EP3127673A4 - Verfahren zum schneiden eines substrats aus brüchigem material - Google Patents

Verfahren zum schneiden eines substrats aus brüchigem material Download PDF

Info

Publication number
EP3127673A4
EP3127673A4 EP15772939.3A EP15772939A EP3127673A4 EP 3127673 A4 EP3127673 A4 EP 3127673A4 EP 15772939 A EP15772939 A EP 15772939A EP 3127673 A4 EP3127673 A4 EP 3127673A4
Authority
EP
European Patent Office
Prior art keywords
material substrate
cutting brittle
brittle
cutting
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP15772939.3A
Other languages
English (en)
French (fr)
Other versions
EP3127673B1 (de
EP3127673A1 (de
Inventor
Hiroshi Soyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsuboshi Diamond Industrial Co Ltd
Original Assignee
Mitsuboshi Diamond Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Industrial Co Ltd filed Critical Mitsuboshi Diamond Industrial Co Ltd
Priority to EP18205159.9A priority Critical patent/EP3517269A1/de
Publication of EP3127673A1 publication Critical patent/EP3127673A1/de
Publication of EP3127673A4 publication Critical patent/EP3127673A4/de
Application granted granted Critical
Publication of EP3127673B1 publication Critical patent/EP3127673B1/de
Not-in-force legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/10—Glass-cutting tools, e.g. scoring tools
    • C03B33/105—Details of cutting or scoring means, e.g. tips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/225—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising for scoring or breaking, e.g. tiles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mining & Mineral Resources (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Dicing (AREA)
EP15772939.3A 2014-03-31 2015-03-12 Verfahren zum schneiden eines substrats aus brüchigem material Not-in-force EP3127673B1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP18205159.9A EP3517269A1 (de) 2014-03-31 2015-03-12 Verfahren zum schneiden eines substrats aus brüchigem material

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014074089 2014-03-31
PCT/JP2015/057316 WO2015151755A1 (ja) 2014-03-31 2015-03-12 脆性材料基板の分断方法

Related Child Applications (2)

Application Number Title Priority Date Filing Date
EP18205159.9A Division EP3517269A1 (de) 2014-03-31 2015-03-12 Verfahren zum schneiden eines substrats aus brüchigem material
EP18205159.9A Division-Into EP3517269A1 (de) 2014-03-31 2015-03-12 Verfahren zum schneiden eines substrats aus brüchigem material

Publications (3)

Publication Number Publication Date
EP3127673A1 EP3127673A1 (de) 2017-02-08
EP3127673A4 true EP3127673A4 (de) 2017-12-06
EP3127673B1 EP3127673B1 (de) 2018-12-12

Family

ID=54240087

Family Applications (2)

Application Number Title Priority Date Filing Date
EP18205159.9A Withdrawn EP3517269A1 (de) 2014-03-31 2015-03-12 Verfahren zum schneiden eines substrats aus brüchigem material
EP15772939.3A Not-in-force EP3127673B1 (de) 2014-03-31 2015-03-12 Verfahren zum schneiden eines substrats aus brüchigem material

Family Applications Before (1)

Application Number Title Priority Date Filing Date
EP18205159.9A Withdrawn EP3517269A1 (de) 2014-03-31 2015-03-12 Verfahren zum schneiden eines substrats aus brüchigem material

Country Status (7)

Country Link
US (2) US10927031B2 (de)
EP (2) EP3517269A1 (de)
JP (5) JP6249091B2 (de)
KR (1) KR101847921B1 (de)
CN (2) CN106232311B (de)
TW (2) TWI680106B (de)
WO (1) WO2015151755A1 (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI680106B (zh) 2014-03-31 2019-12-21 日商三星鑽石工業股份有限公司 脆性材料基板之分斷方法
EP3150561B1 (de) * 2014-05-30 2022-07-06 Mitsuboshi Diamond Industrial Co., Ltd. Verfahren zum spalten eines brüchigen substrats
JP6589381B2 (ja) * 2015-05-29 2019-10-16 三星ダイヤモンド工業株式会社 脆性材料基板における垂直クラックの形成方法および脆性材料基板の分断方法
TWI605024B (zh) * 2015-08-07 2017-11-11 Mitsuboshi Diamond Ind Co Ltd Breaking method of brittle substrate
TW202039193A (zh) * 2016-02-26 2020-11-01 日商三星鑽石工業股份有限公司 脆性基板之分斷方法
JP6682907B2 (ja) * 2016-02-26 2020-04-15 三星ダイヤモンド工業株式会社 脆性基板の分断方法
JP6645577B2 (ja) 2016-05-25 2020-02-14 三星ダイヤモンド工業株式会社 脆性基板の分断方法
JP6755037B2 (ja) * 2016-07-28 2020-09-16 三星ダイヤモンド工業株式会社 脆性基板の分断方法
CN106542727B (zh) * 2016-10-10 2019-03-05 华南理工大学 一种微磨削尖端精准诱导的曲面镜面脆裂成型方法
JP2018150191A (ja) * 2017-03-13 2018-09-27 日本電気硝子株式会社 ガラス板の製造方法
JP6955754B2 (ja) 2017-07-25 2021-10-27 三星ダイヤモンド工業株式会社 ダイヤモンド刃先および基板分断方法
US11701739B2 (en) * 2019-04-12 2023-07-18 Skyworks Solutions, Inc. Method of optimizing laser cutting of wafers for producing integrated circuit dies
JP7137238B2 (ja) * 2020-09-30 2022-09-14 三星ダイヤモンド工業株式会社 脆性材料基板の加工方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3138875A (en) * 1961-09-11 1964-06-30 Tempress Res Co Inc Diamond scriber
US3230625A (en) * 1961-11-17 1966-01-25 Siemens Ag Method and apparatus for scoring semiconductor plates to be broken into smaller bodies
US3680213A (en) * 1969-02-03 1972-08-01 Karl O Reichert Method of grooving semiconductor wafer for the dividing thereof
JP2003183040A (ja) * 2001-12-18 2003-07-03 Oputo System:Kk ポイントカッター並びにその使用の方法及び装置
US20090183617A1 (en) * 2005-12-14 2009-07-23 Namiki Seimitsu Houseki Kabushiki Kaisha Shank and diamond scriber assembled therewith

Family Cites Families (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2812579A (en) * 1953-06-15 1957-11-12 William M Arck Adjustable glass-cutting tool head
BE797819A (fr) * 1972-04-10 1973-10-05 Ppg Industries Inc Procede et appareil de decoupe de verre en utilisant des fissures creees en dessous de la surface et articles obtenus
JP2712723B2 (ja) * 1990-03-07 1998-02-16 松下電器産業株式会社 レーザ切断方法
JPH04276645A (ja) * 1991-03-04 1992-10-01 Toshiba Corp 化合物半導体ウエーハのダイシング方法
JP2603779B2 (ja) * 1992-01-14 1997-04-23 松下電工株式会社 プリント配線板
JPH07240571A (ja) * 1994-02-28 1995-09-12 Kyocera Corp 分割溝を有するセラミック基板の製造方法
JP3074143B2 (ja) 1995-11-06 2000-08-07 三星ダイヤモンド工業株式会社 ガラスカッターホイール
JP3027768U (ja) * 1996-02-08 1996-08-13 株式会社アールイシダ 健康スリッパ
US5963289A (en) * 1997-10-27 1999-10-05 S Vision Asymmetrical scribe and separation method of manufacturing liquid crystal devices on silicon wafers
JP2000247671A (ja) * 1999-03-04 2000-09-12 Takatori Corp ガラスの分断方法
JP4203177B2 (ja) 1999-03-18 2008-12-24 株式会社ベルデックス スクライブ方法および装置
JP2003002676A (ja) * 2001-06-19 2003-01-08 Seiko Epson Corp 基板の分割方法及び液晶装置の製造方法
RU2206525C2 (ru) * 2001-07-25 2003-06-20 Кондратенко Владимир Степанович Способ резки хрупких неметаллических материалов
JP2003114420A (ja) * 2001-10-03 2003-04-18 Matsushita Electric Ind Co Ltd 液晶表示パネルの製造方法
JP2003292332A (ja) * 2002-03-29 2003-10-15 Nakamura Tome Precision Ind Co Ltd スクライブ方法及びスクライブ装置
FR2839508B1 (fr) * 2002-05-07 2005-03-04 Saint Gobain Vitrage decoupe sans rompage
CN1758993B (zh) 2003-01-29 2012-03-21 三星宝石工业株式会社 基板切割设备和基板切割方法
JP4550457B2 (ja) * 2004-03-26 2010-09-22 ルネサスエレクトロニクス株式会社 半導体装置及びその製造方法
KR101164856B1 (ko) * 2005-07-06 2012-07-11 미쓰보시 다이야몬도 고교 가부시키가이샤 취성재료용 스크라이빙 휠의 제조방법
DE102005046479B4 (de) * 2005-09-28 2008-12-18 Infineon Technologies Austria Ag Verfahren zum Spalten von spröden Materialien mittels Trenching Technologie
JP2007331983A (ja) 2006-06-15 2007-12-27 Sony Corp ガラスのスクライブ方法
JP2008201629A (ja) 2007-02-21 2008-09-04 Epson Imaging Devices Corp 電気光学装置の製造方法、基板の分断方法、及び、基板分断装置
JP5450964B2 (ja) * 2008-02-29 2014-03-26 三星ダイヤモンド工業株式会社 スクライブ装置及びスクライブ方法
CN102026926B (zh) * 2008-04-14 2013-06-05 三星钻石工业股份有限公司 脆性材料基板的加工方法
JP5832064B2 (ja) * 2009-01-30 2015-12-16 三星ダイヤモンド工業株式会社 カッター及びそれを用いた脆性材料基板の分断方法
JP2011054709A (ja) * 2009-09-01 2011-03-17 Disco Abrasive Syst Ltd スクライバシャンク調整方法
JP2011121817A (ja) * 2009-12-10 2011-06-23 Seiko Instruments Inc 接合ガラスの切断方法、パッケージの製造方法、パッケージ、圧電振動子、発振器、電子機器及び電波時計
US8802479B2 (en) * 2010-06-03 2014-08-12 NuvoSun, Inc. Solar cell interconnection method using a flat metallic mesh
KR101247571B1 (ko) 2010-06-14 2013-03-26 미쓰보시 다이야몬도 고교 가부시키가이샤 취성 재료 기판의 스크라이브 방법
JP5210356B2 (ja) 2010-06-14 2013-06-12 三星ダイヤモンド工業株式会社 脆性材料基板のスクライブ方法
JP2012012238A (ja) * 2010-06-30 2012-01-19 Mitsuboshi Diamond Industrial Co Ltd ホイール間距離設定治具
JP5118736B2 (ja) * 2010-09-28 2013-01-16 三星ダイヤモンド工業株式会社 スクライブ方法及びスクライビングホイール
TWI498293B (zh) * 2011-05-31 2015-09-01 Mitsuboshi Diamond Ind Co Ltd 劃線方法、鑽石尖、劃線裝置
JP5966564B2 (ja) * 2011-06-08 2016-08-10 三星ダイヤモンド工業株式会社 スクライビングホイール及びスクライブ方法
JP2013010644A (ja) 2011-06-28 2013-01-17 Mitsuboshi Diamond Industrial Co Ltd ガラス基板のスクライブ方法
TWI474983B (zh) * 2011-10-04 2015-03-01 Mitsuboshi Diamond Ind Co Ltd Scoring Method and Breaking Method of Mother Substrate
JP2013089622A (ja) * 2011-10-13 2013-05-13 Mitsuboshi Diamond Industrial Co Ltd 半導体基板のブレイク方法
US8723314B2 (en) * 2012-02-29 2014-05-13 Advanced Micro Devices, Inc. Semiconductor workpiece with backside metallization and methods of dicing the same
US10351460B2 (en) * 2012-05-22 2019-07-16 Corning Incorporated Methods of separating strengthened glass sheets by mechanical scribing
JP2014004812A (ja) * 2012-06-27 2014-01-16 Mitsuboshi Diamond Industrial Co Ltd カッティングツール及びこれを用いたスクライブ方法並びにスクライブ装置
JP5912927B2 (ja) * 2012-06-29 2016-04-27 三星ダイヤモンド工業株式会社 基板加工システム及びこれに用いるチップホルダの取付方法
US9651627B2 (en) * 2013-03-29 2017-05-16 Stmicroelectronics Pte Ltd. Accumulated power consumption sensor: application in smart batteries systems
US9236351B2 (en) * 2013-10-09 2016-01-12 Taiwan Semiconductor Manufacturing Company Ltd. Semiconductor wafer device
TWI680106B (zh) 2014-03-31 2019-12-21 日商三星鑽石工業股份有限公司 脆性材料基板之分斷方法
KR20170041378A (ko) * 2015-10-07 2017-04-17 삼성전자주식회사 기판 측정 방법 및 이를 이용한 반도체 장치 제조 방법

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3138875A (en) * 1961-09-11 1964-06-30 Tempress Res Co Inc Diamond scriber
US3230625A (en) * 1961-11-17 1966-01-25 Siemens Ag Method and apparatus for scoring semiconductor plates to be broken into smaller bodies
US3680213A (en) * 1969-02-03 1972-08-01 Karl O Reichert Method of grooving semiconductor wafer for the dividing thereof
JP2003183040A (ja) * 2001-12-18 2003-07-03 Oputo System:Kk ポイントカッター並びにその使用の方法及び装置
US20090183617A1 (en) * 2005-12-14 2009-07-23 Namiki Seimitsu Houseki Kabushiki Kaisha Shank and diamond scriber assembled therewith

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
ANONYMOUS: "Glasschneider", 29 October 2013 (2013-10-29), XP055419231, Retrieved from the Internet <URL:https://de.wikipedia.org/w/index.php?title=Glasschneider&oldid=123936432> [retrieved on 20171025] *
DATABASE WPI Week 200349, 3 July 2003 Derwent World Patents Index; AN 2003-519309, XP002775064 *
See also references of WO2015151755A1 *

Also Published As

Publication number Publication date
TWI680106B (zh) 2019-12-21
CN106232311A (zh) 2016-12-14
TW201536700A (zh) 2015-10-01
EP3517269A1 (de) 2019-07-31
EP3127673B1 (de) 2018-12-12
TWI648231B (zh) 2019-01-21
JPWO2015151755A1 (ja) 2017-04-13
JP2017209999A (ja) 2017-11-30
WO2015151755A1 (ja) 2015-10-08
US20170113960A1 (en) 2017-04-27
JP6583644B2 (ja) 2019-10-02
EP3127673A1 (de) 2017-02-08
US20200189957A1 (en) 2020-06-18
KR20160126072A (ko) 2016-11-01
JP6508263B2 (ja) 2019-05-08
CN109455919A (zh) 2019-03-12
CN106232311B (zh) 2018-11-23
US10927031B2 (en) 2021-02-23
JP6249091B2 (ja) 2017-12-20
CN109455919B (zh) 2022-03-08
JP2017202975A (ja) 2017-11-16
KR101847921B1 (ko) 2018-04-11
JP2017209998A (ja) 2017-11-30
JP6493456B2 (ja) 2019-04-03
JP2017202686A (ja) 2017-11-16
TW201902843A (zh) 2019-01-16
JP6508262B2 (ja) 2019-05-08

Similar Documents

Publication Publication Date Title
EP3338105A4 (de) Verfahren zur beschleunigungsmessergestützten navigation
EP3398960A4 (de) Verfahren zur herstellung von sermaglutid
EP3186062A4 (de) Verfahren zur herstellung eines objekts
EP3127673A4 (de) Verfahren zum schneiden eines substrats aus brüchigem material
EP3276578A4 (de) Verfahren zur darstellung eines objekts
EP3321272A4 (de) Verfahren zur herstellung von l-bpa
EP3231545A4 (de) Lötverfahren
EP3214072A4 (de) Verfahren zur herstellung von caprolactam
EP3227023B8 (de) Verfahren zur tropfenerzeugung
EP3142667A4 (de) Verfahren zur hemmung von nekroptose
EP3106250A4 (de) Schneidwerkzeug
EP3173169A4 (de) Beschichtetes schneidewerkzeug
EP3196196A4 (de) Verfahren zur herstellung von calcobutrol
EP3100806A4 (de) Beschichtetes schneidewerkzeug
EP3195959A4 (de) Beschichtetes schneidwerkzeug
EP3093090A4 (de) Verfahren zum entwurf von schnittbedingungen zum schneiden
EP3127680A4 (de) Verfahren zur herstellung einer flasche
EP3150561A4 (de) Verfahren zum spalten eines brüchigen substrats
EP3246343A4 (de) Verfahren zur herstellung von polyolefin
EP3239300A4 (de) Verfahren zur herstellung von stallimycin
EP3241837A4 (de) Verfahren zur herstellung von sofosbuvir-kristallform-6
EP3214922A4 (de) Verfahren zur pflanzenverbesserung
EP3188877A4 (de) Schneidwerkzeug
EP3442984A4 (de) Verfahren für den nachweis von bordetella
EP3109246A4 (de) Thiopyranoseverbindung und verfahren zur herstellung davon

Legal Events

Date Code Title Description
STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE INTERNATIONAL PUBLICATION HAS BEEN MADE

PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE

17P Request for examination filed

Effective date: 20160926

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

AX Request for extension of the european patent

Extension state: BA ME

DAV Request for validation of the european patent (deleted)
DAX Request for extension of the european patent (deleted)
REG Reference to a national code

Ref country code: DE

Ref legal event code: R079

Ref document number: 602015021456

Country of ref document: DE

Free format text: PREVIOUS MAIN CLASS: B28D0005000000

Ipc: B28D0001220000

A4 Supplementary search report drawn up and despatched

Effective date: 20171107

RIC1 Information provided on ipc code assigned before grant

Ipc: C03B 33/10 20060101ALI20171027BHEP

Ipc: B28D 5/00 20060101ALI20171027BHEP

Ipc: B28D 1/22 20060101AFI20171027BHEP

GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: GRANT OF PATENT IS INTENDED

INTG Intention to grant announced

Effective date: 20180629

GRAS Grant fee paid

Free format text: ORIGINAL CODE: EPIDOSNIGR3

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE PATENT HAS BEEN GRANTED

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

REG Reference to a national code

Ref country code: GB

Ref legal event code: FG4D

REG Reference to a national code

Ref country code: CH

Ref legal event code: EP

REG Reference to a national code

Ref country code: AT

Ref legal event code: REF

Ref document number: 1075344

Country of ref document: AT

Kind code of ref document: T

Effective date: 20181215

REG Reference to a national code

Ref country code: DE

Ref legal event code: R096

Ref document number: 602015021456

Country of ref document: DE

REG Reference to a national code

Ref country code: IE

Ref legal event code: FG4D

REG Reference to a national code

Ref country code: NL

Ref legal event code: MP

Effective date: 20181212

REG Reference to a national code

Ref country code: LT

Ref legal event code: MG4D

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: ES

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20181212

Ref country code: LV

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20181212

Ref country code: HR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20181212

Ref country code: FI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20181212

Ref country code: BG

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190312

Ref country code: NO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190312

Ref country code: LT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20181212

REG Reference to a national code

Ref country code: AT

Ref legal event code: MK05

Ref document number: 1075344

Country of ref document: AT

Kind code of ref document: T

Effective date: 20181212

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: RS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20181212

Ref country code: SE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20181212

Ref country code: GR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190313

Ref country code: AL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20181212

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: NL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20181212

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: PT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190412

Ref country code: IT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20181212

Ref country code: CZ

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20181212

Ref country code: PL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20181212

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190412

Ref country code: RO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20181212

Ref country code: SK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20181212

Ref country code: EE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20181212

Ref country code: SM

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20181212

REG Reference to a national code

Ref country code: DE

Ref legal event code: R097

Ref document number: 602015021456

Country of ref document: DE

PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20181212

Ref country code: DK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20181212

Ref country code: AT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20181212

Ref country code: MC

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20181212

REG Reference to a national code

Ref country code: CH

Ref legal event code: PL

26N No opposition filed

Effective date: 20190913

GBPC Gb: european patent ceased through non-payment of renewal fee

Effective date: 20190312

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LU

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20190312

REG Reference to a national code

Ref country code: BE

Ref legal event code: MM

Effective date: 20190331

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20190312

Ref country code: CH

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20190331

Ref country code: GB

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20190312

Ref country code: LI

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20190331

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: BE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20190331

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: TR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20181212

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MT

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20190312

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: CY

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20181212

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: HU

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT; INVALID AB INITIO

Effective date: 20150312

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: DE

Payment date: 20220203

Year of fee payment: 8

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: FR

Payment date: 20220209

Year of fee payment: 8

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20181212

REG Reference to a national code

Ref country code: DE

Ref legal event code: R119

Ref document number: 602015021456

Country of ref document: DE

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: FR

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20230331

Ref country code: DE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20231003