EP3001856A1 - Dispositif d'éclairage - Google Patents

Dispositif d'éclairage

Info

Publication number
EP3001856A1
EP3001856A1 EP14727732.1A EP14727732A EP3001856A1 EP 3001856 A1 EP3001856 A1 EP 3001856A1 EP 14727732 A EP14727732 A EP 14727732A EP 3001856 A1 EP3001856 A1 EP 3001856A1
Authority
EP
European Patent Office
Prior art keywords
lighting device
base body
housing
upper shell
rivet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
EP14727732.1A
Other languages
German (de)
English (en)
Inventor
Andreas Ritzenhoff
Lutz ENGEL
Jörg RACHE
Oliver Arnold
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seidel GmbH and Co KG
Original Assignee
Seidel GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seidel GmbH and Co KG filed Critical Seidel GmbH and Co KG
Publication of EP3001856A1 publication Critical patent/EP3001856A1/fr
Ceased legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/90—Methods of manufacture
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89—Metals
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V15/00—Protecting lighting devices from damage
    • F21V15/01—Housings, e.g. material or assembling of housing parts
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/005—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages with keying means, i.e. for enabling the assembling of component parts in distinctive positions, e.g. for preventing wrong mounting
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/16—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by deformation of parts; Snap action mounting
    • F21V17/164—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by deformation of parts; Snap action mounting the parts being subjected to bending, e.g. snap joints
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/005—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by permanent fixing means, e.g. gluing, riveting or embedding in a potting compound
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/0055—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by screwing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F21V29/713—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements in direct thermal and mechanical contact of each other to form a single system
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
    • F21V3/06—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material
    • F21V3/062—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material the material being plastics
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/238—Arrangement or mounting of circuit elements integrated in the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • F21V23/006—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate being distinct from the light source holder
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • F21V7/0008—Reflectors for light sources providing for indirect lighting
    • F21V7/0016—Reflectors for light sources providing for indirect lighting on lighting devices that also provide for direct lighting, e.g. by means of independent light sources, by splitting of the light beam, by switching between both lighting modes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the invention relates to a lighting device with at least one semiconductor lamp and a housing made of plastic, in which the semiconductor lamp is accommodated.
  • Luminous devices with semiconductor lamps are characterized by a high specific luminosity and thus low energy consumption and by a long life. In operation, the semiconductor bulbs must be cooled, since both the life and the effectiveness achieved with the
  • a driver module for the semiconductor light-emitting means also referred to as connection module, is frequently arranged in the housing of the lighting device, which provides a current suitable for driving the semiconductor light-emitting means.
  • an optical element for example a reflector and / or a lens arrangement, is optionally provided to achieve a desired spatial radiation characteristic.
  • At least sections of the housing are frequently made of metal, for example aluminum.
  • These housing sections acting as heat sinks may additionally be equipped with cooling fins, so that heat can be effectively dissipated via convection.
  • using such an outer metal portion of the housing is production-consuming and correspondingly expensive.
  • the section acting as a heat sink places narrow limits on the design of the lighting device. It is therefore an object of the present invention to provide a lighting device of the type mentioned, in which an effective heat dissipation even without metallic housing sections, which act as a heat sink, is achieved.
  • the lighting device should also be inexpensive and can be produced with consistent quality.
  • a lighting device having the features of the independent claim.
  • Advantageous embodiments are specified in the dependent claims.
  • a lighting device of the type mentioned above is characterized in that the lighting device within the housing has a metallic base body on which the semiconductor lamp is fixed, wherein the metallic base body has a surface which rests at least partially inside of the housing.
  • the surface resting against the inside of the housing it is also possible to dissipate heat via the plastic housing, effectively contributing to cooling, even in the case of an internal metallic base body.
  • the metallic base body serves as a carrier and at the same time constitutes a cooling element for the semiconductor lamp, so that a good removal of the heat generated by the semiconductor lamp during operation takes place.
  • the surface of the base body preferably fits tightly against an inner surface of a wall of the housing in order to allow the best possible heat transfer.
  • the contact surface preferably has a large proportion of the total surface area of the base body, for example at least 30%, preferably at least 50%. More preferably, the base body as well as the housing in the region of the contact surface is substantially rotationally symmetrical.
  • the contact surface is then preferably or a part of the lateral surface of the base body.
  • the lighting device of the base body is fixed detent or clamping in the housing.
  • the base body preferably has a latching bead which engages under at least one latching projection arranged in the housing. Further preferred are the Rastwulst and a undercut part of the locking projection shaped so that the locking bead has a range of motion in a locking position.
  • the range of motion extends in the direction of a wall of the base body.
  • contact surfaces between the base body and the housing are avoided whose surface normal lies in the direction of the thermal expansion of the base body.
  • the latched part of the housing can escape in the latching position without disengaging from the latching.
  • the base body is preferably designed in two parts, wherein it is composed for example of a lower shell and an upper shell.
  • the two shells form a cavity in which a connection module for the power supply of the semiconductor light-emitting means is arranged.
  • the semiconductor light-emitting means with a rivet on the base body for example, the upper shell, set.
  • the rivet is integrally formed with the base body, whereby the semiconductor light-emitting means can be attached to the base body as a carrier in a particularly simple and cost-effective manner.
  • the integral design also allows the rivet to be deformed for attachment without having to press with a tool against the side opposite the semiconductor bulb. Deformation of the rivet can be done solely from the outside of the base body.
  • the base body for example, in turn, the upper shell, urgeformt with the rivet in a deep-drawing process. It is then formed in only one manufacturing step, the upper shell and formed the rivet.
  • Upper and lower shell can be deep drawn, for example, made of aluminum.
  • the semiconductor light-emitting means can also be fixed by means of a screw on the base body, in particular on its upper shell.
  • the lighting device described can be particularly well designed as a retrofit lighting device, in which, for example, a look and a connection diagram of a classic light bulb are imitated.
  • Lighting devices in each case in schematic sectional views or schematic perspective views.
  • FIGS. 1 to 3 three different embodiments of a lighting device according to the application are each shown in a perspective exploded view. Identical or equivalent elements are identified in these and the following figures by the same reference numerals.
  • the lighting device is designed as a retrofit lighting device, that is, with respect to the electrical connection and the shape of known bulbs, in this case light bulbs with screw thread (E14 or E27), oriented.
  • the features shown in this application can also be implemented in lighting devices with different shape and / or other connection sockets or connection options, including lighting devices that are not designed as retrofit lights.
  • the featured features are also used in other electronics applications that have no bulbs.
  • the lighting device has a housing 10, which has a lower housing part 1 1 and an upper housing part 12 mounted thereon, and a relative to the upper housing part 12 on the lower housing part 1 1 attached socket 13, which serves to hold the lighting device in a socket and the electrical contact. It is a restraining or snapping connection of the Housing bottom part 1 1 and the housing upper part 12 is provided.
  • the parts in the connection area are configured correspondingly interlocking.
  • a detent is provided, which can transmit a torque, so that the two housing parts 1 1, 12 are fixed against rotation to each other.
  • the individual parts of the housing 10 are made of plastic, preferably in an injection molding process.
  • At least the upper housing part 12 is held translucent or transparent in order to emit the light emitted by the lighting device.
  • the upper housing part 12 may advantageously be produced in a Spritblas vide.
  • a base body 20 is used, which is in each case constructed in two parts in the cases shown here and has a lower shell 21 and an upper shell 22 connected thereto.
  • the base body 20 has a diverse function. It serves, for example, to hold a semiconductor light-emitting means 30, hereinafter called light-emitting means 30, which is fastened to the upper shell 22.
  • the base body 20 is made of a good heat-conducting material, preferably a metal such as aluminum, and thus serves to dissipate heat from the light source 30 produced heat.
  • Both the lower shell 21 and the upper shell 22 are preferably produced in a deep-drawing process, which allows a cost-effective production with minimum wall thicknesses.
  • the lower shell 21 and the upper shell 22 are connected to one another in a mechanically loadable manner, as a result of which there is good heat conduction from the upper shell 22 to the lower shell 21, so that the lower shell 21 can also absorb heat from the illuminant 30 and pass it on or release it.
  • Both elements, lower shell 21 and upper shell 22, are constructed substantially rotationally symmetrical, wherein the connection of the two elements takes place with one another by a joint fit, optionally supported by locking means in the connection region, for example a peripheral bead or notch formed in the connection region.
  • the base body 20 is composed essentially in the shape of a capsule, with a connection module 40 being accommodated in its inner cavity.
  • Connection module 40 is used to implement the supplied via the base 13 AC power of the home-light network, so for example in the voltage range of 1 10 volts to 230 volts, in a suitable for supplying the light source 30 DC.
  • base body 20 and the lower housing part 1 1 are locked together, wherein the latching is formed so that a thermal expansion of the base body 20, in particular the lower shell 21 of the base body 20 pers, no undue and material destroying or tiring stress on the lower housing part 1 1 exerts , In this case, a good thermal contact between the lower shell 21 and the lower housing part 1 1 is given, so that heat generated within the lighting device, among other things, on the lower housing part 1 1 is discharged.
  • the latching of the base body 20 with the lower housing part 1 1 is shown in more detail in connection with Figures 5 to 7.
  • an opening is provided, are passed through the connecting wires 41 of the connection module 40 to the base 13.
  • an opening is also introduced, through which an electrical connection from the lighting means 30 to the connection module 40 takes place. This can be done, for example, via a preassembled on semiconductor light-emitting means 30, for example, soldered, plug 42.
  • the lighting means 30 may have a planar support plate 31, on which a plurality of light-emitting elements, here light-emitting diodes 32 (LEDs - light emitting diodes) are arranged.
  • a designed illuminant 30 radiates substantially perpendicular to the surface of the carrier board 31, ie in the direction of the axis of symmetry (screw axis) of the lighting device.
  • an optical element 50 is provided in the embodiments of FIGS. 1 and 3, which is arranged in the emission direction behind the light source 30 and influences the emission characteristic of the lighting device.
  • the optical element 50 is mounted on the upper shell 22 in the embodiments shown.
  • the optical element 50 is preferably also a metal element produced in a deep-drawing process, which due to the attachment to the upper shell 22 or directly to the carrier board 31 can also absorb and release heat.
  • the optical element 50 may also be made of plastic, wherein transparent and / or reflective components may be used.
  • the optical element 50 has reflective surfaces 51, which are designed in a rotationally symmetrical funnel-shaped manner are.
  • the reflective surfaces 51 divert a majority of the radiation emitted by the LEDs 32 radiation radially outward.
  • the optical element 50 is open, so that a further part of the radiation emerges axially.
  • the optical element 50 comprises a lens 52, which is arranged axially in front of the light-emitting diodes 32.
  • the lens 52 is here a diverging lens, which widens the radiation beam emitted by the light emitting diodes 32 and thus widens the emission characteristic in the radial direction. Because of its flat design, the lens 52 can be advantageously designed as a Fresnel lens. It is also possible to use optical elements 50 which have both reflective surfaces 51 and lenses 52.
  • the components of the lighting device are designed with regard to a possible automation of the manufacturing process, in particular the process of assembling the lighting device.
  • connections between the parts are preferably snap-fit and / or latching and / or joining connections, which can particularly preferably be assembled in a common joining or latching direction, particularly preferably along the symmetry axis of the lighting device, which in the illustrated pedestals 13 also the direction in which the lighting device is screwed into a socket. In the context of the application, this direction is also referred to as the axial direction.
  • the three lighting devices shown in FIGS. 1 to 3 differ in the exact shape of their components, the external dimensions and the light output. Nevertheless, they all have a comparable basic structure.
  • FIGS. 1 to 3 an advantageous attachment possibility for the illuminant 30 on the upper shell 22 is indicated, which is shown in more detail in FIG. So far, an adhesive or a screw connection is known for fastening the illuminant 30. According to the application, it is provided to fix the luminous means 30 on the upper shell 22 by means of a positive connection by means of a deformable connecting element.
  • a fastening clip 222 is used as the deformable connecting element, which is preferably inserted through previously introduced openings 31 1, 221 in the carrier board 31 of the illuminant 30 or the upper shell 22 and bent at the bottom by appropriate tools , The shape of the bend and the selected material thereby allow a secure and elastic, even with thermal expansion frictional fixing of the light source 30 on the upper shell 22, whereby a good thermal connection of the light source 30 is given to the base body 20.
  • the fastening clip 222 which preferably consists of a metal, for example of a copper alloy, can be used for making electrical contact with the luminous means 30.
  • a heat-conducting paste may be applied between the illuminant 30 and the upper shell 22.
  • FIGS. 5 to 7 show a further exemplary embodiment of a lighting device in various representations and different mounting states.
  • the attachment option for the illuminant 30 on the upper shell 22 indicated there can likewise be used for the luminous devices of FIGS. 1 to 3.
  • the upper shell 22 used is first shown.
  • the upper shell 22 has an integrally formed rivet 223 on its upper side, on which the illuminant 30 is mounted.
  • the rivet 223 is an alternative to the mounting bracket 222 shown in FIG. 4.
  • the rivet 223 may be formed as a rivet or solid rivet.
  • the upper shell 22 is preferably made of aluminum from a deep-drawing process. Particularly preferably, the rivet 223 is already formed in this deep-drawing process. The rivet 223 is thus in the original molding process, with which the upper shell 22 is brought into its basic form formed. In this way, the rivet 223 is not only formed integrally with the upper shell 22, but also in a manufacturing step.
  • the assembly of the illuminant 30 is shown with the aid of the rivet 223.
  • the lighting device is already partially pre-assembled.
  • the lower housing part 1 1 is already mounted on the base 13 or inserted, from the base body 20, the lower shell 21 is inserted into the lower housing part 1 1 and locked with this.
  • a latching bead 21 1 is circumferentially formed on the lower housing part 1 1, which engages under latching projections (not provided in FIG. 5 with reference numerals) of the lower housing part 1 1.
  • the connection module 40 is inserted into the lower shell 21, wherein the connecting wires 41 possibly already connected to the base 13, for example, soldered or plugged into corresponding plug contacts, are.
  • the illuminant 30 is placed on the upper side of the upper shell 22, the rivet 223 penetrating through the opening 31 1 of the support board 31 provided for this purpose (not provided with reference numerals in FIG. 5).
  • the lighting means 30 is fixed by means of the plug 42 on the one hand on the upper shell 22 and contacted on the other with the connection module 40.
  • the rivet 223 is deformed by the action of a punch from above, so that it sets the carrier plate 31 in a form-fitting manner on the upper shell 22.
  • the upper shell 22 is preferably circumferentially at its lower edge on the lower shell 21, so that the force acting on the upper shell 22 when bending the rivet 223 forces can be derived well and over a large area down. For this reason, the deformation of the rivet 223 can take place in the preassembled state of the luminous means.
  • an at least single-pole electrical contact can additionally take place via the rivet 223.
  • FIGS. 6a and 6b The further assembly process is illustrated with reference to FIGS. 6a and 6b.
  • Fig. 6a shows first the final mounted device.
  • the optical element 50 is placed, wherein this optical element 50 is designed such that it latches in the upper region of the upper shell 22 on its outer circumference.
  • the upper shell 22 in this area on a circumferential constriction.
  • translucent housing upper part 12 placed on the lower housing part 1 1 and locked with this.
  • Fig. 6b shows the area in which the lower shell 21 of the base body 20 and the upper housing part 12 are latched in the lower housing part 1 1, in more detail.
  • Fig. 7a and 7b show in addition to the lower housing part 1 1 with inserted lower shell 21 separately in a sectional view, in Fig. 7 b, in turn, the Verrastungs Scheme is shown enlarged.
  • Fig. 7c shows that
  • the detent recess 1 1 1 may be circumferentially or at least partially formed circumferentially.
  • a corrugation 1 12 is incorporated in the locking recess 1 1 1 also incorporated.
  • the upper housing part 12 has a complementary bearing edge 121, with which it rests on the upper housing part 12. Internally encircling a downwardly pointing tongue is formed on the support edge 121 with a likewise circumferentially or at least partially circumferentially outwardly facing latching lug 122.
  • Housing upper part 12 engages the locking lug 122 in an undercut of the locking projection 1 1 1 a.
  • the locking lug 122 is formed circumferentially and it is additionally provided with a plurality of again projecting ribs 123.
  • the ribs 123 are distributed along the circumference.
  • the upper shell 22 is also slightly angled radially outward.
  • the tongue on which the latching noses 122 are formed may be dimensioned so that it lies with its lower end on this bend and thus the upper shell 22 directly and indirectly also the Un. terschale 21, on which the upper shell 22 rests circumferentially, in the lower housing part 1 1 determines.
  • the tongue of the upper housing part 12 does not fix the base body 20 directly in the lower housing part 1 1, but provides an additional safeguard in the event that the actual fastening of the basic body 20 is released.
  • Housing lower part 1 1 defined in the lighting device or at least additionally secured lent.
  • a latching projection 1 13 is formed below the detent recess 1 1 1 on the inside of the lower housing part 1 1 . This can be circumferential, or consist of several distributed segments.
  • the latching projection 1 13 is undercut, so that the locking bead 21 1 of the lower shell 21 is latched under the latching projection 1 13.
  • the lower shell 21 fits snugly in the lower housing part 1 1, so that the lateral surfaces both superimposed as large as possible.
  • a good heat transfer from the lower shell 21 to the lower housing part 1 1 is achieved.
  • This is preferably formed thin-walled, so that a heat transfer also takes place on the outside of the housing lower part 1 1, where a heat release via convection and / or radiant heat takes place.
  • the lower housing part 1 1 is made of plastic, so a non-negligible part of the heat generated by the lighting device can be removed. Due to the different thermal expansion, however, the metallic lower shell 21 expands when heated relative to the lower housing part 1 1. So that this does not lead to unacceptable stresses in the materials, the locking bead 21 1 and the undercut portion of the locking projection 1 13 are formed so that the locking bead 21 1 can escape in the locked position upwards. For this purpose, for example, both the locking bead 21 1 and the undercut of the locking projection 1 13 rounded.
  • connection module 40 with a printed circuit board (PCB - printed circuit board) are inserted.
  • FIGS. 8 and 9 show a side view and a top view of the connection module 40.
  • the connection wires 40 are fixed to the connection module 40, for example by a solder connection.
  • the connecting wires 41 are designed as rigid wires, wherein the diameter of the connecting wires 41 may possibly be larger than is necessary for the electrical conductivity.
  • the rigid execution of the leads 41 has the advantage that the leads 41 in the automated assembly of the connection module 40 can be easily guided through openings in the lower shell 21 and the lower housing part 1 1 and thus stand ready for a Kunststoffie- tion with the base 13.
  • the terminal wires 41 can be guided in different planes so as to be sufficiently spaced apart from each other even if the terminal points of the lead wires 41 on the terminal module 40 are closely adjacent.
  • the connecting wires 41 may be formed as insulated or non-insulated wires. The bending stiffness or bending strength also makes it possible to align, fix, bend and / or cut these connection wires 41 in an automated assembly.
  • Fig. 10 shows an advantageous electrical connection between a plurality of printed circuit boards.
  • these are a printed circuit board of the connection module 40 and the printed circuit board 31 of the lighting means 30. It should be noted that this type of connection of two printed circuit boards which are at an angle to one another can also be used in other fields of application.
  • the electrical connection shown in Fig. 10 represents an alternative to the connector 42 shown in the previous embodiments.
  • a breakthrough is present in the carrier board 31, in which the printed circuit board (board) of the connection module 40 with at least one
  • FIG. Fig. 1 1 shows a sectional view of a dome 60, which is provided with openings 61 in a variety of geometries.
  • This dome 60 can be placed on the upper shell 22 by a suitable method, for example, again by joining and / or locking, and surrounds the illuminant 30.
  • the dome 60 leads to an effective light distribution, which reflects the shape of the apertures 61.
  • mirrored metal parts can also be arranged around the lighting means 30, which lead to a correspondingly effective light distribution.
  • an optical element 50 designed here as a reflector see FIGS. 1 and 3
  • FIGS. 1 and 3 which serves to distribute the light of the light emitted by the illuminant 30, are shown in FIGS. In the exemplary embodiments of FIGS.
  • the optical element 50 can additionally and / or alternatively be used to fix the luminous means 30 on the upper shell 22 in the manner of the fastening clip 222 according to FIGS. 1 to 4.
  • the flattened area at the lower end of the leg 53 may be formed upon insertion of the optical element 50 by a deformation process during assembly.
  • optical element 50 By connecting the optical element 50 with the lighting means 30, an effective heat dissipation is also achieved on the optical element 50, which can deliver the absorbed heat as radiant heat and represents an effective element for cooling the lighting means 30 next to the base body 20.
  • inner and outer reflective surfaces 51 of the optical element 50 are formed rounded such that the optical element 50 shows no sharp edges in the shadow.
  • the optical element 50 is formed as a rotationally symmetrical body having an open area inside. The light which penetrates through the inner open region and the light which is guided laterally past the optical element 50 are superimposed in the far region to form a uniformly illuminated light field.
  • Fig. 15 shows a perspective view of a three-dimensionally formed light source 30.
  • the carrier board 31 (PCB - printed circuit board) of the illuminant 30 is not flat (two-dimensional) formed, but has a three-dimensional structure.
  • LEDs 32 are arranged on surfaces which point in different directions. In this way, a uniformly radiating characteristic is already achieved by the luminous means 30 itself, so that an additional optical element for light distribution can be dispensed with.
  • the support plate 31 of the luminous means 30 is produced in a planar shape, wherein the support plate 31 has a substantially circular base portion 312 with radially outwardly projecting arms 313.
  • LEDs 32 are arranged both in the base region 312, as well as on the protruding arms 313.
  • the protruding arms 313 are subsequently bent by deformation. In this case, a relatively large bending radius may be provided in order not to damage the layer structure (aluminum carrier, insulating layer, conductor track). The deformation can be done either before mounting the LEDs 32 or after their assembly.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

L'invention concerne un dispositif d'éclairage comprenant au moins un moyen lumineux semi-conducteur (30) et une enveloppe (10) en matière plastique qui abrite ledit au moins un moyen lumineux semi-conducteur (30). Le dispositif d'éclairage est caractérisé en ce qu'il présente à l'intérieur de l'enveloppe (10) un corps de base métallique (20) sur lequel est fixé le moyen lumineux semi-conducteur (30), le corps de base métallique (20) présente une surface qui est en contact au moins par sections avec l'intérieur de l'enveloppe (10).
EP14727732.1A 2013-05-15 2014-05-13 Dispositif d'éclairage Ceased EP3001856A1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102013105011 2013-05-15
DE102014101403.0A DE102014101403A1 (de) 2013-05-15 2014-02-05 Leuchtvorrichtung
PCT/EP2014/059793 WO2014184207A1 (fr) 2013-05-15 2014-05-13 Dispositif d'éclairage

Publications (1)

Publication Number Publication Date
EP3001856A1 true EP3001856A1 (fr) 2016-04-06

Family

ID=51831463

Family Applications (4)

Application Number Title Priority Date Filing Date
EP14726105.1A Not-in-force EP3001857B1 (fr) 2013-05-15 2014-05-13 Dispositif d'éclairage et procédé de montage du dispositif d'éclairage
EP14723453.8A Withdrawn EP3001854A1 (fr) 2013-05-15 2014-05-13 Dispositif d'éclairage et procédé de montage d'un moyen lumineux semi-conducteur d'un dispositif d'éclairage
EP14724077.4A Not-in-force EP3001855B1 (fr) 2013-05-15 2014-05-13 Dispositif d'éclairage
EP14727732.1A Ceased EP3001856A1 (fr) 2013-05-15 2014-05-13 Dispositif d'éclairage

Family Applications Before (3)

Application Number Title Priority Date Filing Date
EP14726105.1A Not-in-force EP3001857B1 (fr) 2013-05-15 2014-05-13 Dispositif d'éclairage et procédé de montage du dispositif d'éclairage
EP14723453.8A Withdrawn EP3001854A1 (fr) 2013-05-15 2014-05-13 Dispositif d'éclairage et procédé de montage d'un moyen lumineux semi-conducteur d'un dispositif d'éclairage
EP14724077.4A Not-in-force EP3001855B1 (fr) 2013-05-15 2014-05-13 Dispositif d'éclairage

Country Status (6)

Country Link
US (1) US20160123542A1 (fr)
EP (4) EP3001857B1 (fr)
CN (1) CN105229369A (fr)
DE (1) DE102014101403A1 (fr)
ES (1) ES2727253T3 (fr)
WO (6) WO2014184212A1 (fr)

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Also Published As

Publication number Publication date
EP3001854A1 (fr) 2016-04-06
EP3001857A1 (fr) 2016-04-06
WO2014184213A1 (fr) 2014-11-20
WO2014184210A1 (fr) 2014-11-20
WO2014184207A1 (fr) 2014-11-20
EP3001855A1 (fr) 2016-04-06
EP3001855B1 (fr) 2019-02-20
EP3001857B1 (fr) 2017-11-01
US20160123542A1 (en) 2016-05-05
DE102014101403A1 (de) 2014-11-20
WO2014184214A1 (fr) 2014-11-20
CN105229369A (zh) 2016-01-06
WO2014184215A1 (fr) 2014-11-20
ES2727253T3 (es) 2019-10-15
WO2014184212A1 (fr) 2014-11-20

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