected to an actuator that serves to automatically transfer the shutter portion or the part thereof from its closed shielding position to its open pumping position, and vice versa.
- the actuator can be a linear motion actuator or a rotary motion actuator, mainly depending on the type of the shield arrangement.
- the actuator can be located outside of the vacuum chamber.
- the out-of-vacuum arrangement not only allows for easy servicing of the actuator but also is advantageous with respect to a low risk of vacuum contamination within the vacuum chamber and as such contributes to reducing the pumping down time.
- the actuator can be operatively connected to the shutter portion or at least a part thereof via an air-vacuum feed-through, either of linear motion type or of rotational movement type, depending on the type of actuator used.
- the actuator preferably comprises a pneumatically actuated piston-cylinder-arrangement for selectively switching from the closed shielding position to the open pumping position of the shutter portion, and vice versa (two positions only), that is economically available.
- the arrangement can be such that the actuator is operatively connected to the above described connecting piece in order to simultaneously pivot the slat elements by one and the same actuator.
- this concept can be used where two or more shutter or slat elements are to be moved at the same time and in the same linear direction or sense of rotation, as the case may be.
- a box coating apparatus for vacuum coating of substrates (not shown in the drawings), particularly spectacle lenses, is denoted by 10 in Figs. 1 to 8 .
- box coating apparatus 10 generally has a vacuum chamber 12 which can be evacuated by a pumping arrangement in a manner known per se (cf. Fig. 14 at 25).
- the vacuum chamber 12 contains an evaporation source 14 for evaporating coating material.
- a substrate holder 16 for holding a plurality of substrates is disposed vis-à-vis to the evaporation source 14 in the vacuum chamber 12 so that the coating material evaporated by the evaporation source 14 can impinge on substrates held by the substrate holder 16.
- various functional components are provided in or adjacent to the vacuum chamber 12. These functional components include at least a Meissner trap 20 and a high vacuum valve mechanism 26 (cf. Figs. 3 and 14 ). As further functional components heating devices 22 (quartz lamp heating systems) are shown. Still further functional components that are not shown in the drawings comprise in a manner known per se a vacuum gauge, a deposition sensor device, an operator viewport into the vacuum chamber 12, etc.
- a first shield arrangement 50 is assigned to the high vacuum valve mechanism 26 and located between the evaporation source 14 and the high vacuum valve mechanism 26 at the chamber appendage 28 of the vacuum chamber 12, whereas a second shield arrangement 52 is associated with the Meissner trap 20 and arranged between the evaporation source 14 and the Meissner trap 20.
- each shield arrangement 50, 52 comprises a shutter portion 54, 56 which can selectively be transferred from a) a closed shielding position in which the shutter portion 54, 56 covers a passage way 58, 60 leading through the respective shield arrangement 50, 52, so that the shutter portion 54, 56 serves to shield the related functional component 20, 26 together with a remainder of the respective shield arrangement 50, 52, to b) an open pumping position in which the shutter portion 54, 56 substantially clears the passage way 58, 60 to allow essentially free passage for gases and vapor, thereby considerably reducing the time required for pumping down of the vacuum chamber 12 prior to the actual deposition process, and vice versa.
- the shutter portion 54, 56 i.e. parts thereof can automatically - as contrasted to manually - be transferred from the closed shielding position to the open pumping position, and vice versa.
- actuators 62 are provided and operatively connected to parts of the shutter portions 54, 56, which serve to automatically transfer the related parts of the shutter portions 54, 56 from the closed shielding position to the open pumping position, and vice versa.
- actuators 62 which are basically the same for the first shield arrangement 50 and the second shield arrangement 52 in the illustrated examples, will be explained later with reference to Figs. 10 and 11 taking the second shield arrangement 52 as example. It should be noted at this point already that, in the illustrated examples, all actuators 62 are located outside of the vacuum chamber 12 (see Fig. 1 ). Further, the exemplary actuators 62 without exception are operatively connected to the related shutter portion 54, 56 via a respective air-vacuum feed-through 64 that will be described as well.
- the first shield arrangement 50 further has three fixed shield elements 66, 68, 70 constructed from sheet metal parts that are suitably welded and screwed together.
- Each shield element 66, 68, 70 is provided with an opening area 72, 74, 76.
- two protective plates 78 are fixedly mounted to form kind of a lamella grid with a fixed lamella angle so that the respective protective plate 78 substantially faces the evaporation source 14.
- a grate 80 is mounted behind the shield elements 66, 68, 70, which in width and height extends across the shield elements 66, 68, 70.
- the shutter portion 54 of the first shield arrangement 50 has four slat elements 82 in total, which are located in the opening areas 72, 76 of the outer two shield elements 66, 70.
- the slat elements 82 are made of flat sheet material, and each have a substantially rectangular shape.
- the slat elements 82 are each arranged to be pivoted about a related pivot axis 84 that is oriented transverse with respect to the respective opening area 72, 76.
- two slat elements 82 are located in each opening area 72, 76 and arranged to be pivoted about pivot axes 84 extending in parallel to one another and oriented transverse with respect to the respective opening area 72, 76.
- Suitably designed bearing points 86 are provided on both lateral sides of each slat element 82.
- each slat element 82 has a wide face side 88 and a narrow edge side 90 and can be pivoted about the respective pivot axis 84 a) into a state in which the face side 88 essentially faces the evaporation source 14 in the shielding position of the shutter portion 54 (see Fig. 5 and the right-hand side slat elements 82 in Fig.
- each connecting piece 92 has two axially spaced linkage arms 94 which extend through the grate 80 to be suitably linked to an assigned bracket 96 attached to the respective slat element 82.
- the upper slat element 82 of each pair of slat elements 82 is biased by a spring element 98 into the state in which the surface area of its edge side 90 only restricts the free cross-section of the respective opening area 72, 76 of the related shield element 66, 70 in the pumping position of the shutter portion 54.
- the spring element 98 is in the form of a screw tension spring, with an upper end being fixed to the respective shield element 66, 70 via a U-bolt 100, and a lower end suitably linked to the bracket 96 of the related upper slat element 82.
- the connecting piece 92 which is formed as sheet metal part as well, further has a bent upper portion (cf. Fig. 2 ) that defines a contact surface 102 for the associated actuator 62.
- the actuator 62 has a connecting shaft 104 formed in one or multiple parts that slidingly protrudes into the chamber appendage 28 through the air-vacuum feed-through 64.
- the free end of the connecting shaft 104 carries a mounting bracket 106 which rotatably mounts a roller element 108.
- the roller element 108 abuts on the contact surface 102 of the connecting piece 92.
- the actuator 62 is operatively connected to the connecting piece 92 so as to simultaneously pivot the related slat elements 82 by one and the same actuator 62.
- the pairs of slat elements 82 can be operated independently from each other because each pair of slat elements 82 has its own actuator 62. This feature for example may be used to generate a flow with a defined twist in the vacuum chamber 12 at the very beginning of the pumping down phase to speed up the evacuation.
- the second shield arrangement 52 assigned to the Meissner trap 20 has three fixed shield elements 110, 112, 114 of different size, which are formed as a substantially flat, rectangular sheet metal part each.
- the shield elements 110, 112, 114 are arranged in an angled configuration that essentially follows the C-shaped curvature of the Meissner trap 20.
- Each shield element 110, 112, 114 is provided with four slit-like apertures 116 arranged in parallel to one another and each extending in the width direction of the respective shield element 110, 112, 114.
- the shutter portion 56 of the second shield arrangement 52 comprises three movable shutter elements 118, 120, 122 respectively assigned to the shield elements 110, 112, 114 and arranged between the shield elements 110, 112, 114 and the Meissner trap 20.
- each shutter element 118, 120, 122 is provided with masking areas 124 which are adapted in size and geometry to substantially cover the related apertures 116 in the respective shield element 110, 112, 114.
- the masking areas 124 can be made up of metal strips which are suitably mounted in a separate frame 126 of each shutter element 118, 120, 122.
- Figs. 7 and 8 further illustrate, taking the middle shield element 112 and the associated shutter element 120 as example, that the shutter element 118, 120, 122 assigned to the respective shield element 110, 112, 114 can be moved relative to the respective shield element 110, 112, 114 by way of the related actuator 62 in order to selectively a) cover the apertures 116 in the respective shield element 110, 112, 114 with the masking areas 124 of the assigned shutter element 118, 120, 122 in the shielding position of the shutter portion 56 of the second shield arrangement 52 (see Fig.
- the shutter elements 118, 120, 122 of the shutter portion 56 are arranged to be linearly moved relative to the related shield elements 110, 112, 114, and in parallel therewith. Suitable provision is made (not detailed in the drawings) that the shutter elements 118, 120, 122 cannot rotate about the axial movement axes of the related actuators 62 as they are linearly moved.
- FIG. 11 shows the actuator 62 and the air-vacuum feed-through 64 in a state mounted to a wall 128 of the vacuum chamber 12.
- the wall 128 of the vacuum chamber 12 is provided with a through bore 130, in which a metallic sleeve 132 is fixedly and sealingly mounted by welding (welding bead 134).
- the sleeve 132 has an outer end provided with a collar 136 that serves to sealingly clamp to the sleeve 132 an adapter plate 138 via an upper collar 139 thereof by means of a clamp 140 and an O-ring 142.
- a bushing 144 having an enlarged counter bearing portion 145 at a lower end thereof is tightly accommodated in a stepped bore 146 through the adapter plate 138 and extends through the sleeve 132 with an upper end, where the bushing 144 is secured to the sleeve 132 and the adapter plate 138 by a retaining ring 148.
- the bushing 144 itself is provided with a stepped bore 150 for accommodating a sliding bush 152, which is secured in the stepped bore 150 of the bushing 144 by another retaining ring 154 and serves to guide the connecting shaft 104 of the actuator 62 in the manner of a slide bearing.
- the adapter plate 138 generally has a rectangular shape as seen from above and forms part of a mounting arrangement that further comprises a U-shaped bracket 156 bolted to the adapter plate 138.
- a base portion 158 of the U-shaped bracket 156 serves to mount a flange plate 160 provided for flange-mounting of a pneumatically actuated piston-cylinder-arrangement 162 of the actuator 62.
- the piston-cylinder-arrangement 162 has a piston 164 slidingly arranged in a cylinder chamber 166 of a cylinder housing 167 of the piston-cylinder-arrangement 162. Pressurized air can be introduced into the cylinder chamber 166 via pressurized air connections 168, 170 provided in the cylinder housing 167. Accordingly, the piston 164 can pneumatically be acted upon either from below or from above in Fig. 11 , depending on the desired direction of movement of the connecting shaft 104.
- a piston rod 172 is attached to the piston 164, which extends through related bores in the cylinder housing 167, the flange plate 160 and the base portion 158 of the U-shaped bracket 156 to be connected to the connecting shaft 104 via a screw connection.
- a free end of the piston rod 172 is provided with a threaded end portion 174 that is screwed into a threaded bore 175 at a face side of the connecting shaft 104 and secured in place by a nut 176 and a lock nut 177.
- a metallic bellows 178 is provided, that has two end ring portions 179, 180 with a substantially U-shaped cross section, which are sealingly attached to a bellows section 182 inbetween.
- the connecting shaft 104 is provided with a collar 184 near the lower end thereof, which serves to sealingly clamp to the connecting shaft 104 the lower end ring portion 180 of the metallic bellows 178 by means of a clamp 185 and an O-ring 186.
- the upper end ring portion 179 of the metallic bellows 178 is sealingly clamped to a lower collar 188 of the adapter plate 138 by means of another clamp 189 and an O-ring 190.
- the piston-cylinder-arrangement 162 of the actuator 62 can be pneumatically loaded via the pressurized air connections 168, 170 to either lift or lower the connecting shaft 104 via the piston 164 and the piston rod 172.
- the related shutter portion 54, 56 can selectively be switched from the closed shielding position to the open pumping position, and vice versa, depending on the mounting orientation of the actuator 62. In doing so any vacuum within the vacuum chamber 12 will be present down to or up to the collar 184 of the connecting shaft 104, as the case may be depending on the mounting orientation of the actuator 62, but cannot escape because of the air-vacuum feed-through 64 with its metallic bellows 178.
- a box coating apparatus for coating of substrates comprises a vacuum chamber which contains an evaporation source.
- a substrate holder is disposed vis-à-vis to the evaporation source so that evaporated material can impinge on substrates held by the substrate holder.
- at least one further functional component is provided, namely a Meissner trap and/or a high vacuum valve mechanism, to which a shield arrangement is assigned to prevent evaporated material from impinging on said component.
- This shield arrangement has a shutter portion which can be transferred from a closed shielding position in which it covers a passage way through the shield arrangement and serves to shield said component, to an open pumping position in which it substantially clears the passage way to allow essentially free passage for gases and vapor, and vice versa.
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Ophthalmology & Optometry (AREA)
- Physics & Mathematics (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Physical Vapour Deposition (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP17000280.2A EP3366804B1 (en) | 2017-02-22 | 2017-02-22 | Box coating apparatus for vacuum coating of substrates, in particular spectacle lenses |
US15/900,988 US10913999B2 (en) | 2017-02-22 | 2018-02-21 | Box coating apparatus for vacuum coating of substrates, in particular spectacle lenses |
KR1020180021293A KR102557106B1 (ko) | 2017-02-22 | 2018-02-22 | 기재, 특히 안경 렌즈의 진공 코팅을 위한 박스 코팅 장치 |
CN201810154032.5A CN108456856B (zh) | 2017-02-22 | 2018-02-22 | 用于基材的真空涂布的箱式涂布设备 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP17000280.2A EP3366804B1 (en) | 2017-02-22 | 2017-02-22 | Box coating apparatus for vacuum coating of substrates, in particular spectacle lenses |
Publications (2)
Publication Number | Publication Date |
---|---|
EP3366804A1 EP3366804A1 (en) | 2018-08-29 |
EP3366804B1 true EP3366804B1 (en) | 2022-05-11 |
Family
ID=58266801
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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EP17000280.2A Active EP3366804B1 (en) | 2017-02-22 | 2017-02-22 | Box coating apparatus for vacuum coating of substrates, in particular spectacle lenses |
Country Status (4)
Country | Link |
---|---|
US (1) | US10913999B2 (ko) |
EP (1) | EP3366804B1 (ko) |
KR (1) | KR102557106B1 (ko) |
CN (1) | CN108456856B (ko) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
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CN110184569B (zh) * | 2019-07-03 | 2024-04-02 | 江苏万新光学有限公司 | 一种带可调节电子枪挡板的镀膜机 |
CN110512177B (zh) * | 2019-10-11 | 2021-10-12 | 泉州台商投资区集瑞科技有限公司 | 一种车灯芯反光镜蒸汽镀膜装置 |
EP4112769A1 (en) | 2021-06-30 | 2023-01-04 | Satisloh AG | Holder for holding a substrate, in particular a spectacle lens, during vacuum coating thereof in a box coating apparatus and device for loading/unloading the substrate into/from such holder |
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2017
- 2017-02-22 EP EP17000280.2A patent/EP3366804B1/en active Active
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2018
- 2018-02-21 US US15/900,988 patent/US10913999B2/en active Active
- 2018-02-22 KR KR1020180021293A patent/KR102557106B1/ko active IP Right Grant
- 2018-02-22 CN CN201810154032.5A patent/CN108456856B/zh active Active
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EP0692556A1 (en) * | 1994-07-12 | 1996-01-17 | Sumitomo Electric Industries, Ltd. | K cell type vapor source and shutter |
US20100282710A1 (en) * | 2009-05-07 | 2010-11-11 | Applied Materials, Inc. | Shuttered gate valve |
Also Published As
Publication number | Publication date |
---|---|
KR20180097163A (ko) | 2018-08-30 |
EP3366804A1 (en) | 2018-08-29 |
US10913999B2 (en) | 2021-02-09 |
KR102557106B1 (ko) | 2023-07-20 |
CN108456856A (zh) | 2018-08-28 |
US20180237907A1 (en) | 2018-08-23 |
CN108456856B (zh) | 2021-10-22 |
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