EP2835882A1 - Halbleiterlaservorrichtung und herstellungsverfahren dafür - Google Patents

Halbleiterlaservorrichtung und herstellungsverfahren dafür Download PDF

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Publication number
EP2835882A1
EP2835882A1 EP13772683.2A EP13772683A EP2835882A1 EP 2835882 A1 EP2835882 A1 EP 2835882A1 EP 13772683 A EP13772683 A EP 13772683A EP 2835882 A1 EP2835882 A1 EP 2835882A1
Authority
EP
European Patent Office
Prior art keywords
semiconductor laser
laser element
adhesive
heatsink member
heatsink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP13772683.2A
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English (en)
French (fr)
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EP2835882A4 (de
EP2835882B1 (de
Inventor
Takayuki Yoshida
Naoto Ueda
Kouji Oomori
Takuma Motofuji
Teruaki Kasai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Intellectual Property Management Co Ltd
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Panasonic Intellectual Property Management Co Ltd
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Publication of EP2835882A1 publication Critical patent/EP2835882A1/de
Publication of EP2835882A4 publication Critical patent/EP2835882A4/de
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0235—Method for mounting laser chips
    • H01S5/02355—Fixing laser chips on mounts
    • H01S5/0237—Fixing laser chips on mounts by soldering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02461—Structure or details of the laser chip to manipulate the heat flow, e.g. passive layers in the chip with a low heat conductivity
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0235—Method for mounting laser chips
    • H01S5/02375—Positioning of the laser chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/2612—Auxiliary members for layer connectors, e.g. spacers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/291—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/29101—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of less than 400°C
    • H01L2224/29111—Tin [Sn] as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/291—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/29138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/29144—Gold [Au] as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0235—Method for mounting laser chips
    • H01S5/02355—Fixing laser chips on mounts
    • H01S5/0236—Fixing laser chips on mounts using an adhesive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02469—Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02476—Heat spreaders, i.e. improving heat flow between laser chip and heat dissipating elements
    • H01S5/02492—CuW heat spreaders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/028—Coatings ; Treatment of the laser facets, e.g. etching, passivation layers or reflecting layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
    • H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
    • H01S5/223—Buried stripe structure
    • H01S5/2231—Buried stripe structure with inner confining structure only between the active layer and the upper electrode

Definitions

  • the present invention relates to a high-power semiconductor laser device as a light source for welding, joining, and cutting in the industrial field. It also relates to a method for manufacturing the same.
  • the semiconductor laser device is suitable for a small light source for tens-of-watts of output.
  • an arrayed semiconductor laser device or a combined structure of a plurality of stand-alone semiconductor laser devices are employed.
  • An arrayed semiconductor laser device has a plurality of adjacent active regions in a single chip. On the edge of a chip, the device has a plurality of adjacent emitting points, i.e., emitters.
  • a stand-alone semiconductor laser device has a single emitter.
  • the laser light fed from a semiconductor laser device can be concentrated into several micron scale. With the high capability of light-gathering, a semiconductor laser device focuses light energy on an extremely small area, providing an optimal pinpoint process.
  • the semiconductor laser devices above work with a light output ranging from approximately ten watts to tens of watts. Compared to laser devices with hundreds of milliwatts scale of output used for optical disks, the aforementioned semiconductor laser devices have extremely large actuating current and a large amount of heat generation in the active regions. Therefore, to obtain high reliability of the devices, i.e., to maintain high output and long-life operation, what important is quick heat dissipation from the active regions to the outside so as to suppress the temperature rise in the active regions.
  • Fig. 15 is a perspective view of conventional semiconductor laser device 100.
  • semiconductor laser element 101 is mounted on heatsink 103 via solder layer 102.
  • Conventional semiconductor laser device 100 emits laser light 104 from the laser emission surface (i.e., from the front surface seen in Fig. 15 ) of semiconductor laser element 101.
  • semiconductor laser element 101 is connected to heatsink 103 with solder layer 102 so that the laser emission surface of element 101 is level with the side surface of heatsink 103.
  • the structure above protects laser light 104 from being blocked by heatsink 103; at the same time, heatsink 103 sufficiently dissipates heat of semiconductor laser element 101.
  • the conventional semiconductor laser device has a problem.
  • the solder layer 102 can stick out from the laser emission surface of semiconductor laser element 101 in the output direction of laser light 104. If such a projection of solder layer 102 blocks the path of laser light 104, an intended output of laser light 104 cannot be obtained.
  • COD catastrophic optical damage
  • the laser emission surface of semiconductor laser element 101 is subject to breakage by catastrophic optical damage (COD).
  • COD is a self-destructive phenomenon that the laser light of semiconductor laser element 101 destroys the laser emission surface thereof.
  • laser light density in the laser emission surface has a sudden increase by return light from an optical member (not shown) disposed opposite to the laser emission surface of semiconductor laser element 101, which is called filamentation effect. If it occurs in the laser emission surface from which heat has not been sufficiently dissipated, damage to semiconductor laser element 101 often results from the insufficient heat dissipation.
  • the present invention provides a high-power semiconductor laser device capable of offering stable, uniform characteristics, and high reliability. It also provides the method for manufacturing the laser device.
  • the semiconductor laser device of the present invention has a conductive heatsink member, a conductive first adhesive, and a semiconductor laser element.
  • the first adhesive is disposed on the heatsink member, and over which, the semiconductor laser element is disposed.
  • the first adhesive is disposed on the heatsink member so as to reach an upper part on the side surface of the heatsink member under the end section of the emitter for emitting laser light of the semiconductor laser element.
  • the method for manufacturing a semiconductor laser device has a step of mounting a semiconductor laser element on a conductive heatsink member via a conductive first adhesive.
  • the first adhesive is disposed on the heatsink member so as to reach an upper part on the side surface of the heatsink member under the end section of the emitter for emitting laser light of the semiconductor laser element.
  • the structure above further improves heat dissipation of the semiconductor laser element; at the same time, it is effective in obtaining laser light from the semiconductor laser element.
  • the present invention provides a high-power semiconductor laser device and the manufacturing method capable of offering stable, uniform characteristics and high reliability.
  • Fig. 1 is a plan view of semiconductor laser device 10 in accordance with the first exemplary embodiment.
  • Fig. 2 is a cross-sectional view, taken along the line 2-2 of Fig. 1 , of semiconductor laser device 10 in accordance with the exemplary embodiment.
  • Fig. 3 is a cross-sectional view, taken along the line 3-3 of Fig. 1 , of semiconductor laser device 10 in accordance with the exemplary embodiment.
  • Fig. 4 is a cross-sectional view, enlarged the part indicated by dotted lines in Fig. 2 , of semiconductor laser device 10 in accordance with the exemplary embodiment.
  • Fig. 5 is a cross-sectional view, enlarged the part indicated by dotted lines in Fig. 3 , of semiconductor laser device 10 in accordance with the exemplary embodiment.
  • Semiconductor laser device 10 of the present invention has semiconductor laser element 11, solder layer 12 as a conductive first adhesive, and sub-mount 13 as a conductive first heatsink member.
  • Semiconductor laser device 10 of the present invention further contains solder layer 14 as a conductive second adhesive, heatsink 15 as a conductive second heatsink member, conductive bonding plate 16, and insulating adhesive tape 17.
  • Semiconductor laser element 11 has the laser emission surface (shown on the right side in Fig. 1 and Fig. 2 ), and laser light is emitted from the laser emission surface toward the right direction (seen in the drawings).
  • Solder layer 12 is gold-tin (AuSn)-based solder with a thickness of 2-5 ⁇ m.
  • Semiconductor laser element 11 is bonded to sub-mount 13 with solder layer 12.
  • Solder layer 12 is formed on sub-mount 13 by evaporation or plating, and after that, semiconductor laser element 11 is bonded to solder layer 12 formed on sub-mount 13.
  • Solder layer 12 should be formed so as to contact with the entire bottom surface of semiconductor laser element 11. As shown in Fig. 1 through Fig. 3 , solder layer 12 should preferably be stuck out from the side surfaces-except for the laser emission surface-of semiconductor laser element 11. This allows solder layer 12 to thoroughly cover the bottom surface of semiconductor laser element 11. Solder layer 12 may be formed on the entire upper surface of sub-mount 13.
  • Sub-mount 13 which is mainly made of copper-tungsten (CuW), has a thickness of approximately 300 ⁇ m.
  • Aluminum nitride (AlN) may be employed for the material of sub-mount 13.
  • Solder layer 14 is tin-silver (SnAg)-based solder with a thickness of approximately 20 ⁇ m. Sub-mount 13 is bonded to heatsink 15 with solder layer 14. Solder layer 14 of foil is formed on heatsink 15, and after that, sub-mount 13 is bonded to solder layer 14 formed on heatsink 15. Sub-mount 13 is mounted on heatsink 15 via solder layer 14, with the surface irregularities of heatsink 15 eased by the thickness of solder layer 14. The structure above enhances heat dissipation from sub-mount 13 to heatsink 15.
  • the side surface of sub-mount 13 is nearly level with the side surface of heatsink 15.
  • the side surface of sub-mount 13 may be set back from the side surface of heatsink 15 (not shown), as long as the laser light from semiconductor laser element 11 is not blocked by the positioning. Further, the side surface of sub-mount 13 may be stuck out from the side surface of heatsink 15 (not shown), as long as an intended heat dissipation to heatsink 15 is guaranteed.
  • Solder layer 14 is formed so as to completely cover the overlapping area of sub-mount 13 and heatsink 15. This is because that the influence on semiconductor laser element 11 by heat dissipation from semiconductor laser element 11 to sub-mount 13 is smaller than the influence on semiconductor laser element 11 by heat dissipation from sub-mount 13 to heatsink 15.
  • solder layer 14 should stick out from the side surfaces-except for the laser emission surface-of semiconductor laser element 11.
  • Adhesive tape 17 is made of polyimide. Bonding plate 16 is attached to heatsink 15 with adhesive tape 17. As long as having insulation property, the shape and the material of adhesive tape 17 are not limited to above. Besides, adhesive tape 17 may be not formed all over the bottom surface of bonding plate 16-at least bonding heatsink 15 with bonding plate 16.
  • Bonding plate 16 is made of copper. Bonding plate 16 is connected to the upper surface of semiconductor laser element 11 with a gold wire (not shown). Bonding plate 16 of U-shape, as shown in the plan view of Fig. 1 , is disposed so as to surround semiconductor laser element 11. The arrangement allows the gold wire to increase in number for connecting semiconductor laser element 11 and bonding plate 16. However, bonding plate 16 is not necessarily formed into U in planer shape, and its material is not limited to copper as long as being conductive.
  • Bonding plate 16 and heatsink 15 are electrically separated from each other by the adhesive tape. Therefore, a first voltage can be applied to the upper surface of semiconductor laser element 11 via bonding plate 16; and at the same time, a second voltage different from the first voltage can be applied to the lower surface of semiconductor laser element 11 via heatsink 15 and sub-mount 13.
  • the application of voltage above allows semiconductor laser element 11 to have emission of laser light.
  • Fig. 4 is a cross-sectional view, enlarged the part indicated by dotted lines in Fig. 2 , of semiconductor laser device 10 in accordance with the embodiment.
  • Fig. 5 is a cross-sectional view, enlarged the part indicated by dotted lines in Fig. 3 , of semiconductor laser device 10 in accordance with the embodiment.
  • Semiconductor laser element 11 of the embodiment has n-type semiconductor substrate 21, current constriction layer 22, current transmission window layer 23, laser output emitter 24, active layer 25, p-type semiconductor layer 26, p-electrode 27, n-electrode 28, and antireflection film 29.
  • P-electrode 27 is formed on p-type semiconductor layer 26, whereas n-electrode 28 is formed on n-type semiconductor substrate 21.
  • Antireflection film 29 is formed on the surface on the laser emission side of semiconductor laser element 11.
  • Antireflection film 29 is made of, for example, aluminum oxide (AlO), silicon oxide (SiO), and silicon nitride (SiN). Antireflection film 29 should preferably be formed so as not to have an intrusion under p-electrode 27 because it impairs adhesiveness of solder layer 12.
  • Laser light is emitted in the direction indicated by the arrow shown on the right of Fig. 4 .
  • Fig. 6 is a cross-sectional view illustrating the laser emission surface of semiconductor laser device 10 in accordance with the embodiment.
  • solder layer 12 infills between semiconductor laser element 11 and sub-mount 13 and further extends to the side surface of sub-mount 13.
  • solder layer 12 covers the bottom surface completely and extends to the end on the laser emission side of semiconductor laser element 11.
  • the structure offers sufficient heat dissipation.
  • solder layer 12 extends to the side surface of sub-mount 13. This increases the contact area with sub-mount 13, enhancing heat dissipation.
  • solder layer 12 is guided to the side of sub-mount 13, so that there is no obstacle in the path of laser light emitted from semiconductor laser element 11.
  • Fig. 7 is a cross-sectional view illustrating modified example 1 of the laser emission surface of semiconductor laser device 10 in accordance with the exemplary embodiment.
  • the laser emission surface of semiconductor laser element 11 is disposed inner than the side surface of sub-mount 13. In other words, the laser emission surface of semiconductor laser element 11 is closer to the center of sub-mount 13 than the side surface of sub-mount 13.
  • the structure allows solder layer 12 to completely infill between semiconductor laser element 11 and sub-mount 13, enhancing heat dissipation.
  • the distance (in a planar view) between the side surface of sub-mount 13 and the set-back laser emission surface of semiconductor laser element 11 should preferably be determined to 5 ⁇ m or less. This prevents laser light emitted from semiconductor laser element 11 from being blocked by solder layer 12.
  • Fig. 8 is a cross-sectional view illustrating modified example 2 of the laser emission surface of semiconductor laser device 10 in accordance with the exemplary embodiment.
  • the laser emission surface of semiconductor laser element 11 is disposed outer than the side surface of sub-mount 13. In other words, the laser emission surface of semiconductor laser element 11 is disposed away from the center of sub-mount 13 than the side surface of sub-mount 13. The positioning guarantees laser light emitted from semiconductor laser element 11 against being blocked by solder layer 12.
  • the distance (in a planar view) between the side surface of sub-mount 13 and the laser emission surface of semiconductor laser element 11 should preferably be determined to 10 ⁇ m or less; more preferable, 5 ⁇ m or less. With the positioning above, heat dissipation from semiconductor laser element 11 to sub-mount 13 is sufficiently obtained.
  • Fig. 9 is a cross-sectional view illustrating modified example 3 of the laser emission surface of semiconductor laser device 10 in accordance with the exemplary embodiment.
  • solder layer 12 is formed all over the side surface of sub-mount 13.
  • the structure allows solder layer 12 to be formed so as to firmly contact with sub-mount 13 and completely infill between semiconductor laser element 11 and sub-mount 13.
  • Fig. 10 is a cross-sectional view illustrating modified example 4 of the laser emission surface of semiconductor laser device 10 in accordance with the exemplary embodiment.
  • the upper surface of sub-mount 13 has a chamfered edge on the laser emission side of semiconductor laser element 11.
  • the structure guarantees laser light emitted from semiconductor laser element 11 against being blocked by solder layer 12.
  • the structure allows solder layer 12 to completely infill between sub-mount 13 and semiconductor laser element 11 on the side of the laser emission surface. This enhances heat dissipation.
  • the chamfered edge of sub-mount 13 has a curved cross section, but it is not limited to.
  • the edge may be chamfered linearly.
  • solder layer 12 so as to conform to the side surface of sub-mount 13, as shown in Fig. 6 through Fig. 10 , it is preferable that the side surface of sub-mount 13 should be coated with a solder-layer guide film (not shown) having high wettability (i.e., affinity) for solder layer 12.
  • the film coating allows solder layer 12 to be guided toward sub-mount 13, which guarantees laser light emitted from semiconductor laser element 11 against being blocked by solder layer 12.
  • antireflection film 29 is formed on the laser emission surface of semiconductor laser element 11.
  • antireflection film 29 should be a material with low affinity for solder layer 12. This prevents solder layer 12 from intruding into the laser emission surface of semiconductor laser element 11 and therefore guarantees laser light emitted from semiconductor laser element 11 against being blocked by solder layer 12.
  • solder layer 12 is extended to only the upper part of the side surface of sub-mount 13, but it is not limited to. Solder layer 12 may be formed over the whole area of the side surface of sub-mount 13. In that case, solder layer 12 formed on the upper part of the side surface of sub-mount 13 has a thickness greater than that of solder layer 12 disposed on other parts of sub-mount 13.
  • Fig. 11 through Fig. 13 are cross-sectional views illustrating the method for manufacturing the semiconductor laser device in accordance with the exemplary embodiment.
  • solder layer 12 is formed on sub-mount 13.
  • Solder layer 12 is evaporated or plated onto the upper and side surfaces of sub-mount 13.
  • Solder layer 12 is not necessarily formed on the entire area of the side surface of sub-mount 13; it is formed at least on the upper part of the side surface.
  • Solder layer 12 formed on the upper surface of sub-mount 13 has a thickness of approximately 2 ⁇ m.
  • solder layer 12 has a thickness smaller than that on the upper surface.
  • Solder layer 12 is formed with an amount enough for infilling completely between sub-mount 13 and semiconductor laser element 11 to be mounted thereon.
  • semiconductor laser element 11 is mounted on sub-mount 13 so that the laser emission surface of semiconductor laser element 11 is nearly level with the side surface of sub-mount 13.
  • solder layer 12 is guided by the solder layer disposed at least on the upper part of the side surface of sub-mount 13 and reaches the side surface of sub-mount 13.
  • solder layer 12 sticks out of semiconductor laser element 11.
  • the structure above enhances heat dissipation from semiconductor laser element 11 to sub-mount 13, and at the same time, it prevents laser light emitted from semiconductor laser element 11 from being blocked by solder layer 12.
  • Semiconductor laser element 11 may be mounted on sub-mount 13 so as to have a positional relation shown in Fig. 7 and Fig. 8 . In that case, too, the structure offers the effects the same as those obtained by the structures shown in Fig. 7 and Fig. 8 .
  • solder layer 12 may be formed all over the area of the side surface of sub-mount 13, as shown in Fig. 9 .
  • the structure offers the effect the same as that obtained by the structure shown in Fig. 9 .
  • the upper surface of sub-mount 13 may have an angled edge, as shown in Fig. 10 , on the laser emission side of semiconductor laser element 11. In that case, the structure offers the effect the same as that obtained by the structure shown in Fig. 10 .
  • sub-mount 13 is mounted on heatsink 15 via solder layer 14. After that, bonding plate 16 is bonded to heatsink 15 with adhesive tape 17.
  • the semiconductor laser device shown in Fig. 1 through Fig. 3 is completed.
  • Fig. 14 is a cross-sectional view of a semiconductor laser element of a semiconductor laser device in accordance with the second exemplary embodiment.
  • the descriptions thereof will be omitted.
  • the semiconductor laser element of the exemplary embodiment has four current transmission window layers 23 and four laser output emitters 24. That is, the semiconductor laser element of the embodiment emits four laser beams.
  • the structure above allows a single semiconductor laser device to offer a plurality of laser beams, contributing to downsizing and cost reduction. Besides, compared to a system in which a plurality of laser beams is obtained by a plurality of semiconductor laser devices, the structure of the embodiment significantly reduces the manufacturing steps.
  • the present invention provides a high-power semiconductor laser device capable of offering stable, uniform characteristics, and high reliability, and also provides the method for manufacturing the semiconductor laser device.
  • the semiconductor laser device is useful not only as a light source for devices for welding, joining, and cutting in the industrial field, but also as a semiconductor-laser light source for communications and commercial use.

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Semiconductor Lasers (AREA)
EP13772683.2A 2012-04-05 2013-03-05 Halbleiterlaservorrichtung und herstellungsverfahren dafür Active EP2835882B1 (de)

Applications Claiming Priority (2)

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JP2012086119 2012-04-05
PCT/JP2013/001348 WO2013150715A1 (ja) 2012-04-05 2013-03-05 半導体レーザ装置およびその製造方法

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EP2835882A1 true EP2835882A1 (de) 2015-02-11
EP2835882A4 EP2835882A4 (de) 2015-09-02
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DE102015106712A1 (de) * 2015-04-30 2016-11-03 Osram Opto Semiconductors Gmbh Anordnung mit einem Substrat und einem Halbleiterlaser
CN104966705B (zh) * 2015-07-13 2017-12-22 北京工业大学 一种半导体器件散热模块的焊料分布
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US8897328B2 (en) 2014-11-25
CN104040809B (zh) 2017-03-22
CN104040809A (zh) 2014-09-10
EP2835882A4 (de) 2015-09-02
WO2013150715A1 (ja) 2013-10-10
US20140211819A1 (en) 2014-07-31
EP2835882B1 (de) 2017-07-05
JPWO2013150715A1 (ja) 2015-12-17

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