JP6652856B2 - 半導体レーザモジュール及びその製造方法 - Google Patents
半導体レーザモジュール及びその製造方法 Download PDFInfo
- Publication number
- JP6652856B2 JP6652856B2 JP2016033875A JP2016033875A JP6652856B2 JP 6652856 B2 JP6652856 B2 JP 6652856B2 JP 2016033875 A JP2016033875 A JP 2016033875A JP 2016033875 A JP2016033875 A JP 2016033875A JP 6652856 B2 JP6652856 B2 JP 6652856B2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor laser
- submount
- solder layer
- heat sink
- laser module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000004065 semiconductor Substances 0.000 title claims description 221
- 238000004519 manufacturing process Methods 0.000 title claims description 27
- 229910000679 solder Inorganic materials 0.000 claims description 150
- 238000007747 plating Methods 0.000 claims description 23
- 238000000034 method Methods 0.000 claims description 12
- 230000015572 biosynthetic process Effects 0.000 claims description 3
- 239000000463 material Substances 0.000 description 31
- 230000000052 comparative effect Effects 0.000 description 26
- 230000017525 heat dissipation Effects 0.000 description 20
- 229910003460 diamond Inorganic materials 0.000 description 16
- 239000010432 diamond Substances 0.000 description 16
- 229910015363 Au—Sn Inorganic materials 0.000 description 14
- 239000002131 composite material Substances 0.000 description 12
- 238000002844 melting Methods 0.000 description 10
- 230000008018 melting Effects 0.000 description 10
- 238000010438 heat treatment Methods 0.000 description 8
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 230000002542 deteriorative effect Effects 0.000 description 5
- 230000003287 optical effect Effects 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000000835 fiber Substances 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 229910017944 Ag—Cu Inorganic materials 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005284 excitation Effects 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0235—Method for mounting laser chips
- H01S5/02355—Fixing laser chips on mounts
- H01S5/0237—Fixing laser chips on mounts by soldering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0233—Mounting configuration of laser chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0233—Mounting configuration of laser chips
- H01S5/02345—Wire-bonding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0235—Method for mounting laser chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02469—Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02476—Heat spreaders, i.e. improving heat flow between laser chip and heat dissipating elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02476—Heat spreaders, i.e. improving heat flow between laser chip and heat dissipating elements
- H01S5/02484—Sapphire or diamond heat spreaders
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/026—Monolithically integrated components, e.g. waveguides, monitoring photo-detectors, drivers
- H01S5/0261—Non-optical elements, e.g. laser driver components, heaters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/04—Processes or apparatus for excitation, e.g. pumping, e.g. by electron beams
- H01S5/042—Electrical excitation ; Circuits therefor
- H01S5/0425—Electrodes, e.g. characterised by the structure
Description
10 ヒートシンク
20 サブマウント
23 縁部
30 半導体レーザ素子
40 ボンディングワイヤ
50 下側はんだ層
60 上側はんだ層
101 半導体レーザモジュール
201 半導体レーザモジュール
220 サブマウント
221 めっき層
260 上側はんだ層
301 半導体レーザモジュール
320 サブマウント
360 上側はんだ層
370 補助導電層
401 半導体レーザモジュール
430 半導体レーザ素子
432 レーザダイオードバー
Claims (4)
- 導電性を有するヒートシンクと、
前記ヒートシンクの上方に配置されるサブマウントと、
前記サブマウントの上方に配置される半導体レーザ素子と、
前記半導体レーザ素子と前記ヒートシンクとに電気的に接続される導電部であって、前記サブマウントの表面に沿って前記ヒートシンクまで延び、前記サブマウントの電気抵抗率よりも低い電気抵抗率を有する導電部と、
を備え、
前記導電部は、
前記半導体レーザ素子と電気的に接続され、前記サブマウントに直接接触する上側はんだ層と、
前記サブマウントと前記ヒートシンクとの間に形成された下側はんだ層と、
前記サブマウントの側面にのみ形成され、前記上側はんだ層と前記下側はんだ層とを電気的に接続するめっき層と、
を含むことを特徴とする半導体レーザモジュール。 - 前記サブマウントの熱伝導率は、前記導電部の熱伝導率よりも高いことを特徴とする請求項1に記載の半導体レーザモジュール。
- 導電性を有するヒートシンクと、前記ヒートシンクの上方に配置されるサブマウントと、前記サブマウントの上方に配置される半導体レーザ素子とを有する半導体レーザモジュールを製造する方法であって、
前記サブマウントの電気抵抗率よりも低い電気抵抗率を有する導電部を、前記半導体レーザ素子から前記サブマウントの表面に沿って前記ヒートシンクまで延びるように形成して前記半導体レーザ素子と前記ヒートシンクとを電気的に接続し、
前記導電部の形成は、
前記ヒートシンクと前記サブマウントとの間に下側はんだ層を形成し、
前記サブマウントの側面にのみめっき層を形成し、
前記めっき層が前記下側はんだ層に電気的に接続されるように前記サブマウントを前記下側はんだ層上に配置し、
前記めっき層と前記半導体レーザ素子とに電気的に接続される上側はんだ層を前記サブマウントに直接接触するように形成することにより行うことを特徴とする半導体レーザモジュールの製造方法。 - 前記サブマウントの熱伝導率は、前記導電部の熱伝導率よりも高いことを特徴とする請求項3に記載の半導体レーザモジュールの製造方法。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016033875A JP6652856B2 (ja) | 2016-02-25 | 2016-02-25 | 半導体レーザモジュール及びその製造方法 |
PCT/JP2017/006140 WO2017145987A1 (ja) | 2016-02-25 | 2017-02-20 | 半導体レーザモジュール及びその製造方法 |
CN201780013286.9A CN108701959A (zh) | 2016-02-25 | 2017-02-20 | 半导体激光模块及其制造方法 |
EP17756425.9A EP3422497A4 (en) | 2016-02-25 | 2017-02-20 | SEMICONDUCTOR LASER MODULE AND MANUFACTURING METHOD THEREOF |
US16/078,192 US10748836B2 (en) | 2016-02-25 | 2017-02-20 | Semiconductor laser module and method for manufacturing the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016033875A JP6652856B2 (ja) | 2016-02-25 | 2016-02-25 | 半導体レーザモジュール及びその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017152551A JP2017152551A (ja) | 2017-08-31 |
JP6652856B2 true JP6652856B2 (ja) | 2020-02-26 |
Family
ID=59685688
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016033875A Active JP6652856B2 (ja) | 2016-02-25 | 2016-02-25 | 半導体レーザモジュール及びその製造方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US10748836B2 (ja) |
EP (1) | EP3422497A4 (ja) |
JP (1) | JP6652856B2 (ja) |
CN (1) | CN108701959A (ja) |
WO (1) | WO2017145987A1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3507872A4 (en) * | 2016-08-30 | 2020-04-15 | Teradiode, Inc. | HIGH POWER LASER PACKAGING USING CARBON NANOTUBES |
JP6741155B2 (ja) * | 2017-05-17 | 2020-08-19 | 三菱電機株式会社 | 光モジュール |
CN110011178A (zh) * | 2019-03-28 | 2019-07-12 | 广东工业大学 | 电流-温控半导体激光器的光学干涉光源装置及其构成的测量系统 |
JP7324665B2 (ja) | 2019-09-13 | 2023-08-10 | シチズンファインデバイス株式会社 | サブマウント |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5837713B2 (ja) * | 1978-12-01 | 1983-08-18 | 富士通株式会社 | 半導体レ−ザ−装置の製造方法 |
JPS5972752U (ja) * | 1982-11-08 | 1984-05-17 | 日本電気株式会社 | ダイヤモンドヒ−トシンク |
JPH03209896A (ja) * | 1990-01-12 | 1991-09-12 | Mitsubishi Electric Corp | 半導体レーザ素子用サブマウント |
JPH07176820A (ja) | 1993-12-20 | 1995-07-14 | Mitsubishi Electric Corp | 半導体レーザ装置 |
JP2839015B2 (ja) * | 1996-06-21 | 1998-12-16 | 日本電気株式会社 | 半導体装置の製造方法 |
JPH11307875A (ja) | 1998-04-24 | 1999-11-05 | Sony Corp | 電子装置 |
JP2003152145A (ja) * | 2001-08-31 | 2003-05-23 | Sumitomo Electric Ind Ltd | 半導体放熱用基板とその製造方法及びパッケージ |
WO2003040420A1 (en) * | 2001-11-09 | 2003-05-15 | Sumitomo Electric Industries, Ltd. | Sintered diamond having high thermal conductivity and method for producing the same and heat sink employing it |
JP2005026333A (ja) | 2003-06-30 | 2005-01-27 | Sanyo Electric Co Ltd | 半導体レーザ装置 |
CA2560410C (en) | 2004-12-08 | 2014-02-18 | A.L.M.T. Corp. | Heat sink material, manufacturing method for the same, and semiconductor laser device |
JP5273922B2 (ja) * | 2006-12-28 | 2013-08-28 | 株式会社アライドマテリアル | 放熱部材および半導体装置 |
US8320419B2 (en) * | 2007-09-20 | 2012-11-27 | Oclaro Technology Limited | High power semiconductor laser diodes |
US8804783B2 (en) * | 2011-04-11 | 2014-08-12 | Coherent, Inc. | Cooling apparatus for optically pumped semiconductor laser |
JP2013004571A (ja) * | 2011-06-13 | 2013-01-07 | Hamamatsu Photonics Kk | 半導体レーザ装置 |
EP2835882B1 (en) * | 2012-04-05 | 2017-07-05 | Panasonic Intellectual Property Management Co., Ltd. | Semiconductor laser apparatus and method for manufacturing same |
JP5672324B2 (ja) * | 2013-03-18 | 2015-02-18 | 三菱マテリアル株式会社 | 接合体の製造方法及びパワーモジュール用基板の製造方法 |
JP6305127B2 (ja) * | 2014-03-12 | 2018-04-04 | 三菱電機株式会社 | 半導体レーザ光源 |
CN106134018A (zh) * | 2014-03-31 | 2016-11-16 | Ipg光子公司 | 高功率激光二极管封装方法和激光二极管模块 |
-
2016
- 2016-02-25 JP JP2016033875A patent/JP6652856B2/ja active Active
-
2017
- 2017-02-20 CN CN201780013286.9A patent/CN108701959A/zh active Pending
- 2017-02-20 WO PCT/JP2017/006140 patent/WO2017145987A1/ja active Application Filing
- 2017-02-20 US US16/078,192 patent/US10748836B2/en active Active
- 2017-02-20 EP EP17756425.9A patent/EP3422497A4/en not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
JP2017152551A (ja) | 2017-08-31 |
WO2017145987A1 (ja) | 2017-08-31 |
EP3422497A1 (en) | 2019-01-02 |
EP3422497A4 (en) | 2020-01-01 |
US10748836B2 (en) | 2020-08-18 |
US20190067161A1 (en) | 2019-02-28 |
CN108701959A (zh) | 2018-10-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR101142561B1 (ko) | 레이저 광원 모듈 | |
US20170070028A1 (en) | Laser Light Modules | |
JP6652856B2 (ja) | 半導体レーザモジュール及びその製造方法 | |
JP2001168442A (ja) | 半導体レーザ素子の製造方法、配設基板および支持基板 | |
KR20120087989A (ko) | 레이저 모듈 | |
JP2016054279A (ja) | 半導体レーザ | |
CN108604768B (zh) | 半导体激光器装置及其制造方法 | |
JP4811629B2 (ja) | 半導体レーザ装置 | |
JP2006128236A (ja) | 光半導体モジュール | |
JP2008172141A (ja) | レーザダイオード素子 | |
JP2006351847A (ja) | 半導体発光装置 | |
JP2002299744A (ja) | 半導体レーザアセンブリ | |
JP2005183996A (ja) | 放射発光型半導体構成素子及びリードフレーム上に半導体チップを固定するための方法 | |
JP2003198051A (ja) | 半導体レーザ装置および半導体レーザモジュール | |
JP2006294805A (ja) | 半導体レーザ装置 | |
JP2007305977A (ja) | 半導体レーザ装置及びその製造方法 | |
US20050286592A1 (en) | Semiconductor laser array device | |
JP2019062033A (ja) | 半導体レーザ装置 | |
JP2018113377A (ja) | レーザー光源装置 | |
JP2004096062A (ja) | 半導体発光装置 | |
US7873086B2 (en) | Semiconductor device | |
JP2009158645A (ja) | レーザモジュール | |
JPH0451073B2 (ja) | ||
JPWO2020031944A1 (ja) | 半導体発光装置 | |
JP4350382B2 (ja) | 半導体レーザ装置及びその製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20181214 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20190514 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20190711 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20200107 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20200124 |
|
R151 | Written notification of patent or utility model registration |
Ref document number: 6652856 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R151 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |