JPS649175A - Method for packaging precise processed electronic part such as lead frame - Google Patents
Method for packaging precise processed electronic part such as lead frameInfo
- Publication number
- JPS649175A JPS649175A JP62157441A JP15744187A JPS649175A JP S649175 A JPS649175 A JP S649175A JP 62157441 A JP62157441 A JP 62157441A JP 15744187 A JP15744187 A JP 15744187A JP S649175 A JPS649175 A JP S649175A
- Authority
- JP
- Japan
- Prior art keywords
- film
- packaged
- articles
- air cap
- cover
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Packages (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
PURPOSE:To package diversified precise processed electronic part in a hermetically sealed state, by mounting an integrated body on the plastic film of a substrate on the side of an air cap to cover the same with the plastic film and degassing the air in the plastic film to perform skin packaging. CONSTITUTION:An air cap film (d) having an air cap 4 is mounted on a base plate (e) and articles (c) to be packaged, which are stacked in such a state that spacers b1, b2 are brought into contact with the upper and lower surfaces of the integrated body (a) of lead frames 1, is mounted on the air cap film (d). A cover film (f) is placed on the articles (c) to be packaged both sides thereof are grasped by a support member to heat the film (f) and, when the film is softened to a certain degree, a support member is allowed to fall to cover the articles C to be packaged with said film. In this state, the air between the articles (c) to be packaged and the cover film (f) is removed from the gap part 7 between a skirt part 6 and the film (d). Subsequently, four peripheries of the film (d) is cut at the position of the air cap 4 and welded under heating as shown by a numeral 8 to finish skin packaging.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62157441A JPS649175A (en) | 1987-06-24 | 1987-06-24 | Method for packaging precise processed electronic part such as lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62157441A JPS649175A (en) | 1987-06-24 | 1987-06-24 | Method for packaging precise processed electronic part such as lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS649175A true JPS649175A (en) | 1989-01-12 |
Family
ID=15649719
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62157441A Pending JPS649175A (en) | 1987-06-24 | 1987-06-24 | Method for packaging precise processed electronic part such as lead frame |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS649175A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02242758A (en) * | 1989-03-10 | 1990-09-27 | Hitachi Cable Ltd | Packaging of a number of stacked lead frames |
| US5141071A (en) * | 1990-03-13 | 1992-08-25 | Mazda Motor Corporation | Four-wheel-steered vehicle control system |
| JP2011173654A (en) * | 2010-01-20 | 2011-09-08 | Semikron Elektronik Gmbh & Co Kg | Arrangement device comprising at least one power semiconductor module and transport packaging |
-
1987
- 1987-06-24 JP JP62157441A patent/JPS649175A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02242758A (en) * | 1989-03-10 | 1990-09-27 | Hitachi Cable Ltd | Packaging of a number of stacked lead frames |
| US5141071A (en) * | 1990-03-13 | 1992-08-25 | Mazda Motor Corporation | Four-wheel-steered vehicle control system |
| JP2011173654A (en) * | 2010-01-20 | 2011-09-08 | Semikron Elektronik Gmbh & Co Kg | Arrangement device comprising at least one power semiconductor module and transport packaging |
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