EP3001855B1 - Dispositif d'éclairage - Google Patents

Dispositif d'éclairage Download PDF

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Publication number
EP3001855B1
EP3001855B1 EP14724077.4A EP14724077A EP3001855B1 EP 3001855 B1 EP3001855 B1 EP 3001855B1 EP 14724077 A EP14724077 A EP 14724077A EP 3001855 B1 EP3001855 B1 EP 3001855B1
Authority
EP
European Patent Office
Prior art keywords
lighting device
housing
base body
catch
housing part
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Not-in-force
Application number
EP14724077.4A
Other languages
German (de)
English (en)
Other versions
EP3001855A1 (fr
Inventor
Andreas Ritzenhoff
Lutz ENGEL
Jörg RACHE
Oliver Arnold
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seidel GmbH and Co KG
Original Assignee
Seidel GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seidel GmbH and Co KG filed Critical Seidel GmbH and Co KG
Publication of EP3001855A1 publication Critical patent/EP3001855A1/fr
Application granted granted Critical
Publication of EP3001855B1 publication Critical patent/EP3001855B1/fr
Not-in-force legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/90—Methods of manufacture
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89—Metals
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V15/00—Protecting lighting devices from damage
    • F21V15/01—Housings, e.g. material or assembling of housing parts
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/005—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages with keying means, i.e. for enabling the assembling of component parts in distinctive positions, e.g. for preventing wrong mounting
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/16—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by deformation of parts; Snap action mounting
    • F21V17/164—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by deformation of parts; Snap action mounting the parts being subjected to bending, e.g. snap joints
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/005—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by permanent fixing means, e.g. gluing, riveting or embedding in a potting compound
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/0055—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by screwing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F21V29/713—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements in direct thermal and mechanical contact of each other to form a single system
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
    • F21V3/06—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material
    • F21V3/062—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material the material being plastics
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/238—Arrangement or mounting of circuit elements integrated in the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • F21V23/006—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate being distinct from the light source holder
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • F21V7/0008—Reflectors for light sources providing for indirect lighting
    • F21V7/0016—Reflectors for light sources providing for indirect lighting on lighting devices that also provide for direct lighting, e.g. by means of independent light sources, by splitting of the light beam, by switching between both lighting modes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the invention relates to a lighting device having at least one semiconductor lamp and a housing made of plastic, in which the semiconductor lamp is accommodated, wherein the housing comprises a lower housing part and a translucent upper housing part and wherein the upper housing part at least partially protrudes into the lower housing part and the lower housing part is locked.
  • Luminous devices with semiconductor lamps are characterized by a high specific luminosity and thus low energy consumption and by a long life.
  • the semiconductor bulbs must be cooled, since both the lifetime and the effectiveness achieved decreases with the temperature of the lamps.
  • a driver module for the semiconductor light-emitting means also referred to as a connection module, is frequently arranged in the housing of the lighting device and provides a current suitable for driving the semiconductor light-emitting means.
  • an optical element for example a reflector and / or a lens arrangement, is optionally provided to achieve a desired spatial radiation characteristic.
  • the housing of the lighting device comprises a translucent (translucent or transparent) housing upper part and an opaque housing lower part. It is desirable for visual and haptic reasons that the two housing parts as smooth as possible merge into one another and are connected to each other loadable.
  • Such a lighting device is from the document WO 2012/020366 A1 known.
  • This housing comprises a housing lower part with a screw thread socket and a spherical and translucent housing upper part, which is at least partially inserted into the screw thread socket on the side of the housing lower part in this and connected to this in unspecified manner.
  • a lighting device of the type mentioned above is characterized in that a downward-pointing tongue is formed on a support edge of the upper housing part, with which the upper housing part is inserted into the lower housing part, wherein on the tongue a plurality of outwardly projecting ribs is arranged, and that an outwardly widening detent recess is arranged on an upper edge of the housing lower part, wherein in the region of the detent recess a corrugation is provided, with which the protruding ribs interlock.
  • the locking allows easy, fast and thus cost-effective installation.
  • the lower housing part engages over the upper housing part in the region of the latch, whereby the latching is located within the housing and thus a smooth transition between the two housing parts on the outside of the lighting device is made possible.
  • the tongue is advantageously formed circumferentially. It may have at least one circumferential or at least partially encircling, outwardly facing latching lug which engages in the latching recess of the housing base.
  • the latching is arranged in the widened portion of the housing base and can accommodate correspondingly large latching forces for a reliable connection of the two housing parts.
  • an upper edge of the lower housing part is widened, wherein the widened area serves as a support on which the upper housing part rests with a support edge.
  • the widened area serves as a support on which the upper housing part rests with a support edge.
  • a large bearing surface between the two housing parts is created, which contributes to a solid connection of the two parts.
  • an outwardly widening latching recess is arranged, which forms an undercut latching projection.
  • a metallic base body is arranged within the housing, on which the semiconductor lamp is fixed, wherein the metallic base body is inserted into the lower housing part and is fixed by the upper housing part.
  • the metallic base body serves as a carrier and at the same time constitutes a cooling element for the semiconductor light-emitting means, so that a good dissipation of the heat generated by the semiconductor light-emitting means during operation takes place.
  • the surface of the base body preferably fits tightly against an inner surface of a wall of the housing in order to allow the best possible heat transfer. Due to the fact that the housing upper part is shaped and arranged in the region of the catch in such a way that it defines the base body, substantially all internal components of the lighting device are fixed by the latching connection between the housing upper part and the housing lower part in the lighting device.
  • the lighting device is provided to set the base body in addition latching or clamping in the lower housing part.
  • the fixing by the upper housing part serves in the case as an additional safeguard.
  • a locking bead which is locked under at least one arranged in the lower housing part latching projection.
  • the lower housing part is preferably a plastic injection-molded part, whereas the upper housing part, which is modeled, for example, the typical bulb shape of light bulbs, is advantageously produced by injection blow molding.
  • the base body is preferably designed in two parts, wherein it is composed for example of a lower shell and an upper shell.
  • the two shells form a cavity in which a connection module for powering the semiconductor lamp can be arranged.
  • the semiconductor light-emitting means with a rivet on the base body for example, the upper shell, set.
  • the rivet is integrally formed with the base body, whereby the semiconductor light-emitting means can be particularly simple and inexpensive attached to the base body as a carrier.
  • the integral design also allows the rivet to be deformed for attachment without having to press with a tool against the side opposite the semiconductor bulb. Deformation of the rivet can be done solely from the outside of the base body.
  • the base body for example, in turn, the upper shell, urgeformt with the rivet in a deep-drawing process. It is then formed in only one manufacturing step, the upper shell and formed the rivet.
  • Upper and lower shell can be deep drawn, for example, made of aluminum.
  • the semiconductor light-emitting means can also be fixed by means of a screw on the base body, in particular on its upper shell.
  • the described lighting device can in particular be well designed as a retrofit lighting device, in which, for example, a look and a connection diagram of a conventional light bulb are imitated.
  • FIG. 1 to 3 are three different embodiments of an application according lighting device each in a perspective exploded view shown. Identical or equivalent elements are identified in these and the following figures by the same reference numerals.
  • the lighting device is designed as a retrofit lighting device, that is, with respect to the electrical connection and the shape of known bulbs, in this case light bulbs with screw thread (E14 or E27), oriented.
  • the features shown in this application can also be implemented in lighting devices with different shape and / or other connection sockets or connection options, including lighting devices that are not designed as retrofit lights.
  • the featured features are also used in other electronics applications that have no bulbs.
  • the lighting device has a housing 10, which has a housing lower part 11 and a housing upper part 12 mounted thereon, and a base 13 which is attached to the housing lower part 11 opposite the housing upper part 12 and serves to hold the lighting device in a socket and the electrical contact.
  • the parts in the connection area are configured correspondingly interlocking.
  • a detent is provided, which can transmit a torque, so that the two housing parts 11, 12 are fixed against rotation to each other.
  • the individual parts of the housing 10 are made of plastic, preferably in an injection molding process.
  • At least the upper housing part 12 is translucent, e.g. transparent or opaque, held to emit the light emitted by the lighting device.
  • the upper housing part 12 may advantageously be produced in a Spritblas vide.
  • a base body 20 is used, which is in each case constructed in two parts in the cases shown here and has a lower shell 21 and an upper shell 22 connected thereto.
  • the base body 20 has a diverse function. It serves, for example, to hold a semiconductor light-emitting means 30, hereinafter referred to as light-emitting means 30, which is fastened on the upper shell 22.
  • the base body 20 is made of a good heat-conductive material, preferably a metal such as aluminum, and thus serves for heat dissipation heat produced by the lamp 30.
  • Both the lower shell 21 and the upper shell 22 are preferably produced in a deep-drawing process, which allows a cost-effective production with minimum wall thicknesses.
  • the lower shell 21 and the upper shell 22 are connected to one another in a mechanically loadable manner, as a result of which there is good heat conduction from the upper shell 22 to the lower shell 21, so that the lower shell 21 can also absorb heat from the illuminant 30 and pass it on or release it.
  • Both elements, lower shell 21 and upper shell 22, are constructed substantially rotationally symmetrical, wherein the connection of the two elements takes place together by a Fügepassung, possibly supported by locking means in the connection region, for example, formed in the connecting region circumferential bead or notch.
  • the base body 20 is substantially capsule-shaped, wherein in its inner cavity, a connection module 40 is received.
  • the connection module 40 is used to implement the supplied via the base 13 AC power of the home-light network, so for example in the voltage range of 110 volts to 230 volts, in a suitable for supplying the light source 30 DC.
  • base body 20 and the lower housing part 11 are locked together, wherein the latching is formed so that a thermal expansion of the base body 20, in particular the lower shell 21 of the base body 20, no undue and material destroying or tiring stress on the housing base 11 exerts.
  • a good thermal contact between the lower shell 21 and the lower housing part 11 is given, so that heat generated within the lighting device is discharged, inter alia, via the lower housing part 11.
  • the latching of the base body 20 with the lower housing part 11 is described in more detail in connection with the FIGS. 5 to 7 shown.
  • an opening is provided, are passed through the connecting wires 41 of the connection module 40 to the base 13.
  • an opening is also introduced, through which an electrical connection from the lighting means 30 to the connection module 40 takes place. This can be done, for example, via a preassembled on semiconductor light-emitting means 30, for example, soldered, plug 42.
  • the luminous means 30 can have a planar carrier board 31 on which a plurality of luminous elements, Here light-emitting diodes 32 (LEDs - light emitting diodes) are arranged.
  • LEDs - light emitting diodes LEDs - light emitting diodes
  • Such a designed illuminant 30 radiates substantially perpendicular to the surface of the carrier board 31, ie in the direction of the axis of symmetry (screw axis) of the lighting device.
  • an optical element 50 is provided which, viewed in the emission direction, is arranged behind the luminous means 30 and influences the emission characteristic of the luminous device.
  • the optical element 50 is mounted on the upper shell 22 in the embodiments shown.
  • the optical element 50 is preferably also a metal element produced in a deep-drawing process, which due to the attachment to the upper shell 22 or directly to the carrier board 31 can also absorb and release heat.
  • the optical element 50 may also be made of plastic, wherein transparent and / or reflective components may be used.
  • the optical element 50 has the optical element 50 reflective surfaces 51 which are configured rotationally symmetrical funnel-shaped.
  • the reflective surfaces 51 deflect a large part of the radiation emitted by the LEDs 32 radiation radially outward.
  • the optical element 50 is open, so that a further part of the radiation emerges axially.
  • the optical element 50 includes a lens 52 disposed axially in front of the light emitting diodes 32.
  • the lens 52 is here a diverging lens, which widens the radiation beam emitted by the light emitting diodes 32 and thus widens the emission characteristic in the radial direction. Because of its flat design, the lens 52 can be advantageously designed as a Fresnel lens.
  • optical elements 50 having both reflective surfaces 51 and lenses 52 may be used.
  • the components of the lighting device are designed with regard to a possible automation of the manufacturing process, in particular the process of assembling the lighting device.
  • connections between the parts are preferably snap-fit and / or latching and / or joining connections, which can particularly preferably be assembled in a common joining or latching direction, particularly preferably along the symmetry axis of the lighting device, which in the illustrated pedestals 13 also the direction is in which the lighting device in one Version is screwed in. In the context of the application, this direction is also referred to as the axial direction.
  • the three in the Fig. 1 to 3 illustrated lighting devices differ in the exact shape of their components, the external dimensions and the light output. Nevertheless, they all have a comparable basic structure. This makes it possible to produce a plurality of different lighting devices on the same production lines automatically, without the need for a model change profound changes to the production line or the manufacturing process. It creates a kind of modular system of design solutions that can be quickly responded to market requirements and small changes in the components, such as new bulbs. New developments can be flexibly and quickly integrated into new products.
  • Fig. 1 to 3 is an advantageous mounting option for the bulb 30 indicated on the upper shell 22, in Fig. 4 is shown in more detail. So far, an adhesive or a screw connection is known for fastening the illuminant 30. According to the application, it is provided to fix the lighting means 30 on the upper shell 22 by means of a positive connection by means of a deformable connecting element.
  • a mounting bracket 222 which are preferably inserted through previously introduced openings 311, 221 in the support plate 31 of the bulb 30 and the upper shell 22 and bent at the bottom by appropriate tools.
  • the shape of the bend and the selected material thereby allow a secure and elastic, even with thermal expansion frictional fixing of the light source 30 on the upper shell 22, whereby a good thermal connection of the light source 30 is given to the base body 20.
  • the fastening clip 222 which preferably consists of a metal, for example of a copper alloy, can be used for making electrical contact with the luminous means 30.
  • a heat-conducting paste may be applied between the illuminant 30 and the upper shell 22.
  • a further embodiment of a lighting device is shown in various representations and different mounting conditions.
  • the attachment option for the illuminant 30 on the upper shell 22 can also be used for the lighting devices of the Fig. 1 to 3 be used.
  • the upper shell 22 used is shown.
  • the upper shell 22 has an integrally formed rivet 223 on its upper side, on which the illuminant 30 is mounted.
  • the rivet 223 represents an alternative to the in Fig. 4
  • the rivet 223 may be formed as a hollow rivet or as a solid material rivet.
  • the top shell 22 is preferably made of aluminum from a deep drawing process. Particularly preferably, the rivet 223 is already formed in this deep-drawing process. The rivet 223 is thus in the original molding process, with which the upper shell 22 is brought into its basic form formed. In this way, the rivet 223 is not only formed integrally with the upper shell 22, but also in a manufacturing step.
  • Fig. 5b and 5c the assembly of the illuminant 30 is shown with the aid of the rivet 223.
  • the lighting device is already partially pre-assembled.
  • the lower housing part 11 is already on the base 13 or inserted, from the base body 20, the lower shell 21 is inserted into the lower housing part 11 and locked with this.
  • a latching bead 211 is formed circumferentially on the lower housing part 11, the latching protrusion (in the Fig. 5 not provided with reference numerals) of the housing base 11 engages.
  • the connection module 40 is inserted into the lower shell 21, wherein the connecting wires 41 possibly already connected to the base 13, for example, soldered or plugged into corresponding plug contacts, are.
  • the illuminant 30 is placed on top of the upper shell 22, wherein the rivet 223 through the intended opening 311 of the support board 31 (in the Fig. 5 not provided with reference numerals) penetrates.
  • the lighting means 30 is fixed by means of the plug 42 on the one hand on the upper shell 22 and contacted on the other with the connection module 40.
  • the rivet 223 is deformed by the action of a punch from above, so that it sets the carrier plate 31 in a form-fitting manner on the upper shell 22.
  • the upper shell 22 is preferably circumferentially at its lower edge on the lower shell 21, so that the force acting on the upper shell 22 when bending the rivet 223 forces can be derived well and over a large area down. For this reason, the deformation of the rivet 223 can take place in the preassembled state of the luminous means.
  • an at least single-pole electrical contacting can additionally take place via the rivet 223.
  • Fig. 6a first shows the final mounted device. Opposite the in Fig. 5c illustrated state, the optical element 50 is placed, this optical element 50 is formed so that it latches in the upper region of the upper shell 22 at its outer periphery. For this purpose, the upper shell 22 in this area on a circumferential constriction. Furthermore, the translucent housing upper part 12 is placed on the lower housing part 11 and locked with this.
  • Fig. 6b shows the area in which the lower shell 21 of the base body 20 and the upper housing part 12 are latched in the lower housing part 11, in more detail.
  • Fig. 7a and 7b show in addition to the lower housing part 11 with inserted lower shell 21 separately in a sectional view, wherein in Fig. 7b in turn, the Verrastungs Scheme is shown enlarged.
  • Fig. 7c shows the upper housing part 12 in a perspective view separately.
  • a detent recess 111 is introduced, the upper edge forms an inwardly facing undercut locking projection.
  • the detent recess 111 may be formed circumferentially or at least partially encircling.
  • a corrugation 112 is incorporated in the detent recess 111.
  • a common edge is formed on the lower housing part 11 by the latching projection.
  • the upper housing part 12 has a complementary support edge 121, with which it rests on the upper housing part 12.
  • the locking lug 122 engages in an undercut of the locking projection 111 a.
  • the locking lug 122 is formed circumferentially and it is additionally provided with a plurality of again projecting ribs 123. As in Fig. 7c it can be seen, the ribs 123 are distributed along the circumference.
  • the upper shell 22 is also slightly angled radially outward.
  • the tongue on which the locking lugs 122 are formed may be dimensioned so that it lies with its lower end on this bend and thus the upper shell 22 directly and indirectly, the lower shell 21, on which the upper shell 22 rests circumferentially, in the lower housing part 11th sets.
  • the tongue of the upper housing part 12 does not fix the base body 20 directly in the lower housing part 11, but provides an additional safeguard in the event that the actual fastening of the basic body 20 is released.
  • substantially all internal components of the lighting device are fixed by the one latching connection between the upper housing part 12 and the lower housing part 11 in the lighting device or at least additionally secured.
  • a detent projection 113 is formed on the inside of the lower housing part 11. This can be circumferential, or consist of several distributed segments.
  • the latching projection 113 is undercut, so that the latching bead 211 of the lower shell 21 is latched under the latching projection 113.
  • the lower shell 21 sits snugly in the lower housing part 11, so that the lateral surfaces both superimposed as large as possible.
  • a good heat transfer from the lower shell 21 to the lower housing part 11 is achieved.
  • This is preferably formed thin-walled, so that a heat transfer to the outside the lower housing part 11 takes place, where heat is released by convection and / or radiant heat.
  • the lower housing part 11 is made of plastic, so a non-negligible part of the heat generated by the lighting device can be removed.
  • the metallic lower shell 21 expands when heated relative to the lower housing part 11. So that this does not lead to unacceptable stresses in the materials, the locking bead 211 and the undercut portion of the locking projection 113 are formed so that the locking bead 211 can move upwards in the locking position.
  • both the locking bead 211 and the undercut of the locking projection 113 are rounded.
  • connection module 40 with a printed circuit board (PCB - printed circuit board) are inserted.
  • connection module 40 shows in a side view and a plan view of the connection module 40.
  • the connecting wires 41 are fixed, for example by a solder joint.
  • the connecting wires 41 are designed as rigid wires, wherein the diameter of the connecting wires 41 may possibly be larger than is necessary for the electrical conductivity.
  • the rigid execution of the leads 41 has the advantage that the leads 41 in the automated assembly of the connection module 40 can be easily passed through openings in the lower shell 21 and the lower housing part 11 and thus stand ready for a contact with the base 13.
  • the lead wires 41 can be guided in different planes so as to be sufficiently spaced apart from each other even if the terminal points of the lead wires 41 on the terminal module 40 are closely adjacent.
  • the connecting wires 41 may be formed as insulated or non-insulated wires. The bending stiffness or flexural strength allows in an automated assembly also the alignment, fixing, bending and / or cutting these connection wires 41st
  • Fig. 10 shows an advantageous electrical connection between several circuit boards.
  • these are a printed circuit board of the connection module 40 and the printed circuit board 31 of the lighting means 30. It is noted that this type of connection of two printed circuit boards which are at an angle to one another can also be used in other fields of application.
  • electrical connection is an alternative to the connector 42 shown in the previous embodiments.
  • a breakthrough is present in the carrier board 31, into which the printed circuit board (board) of the connection module 40 is inserted with at least one lug-shaped part.
  • the tracks of both boards are then soldered together after joining, on the one hand to establish the mechanical and on the other the electrical connection.
  • a solder supply already be applied, which is melted by means of suitable soldering, for example, heating by laser, ultrasound, induction or another soldering to produce the connection.
  • suitable soldering for example, heating by laser, ultrasound, induction or another soldering to produce the connection.
  • the method described can be carried out as shown here with two planar printed circuit boards, but also with three-dimensionally designed printed circuit boards (see also Fig. 15 ).
  • Fig. 11 shows in a sectional view a dome 60, which is provided with openings 61 in a variety of geometries.
  • This dome 60 can be placed on the upper shell 22 by a suitable method, for example, again by joining and / or locking, and surrounds the illuminant 30.
  • the dome 60 leads to an effective light distribution, which reflects the shape of the apertures 61.
  • mirrored metal parts can also be arranged around the lighting means 30, which lead to a correspondingly effective light distribution.
  • FIG. 12 to 14 different configurations of an optical element 50 embodied here as a reflector are shown (cf. Fig. 1 and 3 ), which serves the light distribution of the light emitted by the light source 30.
  • an optical element 50 with appropriately designed legs 53 am Illuminant 30 and optionally additionally may be fixed to the upper shell 22. It is possible (cf. Fig. 14 ), the legs 53 also act as mounting brackets, via which a fixing of the illuminant 30 takes place on the base body 20. In this sense, the optical element 50 additionally and / or alternatively for fixing the illuminant 30 on the upper shell 22 in the manner of the mounting bracket 222 according to the Fig.
  • the flattened area at the lower end of the leg 53 may be formed upon insertion of the optical element 50 by a deformation process during assembly.
  • inner and outer reflective surfaces 51 of the optical element 50 are formed rounded such that the optical element 50 shows no sharp edges in the shadow.
  • the optical element 50 is formed as a rotationally symmetrical body having an open area inside. The light passing through the inner open area and the light guided laterally past the optical element 50 are superimposed in the far region to form a uniformly illuminated light field.
  • Fig. 15 shows a perspective view of a three-dimensionally formed light source 30.
  • the carrier board 31 (PCB - printed circuit board) of the illuminant 30 is not flat (two-dimensional) is formed, but has a three-dimensional structure.
  • LEDs 32 are arranged on surfaces which point in different directions. In this way, a uniformly radiating characteristic is already achieved by the luminous means 30 itself, so that an additional optical element for light distribution can be dispensed with.
  • the support plate 31 of the luminous means 30 is produced in a planar shape, wherein the support plate 31 has a substantially circular base portion 312 with radially outwardly projecting arms 313.
  • LEDs 32 are arranged both in the base region 312, as well as on the protruding arms 313.
  • the protruding arms 313 are subsequently bent by deformation. In this case, a relatively large bending radius may be provided in order not to damage the layer structure (aluminum carrier, insulating layer, conductor track). The deformation can be done either before mounting the LEDs 32 or after their assembly.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Claims (13)

  1. Dispositif d'éclairage avec au moins une lampe à semiconducteurs (30) et un boîtier (10) en plastique dans lequel l'au moins une lampe à semiconducteurs (30) est logée, dans lequel le boîtier (10) présente une partie inférieure de boîtier (11) et une partie supérieure de boîtier (12) translucide, la partie supérieure de boîtier (12) dépassant au moins en partie dans la partie inférieure de boîtier (11) et étant enclenchée avec la partie inférieure de boîtier (11), caractérisé en ce qu'est formée sur un bord d'appui (121) de la partie supérieure de boîtier (12) une languette dirigée vers le bas avec laquelle la partie supérieure de boîtier (12) est insérée dans la partie inférieure de boîtier (11), plusieurs nervures (123) qui dépassent vers l'extérieur étant disposées sur la languette, et en ce qu'un creux d'enclenchement (111) qui s'élargit vers l'extérieur est disposé sur le bord supérieur de la partie inférieure de boîtier (11), un rainurage (112) avec lequel s'accrochent les nervures (123) en saillie étant prévu au niveau du creux d'enclenchement (111).
  2. Dispositif d'éclairage selon la revendication 1, dans lequel le bord de la partie inférieure de boîtier (11) tourné vers la partie supérieure de boîtier (12) est élargi, la partie élargie servant d'appui sur lequel la partie supérieure de boîtier (12) repose par un bord d'appui (121).
  3. Dispositif d'éclairage selon la revendication 2, dans lequel le creux d'enclenchement (111) élargi vers l'extérieur est disposé dans la zone élargie de la partie inférieure de boîtier (11) et forme une saillie d'enclenchement munie d'une contre-dépouille.
  4. Dispositif d'éclairage selon l'une des revendications 1 à 3, dans lequel la languette est formée sur la circonférence.
  5. Dispositif d'éclairage selon l'une des revendications 1 à 4, dans lequel un ergot d'enclenchement (122) tourné vers l'extérieur est formé sur la périphérie ou au moins une partie de la périphérie sur la languette.
  6. Dispositif d'éclairage selon les revendications 3 et 5, dans lequel l'au moins un ergot d'enclenchement (122) de la partie supérieure de boîtier (12) se met en prise dans le creux d'enclenchement (111) de la partie inférieure de boîtier (11).
  7. Dispositif d'éclairage selon l'une des revendications 1 à 6, dans lequel est disposé à l'intérieur du boîtier (10) un corps de base (20) métallique sur lequel la lampe à semiconducteurs (30) est fixée, le corps de base (20) métallique étant introduit dans la partie inférieure de boîtier (11) et immobilisé par la partie supérieure de boîtier (12).
  8. Dispositif d'éclairage selon la revendication 7, dans lequel le corps de base (20) est en outre immobilisé par enclenchement ou serrage dans la partie inférieure de boîtier (11).
  9. Dispositif d'éclairage selon la revendication 8, dans lequel le corps de base (20) présente un bourrelet d'enclenchement (211) qui s'enclenche sous au moins une saillie d'enclenchement (113) disposée dans la partie inférieure de boîtier (11).
  10. Dispositif d'éclairage selon l'une des revendications 7 à 9, dans lequel le corps de base (20) présente une cavité dans laquelle est disposé un module de connexion (40) pour la lampe à semiconducteurs (30).
  11. Dispositif d'éclairage selon l'une des revendications 7 à 10, dans lequel le corps de base (20) est fait de deux parties et composé d'une coque inférieure (21) et d'une coque supérieure (22).
  12. Dispositif d'éclairage selon l'une des revendications 1 à 11, dans lequel la partie supérieure de boîtier (12) est fabriquée d'un seul tenant par un procédé d'injection-soufflage.
  13. Dispositif d'éclairage selon l'une des revendications 1 à 12, conçu comme un dispositif d'éclairage pour rénovation.
EP14724077.4A 2013-05-15 2014-05-13 Dispositif d'éclairage Not-in-force EP3001855B1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102013105011 2013-05-15
DE102014101403.0A DE102014101403A1 (de) 2013-05-15 2014-02-05 Leuchtvorrichtung
PCT/EP2014/059798 WO2014184212A1 (fr) 2013-05-15 2014-05-13 Dispositif d'éclairage

Publications (2)

Publication Number Publication Date
EP3001855A1 EP3001855A1 (fr) 2016-04-06
EP3001855B1 true EP3001855B1 (fr) 2019-02-20

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Application Number Title Priority Date Filing Date
EP14727732.1A Ceased EP3001856A1 (fr) 2013-05-15 2014-05-13 Dispositif d'éclairage
EP14726105.1A Not-in-force EP3001857B1 (fr) 2013-05-15 2014-05-13 Dispositif d'éclairage et procédé de montage du dispositif d'éclairage
EP14724077.4A Not-in-force EP3001855B1 (fr) 2013-05-15 2014-05-13 Dispositif d'éclairage
EP14723453.8A Withdrawn EP3001854A1 (fr) 2013-05-15 2014-05-13 Dispositif d'éclairage et procédé de montage d'un moyen lumineux semi-conducteur d'un dispositif d'éclairage

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EP14727732.1A Ceased EP3001856A1 (fr) 2013-05-15 2014-05-13 Dispositif d'éclairage
EP14726105.1A Not-in-force EP3001857B1 (fr) 2013-05-15 2014-05-13 Dispositif d'éclairage et procédé de montage du dispositif d'éclairage

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EP14723453.8A Withdrawn EP3001854A1 (fr) 2013-05-15 2014-05-13 Dispositif d'éclairage et procédé de montage d'un moyen lumineux semi-conducteur d'un dispositif d'éclairage

Country Status (6)

Country Link
US (1) US20160123542A1 (fr)
EP (4) EP3001856A1 (fr)
CN (1) CN105229369A (fr)
DE (1) DE102014101403A1 (fr)
ES (1) ES2727253T3 (fr)
WO (6) WO2014184212A1 (fr)

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Also Published As

Publication number Publication date
DE102014101403A1 (de) 2014-11-20
WO2014184214A1 (fr) 2014-11-20
US20160123542A1 (en) 2016-05-05
WO2014184213A1 (fr) 2014-11-20
EP3001855A1 (fr) 2016-04-06
EP3001857B1 (fr) 2017-11-01
WO2014184212A1 (fr) 2014-11-20
WO2014184210A1 (fr) 2014-11-20
ES2727253T3 (es) 2019-10-15
CN105229369A (zh) 2016-01-06
WO2014184215A1 (fr) 2014-11-20
EP3001857A1 (fr) 2016-04-06
EP3001856A1 (fr) 2016-04-06
EP3001854A1 (fr) 2016-04-06
WO2014184207A1 (fr) 2014-11-20

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