JPS5591142A - Package forming of semiconductors - Google Patents
Package forming of semiconductorsInfo
- Publication number
- JPS5591142A JPS5591142A JP16475178A JP16475178A JPS5591142A JP S5591142 A JPS5591142 A JP S5591142A JP 16475178 A JP16475178 A JP 16475178A JP 16475178 A JP16475178 A JP 16475178A JP S5591142 A JPS5591142 A JP S5591142A
- Authority
- JP
- Japan
- Prior art keywords
- clearance
- lead
- thermoplastic resin
- frame
- resin sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE: To ensure a sealing with a higher airtightness by penetrating resin melted into the lead clearance of the frame through ultrasonic vibration given upon upper and lower thermoplastic resin sheets each having a recess on the bottom and the top with the lead frame carrying semiconductors placed between the resin sheets.
CONSTITUTION: A semiconductor is carried on a tub 1 of a lead frame having leads 4 parallelly arranged through a lead clearance. The frame 5 is placed between an upper thermoplastic resin sheet 13 having a recess on the bottom and a lower thermoplastic resin sheet 13' both made of polyphenylene oxide and polyethylene terephthalate etc. Prior to this, a small projection is provided on one resin sheet to be inserted into the clearance. Then, the assembly is placed on a fixed base 14. An ultrasonic vibrating tool horn 15 is mounted on the top of the assembly to provide an ultrasonic vibration so that the resin is melted and infiltrated into the clearance 16. With such an arrangement, is is possible to obtain a package excellent in the airtightness thereby improving the reliability.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16475178A JPS5591142A (en) | 1978-12-28 | 1978-12-28 | Package forming of semiconductors |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16475178A JPS5591142A (en) | 1978-12-28 | 1978-12-28 | Package forming of semiconductors |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5591142A true JPS5591142A (en) | 1980-07-10 |
Family
ID=15799217
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16475178A Pending JPS5591142A (en) | 1978-12-28 | 1978-12-28 | Package forming of semiconductors |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5591142A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63299368A (en) * | 1987-05-29 | 1988-12-06 | Sony Corp | Manufacture of semiconductor element housing package |
-
1978
- 1978-12-28 JP JP16475178A patent/JPS5591142A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63299368A (en) * | 1987-05-29 | 1988-12-06 | Sony Corp | Manufacture of semiconductor element housing package |
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