EP3001856A1

EP3001856A1 - Lighting device

Info

Publication number: EP3001856A1
Application number: EP14727732.1A
Authority: EP
Inventors: Andreas Ritzenhoff; Lutz ENGEL; Jörg RACHE; Oliver Arnold
Original assignee: Seidel GmbH and Co KG
Current assignee: Seidel GmbH and Co KG
Priority date: 2013-05-15
Filing date: 2014-05-13
Publication date: 2016-04-06
Also published as: ES2727253T3; WO2014184212A1; EP3001854A1; EP3001855B1; DE102014101403A1; WO2014184207A1; CN105229369A; EP3001855A1; WO2014184215A1; EP3001857A1; WO2014184210A1; WO2014184214A1; EP3001857B1; US20160123542A1; WO2014184213A1

Abstract

The invention relates to a lighting device comprising at least one semiconductor lighting means (30) and a plastic housing (10) in which the at least one semiconductor lighting means (30) is accommodated. Said lighting device is characterised in that it comprises, inside the housing (10), a metallic base body (20) on which the semiconductor lighting means (30) is fixed. The metallic base body (20) has a surface which is in contact, at least in sections, in the inside, with the housing (10).

Description

lighting device

The invention relates to a lighting device with at least one semiconductor lamp and a housing made of plastic, in which the semiconductor lamp is accommodated.

Luminous devices with semiconductor lamps are characterized by a high specific luminosity and thus low energy consumption and by a long life. In operation, the semiconductor bulbs must be cooled, since both the life and the effectiveness achieved with the

Temperature of the lamps decreases. With the increasing light output of the semiconductor lamps and thus also increasing electrical power consumption, the demand for effective cooling of the semiconductor lamps is also increasing. In addition to the heat sink and semiconductor light-emitting means, a driver module for the semiconductor light-emitting means, also referred to as connection module, is frequently arranged in the housing of the lighting device, which provides a current suitable for driving the semiconductor light-emitting means. Furthermore, an optical element, for example a reflector and / or a lens arrangement, is optionally provided to achieve a desired spatial radiation characteristic.

Particularly in the case of so-called retrofit lighting devices, which are adapted in their shape and with respect to the electrical connection known configurations of lighting devices, such as incandescent or Leuchtstoffröh- ren, the lighting device and accordingly the housing in terms of shape and appearance must meet strict specifications , In previously known semiconductor light-emitting devices, this could only be achieved with a relatively complex structure that can be mechanically assembled. The manufacturing process of such known light-emitting devices is correspondingly complicated, which is reflected on the one hand in the price and on the other hand in an inadequate quality.

In order to be able to dissipate the heat occurring within the housing of the semiconductor lighting device, at least sections of the housing are frequently made of metal, for example aluminum. These housing sections acting as heat sinks may additionally be equipped with cooling fins, so that heat can be effectively dissipated via convection. However, using such an outer metal portion of the housing is production-consuming and correspondingly expensive. In addition, the section acting as a heat sink places narrow limits on the design of the lighting device. It is therefore an object of the present invention to provide a lighting device of the type mentioned, in which an effective heat dissipation even without metallic housing sections, which act as a heat sink, is achieved. The lighting device should also be inexpensive and can be produced with consistent quality.

This object is achieved by a lighting device having the features of the independent claim. Advantageous embodiments are specified in the dependent claims. According to the invention, a lighting device of the type mentioned above is characterized in that the lighting device within the housing has a metallic base body on which the semiconductor lamp is fixed, wherein the metallic base body has a surface which rests at least partially inside of the housing.

By means of the surface resting against the inside of the housing, it is also possible to dissipate heat via the plastic housing, effectively contributing to cooling, even in the case of an internal metallic base body. The metallic base body serves as a carrier and at the same time constitutes a cooling element for the semiconductor lamp, so that a good removal of the heat generated by the semiconductor lamp during operation takes place. In this case, the surface of the base body preferably fits tightly against an inner surface of a wall of the housing in order to allow the best possible heat transfer. The contact surface preferably has a large proportion of the total surface area of the base body, for example at least 30%, preferably at least 50%. More preferably, the base body as well as the housing in the region of the contact surface is substantially rotationally symmetrical. The contact surface is then preferably or a part of the lateral surface of the base body. In a preferred embodiment of the lighting device of the base body is fixed detent or clamping in the housing. The base body preferably has a latching bead which engages under at least one latching projection arranged in the housing. Further preferred are the Rastwulst and a undercut part of the locking projection shaped so that the locking bead has a range of motion in a locking position.

In this way, unacceptable stresses in the materials due to different thermal expansions of the metallic base body and the plastic housing are prevented.

Particularly preferably, the range of motion extends in the direction of a wall of the base body. For example, in the region of the latching, contact surfaces between the base body and the housing are avoided whose surface normal lies in the direction of the thermal expansion of the base body. Upon expansion of the base body relative to the housing, the latched part of the housing can escape in the latching position without disengaging from the latching.

With regard to the production process and a space-saving construction of the base body is preferably designed in two parts, wherein it is composed for example of a lower shell and an upper shell. The two shells form a cavity in which a connection module for the power supply of the semiconductor light-emitting means is arranged.

In a further advantageous embodiment of the lighting device, the semiconductor light-emitting means with a rivet on the base body, for example, the upper shell, set. Preferably, the rivet is integrally formed with the base body, whereby the semiconductor light-emitting means can be attached to the base body as a carrier in a particularly simple and cost-effective manner. The integral design also allows the rivet to be deformed for attachment without having to press with a tool against the side opposite the semiconductor bulb. Deformation of the rivet can be done solely from the outside of the base body. Particularly advantageously, the base body, for example, in turn, the upper shell, urgeformt with the rivet in a deep-drawing process. It is then formed in only one manufacturing step, the upper shell and formed the rivet. Upper and lower shell can be deep drawn, for example, made of aluminum.

In a further advantageous embodiment of the lighting device, the semiconductor light-emitting means can also be fixed by means of a screw on the base body, in particular on its upper shell. The lighting device described can be particularly well designed as a retrofit lighting device, in which, for example, a look and a connection diagram of a classic light bulb are imitated.

Embodiments of the lighting device according to the invention will be explained in more detail by means of figures. The exemplary embodiments illustrate further advantageous embodiments of the lighting device or components of the lighting device. The figures show:

1 to 3 each show an embodiment of a lighting device in the retrofit style in schematic exploded views; and

Fig. 4 to 15 details of various embodiments of

Lighting devices in each case in schematic sectional views or schematic perspective views.

In FIGS. 1 to 3, three different embodiments of a lighting device according to the application are each shown in a perspective exploded view. Identical or equivalent elements are identified in these and the following figures by the same reference numerals.

In all three illustrated embodiments, the lighting device is designed as a retrofit lighting device, that is, with respect to the electrical connection and the shape of known bulbs, in this case light bulbs with screw thread (E14 or E27), oriented. It should be noted that the features shown in this application can also be implemented in lighting devices with different shape and / or other connection sockets or connection options, including lighting devices that are not designed as retrofit lights. In part, the featured features are also used in other electronics applications that have no bulbs.

The lighting device has a housing 10, which has a lower housing part 1 1 and an upper housing part 12 mounted thereon, and a relative to the upper housing part 12 on the lower housing part 1 1 attached socket 13, which serves to hold the lighting device in a socket and the electrical contact. It is a restraining or snapping connection of the Housing bottom part 1 1 and the housing upper part 12 is provided. For this purpose, the parts in the connection area are configured correspondingly interlocking. Preferably, a detent is provided, which can transmit a torque, so that the two housing parts 1 1, 12 are fixed against rotation to each other. Except for the contacting surfaces on the base 13, the individual parts of the housing 10 are made of plastic, preferably in an injection molding process. At least the upper housing part 12 is held translucent or transparent in order to emit the light emitted by the lighting device. The upper housing part 12 may advantageously be produced in a Spritblasverfahren.

In the housing 10, a base body 20 is used, which is in each case constructed in two parts in the cases shown here and has a lower shell 21 and an upper shell 22 connected thereto. The base body 20 has a diverse function. It serves, for example, to hold a semiconductor light-emitting means 30, hereinafter called light-emitting means 30, which is fastened to the upper shell 22.

Furthermore, the base body 20 is made of a good heat-conducting material, preferably a metal such as aluminum, and thus serves to dissipate heat from the light source 30 produced heat. Both the lower shell 21 and the upper shell 22 are preferably produced in a deep-drawing process, which allows a cost-effective production with minimum wall thicknesses. The lower shell 21 and the upper shell 22 are connected to one another in a mechanically loadable manner, as a result of which there is good heat conduction from the upper shell 22 to the lower shell 21, so that the lower shell 21 can also absorb heat from the illuminant 30 and pass it on or release it. Both elements, lower shell 21 and upper shell 22, are constructed substantially rotationally symmetrical, wherein the connection of the two elements takes place with one another by a joint fit, optionally supported by locking means in the connection region, for example a peripheral bead or notch formed in the connection region.

The base body 20 is composed essentially in the shape of a capsule, with a connection module 40 being accommodated in its inner cavity. The

Connection module 40 is used to implement the supplied via the base 13 AC power of the home-light network, so for example in the voltage range of 1 10 volts to 230 volts, in a suitable for supplying the light source 30 DC. According to the invention base body 20 and the lower housing part 1 1 are locked together, wherein the latching is formed so that a thermal expansion of the base body 20, in particular the lower shell 21 of the base body 20 pers, no undue and material destroying or tiring stress on the lower housing part 1 1 exerts , In this case, a good thermal contact between the lower shell 21 and the lower housing part 1 1 is given, so that heat generated within the lighting device, among other things, on the lower housing part 1 1 is discharged. The latching of the base body 20 with the lower housing part 1 1 is shown in more detail in connection with Figures 5 to 7. Next, in the direction of the base 13, in the lower shell 21, an opening is provided, are passed through the connecting wires 41 of the connection module 40 to the base 13. In the upper shell 22, an opening is also introduced, through which an electrical connection from the lighting means 30 to the connection module 40 takes place. This can be done, for example, via a preassembled on semiconductor light-emitting means 30, for example, soldered, plug 42.

As the embodiments of FIGS. 1 to 3 show, the lighting means 30 may have a planar support plate 31, on which a plurality of light-emitting elements, here light-emitting diodes 32 (LEDs - light emitting diodes) are arranged. Such a designed illuminant 30 radiates substantially perpendicular to the surface of the carrier board 31, ie in the direction of the axis of symmetry (screw axis) of the lighting device. In order to achieve a radiation also perpendicular to the axis of symmetry, an optical element 50 is provided in the embodiments of FIGS. 1 and 3, which is arranged in the emission direction behind the light source 30 and influences the emission characteristic of the lighting device. The optical element 50 is mounted on the upper shell 22 in the embodiments shown.

The optical element 50 is preferably also a metal element produced in a deep-drawing process, which due to the attachment to the upper shell 22 or directly to the carrier board 31 can also absorb and release heat. Alternatively, the optical element 50 may also be made of plastic, wherein transparent and / or reflective components may be used.

In the embodiment of FIG. 1, the optical element 50 has reflective surfaces 51, which are designed in a rotationally symmetrical funnel-shaped manner are. The reflective surfaces 51 divert a majority of the radiation emitted by the LEDs 32 radiation radially outward. Centrally, the optical element 50 is open, so that a further part of the radiation emerges axially. In the embodiment of FIG. 3, the optical element 50 comprises a lens 52, which is arranged axially in front of the light-emitting diodes 32. The lens 52 is here a diverging lens, which widens the radiation beam emitted by the light emitting diodes 32 and thus widens the emission characteristic in the radial direction. Because of its flat design, the lens 52 can be advantageously designed as a Fresnel lens. It is also possible to use optical elements 50 which have both reflective surfaces 51 and lenses 52.

The components of the lighting device are designed with regard to a possible automation of the manufacturing process, in particular the process of assembling the lighting device. This includes, for example, that parts are easily accessible and orientable. Furthermore, connections between the parts are preferably snap-fit and / or latching and / or joining connections, which can particularly preferably be assembled in a common joining or latching direction, particularly preferably along the symmetry axis of the lighting device, which in the illustrated pedestals 13 also the direction in which the lighting device is screwed into a socket. In the context of the application, this direction is also referred to as the axial direction. The three lighting devices shown in FIGS. 1 to 3 differ in the exact shape of their components, the external dimensions and the light output. Nevertheless, they all have a comparable basic structure. This makes it possible to produce a plurality of different light-emitting devices on the same production lines in an automated manner, without the need for radical changes to the production line or the production process during a model change. It creates a kind of modular system of design solutions that can be quickly responded to market requirements and small changes in the components, such as new bulbs. New developments can be flexibly and quickly integrated into new products.

Further details of the lighting devices, which are relevant, inter alia, for automatable production, are described in the following advantageous embodiments of the lighting device. In FIGS. 1 to 3, an advantageous attachment possibility for the illuminant 30 on the upper shell 22 is indicated, which is shown in more detail in FIG. So far, an adhesive or a screw connection is known for fastening the illuminant 30. According to the application, it is provided to fix the luminous means 30 on the upper shell 22 by means of a positive connection by means of a deformable connecting element.

In the examples of FIGS. 1 to 4, a fastening clip 222 is used as the deformable connecting element, which is preferably inserted through previously introduced openings 31 1, 221 in the carrier board 31 of the illuminant 30 or the upper shell 22 and bent at the bottom by appropriate tools , The shape of the bend and the selected material thereby allow a secure and elastic, even with thermal expansion frictional fixing of the light source 30 on the upper shell 22, whereby a good thermal connection of the light source 30 is given to the base body 20. In addition, the fastening clip 222, which preferably consists of a metal, for example of a copper alloy, can be used for making electrical contact with the luminous means 30. In addition, a heat-conducting paste may be applied between the illuminant 30 and the upper shell 22.

FIGS. 5 to 7 show a further exemplary embodiment of a lighting device in various representations and different mounting states. The attachment option for the illuminant 30 on the upper shell 22 indicated there can likewise be used for the luminous devices of FIGS. 1 to 3.

In Fig. 5a, the upper shell 22 used is first shown. The upper shell 22 has an integrally formed rivet 223 on its upper side, on which the illuminant 30 is mounted. The rivet 223 is an alternative to the mounting bracket 222 shown in FIG. 4. The rivet 223 may be formed as a rivet or solid rivet. As already mentioned above, the upper shell 22 is preferably made of aluminum from a deep-drawing process. Particularly preferably, the rivet 223 is already formed in this deep-drawing process. The rivet 223 is thus in the original molding process, with which the upper shell 22 is brought into its basic form formed. In this way, the rivet 223 is not only formed integrally with the upper shell 22, but also in a manufacturing step. In Fig. 5b and 5c, the assembly of the illuminant 30 is shown with the aid of the rivet 223. For the installation of the illuminant 30, the lighting device is already partially pre-assembled. Specifically, the lower housing part 1 1 is already mounted on the base 13 or inserted, from the base body 20, the lower shell 21 is inserted into the lower housing part 1 1 and locked with this. For this purpose, a latching bead 21 1 is circumferentially formed on the lower housing part 1 1, which engages under latching projections (not provided in FIG. 5 with reference numerals) of the lower housing part 1 1. In addition, the connection module 40 is inserted into the lower shell 21, wherein the connecting wires 41 possibly already connected to the base 13, for example, soldered or plugged into corresponding plug contacts, are.

After placing the upper shell 22 on the lower shell 21, the illuminant 30 is placed on the upper side of the upper shell 22, the rivet 223 penetrating through the opening 31 1 of the support board 31 provided for this purpose (not provided with reference numerals in FIG. 5). By further, in the figure also not provided with reference numerals openings in the carrier board 31, the lighting means 30 is fixed by means of the plug 42 on the one hand on the upper shell 22 and contacted on the other with the connection module 40.

In a next processing step, the rivet 223 is deformed by the action of a punch from above, so that it sets the carrier plate 31 in a form-fitting manner on the upper shell 22. The upper shell 22 is preferably circumferentially at its lower edge on the lower shell 21, so that the force acting on the upper shell 22 when bending the rivet 223 forces can be derived well and over a large area down. For this reason, the deformation of the rivet 223 can take place in the preassembled state of the luminous means. As mentioned in connection with the fastening clip 222, an at least single-pole electrical contact can additionally take place via the rivet 223.

The further assembly process is illustrated with reference to FIGS. 6a and 6b. Fig. 6a shows first the final mounted device. Compared to the state shown in FIG. 5 c, the optical element 50 is placed, wherein this optical element 50 is designed such that it latches in the upper region of the upper shell 22 on its outer circumference. For this purpose, the upper shell 22 in this area on a circumferential constriction. Furthermore, that is translucent housing upper part 12 placed on the lower housing part 1 1 and locked with this.

Fig. 6b shows the area in which the lower shell 21 of the base body 20 and the upper housing part 12 are latched in the lower housing part 1 1, in more detail. Fig. 7a and 7b show in addition to the lower housing part 1 1 with inserted lower shell 21 separately in a sectional view, in Fig. 7 b, in turn, the Verrastungsbereich is shown enlarged. Fig. 7c shows that

Upper housing part 12 in a perspective view separately.

As shown particularly in FIGS. 6b and 7b, is for locking the

Upper housing part 12 with the lower housing part 1 1 in the upper region of the lower housing part 1 1 a locking recess 1 1 1 introduced, the upper edge forms an inwardly facing undercut locking projection. The detent recess 1 1 1 may be circumferentially or at least partially formed circumferentially. In the locking recess 1 1 1 also a corrugation 1 12 is incorporated.

At the top, a widespread edge on the lower housing part 1 1 is formed by the latching projection. The upper housing part 12 has a complementary bearing edge 121, with which it rests on the upper housing part 12. Internally encircling a downwardly pointing tongue is formed on the support edge 121 with a likewise circumferentially or at least partially circumferentially outwardly facing latching lug 122. When plugging the

Housing upper part 12 engages the locking lug 122 in an undercut of the locking projection 1 1 1 a. In the present case, the locking lug 122 is formed circumferentially and it is additionally provided with a plurality of again projecting ribs 123. As can be seen in Fig. 7c, the ribs 123 are distributed along the circumference. When the detent 122 is engaged in the detent recess 1 1 1, engage the ribs 123 in the corrugation 1 13, whereby the upper housing part 12 is rotatably connected to the lower housing part 1 1. This is particularly important in a socket 13 with screw thread to the lighting device easy to screw in and out. Even with light fixtures with a bayonet base a rotationally fixed connection must be given.

In its lower region, the upper shell 22 is also slightly angled radially outward. The tongue on which the latching noses 122 are formed may be dimensioned so that it lies with its lower end on this bend and thus the upper shell 22 directly and indirectly also the Un. terschale 21, on which the upper shell 22 rests circumferentially, in the lower housing part 1 1 determines. Alternatively, there may be a small distance between the tongue of the housing top 12 and the base body 20. In this case, the tongue of the upper housing part 12 does not fix the base body 20 directly in the lower housing part 1 1, but provides an additional safeguard in the event that the actual fastening of the basic body 20 is released. Thus, substantially all internal components of the lighting device by the one locking connection between the upper housing part 12 and the

Housing lower part 1 1 defined in the lighting device or at least additionally secured lent.

Details of the attachment of the lower shell 21 of the base body 20 to the lower housing part 1 1 can be seen in Figs. 6b and 7b. Below the detent recess 1 1 1 on the inside of the lower housing part 1 1 a latching projection 1 13 is formed. This can be circumferential, or consist of several distributed segments. The latching projection 1 13 is undercut, so that the locking bead 21 1 of the lower shell 21 is latched under the latching projection 1 13. In the area below the Rastwulst 21 1, the lower shell 21 fits snugly in the lower housing part 1 1, so that the lateral surfaces both superimposed as large as possible. Thus, a good heat transfer from the lower shell 21 to the lower housing part 1 1 is achieved. This is preferably formed thin-walled, so that a heat transfer also takes place on the outside of the housing lower part 1 1, where a heat release via convection and / or radiant heat takes place. Although the lower housing part 1 1 is made of plastic, so a non-negligible part of the heat generated by the lighting device can be removed. Due to the different thermal expansion, however, the metallic lower shell 21 expands when heated relative to the lower housing part 1 1. So that this does not lead to unacceptable stresses in the materials, the locking bead 21 1 and the undercut portion of the locking projection 1 13 are formed so that the locking bead 21 1 can escape in the locked position upwards. For this purpose, for example, both the locking bead 21 1 and the undercut of the locking projection 1 13 rounded. There are no contact surfaces between the lower shell 21 and the lower housing part 1 1, the surface normal is in the direction of thermal expansion. Upon expansion of the lower shell 21 relative to the lower housing part 1 1, the lower shell 21st Dodge upwards in the locked position, without loosening from the catch.

In the lower part of the lower housing part 1 1 two opposite U-shaped guide webs 1 14 are provided, which protrude through openings 212 of the lower shell 21 in the interior of the base body 20. In the guide webs 1 14, the connection module 40 with a printed circuit board (PCB - printed circuit board) are inserted. FIGS. 8 and 9 show a side view and a top view of the connection module 40. The connection wires 40 are fixed to the connection module 40, for example by a solder connection. According to the application, the connecting wires 41 are designed as rigid wires, wherein the diameter of the connecting wires 41 may possibly be larger than is necessary for the electrical conductivity. The rigid execution of the leads 41 has the advantage that the leads 41 in the automated assembly of the connection module 40 can be easily guided through openings in the lower shell 21 and the lower housing part 1 1 and thus stand ready for a Kontaktie- tion with the base 13. As shown in FIG. 8, the terminal wires 41 can be guided in different planes so as to be sufficiently spaced apart from each other even if the terminal points of the lead wires 41 on the terminal module 40 are closely adjacent. The connecting wires 41 may be formed as insulated or non-insulated wires. The bending stiffness or bending strength also makes it possible to align, fix, bend and / or cut these connection wires 41 in an automated assembly.

Fig. 10 shows an advantageous electrical connection between a plurality of printed circuit boards. In the present case, these are a printed circuit board of the connection module 40 and the printed circuit board 31 of the lighting means 30. It should be noted that this type of connection of two printed circuit boards which are at an angle to one another can also be used in other fields of application. The electrical connection shown in Fig. 10 represents an alternative to the connector 42 shown in the previous embodiments.

In the present case, a breakthrough is present in the carrier board 31, in which the printed circuit board (board) of the connection module 40 with at least one

tab-shaped part is inserted. The tracks of both boards are then soldered together after joining to the one to establish the mechanical and on the other the electrical connection. In this case, on one of the boards, for example on the carrier board 31, a solder supply already be applied, which is melted by means of suitable soldering, for example, heating by laser, ultrasound, induction or another soldering to produce the connection. The method described can be carried out with two planar printed circuit boards as shown here, but also with three-dimensionally designed printed circuit boards (compare also FIG. Fig. 1 1 shows a sectional view of a dome 60, which is provided with openings 61 in a variety of geometries. This dome 60 can be placed on the upper shell 22 by a suitable method, for example, again by joining and / or locking, and surrounds the illuminant 30. The dome 60 leads to an effective light distribution, which reflects the shape of the apertures 61. In addition or as an alternative to the illustrated dome 60, mirrored metal parts can also be arranged around the lighting means 30, which lead to a correspondingly effective light distribution. Various embodiments of an optical element 50 designed here as a reflector (see FIGS. 1 and 3), which serves to distribute the light of the light emitted by the illuminant 30, are shown in FIGS. In the exemplary embodiments of FIGS. 13 and 14, it is also indicated how such an optical element 50 with suitably designed legs 53 can be fixed to the illuminant 30 and possibly also to the upper shell 22. It is possible (see Fig. 14), the legs 53 also act as mounting brackets, via which a fixing of the illuminant 30 takes place on the base body 20. In this sense, the optical element 50 can additionally and / or alternatively be used to fix the luminous means 30 on the upper shell 22 in the manner of the fastening clip 222 according to FIGS. 1 to 4. The flattened area at the lower end of the leg 53 may be formed upon insertion of the optical element 50 by a deformation process during assembly. By connecting the optical element 50 with the lighting means 30, an effective heat dissipation is also achieved on the optical element 50, which can deliver the absorbed heat as radiant heat and represents an effective element for cooling the lighting means 30 next to the base body 20. Advantageously, inner and outer reflective surfaces 51 of the optical element 50 are formed rounded such that the optical element 50 shows no sharp edges in the shadow. The optical element 50 is formed as a rotationally symmetrical body having an open area inside. The light which penetrates through the inner open region and the light which is guided laterally past the optical element 50 are superimposed in the far region to form a uniformly illuminated light field.

Fig. 15 shows a perspective view of a three-dimensionally formed light source 30. The carrier board 31 (PCB - printed circuit board) of the illuminant 30 is not flat (two-dimensional) formed, but has a three-dimensional structure. In this case, LEDs 32 are arranged on surfaces which point in different directions. In this way, a uniformly radiating characteristic is already achieved by the luminous means 30 itself, so that an additional optical element for light distribution can be dispensed with.

In this embodiment, the support plate 31 of the luminous means 30 is produced in a planar shape, wherein the support plate 31 has a substantially circular base portion 312 with radially outwardly projecting arms 313. LEDs 32 are arranged both in the base region 312, as well as on the protruding arms 313. In the base region 312 of the opening 31 1 for mounting the bulb 30 is visible and the further breakthrough, through which the plug is plugged into the contact. The protruding arms 313 are subsequently bent by deformation. In this case, a relatively large bending radius may be provided in order not to damage the layer structure (aluminum carrier, insulating layer, conductor track). The deformation can be done either before mounting the LEDs 32 or after their assembly.

LIST OF REFERENCE NUMBERS

10 housing

1 1 housing base

1 1 1 locking recess

1 12 corrugations

1 13 locking projection

1 14 guide bar

12 housing top

121 Auflagerand

122 locking bead

123 ribs

13 sockets

20 base bodies

21 lower shell

21 1 detent bead

212 breakthrough

22 upper shell

221 breakthrough

222 mounting bracket

223 integral rivet

30 semiconductor bulbs

31 carrier board

31 1 basic area

312 arm

32 light emitting diode (LED)

40 connection module

41 connecting wire

42 plug

50 optical element

51 reflective surface

52 lens

53 leg

60 dome ńurchbruch

Claims

claims

Lighting device with at least one semiconductor lamp (30) and a housing (10) made of plastic, in which the at least one semiconductor lamp (30) is accommodated, characterized in that the lighting device within the housing (10) has a metallic base body (20 ), on which the semiconductor light-emitting means (30) is fixed, wherein the metallic base body (20) has a surface which lies at least partially inside on a wall of the housing (10).

Lighting device according to claim 1, wherein the base body (20) is fixed detent or clamping in the housing (10).

Lighting device according to claim 2, wherein the base body (20) has a latching bead (21 1) which engages under at least one in the housing (10) arranged latching projection (1 13).

Lighting device according to claim 3, wherein the latching bead (21 1) and an undercut portion of the latching projection (1 13) are shaped so that the latching bead (21 1) has a movement in a latching position.

Lighting device according to claim 4, wherein the movement margin in the direction of a wall of the base body (20).

Lighting device according to one of claims 1 to 5, in which the metallic base body (20) bears against the housing (10) with at least 30% and preferably with at least 50% of its surface inside.

Lighting device according to one of claims 1 to 6, wherein the base body (20) has a cavity in which a connection module (40) is arranged.

8. Lighting device according to one of claims 1 to 7, wherein the base body (20) is designed in two parts and from a lower shell (21) and an upper shell (22) is composed.

9. Leuchtvornchtung according to any one of claims 1 to 8, wherein the semiconductor lighting means (30) by means of a rivet (223) on the base body (20) is fixed.

10. Lighting device according to claim 8 and 9, wherein the rivet (223) is formed integrally with the upper shell (22).

1 1. A lighting device according to claim 10, wherein the upper shell (22) is formed into a urethane with the rivet (223) in a deep drawing process.

12. Lighting device according to one of claims 8 to 1 1, wherein the lower shell (1 1) and / or the upper shell (12) are deep-drawn from aluminum.

13. Lighting device according to one of claims 1 to 12, which is designed as a retrofit lighting device.