EP2347970B1 - Agencement doté d'au moins un module semi-conducteur de puissance et d'un emballage de transport - Google Patents
Agencement doté d'au moins un module semi-conducteur de puissance et d'un emballage de transport Download PDFInfo
- Publication number
- EP2347970B1 EP2347970B1 EP10192500.6A EP10192500A EP2347970B1 EP 2347970 B1 EP2347970 B1 EP 2347970B1 EP 10192500 A EP10192500 A EP 10192500A EP 2347970 B1 EP2347970 B1 EP 2347970B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- power semiconductor
- semiconductor module
- arrangement
- plastic moulding
- accordance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000004065 semiconductor Substances 0.000 title claims description 98
- 238000004806 packaging method and process Methods 0.000 claims description 35
- 239000004033 plastic Substances 0.000 claims description 28
- 229920003023 plastic Polymers 0.000 claims description 28
- 238000010137 moulding (plastic) Methods 0.000 claims description 23
- 239000013039 cover film Substances 0.000 claims description 20
- 239000011159 matrix material Substances 0.000 claims description 7
- 239000002131 composite material Substances 0.000 claims description 5
- 239000010410 layer Substances 0.000 description 48
- 241001295925 Gegenes Species 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000002991 molded plastic Substances 0.000 description 3
- 238000009466 skin packaging Methods 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007786 electrostatic charging Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000001473 noxious effect Effects 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 235000011837 pasties Nutrition 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D75/00—Packages comprising articles or materials partially or wholly enclosed in strips, sheets, blanks, tubes, or webs of flexible sheet material, e.g. in folded wrappers
- B65D75/28—Articles or materials wholly enclosed in composite wrappers, i.e. wrappers formed by associating or interconnecting two or more sheets or blanks
- B65D75/30—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding
- B65D75/32—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding one or both sheets or blanks being recessed to accommodate contents
- B65D75/325—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding one or both sheets or blanks being recessed to accommodate contents one sheet being recessed, and the other being a flat not- rigid sheet, e.g. puncturable or peelable foil
- B65D75/327—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding one or both sheets or blanks being recessed to accommodate contents one sheet being recessed, and the other being a flat not- rigid sheet, e.g. puncturable or peelable foil and forming several compartments
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D75/00—Packages comprising articles or materials partially or wholly enclosed in strips, sheets, blanks, tubes, or webs of flexible sheet material, e.g. in folded wrappers
- B65D75/28—Articles or materials wholly enclosed in composite wrappers, i.e. wrappers formed by associating or interconnecting two or more sheets or blanks
- B65D75/30—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding
- B65D75/32—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding one or both sheets or blanks being recessed to accommodate contents
- B65D75/36—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding one or both sheets or blanks being recessed to accommodate contents one sheet or blank being recessed and the other formed of relatively stiff flat sheet material, e.g. blister packages, the recess or recesses being preformed
- B65D75/367—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding one or both sheets or blanks being recessed to accommodate contents one sheet or blank being recessed and the other formed of relatively stiff flat sheet material, e.g. blister packages, the recess or recesses being preformed and forming several compartments
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D81/00—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
- B65D81/02—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
- B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D2575/00—Packages comprising articles or materials partially or wholly enclosed in strips, sheets, blanks, tubes or webs of flexible sheet material, e.g. in folded wrappers
- B65D2575/28—Articles or materials wholly enclosed in composite wrappers, i.e. wrappers formed by association or interconnecting two or more sheets or blanks
- B65D2575/30—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding
- B65D2575/32—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding one or both sheets or blanks being recessed to accommodate contents
- B65D2575/3209—Details
- B65D2575/3218—Details with special means for gaining access to the contents
- B65D2575/3245—Details with special means for gaining access to the contents by peeling off the non-rigid sheet
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D2585/00—Containers, packaging elements or packages specially adapted for particular articles or materials
- B65D2585/68—Containers, packaging elements or packages specially adapted for particular articles or materials for machines, engines, or vehicles in assembled or dismantled form
- B65D2585/86—Containers, packaging elements or packages specially adapted for particular articles or materials for machines, engines, or vehicles in assembled or dismantled form for electrical components
Definitions
- the invention describes an arrangement for mostly au ßer istlichen transport of at least one power semiconductor module.
- Simple cardboard boxes for example, according to DE 39 09 898 A1
- a further disadvantage is that such packaging must be opened by way of example for tests under a customs procedure and thus the power semiconductor modules can be touched directly, which may possibly lead to damage due to electrostatic discharge or due to contact with sensitive surfaces, for example silver-coated connection elements.
- the so-called Skin- packaging as exemplified by the DE 199 28 368 A1 are known, form a starting point of this invention and are a combination of a carton with the plastic film enclosing the goods to be packaged.
- Such packages are known to have the significant disadvantage that they can not protect sufficiently sensitive parts of the goods to be packaged.
- a blister pack with a top layer and two plastic moldings.
- the first molded plastic body forms the receptacle for an object to be packaged, while by means of the second molded plastic body the cover of the article and the closure takes place towards the cover layer.
- the DE 10 2006 020 636 A1 discloses a transport / packaging container for a plurality of power semiconductor modules, consisting of two nested plastics moldings.
- the first of these plastic moldings forms a trough in which the second plastic molded body is arranged.
- This has stop means for the positioning of individual power semiconductor modules in nests.
- it has a recess in the direction of the bottom of the first plastic molded body.
- the invention has for its object to provide an arrangement with at least one power semiconductor module and a transport packaging, which is particularly robust against occurring during transport mechanical effects, at least in combination with another outer packaging, and in principle the protection against electrostatic discharge as well as a legibility of the label mounted at least one power semiconductor module without opening the transport packaging is accessible.
- the inventive idea is based on the above-mentioned skin packaging.
- This is developed into an arrangement with at least one power semiconductor module.
- this arrangement has at least one power semiconductor module, but preferably a plurality of power semiconductor modules arranged in a one- or two-dimensional matrix and a transport packaging.
- the power semiconductor module has a base element, preferably a metallic base plate, a housing made of an insulating material, and connecting elements for external contacting of the power semiconductor components which are internally insulated from the base plate.
- a base element preferably a metallic base plate
- a housing made of an insulating material
- connecting elements for external contacting of the power semiconductor components which are internally insulated from the base plate.
- the transport packaging of the arrangement according to the invention in turn has a cover layer, a cover film and at least one trough-like molded plastic body per power semiconductor module.
- the cover layer preferably designed as a composite cardboard which can be dissipated in its entirety, has a planar design and thus forms the basis of the transport packaging.
- the respective power semiconductor module is in this case arranged to the at least one plastic molded body and partially enclosed by this, wherein the plastic molded body is not completely applied to the power semiconductor module, but is spaced in sections thereof.
- the plastic molding has at least one stop surface, with which it rests directly on the power semiconductor module. Adjacent thereto, at least one cavity is then provided between the plastics molding and the power semiconductor module.
- this cavity when it is provided on the bottom element, can protect a heat-conducting paste structure applied there from contact.
- the at least one cavity can protect connection elements from mechanical contact during transport.
- this plastic molded body completely covers one side of the power semiconductor module and has a wall which rests against the adjacent sides of the power semiconductor module and covers these adjacent sides only partially.
- the at least one plastic molded article thus forms a spacer element between the power semiconductor module and the remaining parts of the packaging, whereby these parts of the packaging in the region of the plastic molded article do not rest directly but only indirectly on it.
- plastic molded body between the power semiconductor module and the cover layer in order to protect, for example, a thermal compound layer, as well as alternatively or additionally a further plastic molded article may be provided on the opposite side of the power semiconductor module to protect local connection elements.
- a plastic molded body forms a protection of the cover sheet against the connection elements, since they could damage the cover sheet with appropriate design, and thus the protection of the power semiconductor module would be no longer available before contact.
- An intermediate layer is arranged on the first main surface of the cover layer, wherein this recess has in each case one associated power semiconductor module.
- the cover sheet is largely only with that of this intermediate layer and only, in the region of their recesses, connected to the cover layer, whereby an easy-to-open transport packaging is formed.
- cover film and / or the respective plastic molded body consists of a conductive or dissipative plastic with or without metallbedampfter outer surface. It is equally advantageous to form the cover film and / or the respective plastic molding at least in sections, but preferably completely, transparently.
- a further preferred embodiment results if, in a plurality of power semiconductor modules arranged in a one-dimensional or two-dimensional matrix, they have a distance apart from one another in at least one dimension parallel to the main surface of the cover layer and parallel to a surface normal of the housing which is greater than the width of the housing arranged plastic molding in this dimension.
- Fig. 1 shows a section through an embodiment of an arrangement.
- Fig. 2 and 3 shows a section through an embodiment of an inventive arrangement.
- Fig. 4 shows in three-dimensional representation two arrangements according to the invention similar to those according to Fig. 2 and 3 ,
- Fig. 1 shows a section of a section along a line AA (see. Fig. 4 ) by an arrangement (1). Shown here is the cover layer (10) of the transport packaging (2) with its first (100) and second main surface (110). On the first main surface (100) of the cover layer (10), the power semiconductor module (5) to be packaged are arranged in a matrix-like manner at the same distance from each other. Of the power semiconductor modules (5) to be packaged, only one bottom element (40), one housing (50) and one connection element (60) are shown.
- connection elements (60) lie on the side of the power semiconductor module (5) opposite the cover layer (10).
- the bottom element (40) of the respective power semiconductor module (5) here has a thermal paste layer (42), as known from the prior art.
- a plastic molding (80) is arranged between the power semiconductor module (5) and the cover layer (10) of the transport packaging (2), whereby the power semiconductor module (5) is not directly on the first main surface (100) of the cover layer (10).
- the plastic molding (80) is formed like a trough and has circumferentially a flat support edge (82). On this support surface (82) are not provided with thermal compound (42) edge region of the bottom element (40) of the power semiconductor module (5). Alternatively, depending on the design of the power semiconductor module (5), also a part of the housing (50) rest on this support surface (82). Between the heat-conducting paste (42) provided with the bottom element (40) and the cover layer (10) of the plastic molded body (80) forms a cavity (86), which serves the mechanical protection of the thermal paste (42).
- cover film (30) as well as the parts of the plastic molded body (80) adjacent to the power semiconductor module (5) are here and hereafter shown spaced apart from the cover layer (10) as well as at a distance from the power semiconductor modules (5), for clarity purposes only.
- the cover film (30) is adhesively bonded to the first main surface (100) of the cover layer (10).
- cover film (30) Due to the design of the cover film (30) and preferably also of the plastic molded body (80) of a conductive or dissipative plastic with or without metallbedampfter outer surface and the cover layer (10) of a conductive or dissipative composite cardboard, a transport packaging (2), which provides sufficient Protection of the power semiconductor modules (5) against electrostatic charging offers. Since the cover film (30) is formed at least in sections, but preferably completely, transparently, it is not necessary for various control purposes to open this protective packaging (2).
- the inventive arrangement (1) according to Fig. 2 is further configured such that the distance (700) of the power semiconductor modules (5) with arranged plastic molding (80) to each other is greater than the width (500) of a power semiconductor module (5), whereby it is possible a second arrangement (1 ') according to Fig. 4 offset by half the distance to the first arrangement (1) and provided rotated by 180 °, resulting in a compact overall arrangement with high packing density with simultaneous sufficient fixation of the individual power semiconductor modules (5) to each other.
- the Fig. 2 and 3 shows in each case a section along a line BB (see. Fig. 4 ) by a second arrangement according to the invention (1), wherein the transport packaging (2) is shown again educated.
- This now has an additional intermediate layer (20), each with a power semiconductor module (5) associated with recesses (230), whereby the associated power semiconductor module (5) in its lower part but does not encompass directly and completely enclosed.
- the edge (220) of the recess (230) On the entire circumference of the power semiconductor module (5), it is advantageous for the edge (220) of the recess (230) to abut a maximum of 50%, preferably only a maximum of 25%, directly on the associated power semiconductor module (5) and the remaining part of the Edge (220) has a distance of at least 2mm to the power semiconductor module (5) and thus forms an intermediate region (240).
- cover sheet (30) and the intermediate layer (20) it is basically preferred but not necessarily necessary, in addition to the adhesive bond between the cover sheet (30) and the intermediate layer (20), also between the cover layer (10) and the cover sheet (30) in the intermediate region (240) described above, as well as between the cover layer (10) and the intermediate layer (20) provide adhesive connections.
- the first-mentioned adhesive bond does not have to be designed as a detachable connection.
- Fig. 2 shows an arrangement 1 with a power semiconductor module (5) and a transport packaging (2).
- the cover layer (10) is shown partially separated from the intermediate layer (20).
- This representation corresponds to the opening of the transport packaging (2) to remove a power semiconductor module (5) from this.
- the detachable connection between the cover layer (10) and the intermediate layer (20) and / or that between the cover layer (10) and the cover film (30) in the intermediate region (240) is separated.
- the intermediate layer (20) as well as the cover layer (10) consists of cardboard or cardboard or composite cardboard. It has proved to be particularly advantageous for protection against electrostatic discharge, the intermediate layer (20) and, but preferably only, the cover layer (10) of conductive or conductive composite cardboard. This then has, by way of example, a conductive or dissipative film interlayer.
- the plastic molded body (80) has a stop surface (82) with the load connection elements (60), and adjacent to each one a cavity (86) for the auxiliary connection elements on. This cavity (86) prevents the respective auxiliary connection elements (62) from damaging the cover film (30) due to their configuration as a plug.
- this plastic molded body (80) covers the entire connecting elements having side of the power semiconductor module (5).
- the plastic molded body (80) further has at least two opposite, but preferably on all sides of a wall (84).
- This wall (84) abuts those sides of the power semiconductor module (5) which adjoin the covered side. It is hereby preferred that these walls (84) only partially cover the respective sides.
- Typical dimensions of said power semiconductor modules (5) are, without being limited thereto, a length in the range of 3cm to 15cm at a width (500) including plastic moldings (80) and also a height of 1cm to 6cm.
- the cover layer (10) of the transport packaging (2) has a typical thickness of 0.2 mm to 1 mm
- the intermediate layer (20) has a thickness of 0.5 to 3 mm
- the cover film (30) has a thickness of the order of 100 ⁇ m having.
- the plastic molding (80) preferably has a thickness which is at least a factor of 5 higher than that of the cover film (30).
- Fig. 3 now shows a further step of removing a power semiconductor module (5) from the transport packaging (2).
- the intermediate layer (20) was pressed in the direction of the surface normal of its first major surface (200) until the intermediate layer (20) lies approximately on the plane formed by the upper side of the housing (50).
- the cover film (30) at least partially detached from the housing (50) of the power semiconductor module (5), and then lies exclusively or at least almost exclusively on the walls (84) of the plastic molded body (80) whereby the power semiconductor module (5) can be removed from this plastic molding (80) simply and without the use of tools.
- Fig. 4 shows three-dimensional representation of two inventive arrangements (1, 1 '), similar to those according to Fig. 1, 2 and 3 , each with a transport packaging (2) and a plurality of power semiconductor modules (5).
- the housing (50) and a plurality of connecting elements (60, 62) is shown.
- floor element (40, cf. Fig. 1 ) here a metallic base plate
- these power semiconductor modules (5) in a two-dimensional matrix on the first main surface (100) of the cover layer (10) of the respective transport packaging (2) are arranged by the bottom element (40, see FIG. Fig. 2 ) directly or as described above indirectly with an interposed plastic molded body (80) comes to lie here.
- This intermediate layer (20) has a plurality of recesses (230) which are each associated with a power semiconductor module (5).
- the power semiconductor module (5) is arranged in this recess (230) such that the edge (220) of the recess (230) rests directly on the housing (50) of the power semiconductor module (5) only at a few sections.
- a gap is provided between the housing (50) of the power semiconductor module (5) and the edge (220) of the recess (230), which forms an intermediate region (240).
- the transparent cover film (30) and the respective plastic moldings (80) themselves.
- the transport packaging ( 2), here only shown in the second arrangement (1 ') between the respective power semiconductor components (5) has a perforation (70) in order to simplify the separation of the packaged power semiconductor modules (5).
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Composite Materials (AREA)
- Packaging Frangible Articles (AREA)
- Packages (AREA)
Claims (9)
- Arrangement (1) avec au moins un module semi-conducteur de puissance (5) et un emballage de transport (2), le module semi-conducteur de puissance (5) comportant un élément de base (40), un boîtier (50) et des éléments de connexion (60, 62), et l'emballage de transport (2) comportant une couche de couverture (10) prévue de forme plate, un film de couverture (30), et au moins un corps moulé en matière plastique (80) de type cuve par module semi-conducteur de puissance (5),
dans lequel ledit au moins un corps moulé en matière plastique (80) n'entoure que partiellement le module semi-conducteur de puissance (5) correspondant et une partie du corps moulé en matière plastique (80) ne repose pas directement contre le module semi-conducteur de puissance (5), un premier côté de l'au moins un module semi-conducteur de puissance (5) venant à reposer directement ou indirectement sur la première surface principale (100) de la couche de couverture, et le film de couverture (30) recouvrant directement et/ou indirectement les autres côtés du module semi-conducteur de puissance (5), en reposant au moins partiellement contre le corps moulé en matière plastique (80),
dans lequel l'emballage de transport (2) comporte une couche intercalaire (20) additionnelle avec un évidement (230) associé à l'au moins un module semi-conducteur de puissance (5), ladite couche intercalaire étant disposée par sa deuxième surface principale (210) sur la première surface principale (100) de la couche de couverture (10), et le module semi-conducteur de puissance (5) étant disposé dans l'au moins un évidement (230) de la couche intercalaire (20),
dans lequel la couche de couverture (10) et la couche intercalaire (20) sont liées de manière amovible l'une à l'autre, et
dans lequel le film de couverture (30) est lié de manière amovible à la première surface principale (100) de la couche de couverture (10) dans une zone intermédiaire (240) ménagée par l'évidement (230) respectif de la couche intercalaire (20) à côté du composant semi-conducteur de puissance (5). - Arrangement (1) selon la revendication 1, dans lequel :le corps moulé en matière plastique (80) présente au moins une surface de butée (82), par laquelle il repose directement contre le module semi-conducteur de puissance (5), et au moins une cavité (86) est prévue de manière contiguë entre le corps moulé en matière plastique (80) et le module semi-conducteur de puissance (5).
- Arrangement (1) selon la revendication 1 ou 2, dans lequel :le corps moulé en matière plastique (80) recouvre complètement un côté du module semi-conducteur de puissance (5) correspondant, et présente une paroi (84) reposant contre les côtés contigus du module semi-conducteur de puissance (5) et ne recouvrant que partiellement lesdits côtés contigus.
- Arrangement (1) selon la revendication 1, dans lequel :le film de couverture (30) et/ou le corps moulé en matière plastique (80) sont constitués d'une matière plastique conductrice ou à capacité de décharge électrostatique, avec ou sans surface extérieure métallisée.
- Arrangement (1) selon la revendication 1, dans lequel :le film de couverture (30) et/ou le corps moulé en matière plastique (80) sont au moins partiellement, de préférence entièrement, transparents.
- Arrangement (1) selon la revendication 1, dans lequel :le film de couverture (30) présente une épaisseur qui est inférieure d'au moins le facteur 5 à celle du corps moulé en matière plastique (80), celui-ci étant de ce fait réalisé plus robuste mécaniquement.
- Arrangement (1) selon la revendication 1 ou 7, dans lequel :la couche intercalaire (20) et/ou la couche de couverture (10) sont en carton, en carton gaufré ou en carton laminé.
- Arrangement (1) selon la revendication 1, dans lequel :pour une pluralité de modules semi-conducteur de puissance (5) agencés dans une matrice mono- ou bidimensionnelle, ceux-ci présentent dans au moins une dimension, parallèlement à la surface principale de la couche de couverture (10) et parallèlement à une normale de surface du boîtier (50), un espacement (700) entre eux qui est supérieur à la largeur (500) du boîtier (50) avec le corps moulé en matière plastique (80) disposé dans ladite dimension.
- Arrangement (1) selon la revendication 1, dans lequel :pour une pluralité de modules semi-conducteur de puissance (5) agencés dans une matrice mono- ou bidimensionnelle, l'emballage de transport (2) présente une perforation (70) entre les composants semi-conducteurs de puissance (5) respectifs.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102010005047.4A DE102010005047B4 (de) | 2010-01-20 | 2010-01-20 | Anordnung mit mindestens einem Leistungshalbleitermodul und mit einer Transportverpackung |
Publications (2)
Publication Number | Publication Date |
---|---|
EP2347970A1 EP2347970A1 (fr) | 2011-07-27 |
EP2347970B1 true EP2347970B1 (fr) | 2013-06-19 |
Family
ID=43902552
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP10192500.6A Active EP2347970B1 (fr) | 2010-01-20 | 2010-11-25 | Agencement doté d'au moins un module semi-conducteur de puissance et d'un emballage de transport |
Country Status (6)
Country | Link |
---|---|
US (1) | US8247892B2 (fr) |
EP (1) | EP2347970B1 (fr) |
JP (1) | JP5732261B2 (fr) |
KR (1) | KR20110085871A (fr) |
CN (1) | CN102145794B (fr) |
DE (1) | DE102010005047B4 (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11769701B2 (en) | 2020-02-27 | 2023-09-26 | Infineon Technologies Austria Ag | Protector cap for package with thermal interface material |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8541886B2 (en) * | 2010-03-09 | 2013-09-24 | Stats Chippac Ltd. | Integrated circuit packaging system with via and method of manufacture thereof |
DE102011114309B4 (de) * | 2011-09-23 | 2019-03-07 | Kartonveredlung Knapp GmbH | Anordnung mit mindestens einem zu verpackenden Gegenstand und einer Transportverpackung und Herstellungsverfahren hierzu |
ES2527006T3 (es) * | 2011-12-22 | 2015-01-19 | Renata Ag | Envase blíster múltiple para pilas de botón |
DE102013207043B4 (de) * | 2013-04-18 | 2020-02-27 | Infineon Technologies Ag | Halbleitermodulanordnung und Verfahren zur Montage eines Halbleitermoduls an einem Kühlkörper |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5088383U (fr) * | 1973-12-14 | 1975-07-26 | ||
GB1580791A (en) * | 1976-01-05 | 1980-12-03 | Gillette Co | Blister packs |
DE3530581A1 (de) * | 1984-08-28 | 1986-03-13 | Matsushita Electric Industrial Co., Ltd., Kadoma, Osaka | Traeger fuer elektronische chips |
JPS649175A (en) * | 1987-06-24 | 1989-01-12 | Dainippon Printing Co Ltd | Method for packaging precise processed electronic part such as lead frame |
DE3909898A1 (de) * | 1989-03-25 | 1990-09-27 | Semikron Elektronik Gmbh | Verpackungsbehaelter und zuschnitte zum herstellen eines solchen behaelters |
JP3010670B2 (ja) * | 1990-02-22 | 2000-02-21 | 松下電器産業株式会社 | 配線回路基板包装体、および、配線回路基板包装体からの配線回路基板取出し方法と装置 |
JPH0510283U (ja) * | 1991-07-18 | 1993-02-09 | 浦和ポリマー株式会社 | 電子部品の収納容器 |
DE9115696U1 (de) * | 1991-12-18 | 1992-03-05 | Hagner, Hans, 7295 Dornstetten | Skinverpackung |
JPH06270955A (ja) * | 1993-03-19 | 1994-09-27 | Fuji Seal Kogyo Kk | 包装体の製造方法及び包装用シート |
DE69633971T2 (de) * | 1995-09-13 | 2005-11-03 | Dai Nippon Printing Co., Ltd. | Verpackung |
JPH0977131A (ja) * | 1995-09-13 | 1997-03-25 | Dainippon Printing Co Ltd | 包装体およびその製造方法 |
ATE227232T1 (de) * | 1998-06-22 | 2002-11-15 | Hawera Probst Gmbh | Verkaufsverpackung |
JP3154985B2 (ja) * | 1999-03-17 | 2001-04-09 | 株式会社エスディーシィー | 物品収納兼包装ケース |
MY130407A (en) * | 2000-12-01 | 2007-06-29 | Texchem Pack M Sdn Bhd | Tray for storing semiconductor chips |
US6837374B2 (en) * | 2001-07-15 | 2005-01-04 | Entegris, Inc. | 300MM single stackable film frame carrier |
US7726481B2 (en) * | 2002-08-29 | 2010-06-01 | Colbert Packaging Corporation | Display chamber packaging container and method for making |
TWI237356B (en) * | 2002-11-04 | 2005-08-01 | Siliconware Precision Industries Co Ltd | Tray for ball grid array semiconductor packages |
US20090090653A1 (en) * | 2003-10-29 | 2009-04-09 | Valoris L Forsyth | Low cost wafer box improvements |
CN100505150C (zh) * | 2004-06-02 | 2009-06-24 | 伊利诺斯器械工程公司 | 用于集成电路芯片的可堆叠托盘 |
US7410060B2 (en) * | 2004-06-02 | 2008-08-12 | Illinois Tool Works Inc. | Stackable tray for integrated circuit chips |
JP4524153B2 (ja) * | 2004-08-10 | 2010-08-11 | 道昭 坂本 | 台紙並びに書籍の表紙 |
DE102005052798B4 (de) * | 2005-11-05 | 2007-12-13 | Semikron Elektronik Gmbh & Co. Kg | Anordnung mit Leistungshalbleitermodulen und mit Vorrichtung zu deren Positionierung sowie Verfahren zur Oberflächenbehandlung der Leistungshalbleitermodule |
DE102006020636B4 (de) * | 2006-05-04 | 2012-01-12 | Semikron Elektronik Gmbh & Co. Kg | Transport-/Verpackungsbehältnis für eine Mehrzahl elektronischer Bauelemente |
JP5632616B2 (ja) * | 2010-01-26 | 2014-11-26 | ラピスセミコンダクタ株式会社 | 半導体装置の製造方法及び基板収容構造 |
-
2010
- 2010-01-20 DE DE102010005047.4A patent/DE102010005047B4/de active Active
- 2010-11-25 EP EP10192500.6A patent/EP2347970B1/fr active Active
- 2010-12-29 KR KR1020100137810A patent/KR20110085871A/ko active IP Right Grant
-
2011
- 2011-01-14 JP JP2011005746A patent/JP5732261B2/ja not_active Expired - Fee Related
- 2011-01-20 CN CN201110025010.7A patent/CN102145794B/zh not_active Expired - Fee Related
- 2011-01-20 US US13/010,621 patent/US8247892B2/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11769701B2 (en) | 2020-02-27 | 2023-09-26 | Infineon Technologies Austria Ag | Protector cap for package with thermal interface material |
Also Published As
Publication number | Publication date |
---|---|
JP2011173654A (ja) | 2011-09-08 |
KR20110085871A (ko) | 2011-07-27 |
DE102010005047B4 (de) | 2014-10-23 |
EP2347970A1 (fr) | 2011-07-27 |
CN102145794A (zh) | 2011-08-10 |
JP5732261B2 (ja) | 2015-06-10 |
US8247892B2 (en) | 2012-08-21 |
CN102145794B (zh) | 2015-04-01 |
US20110180918A1 (en) | 2011-07-28 |
DE102010005047A1 (de) | 2011-07-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP2347970B1 (fr) | Agencement doté d'au moins un module semi-conducteur de puissance et d'un emballage de transport | |
EP2348804B1 (fr) | Agencement doté d'au moins un module semi-conducteur de puissance et d'un emballage de transport | |
DE102011109306B4 (de) | Modulares Plattenträgerkonzept zum Anbringen und eingebetteten Kühlen von Beutelzellenbatterieanordnungen | |
WO2007008920A3 (fr) | Condensateurs a cristal liquide a haute energie massique et couche mince a faible volume | |
WO2010115490A1 (fr) | Dispositif accumulateur d'énergie électrique présentant des cellules plates et des corps de refroidissement | |
DE112016006606B4 (de) | Leistungsspeichervorrichtungspack | |
ATE263720T1 (de) | Einzeldosisblisterverpackung mit schlüssellochöffnung | |
EP2413397A1 (fr) | Dispositif de réception d'un élément galvanique, unité d'accumulateur d'énergie et empilement d'accumulateurs d'énergie | |
CN103189280A (zh) | 用于携带物品的儿童防护盒子和坯件 | |
EP2574569A2 (fr) | Emballage pour pralines | |
EP2573006B1 (fr) | Agencement avec au moins un objet à emballer et un emballage de transport et procédé de fabrication à cet effet | |
DE102014005520B4 (de) | Laserverpackung | |
DE112009004797B9 (de) | Verpackungseinrichtung eines leistungshalbleiterbauteils | |
DE102006020636B4 (de) | Transport-/Verpackungsbehältnis für eine Mehrzahl elektronischer Bauelemente | |
DE102013213551A1 (de) | Aufnahmevorrichtung, Batterie und Kraftfahrzeug | |
US20200187375A1 (en) | Implantable medical device having an improved architecture | |
WO2008000551A2 (fr) | Dissipateur de chaleur | |
DE102013008588A1 (de) | Aufnahmegehäuse für elektrische Energiespeicher | |
BRPI0411075A (pt) | embalagem com conjunto de circuito eletrÈnico e método de monitorar a remoção de um item de um receptáculo | |
ITMI20070830A1 (it) | Contenitore per detonatori | |
DE102009023074A1 (de) | Tiefziehpackung |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
17P | Request for examination filed |
Effective date: 20110518 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR |
|
AX | Request for extension of the european patent |
Extension state: BA ME |
|
RIC1 | Information provided on ipc code assigned before grant |
Ipc: B65D 75/36 20060101ALI20121022BHEP Ipc: B65D 75/32 20060101AFI20121022BHEP |
|
GRAP | Despatch of communication of intention to grant a patent |
Free format text: ORIGINAL CODE: EPIDOSNIGR1 |
|
GRAS | Grant fee paid |
Free format text: ORIGINAL CODE: EPIDOSNIGR3 |
|
GRAA | (expected) grant |
Free format text: ORIGINAL CODE: 0009210 |
|
AK | Designated contracting states |
Kind code of ref document: B1 Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR |
|
REG | Reference to a national code |
Ref country code: GB Ref legal event code: FG4D Free format text: NOT ENGLISH |
|
REG | Reference to a national code |
Ref country code: CH Ref legal event code: EP |
|
REG | Reference to a national code |
Ref country code: AT Ref legal event code: REF Ref document number: 617514 Country of ref document: AT Kind code of ref document: T Effective date: 20130715 |
|
REG | Reference to a national code |
Ref country code: IE Ref legal event code: FG4D Free format text: LANGUAGE OF EP DOCUMENT: GERMAN |
|
REG | Reference to a national code |
Ref country code: DE Ref legal event code: R096 Ref document number: 502010003704 Country of ref document: DE Effective date: 20130814 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: NO Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20130919 Ref country code: SI Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20130619 Ref country code: LT Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20130619 Ref country code: ES Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20130930 Ref country code: GR Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20130920 Ref country code: SE Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20130619 Ref country code: FI Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20130619 |
|
REG | Reference to a national code |
Ref country code: SK Ref legal event code: T3 Ref document number: E 14714 Country of ref document: SK |
|
REG | Reference to a national code |
Ref country code: LT Ref legal event code: MG4D |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: BG Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20130919 Ref country code: HR Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20130619 Ref country code: RS Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20130619 |
|
REG | Reference to a national code |
Ref country code: NL Ref legal event code: VDEP Effective date: 20130619 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: LV Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20130619 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: IS Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20131019 Ref country code: EE Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20130619 Ref country code: CY Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20130626 Ref country code: CZ Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20130619 Ref country code: PT Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20131021 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: NL Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20130619 Ref country code: RO Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20130619 Ref country code: PL Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20130619 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: CY Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20130619 |
|
PLBE | No opposition filed within time limit |
Free format text: ORIGINAL CODE: 0009261 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: DK Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20130619 |
|
26N | No opposition filed |
Effective date: 20140320 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: IT Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20130619 |
|
BERE | Be: lapsed |
Owner name: SEMIKRON ELEKTRONIK G.M.B.H. & CO. KG Effective date: 20131130 |
|
REG | Reference to a national code |
Ref country code: DE Ref legal event code: R097 Ref document number: 502010003704 Country of ref document: DE Effective date: 20140320 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: MC Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20130619 |
|
REG | Reference to a national code |
Ref country code: IE Ref legal event code: MM4A |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: BE Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20131130 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: IE Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20131125 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: SM Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20130619 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: TR Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20130619 |
|
REG | Reference to a national code |
Ref country code: CH Ref legal event code: PL |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: MK Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20130619 Ref country code: LU Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20131125 Ref country code: LI Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20141130 Ref country code: CH Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20141130 Ref country code: HU Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT; INVALID AB INITIO Effective date: 20101125 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: MT Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20130619 |
|
REG | Reference to a national code |
Ref country code: FR Ref legal event code: PLFP Year of fee payment: 6 |
|
REG | Reference to a national code |
Ref country code: FR Ref legal event code: PLFP Year of fee payment: 7 |
|
REG | Reference to a national code |
Ref country code: AT Ref legal event code: MM01 Ref document number: 617514 Country of ref document: AT Kind code of ref document: T Effective date: 20151125 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: AT Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20151125 |
|
REG | Reference to a national code |
Ref country code: FR Ref legal event code: PLFP Year of fee payment: 8 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: AL Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20130619 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: IE Payment date: 20181220 Year of fee payment: 15 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: FR Payment date: 20181127 Year of fee payment: 9 Ref country code: GB Payment date: 20181126 Year of fee payment: 9 |
|
REG | Reference to a national code |
Ref country code: DE Ref legal event code: R084 Ref document number: 502010003704 Country of ref document: DE |
|
REG | Reference to a national code |
Ref country code: SK Ref legal event code: MM4A Ref document number: E 14714 Country of ref document: SK Effective date: 20191125 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: SK Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20191125 |
|
GBPC | Gb: european patent ceased through non-payment of renewal fee |
Effective date: 20191125 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: FR Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20191130 Ref country code: GB Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20191125 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: DE Payment date: 20231130 Year of fee payment: 14 |