EP3001857A1 - Dispositif d'éclairage et procédé de montage du dispositif d'éclairage - Google Patents
Dispositif d'éclairage et procédé de montage du dispositif d'éclairageInfo
- Publication number
- EP3001857A1 EP3001857A1 EP14726105.1A EP14726105A EP3001857A1 EP 3001857 A1 EP3001857 A1 EP 3001857A1 EP 14726105 A EP14726105 A EP 14726105A EP 3001857 A1 EP3001857 A1 EP 3001857A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- lighting device
- housing
- base body
- connection module
- housing part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/89—Metals
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/90—Methods of manufacture
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V15/00—Protecting lighting devices from damage
- F21V15/01—Housings, e.g. material or assembling of housing parts
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
- F21V17/005—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages with keying means, i.e. for enabling the assembling of component parts in distinctive positions, e.g. for preventing wrong mounting
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
- F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
- F21V17/16—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by deformation of parts; Snap action mounting
- F21V17/164—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by deformation of parts; Snap action mounting the parts being subjected to bending, e.g. snap joints
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
- F21V19/005—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by permanent fixing means, e.g. gluing, riveting or embedding in a potting compound
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
- F21V19/0055—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by screwing
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
- F21V29/713—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements in direct thermal and mechanical contact of each other to form a single system
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V3/00—Globes; Bowls; Cover glasses
- F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
- F21V3/06—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material
- F21V3/062—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material the material being plastics
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/238—Arrangement or mounting of circuit elements integrated in the light source
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
- F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
- F21V23/006—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate being distinct from the light source holder
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V7/00—Reflectors for light sources
- F21V7/0008—Reflectors for light sources providing for indirect lighting
- F21V7/0016—Reflectors for light sources providing for indirect lighting on lighting devices that also provide for direct lighting, e.g. by means of independent light sources, by splitting of the light beam, by switching between both lighting modes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Definitions
- the invention relates to a lighting device with at least one semiconductor lamp and a housing in which the semiconductor lamp is accommodated, wherein in the housing a base body is arranged, which carries the semiconductor lamp and wherein the base body has a cavity in the a connection module is arranged.
- the invention further relates to a method for mounting a lighting device.
- Luminous devices with semiconductor lamps are characterized by a high specific luminosity and thus low energy consumption and by a long life. In operation, the semiconductor bulbs must be cooled, since both the lifetime and the effectiveness achieved decreases with the temperature of the lamps. With the increasing light output of the semiconductor lamps and thus also increasing electrical power consumption, the need for effective cooling of the semiconductor lamps is also increasing.
- a driver module for the semiconductor light-emitting means also referred to as a connection module, is frequently arranged in the housing of the lighting device and provides a current suitable for controlling the semiconductor light-emitting means.
- an optical element for example a reflector and / or a lens arrangement, is optionally provided to achieve a desired spatial radiation characteristic.
- retrofit lighting devices which in their case of so-called retrofit lighting devices, which in their case of so-called retrofit lighting devices, which in their
- the semiconductor lamp of the lighting device on a carrier board on which one or more light emitting diodes (LEDs - light emitting diodes) are mounted.
- the carrier board carries and contacts the LEDs. It also serves to dissipate the heat emitted by the LEDs to a heat sink.
- the semiconductor illuminant is mounted on a base body having a cavity in which the connecting device is arranged.
- a plug is used which extends through an opening in the base body and electrically connects the semiconductor lamp with the lying inside the base body connection module. In this case, in particular in the case of automated assembly, the problem arises of connecting the plug through the opening to the connection module.
- a lighting device of the type mentioned above is characterized in that openings are arranged laterally in the base body, through which the connection module can be fixed during an assembly process.
- the connection module can be suitably positioned to put the plug for connection can.
- the lateral access does not hinder the application of the plug from above.
- the openings are arranged in an upper region of the base body, whereby the connection module can be well positioned, even if it is already fixed with play in the lower area.
- the base body is preferably designed in two parts, wherein it is composed for example of a lower shell and an upper shell.
- the two shells form the cavity in which a connection module for the power supply of the semiconductor lamp is arranged.
- the openings used in the assembly are preferably positioned in the upper shell
- the upper shell with the openings in a deep-drawing process urgeformt is then formed in only one manufacturing step, the upper shell and formed the openings.
- upper and lower shells can be deep-drawn from aluminum.
- the base body is fixed detent or clamped in the housing.
- the housing comprises a housing base and a translucent, e.g. translucent or transparent housing upper part, wherein the
- Upper housing part is locked to the lower housing part. Particularly preferred is the locking of the upper housing part with the
- Lower housing part of the base body defined in the housing These embodiments also serve to simplify an automated composition of the lighting device. Further preferably, guide webs are formed inside the housing lower part, which define the connection module in its lower region.
- the lighting device described can be particularly well designed as a retrofit lighting device, in which, for example, a look and a connection diagram of a classic light bulb are imitated.
- An inventive method for mounting a lighting device with at least one semiconductor lamp and a housing in which the at least one semiconductor lamp is accommodated, wherein in the housing a base body is arranged, which carries the semiconductor lamp, and which has a cavity in a terminal module is arranged, has the following steps. There are two arms of a mounting auxiliary tool introduced through lateral openings of the base body in the cavity. With the help of the arms, the connection module located in the cavity is positioned and fixed for further assembly steps. Such a further assembly step is, for example, plugging in a plug for electrical contacting of the connection module by means of a further breakthrough in the base body. This results in the advantages already described in connection with the luminous device.
- FIGS. 1 to 3 three different embodiments of a lighting device according to the application are each shown in a perspective exploded view. Identical or equivalent elements are identified in these and the following figures by the same reference numerals.
- the lighting device is designed as a retrofit lighting device, that is, with respect to the electrical connection and the shape of known bulbs, in this case light bulbs with screw thread (E14 or E27), oriented.
- the features shown in this application can also be implemented in lighting devices with different shape and / or other connection sockets or connection options, including lighting devices that are not designed as retrofit lights.
- the featured features are also used in other electronics applications that have no bulbs.
- the lighting device has a housing 10, which has a lower housing part 1 1 and an upper housing part 12 mounted thereon, and a relative to the upper housing part 12 on the lower housing part 1 1 attached socket 13, which serves to hold the lighting device in a socket and the electrical contact. It is a latching or snap-in connection of the housing lower part 1 1 and the housing upper part 12 is provided.
- the parts in the connection area are configured correspondingly interlocking.
- a detent is provided, which can transmit a torque, so that the two housing parts 1 1, 12 are fixed against rotation to each other.
- the individual parts of the housing 10 are made of plastic, preferably in an injection molding drive.
- At least the upper housing part 12 is held translucent or transparent in order to emit the light emitted by the lighting device.
- the upper housing part 12 may advantageously be produced in a Spritblas vide.
- a base body 20 is used, which is in each case constructed in two parts in the cases shown here and has a lower shell 21 and an upper shell 22 connected thereto.
- the base body 20 has a diverse function. It serves, for example, to hold a semiconductor light-emitting means 30, hereinafter called light-emitting means 30, which is fastened to the upper shell 22.
- the base body 20 is made of a good heat-conductive material, preferably a metal such as aluminum, and thus serves the heat dissipation of the light bulb 30 produced heat.
- Both the lower shell 21 and the upper shell 22 are preferably produced in a deep-drawing process, which allows a cost-effective production with minimum wall thicknesses.
- the lower shell 21 and the upper shell 22 are connected to one another in a mechanically loadable manner, as a result of which there is good heat conduction from the upper shell 22 to the lower shell 21, so that the lower shell 21 can also absorb heat from the illuminant 30 and pass it on or release it.
- Both elements, lower shell 21 and upper shell 22, are constructed substantially rotationally symmetrical, wherein the connection of the two elements takes place together by a Fügepassung, possibly supported by locking means in the connection region, for example, formed in the connecting region circumferential bead or notch.
- the base body 20 is composed essentially in the shape of a capsule, with a connection module 40 being accommodated in its inner cavity.
- the connection module 40 is used to implement the supplied via the base 13 alternating current of the house-light network, so for example in the voltage range of 1 10 volts to 230 volts, in a suitable for supplying the light source 30 DC.
- the latching is formed so that thermal expansion of the base body 20, in particular the lower shell 21 of the base body 20, no inadmissible and materialzerstörende- or tiring stress on the lower housing part 1 1 exerts.
- the lighting means 30 may have a planar carrier board 31, on which a plurality of Leuchtele- elements, here light emitting diodes 32 (LEDs - light emitting diodes) are arranged.
- a designed illuminant 30 radiates substantially perpendicular to the surface of the carrier board 31, ie in the direction of the axis of symmetry (screw axis) of the lighting device.
- an optical element 50 is provided in the embodiments of FIGS. 1 and 3, which is arranged in the emission direction behind the light source 30 and influences the emission characteristic of the lighting device.
- the optical element 50 is mounted on the upper shell 22 in the embodiments shown.
- the optical element 50 is preferably also a metal element produced in a deep-drawing process, which due to the attachment to the upper shell 22 or directly to the carrier board 31 can also absorb and release heat.
- the optical element 50 may also be made of plastic, wherein transparent and / or reflective components can be used.
- the optical element 50 reflective surfaces 51 which are configured rotationally symmetrical funnel-shaped.
- the reflective surfaces 51 divert a majority of the radiation emitted by the light emitting diodes 32 radially outward.
- the optical element 50 is open, so that a further part of the radiation emerges axially.
- the optical element 50 comprises a lens 52, which is arranged axially in front of the light-emitting diodes 32.
- the lens 52 is a diverging lens which transmits the radiation emitted by the light-emitting diodes 32. expansion beam and thus widens the Abstrahlcharaktehstik in the radial direction. Because of its flat design, the lens 52 can be advantageously designed as a Fresnel lens. It is also possible to use optical elements 50 which have both reflective surfaces 51 and lenses 52.
- the components of the lighting device are designed with regard to a possible automation of the manufacturing process, in particular the process of assembling the lighting device. This includes, for example, that parts are easily accessible and orientable. Furthermore, connections between the parts are preferably snap-fit and / or latching and / or joining connections, which can be particularly preferably assembled in a common joining or latching direction, particularly preferably along the axis of symmetry of the lighting device that is shown in FIGS Sockets 13 is also the direction in which the lighting device is screwed into a socket. In the context of the application, this direction is also referred to as the axial direction.
- the three lighting devices shown in FIGS. 1 to 3 differ in the exact shape of their components, the external dimensions and the light output. Nevertheless, they all have a comparable basic structure. This makes it possible to produce a plurality of different lighting devices on the same production lines automatically, without the need for a model change profound changes to the production line or the manufacturing process. It creates a kind of modular system of design solutions that can be quickly responded to market requirements and small changes in the components, such as new bulbs. New developments can be flexibly and quickly integrated into new products.
- FIGS. 1 to 3 an advantageous attachment possibility for the lighting means 30 is indicated on the upper shell 22, which is shown in more detail in FIG.
- the illuminant 30 is mounted on the base body 20 by means of a screw connection.
- FIGS. 1 to 3 an advantageous attachment possibility for the lighting means 30 is indicated on the upper shell 22, which is shown in more detail in FIG.
- the illuminant 30 is mounted on the base body 20 by means of a screw connection. 4
- an embodiment of a lighting device is shown in various representations and different mounting conditions.
- the attachment option for the illuminant 30 on the upper shell 22 indicated there can be used, for example, for the luminous devices of FIGS. 1 to 3.
- the upper shell 22 used is first shown.
- the upper shell 22 has an integrally molded sleeve 221 on its upper side, on which the illuminant 30 is mounted.
- the sleeve 221 represents a pipe section which is open on both sides and which is fixedly connected to the upper shell 22 at the lower end.
- the top shell 22 is preferably made of aluminum from a deep drawing process.
- the sleeve 221 is already formed in this deep-drawing process.
- the sleeve 223 is thus in the primary molding process, with which the upper shell 22 is brought into its basic form formed. In this way, the sleeve 221 is not only formed integrally with the upper shell 22, but also in a manufacturing step.
- a next assembly step force is then applied to the sleeve 221 from above with a stamp, whereby the surroundings of the sleeve 221 on the upper side of the upper shell 22 are dented. Seen from the side, the sleeve 221 then projects less high above the surface of the upper shell 22, as can be seen in FIG. 4b.
- Fig. 4b the assembly of the illuminant 30 with the aid of the indented sleeve 221 is shown.
- the lighting device may already be partially pre-assembled.
- the lower housing part 1 1 already on the base 13 up or be used, from the base body 20, the lower shell 21 can be inserted into the lower housing part 1 1 and locked with this.
- a locking bead 21 1 can be formed circumferentially on the lower housing part 1 1, which engages under latching projections of the housing lower part 1 1.
- the connection module 40 may already be inserted into the lower shell 21, wherein the connecting wires 41 are possibly already connected to the base 13, for example, soldered or plugged into corresponding plug contacts are.
- the illuminant 30 is placed on top of the upper shell 22, wherein the sleeve 221 at least partially by a designated breakthrough of Susunus- ne 31 (not provided with reference numeral in FIG. 4) penetrates.
- the lamp 30 is contacted by means of the plug 42 to the connection module 40. This step will be explained in more detail below in connection with FIG.
- a self-tapping screw 222 is then screwed into the indented sleeve 221.
- the screw preferably has a fine thread, wherein the length of the sleeve 221 allows a good fit of the screw 222.
- FIGS. 4c and 4d again show the assembled unit of upper shell 22 and luminous means 30 in a side view and a perspective view, respectively.
- FIG. 5 shows an advantageous method of assembling the plug 42.
- the plug 42 serves to electrically contact the lighting means 30 with the connection module 40, which is inserted into the cavity of the base body.
- the connection module 40 is guided in its lower region by guide webs 1 14, which are formed on the inside of the housing lower part 1 1 and protrude through corresponding openings in the lower shell 21 in the interior of the base body 20.
- this guide is not so free of play that the upper edge of the connection module 40 is positioned exactly below the opening in the upper shell 22, through which the contact part of the plug 42 is guided.
- two apertures 224 are arranged laterally in the upper shell 22 (compare FIGS. 4a, b and 5a), through which arms 1, 2 of a mounting auxiliary tool are inserted in the assembly process.
- This mounting state is shown in Fig. 5, wherein Fig. 5a shows a side sectional view, Fig. 5b shows a perspective view and Fig. 5c shows a horizontal section.
- the arms 1, 2 of the auxiliary tool at its front inserted into the interior of the base body 20 end V-shaped cut. With these V-shaped cuts, a printed circuit board of the connection module 40 is gripped and centered. The upper end of the connection module 40 is thereby pushed into a correct position, in which the plug 42 can be placed easily.
- FIGS. 6a and 6b The further assembly process is illustrated with reference to FIGS. 6a and 6b.
- Fig. 6a shows first the final mounted device.
- Fig. 6a is well the above-mentioned indentation (reference numeral 223) in the upper shell 22 can be seen.
- the optical element 50 is placed, said optical element 50 is formed so that it latches in the upper region of the upper shell 22 at its outer periphery.
- the upper shell 22 in this area a circumferential
- the translucent housing upper part 12 is placed on the lower housing part 1 1 and locked with this.
- Fig. 6b shows the area in which the lower shell 21 of the base body 20 and the upper housing part 12 are latched in the lower housing part 1 1, in more detail.
- Fig. 7a and 7b show in addition to the lower housing part 1 1 with inserted lower shell 21 separately in a sectional view, in Fig. 7 b, in turn, the Verrastungs Scheme is shown enlarged.
- Fig. 7c shows that
- the detent recess 1 1 1 may be circumferentially or at least partially formed circumferentially.
- a corrugation 1 12 is incorporated in the locking recess 1 1 1 also incorporated.
- the upper housing part 12 has a complementary bearing edge 121, with which it rests on the upper housing part 12. Internally encircling a downwardly pointing tongue is formed on the support edge 121 with a likewise circumferentially or at least partially circumferentially outwardly facing latching lug 122.
- Upper housing part 12 engages the locking lug 122 in an undercut of the latching projection 1 1 1.
- the locking lug 122 is formed circumferentially and it is additionally provided with a plurality of again projecting ribs 123.
- the ribs 123 are distributed along the circumference.
- the upper shell 22 is also slightly angled radially outward.
- the tongue on which the locking lugs 122 are formed may be dimensioned so that it lies with its lower end on this bend and thus the upper shell 22 directly and indirectly, the lower shell 21, on which the upper shell 22 rests circumferentially, in the
- Housing base 1 1 determines. Alternatively, there may be a small distance between the tongue of the housing top 12 and the base body 20. In this case, the tongue of the upper housing part 12 does not fix the base body 20 directly in the lower housing part 1 1, but provides an additional safeguard in the event that the actual fastening of the basic body 20 is released. Thus, substantially all internal components of the lighting device by the one locking connection between the upper housing part 12 and the
- Housing lower part 1 1 defined in the lighting device or at least additionally secured lent.
- a latching projection 1 13 is formed below the detent recess 1 1 1 on the inside of the lower housing part 1 1 . This can be circumferential, or consist of several distributed segments.
- the latching projection 1 13 is undercut, so that the locking bead 21 1 of the lower shell 21 is latched under the latching projection 1 13.
- the lower shell 21 fits snugly in the lower housing part 1 1, so that the lateral surfaces both superimposed as large as possible.
- a good heat transfer from the lower shell 21 to the lower housing part 1 1 is achieved.
- This is preferably formed thin-walled, so that a heat transfer to the outside of the lower housing part 1 1 takes place where heat is released by convection and / or radiant heat.
- the lower housing part 1 1 is made of plastic, so a non-negligible part of the heat generated by the lighting device can be removed.
- the metallic lower shell 21 expands when heated relative to the lower housing part 1 1. So that this does not lead to unacceptable stresses in the materials, the locking bead 21 1 and the undercut portion of the locking projection 1 13 are formed so that the locking bead 21 1 can escape in the locked position upwards. For this purpose, for example, both the locking bead 21 1 and the undercut of the locking projection 1 13 rounded. There are no contact surfaces between the lower shell 21 and the lower housing part 1 1, the surface normal is in the direction of thermal expansion. Upon expansion of the lower shell 21 relative to the lower housing part 1 1, the lower shell 21 can escape in the latching position upwards, without being released from the latching.
- connection module 40 for example, with a printed circuit board (PCB - printed circuit board) are inserted.
- FIGS. 8 and 9 show a side view and a top view of the connection module 40.
- the connection wires 40 are fixed to the connection module 40, for example by a solder connection.
- the connecting wires 41 are designed as rigid wires, wherein the diameter of the connecting wires 41 may possibly be larger than is necessary for the electrical conductivity.
- the rigid execution of the leads 41 has the advantage that the leads 41 in the automated assembly of the connection module 40 can be easily guided through openings in the lower shell 21 and the lower housing part 1 1 and thus stand ready for a Kunststoffie- tion with the base 13.
- the terminal wires 41 can be guided in different planes so as to be sufficiently spaced apart from each other even if the terminal points of the lead wires 41 on the terminal module 40 are closely adjacent.
- the connecting wires 41 may be formed as insulated or non-insulated wires. The bending stiffness or flexural strength allows in an automated Mon- Days also aligning, fixing, bending and / or cutting these leads 41st
- FIG. 10 shows an advantageous electrical connection between a plurality of printed circuit boards.
- these are a printed circuit board of the connection module 40 and the printed circuit board 31 of the lighting means 30. It is noted that this type of connection of two printed circuit boards which are at an angle to one another can also be used in other fields of application.
- the electrical connection illustrated in FIG. 10 represents an alternative to the plug 42 shown in the preceding embodiments.
- a breakthrough is present in the carrier board 31, in which the printed circuit board (board) of the connection module 40 with at least one
- FIG. Fig. 1 1 shows a sectional view of a dome 60, which is provided with openings 61 in a variety of geometries.
- This dome 60 can be placed on the upper shell 22 by a suitable method, for example, again by joining and / or locking, and surrounds the illuminant 30.
- the dome 60 leads to an effective light distribution, which reflects the shape of the apertures 61.
- mirrored metal parts can also be arranged around the lighting means 30, which lead to a correspondingly effective light distribution.
- an optical element 50 designed here as a reflector see FIGS. 1 and 3
- FIGS. 1 and 3 which serves to distribute the light of the light emitted by the illuminant 30, are shown in FIGS. In the embodiments of FIGS.
- FIG. 13 and 14 is also indicated how such an optical element 50 with appropriately designed legs 53 on Luminous means 30 and, if appropriate, additionally can be fixed to the upper shell 22. It is possible (see Fig. 14), the legs 53 also act as mounting brackets, via which a fixing of the illuminant 30 takes place on the base body 20. In this sense, the optical element 50 additional borrowed and / or alternatively for fixing the light source 30 on the upper shell 22 in the manner of the mounting bracket 222 shown in FIGS. 1 to 4 are used.
- the flattened area at the lower end of the leg 53 may be formed upon insertion of the optical element 50 by a deformation process during assembly.
- optical element 50 By connecting the optical element 50 to the illuminant 30, an effective heat dissipation is also achieved to the optical element 50, which can deliver the heat absorbed as radiant heat and next to the base body 20 is an effective element for cooling the illuminant 30.
- inner and outer reflective surfaces 51 of the optical element 50 By connecting the optical element 50 to the illuminant 30, an effective heat dissipation is also achieved to the optical element 50, which can deliver the heat absorbed as radiant heat and next to the base body 20 is an effective element for cooling the illuminant 30.
- the optical element 50 is formed as a rotationally symmetrical body having an open area inside. The light which penetrates through the inner open region and the light which is guided laterally past the optical element 50 are superimposed in the far region to form a uniformly illuminated light field.
- Fig. 15 shows in a perspective view of a three-dimensionally formed light source 30.
- the carrier board 31 (PCB - printed cage board) of the illuminant 30 is not flat (two-dimensional) formed, but has a three-dimensional structure.
- LEDs 32 are arranged on surfaces which point in different directions. In this way, a uniformly radiating characteristic is already achieved by the luminous means 30 itself, so that an additional optical element for light distribution can be dispensed with.
- the support plate 31 of the luminous means 30 is manufactured in a planar form, wherein the support plate 31 has a substantially circular base region 312 with arms 313 projecting radially outward.
- LEDs 32 are arranged both in the base region 312, as well as on the protruding arms 313.
- the projecting arms 313 are subsequently demounted by deformation.
- a relatively large bending radius may be provided in order not to damage the layer structure (aluminum carrier, insulating layer, conductor track). The deformation can be done either before mounting the LEDs 32 or after their assembly.
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102013105011 | 2013-05-15 | ||
DE102014101403.0A DE102014101403A1 (de) | 2013-05-15 | 2014-02-05 | Leuchtvorrichtung |
PCT/EP2014/059800 WO2014184214A1 (fr) | 2013-05-15 | 2014-05-13 | Dispositif d'éclairage et procédé de montage du dispositif d'éclairage |
Publications (2)
Publication Number | Publication Date |
---|---|
EP3001857A1 true EP3001857A1 (fr) | 2016-04-06 |
EP3001857B1 EP3001857B1 (fr) | 2017-11-01 |
Family
ID=51831463
Family Applications (4)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP14727732.1A Ceased EP3001856A1 (fr) | 2013-05-15 | 2014-05-13 | Dispositif d'éclairage |
EP14724077.4A Not-in-force EP3001855B1 (fr) | 2013-05-15 | 2014-05-13 | Dispositif d'éclairage |
EP14723453.8A Withdrawn EP3001854A1 (fr) | 2013-05-15 | 2014-05-13 | Dispositif d'éclairage et procédé de montage d'un moyen lumineux semi-conducteur d'un dispositif d'éclairage |
EP14726105.1A Not-in-force EP3001857B1 (fr) | 2013-05-15 | 2014-05-13 | Dispositif d'éclairage et procédé de montage du dispositif d'éclairage |
Family Applications Before (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP14727732.1A Ceased EP3001856A1 (fr) | 2013-05-15 | 2014-05-13 | Dispositif d'éclairage |
EP14724077.4A Not-in-force EP3001855B1 (fr) | 2013-05-15 | 2014-05-13 | Dispositif d'éclairage |
EP14723453.8A Withdrawn EP3001854A1 (fr) | 2013-05-15 | 2014-05-13 | Dispositif d'éclairage et procédé de montage d'un moyen lumineux semi-conducteur d'un dispositif d'éclairage |
Country Status (6)
Country | Link |
---|---|
US (1) | US20160123542A1 (fr) |
EP (4) | EP3001856A1 (fr) |
CN (1) | CN105229369A (fr) |
DE (1) | DE102014101403A1 (fr) |
ES (1) | ES2727253T3 (fr) |
WO (6) | WO2014184207A1 (fr) |
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CN104676513A (zh) * | 2015-03-27 | 2015-06-03 | 立达信绿色照明股份有限公司 | 灯头电连接结构 |
DE102017120924A1 (de) | 2017-09-11 | 2019-03-14 | Hanon Systems | EMV-Filter zur Unterdrückung von Störsignalen |
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2014
- 2014-02-05 DE DE102014101403.0A patent/DE102014101403A1/de not_active Ceased
- 2014-05-13 EP EP14727732.1A patent/EP3001856A1/fr not_active Ceased
- 2014-05-13 WO PCT/EP2014/059793 patent/WO2014184207A1/fr active Application Filing
- 2014-05-13 EP EP14724077.4A patent/EP3001855B1/fr not_active Not-in-force
- 2014-05-13 WO PCT/EP2014/059798 patent/WO2014184212A1/fr active Application Filing
- 2014-05-13 WO PCT/EP2014/059799 patent/WO2014184213A1/fr active Application Filing
- 2014-05-13 CN CN201480028068.9A patent/CN105229369A/zh active Pending
- 2014-05-13 EP EP14723453.8A patent/EP3001854A1/fr not_active Withdrawn
- 2014-05-13 WO PCT/EP2014/059796 patent/WO2014184210A1/fr active Application Filing
- 2014-05-13 WO PCT/EP2014/059801 patent/WO2014184215A1/fr active Application Filing
- 2014-05-13 WO PCT/EP2014/059800 patent/WO2014184214A1/fr active Application Filing
- 2014-05-13 EP EP14726105.1A patent/EP3001857B1/fr not_active Not-in-force
- 2014-05-13 ES ES14724077T patent/ES2727253T3/es active Active
- 2014-05-13 US US14/891,618 patent/US20160123542A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
EP3001855B1 (fr) | 2019-02-20 |
EP3001854A1 (fr) | 2016-04-06 |
WO2014184210A1 (fr) | 2014-11-20 |
WO2014184215A1 (fr) | 2014-11-20 |
DE102014101403A1 (de) | 2014-11-20 |
CN105229369A (zh) | 2016-01-06 |
EP3001856A1 (fr) | 2016-04-06 |
WO2014184207A1 (fr) | 2014-11-20 |
ES2727253T3 (es) | 2019-10-15 |
EP3001855A1 (fr) | 2016-04-06 |
WO2014184212A1 (fr) | 2014-11-20 |
EP3001857B1 (fr) | 2017-11-01 |
US20160123542A1 (en) | 2016-05-05 |
WO2014184213A1 (fr) | 2014-11-20 |
WO2014184214A1 (fr) | 2014-11-20 |
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