JPS5591142A - Package forming of semiconductors - Google Patents

Package forming of semiconductors

Info

Publication number
JPS5591142A
JPS5591142A JP16475178A JP16475178A JPS5591142A JP S5591142 A JPS5591142 A JP S5591142A JP 16475178 A JP16475178 A JP 16475178A JP 16475178 A JP16475178 A JP 16475178A JP S5591142 A JPS5591142 A JP S5591142A
Authority
JP
Japan
Prior art keywords
clearance
lead
thermoplastic resin
frame
resin sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16475178A
Other languages
Japanese (ja)
Inventor
Keiji Hazama
Isao Maeda
Shinichi Oota
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co Ltd
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP16475178A priority Critical patent/JPS5591142A/en
Publication of JPS5591142A publication Critical patent/JPS5591142A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To ensure a sealing with a higher airtightness by penetrating resin melted into the lead clearance of the frame through ultrasonic vibration given upon upper and lower thermoplastic resin sheets each having a recess on the bottom and the top with the lead frame carrying semiconductors placed between the resin sheets.
CONSTITUTION: A semiconductor is carried on a tub 1 of a lead frame having leads 4 parallelly arranged through a lead clearance. The frame 5 is placed between an upper thermoplastic resin sheet 13 having a recess on the bottom and a lower thermoplastic resin sheet 13' both made of polyphenylene oxide and polyethylene terephthalate etc. Prior to this, a small projection is provided on one resin sheet to be inserted into the clearance. Then, the assembly is placed on a fixed base 14. An ultrasonic vibrating tool horn 15 is mounted on the top of the assembly to provide an ultrasonic vibration so that the resin is melted and infiltrated into the clearance 16. With such an arrangement, is is possible to obtain a package excellent in the airtightness thereby improving the reliability.
COPYRIGHT: (C)1980,JPO&Japio
JP16475178A 1978-12-28 1978-12-28 Package forming of semiconductors Pending JPS5591142A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16475178A JPS5591142A (en) 1978-12-28 1978-12-28 Package forming of semiconductors

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16475178A JPS5591142A (en) 1978-12-28 1978-12-28 Package forming of semiconductors

Publications (1)

Publication Number Publication Date
JPS5591142A true JPS5591142A (en) 1980-07-10

Family

ID=15799217

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16475178A Pending JPS5591142A (en) 1978-12-28 1978-12-28 Package forming of semiconductors

Country Status (1)

Country Link
JP (1) JPS5591142A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63299368A (en) * 1987-05-29 1988-12-06 Sony Corp Manufacture of semiconductor element housing package

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63299368A (en) * 1987-05-29 1988-12-06 Sony Corp Manufacture of semiconductor element housing package

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