EP3001854A1 - Dispositif d'éclairage et procédé de montage d'un moyen lumineux semi-conducteur d'un dispositif d'éclairage - Google Patents

Dispositif d'éclairage et procédé de montage d'un moyen lumineux semi-conducteur d'un dispositif d'éclairage

Info

Publication number
EP3001854A1
EP3001854A1 EP14723453.8A EP14723453A EP3001854A1 EP 3001854 A1 EP3001854 A1 EP 3001854A1 EP 14723453 A EP14723453 A EP 14723453A EP 3001854 A1 EP3001854 A1 EP 3001854A1
Authority
EP
European Patent Office
Prior art keywords
lighting device
rivet
base body
housing part
upper shell
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP14723453.8A
Other languages
German (de)
English (en)
Inventor
Andreas Ritzenhoff
Lutz ENGEL
Jörg RACHE
Oliver Arnold
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seidel GmbH and Co KG
Original Assignee
Seidel GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seidel GmbH and Co KG filed Critical Seidel GmbH and Co KG
Publication of EP3001854A1 publication Critical patent/EP3001854A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89—Metals
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/90—Methods of manufacture
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V15/00—Protecting lighting devices from damage
    • F21V15/01—Housings, e.g. material or assembling of housing parts
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/005—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages with keying means, i.e. for enabling the assembling of component parts in distinctive positions, e.g. for preventing wrong mounting
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/16—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by deformation of parts; Snap action mounting
    • F21V17/164—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by deformation of parts; Snap action mounting the parts being subjected to bending, e.g. snap joints
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/005—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by permanent fixing means, e.g. gluing, riveting or embedding in a potting compound
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/0055—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by screwing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F21V29/713—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements in direct thermal and mechanical contact of each other to form a single system
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
    • F21V3/06—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material
    • F21V3/062—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material the material being plastics
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/238—Arrangement or mounting of circuit elements integrated in the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • F21V23/006—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate being distinct from the light source holder
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • F21V7/0008—Reflectors for light sources providing for indirect lighting
    • F21V7/0016—Reflectors for light sources providing for indirect lighting on lighting devices that also provide for direct lighting, e.g. by means of independent light sources, by splitting of the light beam, by switching between both lighting modes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the invention relates to a lighting device with at least one semiconductor lamp and a housing in which the semiconductor lamp is accommodated, wherein in the housing a metallic base body is arranged, which carries the semiconductor lamp.
  • the invention further relates to a method for mounting a semiconductor lamp of a lighting device.
  • Luminous devices with semiconductor lamps are characterized by a high specific luminosity and thus low energy consumption and by a long life. In operation, the semiconductor bulbs must be cooled, since both the lifetime and the effectiveness achieved decreases with the temperature of the lamps. With the increasing light output of the semiconductor lamps and thus also increasing electrical power consumption, the need for effective cooling of the semiconductor lamps is also increasing.
  • a driver module for the semiconductor light-emitting means also referred to as a connection module, is frequently arranged in the housing of the lighting device and provides a current suitable for controlling the semiconductor light-emitting means.
  • an optical element for example a reflector and / or a lens arrangement, is optionally provided to achieve a desired spatial radiation characteristic.
  • retrofit lighting devices which in their case of so-called retrofit lighting devices, which in their case of so-called retrofit lighting devices, which in their
  • the semiconductor lamp of the lighting device on a carrier board on which one or more light emitting diodes (LEDs - light emitting diodes) are mounted.
  • the carrier board carries and contacts the LEDs. she further serves to dissipate the heat emitted by the LEDs to a heat sink.
  • a lighting device of the type mentioned in which the semiconductor light-emitting means is fixed on a plastic hollow body, which is arranged within the lighting device and creates a cavity for receiving the driver module.
  • a metallic heat sink is placed, on which the driver module is placed.
  • a plastic pin is formed, which projects through openings of the heat sink and the applied carrier board and the free end is hot deformed, so that a rivet is formed. With this rivet, the carrier board is fixed together with the underlying heat sink on the plastic body.
  • the heat sink is a separate element that must be set in addition to the carrier board on the plastic body. Due to the hot deformation of the plastic pin, however, it can not be ensured that the created connection also exerts a contact pressure on the carrier board in the cooled state, which ensures a good heat transfer to the heat sink.
  • a lighting device of the type mentioned above is characterized in that the semiconductor light-emitting means is fixed by means of a metallic rivet on the metallic base body.
  • a metallic rivet provides a secure attachment that can be easily automated and thus executed quickly. That can.
  • the attachment via a positive connection during riveting is also elastic with a suitable choice of material, so that even with thermal expansion a non-positive fixing of the semiconductor light-emitting means takes place on the base body, whereby a good heat transfer is given to the base body.
  • the metallic base body serves as a carrier and at the same time constitutes a cooling element for the semiconductor light-emitting means, so that a good dissipation of the heat generated by the semiconductor light-emitting means during operation takes place.
  • the rivet is part of the base body.
  • a setting (deformation) of the rivet can be carried out similarly to a blind rivet with a tool engagement from only one side, which considerably simplifies assembly.
  • the base body is preferably designed in two parts, wherein it is composed for example of a lower shell and an upper shell.
  • the two shells form a cavity in which a connection module for the power supply of the semiconductor light-emitting device is arranged.
  • the lighting device of the aforementioned rivet is formed integrally with the upper shell, whereby the semiconductor lamp can be particularly simple and inexpensive attached to the upper shell as a carrier.
  • the integral design also allows here to deform the rivet for attachment, without having to be pressed with a tool against the side facing the semiconductor bulb side.
  • Deformation of the rivet can be done solely from the outside of the upper shell.
  • the upper shell is urgeformt with the rivet in a deep drawing process. It is then formed in only one manufacturing step, the upper shell and formed the rivet.
  • Upper and lower shell can be deep drawn, for example, made of aluminum.
  • connection module is provided with rigid connection wires. This simplifies automated assembly of the connection module, which is complex in the case of flexible connection wires. It can be dispensed with special devices for guiding the connecting wires.
  • the base body is fixed detent or clamped in the housing.
  • the housing comprises a lower housing part and a translucent, eg translucent or transparent housing upper part, wherein the upper housing part is latched to the lower housing part.
  • the base body in the housing is fixed by the latching of the upper housing part with the lower housing part.
  • an optical element which has reflective surfaces and / or comprises a lens is arranged on the base body.
  • the emission characteristic of the light source can be modified.
  • radiation into a further spatial area can be achieved.
  • the optical element is preferably deep-drawn from aluminum. It has such good reflecting surfaces and, in addition to the base body, can conduct heat away from the semiconductor light source.
  • Be formed lighting device in which, for example, a look and a connection diagram of a classic light bulb are imitated.
  • a method for mounting a semiconductor light-emitting means on a metallic base body of a lighting device is characterized in that the metallic base body has an integral rivet formed as a rivet, which is penetrated by an aperture, e.g. a hole in which semiconductor light-emitting means is guided and is spread open by screwing in a setting tool which has a self-tapping thread crest.
  • a throat is formed between a shaft of the setting tool and the thread crest, on which the rivet is deformed.
  • the counterforce required for the deformation of the rivet in its upper region is transferred to the lower section of the rivet by the setting tool itself via the thread cut by the thread crest in the lower region of the rivet.
  • the rivet is deformed without forces being diverted down the base body.
  • the throat is not formed rotationally symmetrical, whereby the rivet is deformed in a tumbling process. Due to the rolling motion associated with the tumbling process, larger material deformations of the rivet are possible without this ripping.
  • FIGS. 4 to 1 show details of various exemplary embodiments of FIG
  • Lighting devices in each case in schematic sectional views or schematic perspective views.
  • FIGS. 1 to 3 three different embodiments of a lighting device according to the application are each shown in a perspective exploded view. Identical or equivalent elements are identified in these and the following figures by the same reference numerals.
  • the lighting device is configured as a retrofit lighting device, that is, it is oriented with respect to the electrical connection and the shape of known bulbs, here screw-threaded bulbs (E14 or E27).
  • E14 or E27 screw-threaded bulbs
  • the features shown in this application can also be implemented in lighting devices with different shape and / or other connection sockets or connection options, including lighting devices that are not designed as retrofit lights. In part, the featured features are also used in other electronics applications that have no bulbs.
  • the lighting device has a housing 1 0, which has a lower housing part 1 1 and an upper housing part 1 2 mounted thereon, and a relation to the upper housing part 1 2 on the lower housing part 1 1 socket 1 1, the holder of the lighting device in a socket and the electric Contacting serves. It is a latching or snapping connection of the lower housing part 1 1 and the upper housing part 1 2 is provided.
  • the parts in the connection area are configured correspondingly interlocking.
  • a detent is provided, which can transmit a torque, so that the two housing parts 1 1, 1 2 are fixed against rotation to each other.
  • the individual parts of the housing 1 0 are made of plastic, preferably in an injection molding process.
  • At least the upper housing part 1 2 is held translucent or transparent to emit the light emitted by the lighting device.
  • the upper housing part 12 may advantageously be produced in a Spritblas vide.
  • a base body 20 is used, which is in each case constructed in two parts in the cases shown here and has a lower shell 21 and an upper shell 22 connected thereto.
  • the base body 20 has a diverse function. It serves, for example, to hold a semiconductor light-emitting means 30, hereinafter called light-emitting means 30, which is fastened to the upper shell 22.
  • the base body 20 is made of a good heat-conductive material, preferably a metal such as aluminum, and thus serves the heat dissipation of the light bulb 30 produced heat.
  • Both the lower shell 21 and the upper shell 22 are preferably produced in a deep-drawing process, which allows a cost-effective production with minimum wall thicknesses.
  • the lower shell 21 and the upper shell 22 are connected to one another in a mechanically loadable manner, as a result of which there is good heat conduction from the upper shell 22 to the lower shell 21, so that the lower shell 21 can also absorb heat from the illuminant 30 and pass it on or release it.
  • Both elements, lower shell 21 and upper shell 22, are constructed substantially rotationally symmetrical, wherein the connection of the two elements takes place by a joint fit, possibly supported by locking means in the connection region, for example a peripheral bead or notch formed in the connection region.
  • the base body 20 is composed essentially in the shape of a capsule, with a connection module 40 being accommodated in its inner cavity.
  • connection module 40 serves for the conversion of the alternating current of the house-light network, which is supplied via the base 1 3, that is to say, for example, in the field of voltage. rich from 1 10 volts to 230 volts, in a suitable for supplying the light source 30 DC.
  • base body 20 and the lower housing part 1 1 are locked together, wherein the latching is formed so that a thermal expansion of the base body 20, in particular the lower shell 21 of the base body 20, no undue and material destroying or tiring stress on the lower housing part 1 1 exercises , In this case, a good thermal contact between the lower shell 21 and the lower housing part 1 1 is given, so that heat generated within the lighting device, among other things, on the lower housing part 1 1 is discharged.
  • the latching of the base body 20 with the lower housing part 1 1 is shown in more detail in connection with Figures 5 to 7. Further, in the direction of the base 1 3, an opening is provided in the lower shell 21, through which connection wires 41 of the connection module 40 are led to the base 1 3. In the upper shell 22, an opening is also introduced, through which an electrical connection from the lighting means 30 to the connection module 40 takes place. This can be done, for example, via a preassembled on semiconductor light-emitting means 30, for example, soldered, plug 42.
  • the lighting means 30 may have a planar support plate 31, on which a plurality of light-emitting elements, here light-emitting diodes 32 (LEDs - light emitting diodes) are arranged.
  • a designed illuminant 30 radiates substantially perpendicular to the surface of the carrier board 31, ie in the direction of the axis of symmetry (screw axis) of the lighting device.
  • an optical element 50 is provided in the embodiments of FIGS. 1 and 3, which is arranged in the emission direction behind the light source 30 and influences the emission characteristic of the lighting device.
  • the optical element 50 is mounted on the upper shell 22 in the embodiments shown.
  • the optical element 50 is preferably also a metal element produced in a deep-drawing process, which due to the attachment to the upper shell 22 or directly to the carrier board 31 can also absorb and release heat.
  • the optical element 50 may also be made of plastic, wherein transparent and / or reflective components may be used.
  • the optical element 50 reflective surfaces 51 which are configured rotationally symmetrical funnel-shaped. The reflective surfaces 51 direct a majority of the radiation emitted by the LEDs 32 radiation radially outward Shen.
  • the optical element 50 is open at the center, so that a further part of the radiation emerges axially.
  • the optical element 50 comprises a lens 52, which is arranged axially in front of the light-emitting diodes 32.
  • the lens 52 is here a diverging lens, which widens the radiation beam emitted by the light emitting diodes 32 and thus widens the radiation characteristic in the radial direction. Because of its flat design, the lens 52 can be advantageously designed as a Fresnel lens. Also, optical elements 50 having both reflective surfaces 51 and lenses 52 may be used.
  • the components of the lighting device are designed with regard to a possible automation of the manufacturing process, in particular the process of assembling the lighting device.
  • connections between the parts are preferably snap-fit and / or latching and / or joining connections, which can particularly preferably be assembled in a common joining or latching direction, particularly preferably along the symmetry axis of the lighting device, which in the illustrated pedestals 1 3 is also the direction in which the lighting device is screwed into a socket. In the context of the application, this direction is also referred to as the axial direction.
  • the three light-emitting devices shown in FIGS. 1 to 3 differ in the exact shape of their components, the externa ßeren dimensions and the light output. Nevertheless, they all have a comparable basic structure. This makes it possible to produce a plurality of different lighting devices on the same production lines automatically, without the need for a model change profound changes to the production line or the manufacturing process. It creates a kind of modular system of design solutions that can be quickly responded to market requirements and small changes in the components, such as new bulbs. New developments can be flexibly and quickly integrated into new products. Further details of the lighting devices, which are relevant, inter alia, for automatable production, are described in the following advantageous embodiments of the lighting device. In FIGS.
  • an advantageous attachment possibility for the lighting means 30 is indicated on the upper shell 22, which is shown in more detail in FIG. So far, an adhesive or a screw connection is known or a hot deformation of a plastic pin for fixing the lamp 30. According to the application, it is provided to mount the luminous means 30 directly on the metallic base body 20 by means of a rivet 223.
  • FIGS. 1 to 3 an embodiment of a lighting device is shown in various representations and different mounting conditions.
  • the attachment option for the illuminant 30 on the upper shell 22 indicated there can be used, for example, for the luminous devices of FIGS. 1 to 3.
  • the upper shell 22 used is first shown.
  • the upper shell 22 has an integrally formed rivet 223 on its upper side, on which the illuminant 30 is mounted.
  • the rivet 223 may be formed as a rivet or as a solid material rivet.
  • the top shell 22 is preferably made of aluminum from a deep drawing process. Particularly preferably, the rivet 223 is already formed in this deep-drawing process. The rivet 223 is thus in the original molding process, with which the upper shell 22 is brought into its basic form formed. In this way, the rivet 223 is not only formed integrally with the upper shell 22, but also in a manufacturing step.
  • Fig. 4b and 4c the assembly of the illuminant 30 is shown with the aid of the rivet 223.
  • the lighting device is already partially pre-assembled.
  • the lower housing part 1 1 is already on the base 13 or inserted, from the base body 20, the lower shell 21 is inserted into the lower housing part 1 1 and locked with this.
  • a locking bead 21 1 is formed circumferentially on the lower housing part 1 1, which engages under latching projections (in Fig. 4 is not provided with reference numerals) of the lower housing part 1 1.
  • connection module 40 is inserted into the lower shell 21, wherein the connecting wires 41 possibly already connected to the base 13, for example, soldered or plugged into corresponding plug contacts, are.
  • the light source 30 is placed on top of the upper shell 22, wherein the rivet 223 penetrates through the intended breakthrough of the support board 31 (not provided in FIG. 4 with reference numerals).
  • Illuminant 30 fixed by means of the plug 42 on the one hand on the upper shell 22 and contacted on the other with the connection module 40.
  • the rivet 223 is deformed by the action of a punch from above, so that it sets the carrier plate 31 in a form-fitting manner on the upper shell 22.
  • the upper shell 22 is preferably circumferentially at its lower edge on the lower shell 21, so that the force acting on the upper shell 22 when bending the rivet 223 forces can be derived well and over a large area down. For this reason, the deformation of the rivet 223 can take place in the preassembled state of the luminous means.
  • at least one-pole electrical contacting of the lighting means 30 can take place.
  • FIG. 5 an advantageous deformation method for the rivet 223 is shown, which can be used when the rivet 223 is formed as a hollow rivet.
  • the subfigure 5a shows a first step of the deformation process for the rivet 223, with which the illuminant 30 is fixed on the upper shell 22 of the base body 20.
  • the upper shell 22 is shown separately with the attached carrier board 31. It is understood that the deformation process for the rivet 223 shown in Fig. 5 is already carried out in a preassembled state of the lighting device, as shown for example in Fig. 4b.
  • a rotary setting tool 1 is used, which has at its lower end an externally threaded thread crest 2, which is introduced into the rivet 223.
  • the threaded tip 2 is provided in the manner of a tap with a self-tapping thread, so that when lowering and screwing the setting tool 1, an internal thread is introduced into the rivet 223.
  • the transition region between the thread crest 2 and a shank of the setting tool 1 is formed by a throat 3, which in the further Screwing the setting tool 1 into the rivet 223 spreads the rivet 223 at its upper end.
  • the screwing of the setting tool 1 and spreading of the rivet 223 is, as shown in FIG. 5b, carried out until the rivet 223 is completely set and the carrier board 31 on the top of the upper shell 22 sets.
  • the counterforce required for the deformation of the rivet 223 in its upper region is applied due to the thread cut by the thread crest 2 in the lower region of the rivet 223.
  • the rivet 223 can be deformed without forces on the upper shell 22 to the lower shell 21 and thus the lower housing part 1 1 are derived.
  • the throat 3 may be formed asymmetrically (obliquely) to the axis of rotation of the setting tool 1.
  • deformation of the rivet 223 does not start simultaneously along the entire circumference, but in the form of rolling movement along the circumference.
  • the rivet 223 is thus deformed in a tumbling process.
  • the setting tool 1 is unscrewed from the rivet 223 by rotation with the reverse direction of rotation.
  • FIGS. 6a and 6b The further assembly process is illustrated with reference to FIGS. 6a and 6b.
  • Fig. 6a shows first the final mounted device. Compared to the state shown in Fig. 5c, the optical element 50 is placed, said optical element 50 is formed so that it is locked in the upper region of the upper shell 22 at its outer periphery ßerem. For this purpose, the upper shell 22 in this area on a circumferential constriction. Furthermore, the translucent housing upper part 1 2 is placed on the lower housing part 1 1 and locked with this.
  • Fig. 6b shows the area in which the lower shell 21 of the base body 20 and the upper housing part 1 2 are latched in the lower housing part 1 1, in more detail.
  • Fig. 7a and 7b show in addition to the lower housing part 1 1 with inserted lower shell 21 separately in a sectional view, in Fig. 7 b, in turn, the Verrastungs Sector is shown enlarged.
  • Fig. 7c shows the upper housing part 1 2 in a perspective view separately.
  • FIGS. 6b and 7b show, for latching the upper housing part 12 with the lower housing part 1 1 in the upper region of the lower housing part 1 1, a detent recess 1 1 1 is introduced, the upper edge forms an inwardly facing undercut locking projection.
  • the detent recess 1 1 1 may be circumferentially or at least partially formed circumferentially.
  • a corrugation 1 12 is incorporated.
  • the upper housing part 12 has a complementary support edge 121, with which it rests on the upper housing part 12. Internally encircling a downwardly pointing tongue is formed on the support edge 121 with a likewise circumferentially or at least partially circumferentially outwardly facing latching lug 122.
  • the latching nose 122 engages in an undercut of the latching projection 1 1 1 a.
  • the locking lug 122 is formed circumferentially and it is additionally provided with a plurality of again projecting ribs 123. As can be seen in Fig. 7c, the ribs 123 are distributed along the circumference.
  • the upper shell 22 is also slightly angled radially outward.
  • the tongue on which the latching noses 122 are formed may be dimensioned such that it lies with its lower end on this bend and thus the upper shell 22 directly and indirectly also the lower shell 21, on which the upper shell 22 rests in the circumferential direction Housing base 1 1 determines.
  • substantially all internal components of the lighting device are fixed by the one locking connection between the upper housing part 12 and the lower housing part 1 1 in the lighting device or at least additionally secured.
  • Details of the attachment of the lower shell 21 of the base body 20 to the lower housing part 1 1 can be seen in Figs. 6b and 7b.
  • a locking projection 1 1 3 is formed on the inside of the housing lower part 1 1. This can be circumferential, or consist of several distributed segments.
  • the locking projection 1 1 3 is undercut, so that the locking bead 21 1 of the lower shell 21 under the locking projection 1 1 3 locked.
  • the lower shell 21 fits snugly in the lower housing part 1 1, so that the lateral surfaces both superimposed as large as possible.
  • a good heat transfer from the lower shell 21 to the lower housing part 1 1 is achieved.
  • This is preferably formed thin-walled, so that a heat transfer also takes place on the Au DTseite the lower housing part 1 1, where a heat transfer via convection and / or radiant heat takes place.
  • the lower housing part 1 1 is made of plastic, so a non-negligible part of the heat generated by the lighting device can be removed.
  • the metallic lower shell 21 expands when heated relative to the lower housing part 1 1. So that this does not lead to unacceptable stresses in the materials, the locking bead 21 1 and the undercut portion of the locking projection 1 1 3 are shaped so that the locking bead 21 1 can escape in the latching position upwards. For this purpose, for example, both the locking bead 21 1 and the undercut of the locking projection 1 1 3 rounded. There are no contact surfaces between the lower shell 21 and the lower housing part 11 whose surface normal lies in the direction of thermal expansion. Upon expansion of the lower shell 21 relative to the lower housing part 1 1, the lower shell 21 can escape in the latching position upwards, without being released from the latching.
  • connection module 40 with a printed circuit board PCB - printed circuit board
  • FIGS. 8 and 9 show a side view and a top view of the connection module 40.
  • the connection wires 40 are fixed to the connection module 40, for example by a solder connection.
  • the connecting wires 41 are designed as rigid wires, wherein the diameter of the connecting wires 41 may possibly be larger than is necessary for the electrical conductivity.
  • the rigid execution of the leads 41 has the advantage that the leads 41 in the automated assembly of the connection module 40 can be easily guided through openings in the lower shell 21 and the lower housing part 1 1 and thus stand ready for a Maisie- tion with the base 13. As shown in FIG.
  • connection wires 41 can be guided in different planes so that they are sufficiently spaced apart from one another, even if the connection points of the connection wires 41 on the connection module 40 are closely adjacent.
  • the connecting wires 41 may be formed as insulated or non-insulated wires. The bending stiffness or flexural strength also enables the alignment, fixing, bending and / or cutting of these connecting wires 41 in an automated assembly.
  • Fig. 10 shows an advantageous electrical connection between a plurality of printed circuit boards.
  • these are a printed circuit board of the connection module 40 and the printed circuit board 31 of the lighting means 30. It is noted that this type of connection of two printed circuit boards which are at an angle to one another can also be used in other fields of application.
  • the electrical connection shown in Fig. 10 represents an alternative to the connector 42 shown in the previous embodiments.
  • the carrier board 31 there is an opening in the carrier board 31 into which the printed circuit board (board) of the connection module 40 is inserted with at least one lug-shaped part.
  • the tracks of both boards are then soldered together after joining, on the one hand to establish the mechanical and on the other the electrical connection.
  • a solder supply already be applied, which is melted by means of suitable soldering, for example, heating by laser, ultrasound, induction or another soldering to produce the connection.
  • suitable soldering for example, heating by laser, ultrasound, induction or another soldering to produce the connection.
  • the method described can be carried out with two planar printed circuit boards as shown here, but also with three-dimensionally designed printed circuit boards (compare also FIG.
  • Fig. 1 1 shows a sectional view of a dome 60, which is provided with openings 61 in a variety of geometries.
  • This dome 60 can on the upper shell 22 by a suitable method, for example, again by Filling and / or locking, are placed and surrounds the bulb 30.
  • the dome 60 leads to an effective light distribution, which reflects the shape of the openings 61.
  • mirrored metal parts can also be arranged around the lighting means 30, which lead to a correspondingly effective light distribution.
  • FIGS. 1 to 14 show various embodiments of an optical element 50 designed here as a reflector (cf., FIGS. 1 and 3), which serves to distribute the light of the light emitted by the illuminant 30.
  • FIGS. 1 3 and 14 it is also indicated how such an optical element 50 with appropriately designed legs 53 can be fixed to the illuminant 30 and, if appropriate, additionally to the upper shell 22. It is possible (see Fig. 14), the legs 53 also act as mounting brackets, via which a fixing of the illuminant 30 takes place on the base body 20.
  • the optical element 50 can additionally and / or alternatively be used to fix the luminous means 30 on the upper shell 22 in the manner of the fastening clip 222 according to FIGS.
  • the flattened area at the lower end of the leg 53 can be formed by inserting the optical element 50 by a deformation process during assembly.
  • an effective heat dissipation is also achieved to the optical element 50, which can deliver the absorbed heat as radiant heat and next to the base body 20 is an effective element for cooling the light source 30.
  • inner and outer reflective surfaces 51 of the optical element 50 are formed rounded such that the optical element 50 shows no sharp edges in the shadow.
  • the optical element 50 is formed as a rotationally symmetrical body having an open area inside. The light which penetrates through the inner open region and the light which is guided laterally past the optical element 50 are superimposed in the far region to form a uniformly illuminated light field.
  • Fig. 1 5 shows a perspective view of a three-dimensionally formed light source 30.
  • the carrier board 31 (PCB - printed circuit board) of the illuminant 30 is not flat (two-dimensional) is formed, but has a three-dimensional structure.
  • LEDs 32 are arranged on surfaces which point in different directions. This is already going on from the lamp 30 itself achieves a radiating characteristic all around, so that it is possible to dispense with an additional optical element for light distribution.
  • the support plate 31 of the luminous means 30 is produced in a planar shape, wherein the support plate 31 has a substantially circular base portion 312 with radially outwardly projecting arms 313.
  • LEDs 32 are arranged both in the base region 312, as well as on the protruding arms 313.
  • the protruding arms 313 are subsequently bent by deformation. In this case, a relatively large bending radius may be provided in order not to damage the layer structure (aluminum carrier, insulating layer, conductor track). The deformation can be done either before mounting the LEDs 32 or after their assembly.

Abstract

L'invention concerne un dispositif d'éclairage comprenant au moins un moyen lumineux semi-conducteur (30) et une enveloppe (10) abritant ledit au moins un moyen lumineux semi-conducteur (30), un corps de base (20) métallique étant disposé dans l'enveloppe (10) et portant le moyen lumineux semi-conducteur (30). Le dispositif d'éclairage est caractérisé en ce que le moyen lumineux semi-conducteur (30) est fixé au corps de base (20) métallique à l'aide d'un rivet (223) métallique. L'invention concerne également un procédé de montage d'un moyen lumineux semi-conducteur (30) sur un corps de base (20) métallique d'un dispositif d'éclairage.
EP14723453.8A 2013-05-15 2014-05-13 Dispositif d'éclairage et procédé de montage d'un moyen lumineux semi-conducteur d'un dispositif d'éclairage Withdrawn EP3001854A1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102013105011 2013-05-15
DE102014101403.0A DE102014101403A1 (de) 2013-05-15 2014-02-05 Leuchtvorrichtung
PCT/EP2014/059799 WO2014184213A1 (fr) 2013-05-15 2014-05-13 Dispositif d'éclairage et procédé de montage d'un moyen lumineux semi-conducteur d'un dispositif d'éclairage

Publications (1)

Publication Number Publication Date
EP3001854A1 true EP3001854A1 (fr) 2016-04-06

Family

ID=51831463

Family Applications (4)

Application Number Title Priority Date Filing Date
EP14724077.4A Not-in-force EP3001855B1 (fr) 2013-05-15 2014-05-13 Dispositif d'éclairage
EP14727732.1A Ceased EP3001856A1 (fr) 2013-05-15 2014-05-13 Dispositif d'éclairage
EP14723453.8A Withdrawn EP3001854A1 (fr) 2013-05-15 2014-05-13 Dispositif d'éclairage et procédé de montage d'un moyen lumineux semi-conducteur d'un dispositif d'éclairage
EP14726105.1A Not-in-force EP3001857B1 (fr) 2013-05-15 2014-05-13 Dispositif d'éclairage et procédé de montage du dispositif d'éclairage

Family Applications Before (2)

Application Number Title Priority Date Filing Date
EP14724077.4A Not-in-force EP3001855B1 (fr) 2013-05-15 2014-05-13 Dispositif d'éclairage
EP14727732.1A Ceased EP3001856A1 (fr) 2013-05-15 2014-05-13 Dispositif d'éclairage

Family Applications After (1)

Application Number Title Priority Date Filing Date
EP14726105.1A Not-in-force EP3001857B1 (fr) 2013-05-15 2014-05-13 Dispositif d'éclairage et procédé de montage du dispositif d'éclairage

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Country Link
US (1) US20160123542A1 (fr)
EP (4) EP3001855B1 (fr)
CN (1) CN105229369A (fr)
DE (1) DE102014101403A1 (fr)
ES (1) ES2727253T3 (fr)
WO (6) WO2014184207A1 (fr)

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Also Published As

Publication number Publication date
EP3001857B1 (fr) 2017-11-01
WO2014184212A1 (fr) 2014-11-20
WO2014184214A1 (fr) 2014-11-20
WO2014184215A1 (fr) 2014-11-20
EP3001857A1 (fr) 2016-04-06
ES2727253T3 (es) 2019-10-15
CN105229369A (zh) 2016-01-06
EP3001855A1 (fr) 2016-04-06
EP3001856A1 (fr) 2016-04-06
EP3001855B1 (fr) 2019-02-20
US20160123542A1 (en) 2016-05-05
WO2014184210A1 (fr) 2014-11-20
WO2014184207A1 (fr) 2014-11-20
WO2014184213A1 (fr) 2014-11-20
DE102014101403A1 (de) 2014-11-20

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