EP2347970B1 - Anordnung mit mindestens einem Leistungshalbleitermodul und mit einer Transportverpackung - Google Patents

Anordnung mit mindestens einem Leistungshalbleitermodul und mit einer Transportverpackung Download PDF

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Publication number
EP2347970B1
EP2347970B1 EP10192500.6A EP10192500A EP2347970B1 EP 2347970 B1 EP2347970 B1 EP 2347970B1 EP 10192500 A EP10192500 A EP 10192500A EP 2347970 B1 EP2347970 B1 EP 2347970B1
Authority
EP
European Patent Office
Prior art keywords
power semiconductor
semiconductor module
arrangement
plastic moulding
accordance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP10192500.6A
Other languages
German (de)
English (en)
French (fr)
Other versions
EP2347970A1 (de
Inventor
Stefan Starovecky
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semikron GmbH and Co KG
Semikron Elektronik GmbH and Co KG
Original Assignee
Semikron GmbH and Co KG
Semikron Elektronik GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semikron GmbH and Co KG, Semikron Elektronik GmbH and Co KG filed Critical Semikron GmbH and Co KG
Publication of EP2347970A1 publication Critical patent/EP2347970A1/de
Application granted granted Critical
Publication of EP2347970B1 publication Critical patent/EP2347970B1/de
Active legal-status Critical Current
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D75/00—Packages comprising articles or materials partially or wholly enclosed in strips, sheets, blanks, tubes, or webs of flexible sheet material, e.g. in folded wrappers
    • B65D75/28—Articles or materials wholly enclosed in composite wrappers, i.e. wrappers formed by associating or interconnecting two or more sheets or blanks
    • B65D75/30—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding
    • B65D75/32—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding one or both sheets or blanks being recessed to accommodate contents
    • B65D75/325—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding one or both sheets or blanks being recessed to accommodate contents one sheet being recessed, and the other being a flat not- rigid sheet, e.g. puncturable or peelable foil
    • B65D75/327—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding one or both sheets or blanks being recessed to accommodate contents one sheet being recessed, and the other being a flat not- rigid sheet, e.g. puncturable or peelable foil and forming several compartments
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D75/00—Packages comprising articles or materials partially or wholly enclosed in strips, sheets, blanks, tubes, or webs of flexible sheet material, e.g. in folded wrappers
    • B65D75/28—Articles or materials wholly enclosed in composite wrappers, i.e. wrappers formed by associating or interconnecting two or more sheets or blanks
    • B65D75/30—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding
    • B65D75/32—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding one or both sheets or blanks being recessed to accommodate contents
    • B65D75/36—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding one or both sheets or blanks being recessed to accommodate contents one sheet or blank being recessed and the other formed of relatively stiff flat sheet material, e.g. blister packages, the recess or recesses being preformed
    • B65D75/367—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding one or both sheets or blanks being recessed to accommodate contents one sheet or blank being recessed and the other formed of relatively stiff flat sheet material, e.g. blister packages, the recess or recesses being preformed and forming several compartments
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D81/00—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
    • B65D81/02—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
    • B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D2575/00—Packages comprising articles or materials partially or wholly enclosed in strips, sheets, blanks, tubes or webs of flexible sheet material, e.g. in folded wrappers
    • B65D2575/28—Articles or materials wholly enclosed in composite wrappers, i.e. wrappers formed by association or interconnecting two or more sheets or blanks
    • B65D2575/30—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding
    • B65D2575/32—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding one or both sheets or blanks being recessed to accommodate contents
    • B65D2575/3209—Details
    • B65D2575/3218—Details with special means for gaining access to the contents
    • B65D2575/3245—Details with special means for gaining access to the contents by peeling off the non-rigid sheet
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D2585/00—Containers, packaging elements or packages specially adapted for particular articles or materials
    • B65D2585/68—Containers, packaging elements or packages specially adapted for particular articles or materials for machines, engines, or vehicles in assembled or dismantled form
    • B65D2585/86—Containers, packaging elements or packages specially adapted for particular articles or materials for machines, engines, or vehicles in assembled or dismantled form for electrical components

Definitions

  • the invention describes an arrangement for mostly au ßer istlichen transport of at least one power semiconductor module.
  • Simple cardboard boxes for example, according to DE 39 09 898 A1
  • a further disadvantage is that such packaging must be opened by way of example for tests under a customs procedure and thus the power semiconductor modules can be touched directly, which may possibly lead to damage due to electrostatic discharge or due to contact with sensitive surfaces, for example silver-coated connection elements.
  • the so-called Skin- packaging as exemplified by the DE 199 28 368 A1 are known, form a starting point of this invention and are a combination of a carton with the plastic film enclosing the goods to be packaged.
  • Such packages are known to have the significant disadvantage that they can not protect sufficiently sensitive parts of the goods to be packaged.
  • a blister pack with a top layer and two plastic moldings.
  • the first molded plastic body forms the receptacle for an object to be packaged, while by means of the second molded plastic body the cover of the article and the closure takes place towards the cover layer.
  • the DE 10 2006 020 636 A1 discloses a transport / packaging container for a plurality of power semiconductor modules, consisting of two nested plastics moldings.
  • the first of these plastic moldings forms a trough in which the second plastic molded body is arranged.
  • This has stop means for the positioning of individual power semiconductor modules in nests.
  • it has a recess in the direction of the bottom of the first plastic molded body.
  • the invention has for its object to provide an arrangement with at least one power semiconductor module and a transport packaging, which is particularly robust against occurring during transport mechanical effects, at least in combination with another outer packaging, and in principle the protection against electrostatic discharge as well as a legibility of the label mounted at least one power semiconductor module without opening the transport packaging is accessible.
  • the inventive idea is based on the above-mentioned skin packaging.
  • This is developed into an arrangement with at least one power semiconductor module.
  • this arrangement has at least one power semiconductor module, but preferably a plurality of power semiconductor modules arranged in a one- or two-dimensional matrix and a transport packaging.
  • the power semiconductor module has a base element, preferably a metallic base plate, a housing made of an insulating material, and connecting elements for external contacting of the power semiconductor components which are internally insulated from the base plate.
  • a base element preferably a metallic base plate
  • a housing made of an insulating material
  • connecting elements for external contacting of the power semiconductor components which are internally insulated from the base plate.
  • the transport packaging of the arrangement according to the invention in turn has a cover layer, a cover film and at least one trough-like molded plastic body per power semiconductor module.
  • the cover layer preferably designed as a composite cardboard which can be dissipated in its entirety, has a planar design and thus forms the basis of the transport packaging.
  • the respective power semiconductor module is in this case arranged to the at least one plastic molded body and partially enclosed by this, wherein the plastic molded body is not completely applied to the power semiconductor module, but is spaced in sections thereof.
  • the plastic molding has at least one stop surface, with which it rests directly on the power semiconductor module. Adjacent thereto, at least one cavity is then provided between the plastics molding and the power semiconductor module.
  • this cavity when it is provided on the bottom element, can protect a heat-conducting paste structure applied there from contact.
  • the at least one cavity can protect connection elements from mechanical contact during transport.
  • this plastic molded body completely covers one side of the power semiconductor module and has a wall which rests against the adjacent sides of the power semiconductor module and covers these adjacent sides only partially.
  • the at least one plastic molded article thus forms a spacer element between the power semiconductor module and the remaining parts of the packaging, whereby these parts of the packaging in the region of the plastic molded article do not rest directly but only indirectly on it.
  • plastic molded body between the power semiconductor module and the cover layer in order to protect, for example, a thermal compound layer, as well as alternatively or additionally a further plastic molded article may be provided on the opposite side of the power semiconductor module to protect local connection elements.
  • a plastic molded body forms a protection of the cover sheet against the connection elements, since they could damage the cover sheet with appropriate design, and thus the protection of the power semiconductor module would be no longer available before contact.
  • An intermediate layer is arranged on the first main surface of the cover layer, wherein this recess has in each case one associated power semiconductor module.
  • the cover sheet is largely only with that of this intermediate layer and only, in the region of their recesses, connected to the cover layer, whereby an easy-to-open transport packaging is formed.
  • cover film and / or the respective plastic molded body consists of a conductive or dissipative plastic with or without metallbedampfter outer surface. It is equally advantageous to form the cover film and / or the respective plastic molding at least in sections, but preferably completely, transparently.
  • a further preferred embodiment results if, in a plurality of power semiconductor modules arranged in a one-dimensional or two-dimensional matrix, they have a distance apart from one another in at least one dimension parallel to the main surface of the cover layer and parallel to a surface normal of the housing which is greater than the width of the housing arranged plastic molding in this dimension.
  • Fig. 1 shows a section through an embodiment of an arrangement.
  • Fig. 2 and 3 shows a section through an embodiment of an inventive arrangement.
  • Fig. 4 shows in three-dimensional representation two arrangements according to the invention similar to those according to Fig. 2 and 3 ,
  • Fig. 1 shows a section of a section along a line AA (see. Fig. 4 ) by an arrangement (1). Shown here is the cover layer (10) of the transport packaging (2) with its first (100) and second main surface (110). On the first main surface (100) of the cover layer (10), the power semiconductor module (5) to be packaged are arranged in a matrix-like manner at the same distance from each other. Of the power semiconductor modules (5) to be packaged, only one bottom element (40), one housing (50) and one connection element (60) are shown.
  • connection elements (60) lie on the side of the power semiconductor module (5) opposite the cover layer (10).
  • the bottom element (40) of the respective power semiconductor module (5) here has a thermal paste layer (42), as known from the prior art.
  • a plastic molding (80) is arranged between the power semiconductor module (5) and the cover layer (10) of the transport packaging (2), whereby the power semiconductor module (5) is not directly on the first main surface (100) of the cover layer (10).
  • the plastic molding (80) is formed like a trough and has circumferentially a flat support edge (82). On this support surface (82) are not provided with thermal compound (42) edge region of the bottom element (40) of the power semiconductor module (5). Alternatively, depending on the design of the power semiconductor module (5), also a part of the housing (50) rest on this support surface (82). Between the heat-conducting paste (42) provided with the bottom element (40) and the cover layer (10) of the plastic molded body (80) forms a cavity (86), which serves the mechanical protection of the thermal paste (42).
  • cover film (30) as well as the parts of the plastic molded body (80) adjacent to the power semiconductor module (5) are here and hereafter shown spaced apart from the cover layer (10) as well as at a distance from the power semiconductor modules (5), for clarity purposes only.
  • the cover film (30) is adhesively bonded to the first main surface (100) of the cover layer (10).
  • cover film (30) Due to the design of the cover film (30) and preferably also of the plastic molded body (80) of a conductive or dissipative plastic with or without metallbedampfter outer surface and the cover layer (10) of a conductive or dissipative composite cardboard, a transport packaging (2), which provides sufficient Protection of the power semiconductor modules (5) against electrostatic charging offers. Since the cover film (30) is formed at least in sections, but preferably completely, transparently, it is not necessary for various control purposes to open this protective packaging (2).
  • the inventive arrangement (1) according to Fig. 2 is further configured such that the distance (700) of the power semiconductor modules (5) with arranged plastic molding (80) to each other is greater than the width (500) of a power semiconductor module (5), whereby it is possible a second arrangement (1 ') according to Fig. 4 offset by half the distance to the first arrangement (1) and provided rotated by 180 °, resulting in a compact overall arrangement with high packing density with simultaneous sufficient fixation of the individual power semiconductor modules (5) to each other.
  • the Fig. 2 and 3 shows in each case a section along a line BB (see. Fig. 4 ) by a second arrangement according to the invention (1), wherein the transport packaging (2) is shown again educated.
  • This now has an additional intermediate layer (20), each with a power semiconductor module (5) associated with recesses (230), whereby the associated power semiconductor module (5) in its lower part but does not encompass directly and completely enclosed.
  • the edge (220) of the recess (230) On the entire circumference of the power semiconductor module (5), it is advantageous for the edge (220) of the recess (230) to abut a maximum of 50%, preferably only a maximum of 25%, directly on the associated power semiconductor module (5) and the remaining part of the Edge (220) has a distance of at least 2mm to the power semiconductor module (5) and thus forms an intermediate region (240).
  • cover sheet (30) and the intermediate layer (20) it is basically preferred but not necessarily necessary, in addition to the adhesive bond between the cover sheet (30) and the intermediate layer (20), also between the cover layer (10) and the cover sheet (30) in the intermediate region (240) described above, as well as between the cover layer (10) and the intermediate layer (20) provide adhesive connections.
  • the first-mentioned adhesive bond does not have to be designed as a detachable connection.
  • Fig. 2 shows an arrangement 1 with a power semiconductor module (5) and a transport packaging (2).
  • the cover layer (10) is shown partially separated from the intermediate layer (20).
  • This representation corresponds to the opening of the transport packaging (2) to remove a power semiconductor module (5) from this.
  • the detachable connection between the cover layer (10) and the intermediate layer (20) and / or that between the cover layer (10) and the cover film (30) in the intermediate region (240) is separated.
  • the intermediate layer (20) as well as the cover layer (10) consists of cardboard or cardboard or composite cardboard. It has proved to be particularly advantageous for protection against electrostatic discharge, the intermediate layer (20) and, but preferably only, the cover layer (10) of conductive or conductive composite cardboard. This then has, by way of example, a conductive or dissipative film interlayer.
  • the plastic molded body (80) has a stop surface (82) with the load connection elements (60), and adjacent to each one a cavity (86) for the auxiliary connection elements on. This cavity (86) prevents the respective auxiliary connection elements (62) from damaging the cover film (30) due to their configuration as a plug.
  • this plastic molded body (80) covers the entire connecting elements having side of the power semiconductor module (5).
  • the plastic molded body (80) further has at least two opposite, but preferably on all sides of a wall (84).
  • This wall (84) abuts those sides of the power semiconductor module (5) which adjoin the covered side. It is hereby preferred that these walls (84) only partially cover the respective sides.
  • Typical dimensions of said power semiconductor modules (5) are, without being limited thereto, a length in the range of 3cm to 15cm at a width (500) including plastic moldings (80) and also a height of 1cm to 6cm.
  • the cover layer (10) of the transport packaging (2) has a typical thickness of 0.2 mm to 1 mm
  • the intermediate layer (20) has a thickness of 0.5 to 3 mm
  • the cover film (30) has a thickness of the order of 100 ⁇ m having.
  • the plastic molding (80) preferably has a thickness which is at least a factor of 5 higher than that of the cover film (30).
  • Fig. 3 now shows a further step of removing a power semiconductor module (5) from the transport packaging (2).
  • the intermediate layer (20) was pressed in the direction of the surface normal of its first major surface (200) until the intermediate layer (20) lies approximately on the plane formed by the upper side of the housing (50).
  • the cover film (30) at least partially detached from the housing (50) of the power semiconductor module (5), and then lies exclusively or at least almost exclusively on the walls (84) of the plastic molded body (80) whereby the power semiconductor module (5) can be removed from this plastic molding (80) simply and without the use of tools.
  • Fig. 4 shows three-dimensional representation of two inventive arrangements (1, 1 '), similar to those according to Fig. 1, 2 and 3 , each with a transport packaging (2) and a plurality of power semiconductor modules (5).
  • the housing (50) and a plurality of connecting elements (60, 62) is shown.
  • floor element (40, cf. Fig. 1 ) here a metallic base plate
  • these power semiconductor modules (5) in a two-dimensional matrix on the first main surface (100) of the cover layer (10) of the respective transport packaging (2) are arranged by the bottom element (40, see FIG. Fig. 2 ) directly or as described above indirectly with an interposed plastic molded body (80) comes to lie here.
  • This intermediate layer (20) has a plurality of recesses (230) which are each associated with a power semiconductor module (5).
  • the power semiconductor module (5) is arranged in this recess (230) such that the edge (220) of the recess (230) rests directly on the housing (50) of the power semiconductor module (5) only at a few sections.
  • a gap is provided between the housing (50) of the power semiconductor module (5) and the edge (220) of the recess (230), which forms an intermediate region (240).
  • the transparent cover film (30) and the respective plastic moldings (80) themselves.
  • the transport packaging ( 2), here only shown in the second arrangement (1 ') between the respective power semiconductor components (5) has a perforation (70) in order to simplify the separation of the packaged power semiconductor modules (5).

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Composite Materials (AREA)
  • Packaging Frangible Articles (AREA)
  • Packages (AREA)
EP10192500.6A 2010-01-20 2010-11-25 Anordnung mit mindestens einem Leistungshalbleitermodul und mit einer Transportverpackung Active EP2347970B1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102010005047.4A DE102010005047B4 (de) 2010-01-20 2010-01-20 Anordnung mit mindestens einem Leistungshalbleitermodul und mit einer Transportverpackung

Publications (2)

Publication Number Publication Date
EP2347970A1 EP2347970A1 (de) 2011-07-27
EP2347970B1 true EP2347970B1 (de) 2013-06-19

Family

ID=43902552

Family Applications (1)

Application Number Title Priority Date Filing Date
EP10192500.6A Active EP2347970B1 (de) 2010-01-20 2010-11-25 Anordnung mit mindestens einem Leistungshalbleitermodul und mit einer Transportverpackung

Country Status (6)

Country Link
US (1) US8247892B2 (ja)
EP (1) EP2347970B1 (ja)
JP (1) JP5732261B2 (ja)
KR (1) KR20110085871A (ja)
CN (1) CN102145794B (ja)
DE (1) DE102010005047B4 (ja)

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DE102011114309B4 (de) * 2011-09-23 2019-03-07 Kartonveredlung Knapp GmbH Anordnung mit mindestens einem zu verpackenden Gegenstand und einer Transportverpackung und Herstellungsverfahren hierzu
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DE102013207043B4 (de) * 2013-04-18 2020-02-27 Infineon Technologies Ag Halbleitermodulanordnung und Verfahren zur Montage eines Halbleitermoduls an einem Kühlkörper

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US11769701B2 (en) 2020-02-27 2023-09-26 Infineon Technologies Austria Ag Protector cap for package with thermal interface material

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KR20110085871A (ko) 2011-07-27
CN102145794B (zh) 2015-04-01
DE102010005047B4 (de) 2014-10-23
JP5732261B2 (ja) 2015-06-10
US8247892B2 (en) 2012-08-21
JP2011173654A (ja) 2011-09-08
DE102010005047A1 (de) 2011-07-21
EP2347970A1 (de) 2011-07-27
CN102145794A (zh) 2011-08-10
US20110180918A1 (en) 2011-07-28

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