EP2348804B1 - Agencement doté d'au moins un module semi-conducteur de puissance et d'un emballage de transport - Google Patents

Agencement doté d'au moins un module semi-conducteur de puissance et d'un emballage de transport Download PDF

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Publication number
EP2348804B1
EP2348804B1 EP10192495.9A EP10192495A EP2348804B1 EP 2348804 B1 EP2348804 B1 EP 2348804B1 EP 10192495 A EP10192495 A EP 10192495A EP 2348804 B1 EP2348804 B1 EP 2348804B1
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EP
European Patent Office
Prior art keywords
power semiconductor
arrangement
intermediate layer
cover
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP10192495.9A
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German (de)
English (en)
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EP2348804A1 (fr
Inventor
Stefan Starovecky
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semikron GmbH and Co KG
Semikron Elektronik GmbH and Co KG
Original Assignee
Semikron GmbH and Co KG
Semikron Elektronik GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Semikron GmbH and Co KG, Semikron Elektronik GmbH and Co KG filed Critical Semikron GmbH and Co KG
Publication of EP2348804A1 publication Critical patent/EP2348804A1/fr
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Publication of EP2348804B1 publication Critical patent/EP2348804B1/fr
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D75/00—Packages comprising articles or materials partially or wholly enclosed in strips, sheets, blanks, tubes, or webs of flexible sheet material, e.g. in folded wrappers
    • B65D75/28—Articles or materials wholly enclosed in composite wrappers, i.e. wrappers formed by associating or interconnecting two or more sheets or blanks
    • B65D75/30—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding
    • B65D75/32—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding one or both sheets or blanks being recessed to accommodate contents
    • B65D75/325—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding one or both sheets or blanks being recessed to accommodate contents one sheet being recessed, and the other being a flat not- rigid sheet, e.g. puncturable or peelable foil
    • B65D75/327—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding one or both sheets or blanks being recessed to accommodate contents one sheet being recessed, and the other being a flat not- rigid sheet, e.g. puncturable or peelable foil and forming several compartments
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D75/00—Packages comprising articles or materials partially or wholly enclosed in strips, sheets, blanks, tubes, or webs of flexible sheet material, e.g. in folded wrappers
    • B65D75/28—Articles or materials wholly enclosed in composite wrappers, i.e. wrappers formed by associating or interconnecting two or more sheets or blanks
    • B65D75/30—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding
    • B65D75/32—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding one or both sheets or blanks being recessed to accommodate contents
    • B65D75/36—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding one or both sheets or blanks being recessed to accommodate contents one sheet or blank being recessed and the other formed of relatively stiff flat sheet material, e.g. blister packages, the recess or recesses being preformed
    • B65D75/367—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding one or both sheets or blanks being recessed to accommodate contents one sheet or blank being recessed and the other formed of relatively stiff flat sheet material, e.g. blister packages, the recess or recesses being preformed and forming several compartments
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D81/00—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
    • B65D81/02—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
    • B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D2575/00—Packages comprising articles or materials partially or wholly enclosed in strips, sheets, blanks, tubes or webs of flexible sheet material, e.g. in folded wrappers
    • B65D2575/28—Articles or materials wholly enclosed in composite wrappers, i.e. wrappers formed by association or interconnecting two or more sheets or blanks
    • B65D2575/30—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding
    • B65D2575/32—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding one or both sheets or blanks being recessed to accommodate contents
    • B65D2575/3209—Details
    • B65D2575/3218—Details with special means for gaining access to the contents
    • B65D2575/3245—Details with special means for gaining access to the contents by peeling off the non-rigid sheet
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D2585/00—Containers, packaging elements or packages specially adapted for particular articles or materials
    • B65D2585/68—Containers, packaging elements or packages specially adapted for particular articles or materials for machines, engines, or vehicles in assembled or dismantled form
    • B65D2585/86—Containers, packaging elements or packages specially adapted for particular articles or materials for machines, engines, or vehicles in assembled or dismantled form for electrical components

Definitions

  • the invention describes an arrangement for mostly au ßer istlichen transport of at least one power semiconductor module.
  • a plurality of power semiconductor modules is preferably to be arranged in a one- or two-dimensional matrix in a transport packaging.
  • Simple cardboard boxes for example, according to DE 39 09 898 A1
  • a further disadvantage is that such packaging must be opened by way of example for tests under a customs procedure and thus the power semiconductor modules can be touched directly, which may possibly lead to damage due to electrostatic discharge or due to contact with sensitive surfaces, for example silver-coated connection elements.
  • the so-called Skin- packaging as exemplified by the DE 199 28 368 A1 are known, form a starting point of this invention and are a combination of a carton with the plastic film enclosing the goods to be packaged.
  • Such packages are known to have the significant disadvantage that they are not accessible to a simple operation of opening and removing the packaged Guts.
  • the invention has for its object to provide an arrangement with at least one power semiconductor module and a transport packaging, which is sufficiently robust at least in combination with another outer packaging against occurring during transport mechanical effects, and in principle the protection against electrostatic discharge as well as a legibility of the label mounted at least one power semiconductor module without opening the transport packaging is accessible, further, a removal of the power semiconductor module from the transport packaging should be possible easily and without tools.
  • the inventive idea is based on the above-mentioned skin packaging.
  • This is developed into an arrangement with at least one power semiconductor module.
  • this arrangement has at least one power semiconductor module, but preferably a plurality of power semiconductor modules arranged in a one- or two-dimensional matrix, and a transport packaging.
  • the power semiconductor module has a base element, preferably a metallic base plate, a housing made of an insulating material, and connecting elements for external contacting of the power semiconductor components which are internally insulated from the base plate.
  • a base element preferably a metallic base plate
  • a housing made of an insulating material
  • connecting elements for external contacting of the power semiconductor components which are internally insulated from the base plate.
  • the transport packaging of the arrangement according to the invention in turn has a cover layer, an intermediate layer with in each case one of the at least one power semiconductor module associated recesses and a cover sheet.
  • The, preferably formed as a dissipative in its entirety composite cardboard, top layer is flat and thus forms the basis of the transport packaging.
  • the at least one power semiconductor module is arranged on a first main surface of this cover layer, preferably by its bottom element coming to rest on the first main surface of the cover layer.
  • the intermediate layer is likewise arranged on this first main surface of the cover layer, wherein an associated power semiconductor module is arranged in its respective recess and, of course, projects beyond this intermediate layer in the direction of its first main surface.
  • an associated power semiconductor module is arranged in its respective recess and, of course, projects beyond this intermediate layer in the direction of its first main surface.
  • the edge of the recess of the intermediate layer abuts only a maximum of 50%, preferably only a maximum of 25%, directly on the associated power semiconductor module and the remaining part of the edge has a distance from the power semiconductor module.
  • the connection of the first main surface of the cover layer with the second main surface of the intermediate layer is formed as a releasable connection, preferably as a releasable adhesive connection.
  • the cover film covers substantial parts of the power semiconductor module and in this case lies largely against the housing and the parts not to be located on the first main surface of the cover layer, such as, for example, the connection elements of the power semiconductor module.
  • the cover film is preferably adhesively bonded to the first main surface of the intermediate layer.
  • the cover layer and the intermediate layer have a releasable connection with a lower adhesive force than that connection of the intermediate layers and the cover film, since the cover layer is to be separated from the intermediate layer for removal of the power semiconductor module.
  • the cover sheet consists of a conductive or dissipative plastic film with or without metal-coated outer surface. It is equally advantageous to form the cover film at least in sections, but preferably completely, transparently.
  • a further preferred embodiment results if, in a plurality of power semiconductor modules arranged in a one-dimensional or two-dimensional matrix, they have a distance apart from one another in at least one dimension parallel to the main surface of the cover layer and parallel to a surface normal of the housing which is greater than the width of the housing this dimension.
  • Fig. 1 shows a three-dimensional representation of two inventive arrangements.
  • Fig. 2 shows a section through an inventive arrangement.
  • Fig. 1 shows a three-dimensional representation of two inventive arrangements (1, 1 '), each with a transport packaging (2) and a plurality of power semiconductor modules (5).
  • the housing (50) and a plurality of connecting elements (60) is shown.
  • the bottom element (40, cf. Fig. 2 ) here a metallic base plate, these power semiconductor modules (5) in a two-dimensional matrix on the first main surface (100) of the cover layer (10) of the respective transport packaging (2) are arranged by the bottom element (40, see FIG. Fig. 2 ) each directly on top of it.
  • This intermediate layer (20) has a plurality of recesses (230) which are each associated with a power semiconductor module (5).
  • the power semiconductor module (5) is arranged in this recess (230) such that the edge (220) of the recess (230) rests directly on the housing (50) of the power semiconductor module (5) only at a few sections.
  • a gap is provided between the housing (50) of the power semiconductor module (5) and the edge (220) of the recess (230), which forms an intermediate region (240).
  • the transparent cover film (30) of the transport packaging (30) itself, which encloses the power semiconductor modules (5) with the exception of their bottom element (40) and which is adhesively bonded to the second main surface (210) of the intermediate layer (20).
  • the transport packaging (2) shown here in the second arrangement (1 ') between the respective power semiconductor components (5 ) has a perforation (70), cf. also Fig. 2 in order to simplify the singulation of the packaged power semiconductor modules (5).
  • Fig. 2 shows a detail of a section along the line AA by an inventive arrangement (1) according to Fig. 1 , Shown here is the cover layer (10) of the transport packaging (2) with its first (100) and second main surface (110). On the first main surface (100) of the cover layer (10), the power semiconductor module (5) to be packaged are arranged in a matrix-like manner at the same distance from each other. From the to Packing power semiconductor modules (5), only a bottom element (40), a housing (50) and a connection element (60) are shown.
  • connection elements (60) lie on the side of the power semiconductor module (5) opposite the cover layer (10).
  • the intermediate layer (20) whose second main surface (210) has a detachable connection with the first main surface (100) of the cover layer (10).
  • the intermediate layer (20) as well as the cover layer (10) consists of cardboard or cardboard or composite cardboard. It has proved to be particularly advantageous for protection against electrostatic discharge, the intermediate layer (20) and, but preferably only, the cover layer (10) of conductive or dissipative composite board provided. This then has, by way of example, a conductive or dissipative film interlayer.
  • the intermediate layer (20) furthermore has recesses (230), whereby the associated power semiconductor module (5) comprises in its lower region but is not enclosed directly and completely adjacent.
  • the edge (220) of the recess (230) to a maximum of 50%, preferably only to a maximum of 25%, directly applied to the associated power semiconductor module (5) and the remaining part of the Edge (220) has a distance of at least 2mm to the power semiconductor module (5) and thus forms an intermediate region (240).
  • a direct concern is at least in some places, preferably in the corners of the power semiconductor module (5), cf. Fig. 1 , necessary so that the fixation of the power semiconductor module (5) is ensured in their position to each other.
  • the cover film (30) is shown here only for the sake of clarity, at a distance from the cover (10) or the intermediate layer (20) and also at a distance from the power semiconductor modules (5).
  • the cover film (30) is adhesively bonded to the first main surface (200) of the intermediate layer (20).
  • a connection to the first major surface (100) of the topsheet (10) is also in the intermediate region (240) described above, especially in heavy ones Power semiconductor modules (5), displayed. This connection can be provided as an alternative or in addition to that releasable connection of the cover layer (10) with the intermediate layer (20).
  • the cover sheet (30) as far as its flexibility allows, abuts against the power semiconductor modules (5) and encloses them in each case toward the cover layer (10).
  • Typical dimensions for such power semiconductor modules (5) are, without limitation, a length in the range of 3cm to 15cm with a width (500) and height of 1cm to 6cm.
  • the cover layer (10) of the transport packaging (2) has a typical thickness of 0.2 mm to 1 mm, the intermediate layer (20) has a thickness of 0.5 to 3 mm, while the cover film (30) has a thickness of the order of 100 ⁇ m having.
  • cover film (30) of a conductive or dissipative plastic film with or without metallbedampfter outer surface and the cover layer (10) of a conductive or conductive composite cardboard creates a transport packaging (2), which provides adequate protection against electrostatic charge. Since the cover film (30) is formed at least in sections, but preferably completely, transparently, it is not necessary for various control purposes to open this protective packaging.
  • the inventive arrangement (1) according to Fig. 2 is further configured such that the distance (700) of the power semiconductor modules (5) to each other is greater than the width (500) of a power semiconductor module (5), whereby it is possible a second dotted arrangement (1 ') offset by half the distance to first arrangement (1) and rotated by 180 °, see. Fig. 1 , resulting in a compact overall arrangement with high packing density with simultaneous sufficient fixation of the individual power semiconductor modules (5) to each other.
  • FIG. 3 and 4 shows a further section along the line BB by an inventive arrangement (1) according to Fig. 1 wherein a particular advantage of the arrangement becomes apparent.
  • Fig. 3 again shows a power semiconductor module (5) and a part of the transport packaging (2).
  • the cover layer (10) is shown partially separated from the intermediate layer (20).
  • This representation corresponds to the opening of the transport packaging (2) to remove a power semiconductor module (5) from this.
  • the detachable connection between the cover layer (10) and the intermediate layer (20) and / or that between the cover layer (10) and the cover film (30) in the intermediate region (240) is separated.
  • the releasable connection between the cover layer (10) and the intermediate layer (20) has a lower adhesive force than the connection of the intermediate layers (20) and the cover film (30).
  • the cover layer (10) is thinner and thus mechanically less rigid than the intermediate layer (20), since thus the intermediate layer remains virtually as a holder frame of the rest of the transport packaging (2).
  • Fig. 4 now shows a further step of removing a power semiconductor module (5) from the transport packaging (2).
  • the intermediate layer (20) was pressed in the direction of the surface normal of its first major surface (200) until the intermediate layer (20) lies approximately on the plane formed by the upper side of the housing (50).
  • the cover film (30) at least partially detached from the housing (50) of the power semiconductor module (5), whereby this can be easily removed without the use of tools from the transport packaging (2).

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Composite Materials (AREA)
  • Packaging Frangible Articles (AREA)
  • Packages (AREA)

Claims (12)

  1. Dispositif (1) avec une pluralité de modules semi-conducteur de puissance (5) agencés dans une matrice mono-, bi- ou tridimensionnelle et un emballage de transport (2), chaque module semi-conducteur de puissance (5) comportant un élément de base (40), un boîtier (50) et des éléments de connexion (60),
    l'emballage de transport (2) comportant une couche de couverture (10), une couche intercalaire (20) avec un évidement (230) associé au module semi-conducteur de puissance (5) correspondant, et un film de couverture (30), et
    la couche de couverture (10) étant prévue plate, avec une première surface principale (100) opposée aux modules semi-conducteurs de puissance (5) à disposer, la couche intercalaire (20) étant disposée par sa deuxième surface principale (210) sur ladite première surface principale (100) de la couche de couverture (10), et le module semi-conducteur de puissance (5) associé à l'évidement (230) de la couche intercalaire (20) étant disposé dans ledit évidement sur la première surface principale (100) de la couche de couverture (10), et venant ainsi à reposer sur ladite première surface principale (100) de la couche de couverture (10), le film de couverture (30) recouvrant des parties essentielles des modules semi-conducteurs de puissance (5), en reposant largement contre le boîtier (50), le film de couverture (30) étant lié à la première surface principale (200) de la couche intercalaire (20), et la couche de couverture (10) et la couche intercalaire (20) étant liées de manière amovible l'une à l'autre.
  2. Dispositif (1) selon la revendication 1, dans lequel :
    le film de couverture (30) est lié de manière amovible à la première surface principale (100) de la couche de couverture (10) dans une zone intermédiaire (240) ménagée par l'évidement (230) respectif de la couche intercalaire (20) à côté du composant semi-conducteur de puissance.
  3. Dispositif (1) selon la revendication 1, dans lequel :
    les modules semi-conducteur de puissance (5) présentent dans au moins une dimension, parallèlement à la surface principale de la couche de couverture (10) et parallèlement à une normale de surface du boîtier (50), un espacement (700) entre eux qui est supérieur à la largeur (500) du boîtier (50) dans ladite dimension.
  4. Dispositif (1) selon la revendication 1, dans lequel :
    l'emballage de transport (2) présente une perforation (70) entre les composants semi-conducteurs de puissance (5) respectifs.
  5. Dispositif (1) selon la revendication 1, dans lequel :
    le film de couverture (30) est constitué d'un film en matière plastique, conducteur ou à capacité de décharge électrostatique, avec ou sans surface extérieure métallisée.
  6. Dispositif (1) selon la revendication 1, dans lequel :
    le film de couverture (30) est au moins partiellement, de préférence entièrement, transparent.
  7. Dispositif (1) selon la revendication 1, dans lequel :
    la couche intercalaire (20) et/ou la couche de couverture (10) sont en carton, en carton gaufré ou en carton laminé.
  8. Dispositif (1) selon la revendication 1, dans lequel :
    la couche intercalaire (20) et/ou la couche de couverture (10) sont constituées de préférence d'une couche de film intercalaire, conductrice ou à capacité de décharge électrostatique, d'un carton laminé.
  9. Dispositif (1) selon la revendication 1, dans lequel :
    la liaison amovible entre la couche de couverture (10) et la couche intercalaire (20) présente une force d'adhérence inférieure à la liaison entre les couches intercalaires (20) et le film de couverture (30).
  10. Dispositif (1) selon la revendication 1, dans lequel :
    le bord (220) de l'évidement (230) repose directement contre le module semi-conducteur de puissance (5) correspondant à raison de 50 % au maximum, de préférence de 25 % au maximum, et où la partie restante du bord est espacée d'au moins 2 mm du module semi-conducteur de puissance (5).
  11. Dispositif (1) selon la revendication 1, dans lequel :
    la couche de couverture (10) est prévue plus mince et donc mécaniquement moins rigide que la couche intercalaire (20).
  12. Dispositif (1) selon la revendication 1, dans lequel :
    la couche de couverture (10) présente une épaisseur comprise entre 0,2 mm et 1 mm et la couche intercalaire (20) présente une épaisseur comprise entre 0,5 et 3 mm.
EP10192495.9A 2010-01-20 2010-11-25 Agencement doté d'au moins un module semi-conducteur de puissance et d'un emballage de transport Active EP2348804B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102010005048A DE102010005048A1 (de) 2010-01-20 2010-01-20 Anordnung mit mindestens einem Leistungshalbleitermodul und mit einer Transportverpackung

Publications (2)

Publication Number Publication Date
EP2348804A1 EP2348804A1 (fr) 2011-07-27
EP2348804B1 true EP2348804B1 (fr) 2013-06-19

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Application Number Title Priority Date Filing Date
EP10192495.9A Active EP2348804B1 (fr) 2010-01-20 2010-11-25 Agencement doté d'au moins un module semi-conducteur de puissance et d'un emballage de transport

Country Status (6)

Country Link
US (1) US8405195B2 (fr)
EP (1) EP2348804B1 (fr)
JP (1) JP5732260B2 (fr)
KR (1) KR101784518B1 (fr)
CN (1) CN102145795B (fr)
DE (1) DE102010005048A1 (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011114309B4 (de) 2011-09-23 2019-03-07 Kartonveredlung Knapp GmbH Anordnung mit mindestens einem zu verpackenden Gegenstand und einer Transportverpackung und Herstellungsverfahren hierzu
JP5831626B2 (ja) 2012-03-28 2015-12-09 富士電機株式会社 半導体装置及び半導体装置の製造方法
WO2013145620A1 (fr) * 2012-03-28 2013-10-03 富士電機株式会社 Dispositif à semi-conducteur
EP2833405A4 (fr) 2012-03-28 2016-01-13 Fuji Electric Co Ltd Dispositif à semi-conducteurs, et procédé de fabrication de celui-ci
JP6171586B2 (ja) 2013-06-04 2017-08-02 富士電機株式会社 半導体装置
CN109835612B (zh) * 2017-11-24 2020-08-21 泉州利昌新材料科技有限公司 一种包装结构和包装方法

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3465874A (en) * 1967-06-12 1969-09-09 Frances Hugle Carrier for semiconductor devices
JPS5088383U (fr) * 1973-12-14 1975-07-26
GB2040569B (en) * 1978-12-26 1983-09-01 Murata Manufacturing Co Chip-like electronic component series and method for supplying chip-like electronic components
US4353373A (en) * 1980-04-17 1982-10-12 Ferris Manufacturing Corp. EKG Electrode and package
US4654693A (en) * 1984-08-28 1987-03-31 Matsushita Electric Industrial Co., Ltd. Electronic parts carrier with a chip-supporting top tape
DE3909898A1 (de) 1989-03-25 1990-09-27 Semikron Elektronik Gmbh Verpackungsbehaelter und zuschnitte zum herstellen eines solchen behaelters
US5091229A (en) * 1989-10-13 1992-02-25 E. I. Du Pont De Nemours And Company Electronics protective packaging film
US5234105A (en) * 1990-02-22 1993-08-10 Matsushita Electric Industrial Co., Ltd. Packages for circuit boards for preventing oxidation thereof
JP3010670B2 (ja) * 1990-02-22 2000-02-21 松下電器産業株式会社 配線回路基板包装体、および、配線回路基板包装体からの配線回路基板取出し方法と装置
JPH06270955A (ja) * 1993-03-19 1994-09-27 Fuji Seal Kogyo Kk 包装体の製造方法及び包装用シート
JPH0977131A (ja) * 1995-09-13 1997-03-25 Dainippon Printing Co Ltd 包装体およびその製造方法
EP0788979B1 (fr) * 1995-09-13 2004-12-01 Dai Nippon Printing Co., Ltd. Emballage
JPH09193307A (ja) * 1996-01-23 1997-07-29 Kureha Chem Ind Co Ltd 積層フィルム及び電子部品用包装袋
EP1089922B1 (fr) * 1998-06-22 2002-11-06 Hawera Probst GmbH Emballage de vente
JP3154985B2 (ja) * 1999-03-17 2001-04-09 株式会社エスディーシィー 物品収納兼包装ケース
CA2264339A1 (fr) * 1999-03-26 1999-05-26 Dispill Inc. Feuille etanche pelable et refermable pour contenants a pilules distincts
US20030019784A1 (en) * 2000-01-14 2003-01-30 Pylant John D. Apparatus and methods for improving uniform cover tape adhesion on a carrier tape
MY130407A (en) * 2000-12-01 2007-06-29 Texchem Pack M Sdn Bhd Tray for storing semiconductor chips
TW577852B (en) * 2001-01-22 2004-03-01 John D Pylant Apparatus and methods for improving uniform cover tape adhesion on a carrier tape
US20030001978A1 (en) * 2001-06-12 2003-01-02 Xsides Corporation Method and system for enhancing display functionality in a set-top box environment
CN2506566Y (zh) * 2001-10-25 2002-08-21 玮锋科技股份有限公司 电子元件的包装卷带
TWI237356B (en) * 2002-11-04 2005-08-01 Siliconware Precision Industries Co Ltd Tray for ball grid array semiconductor packages
US20090090653A1 (en) * 2003-10-29 2009-04-09 Valoris L Forsyth Low cost wafer box improvements
JP4299721B2 (ja) * 2003-12-09 2009-07-22 株式会社ルネサステクノロジ 半導体装置の搬送方法および半導体装置の製造方法
US7410060B2 (en) * 2004-06-02 2008-08-12 Illinois Tool Works Inc. Stackable tray for integrated circuit chips
JP4524153B2 (ja) 2004-08-10 2010-08-11 道昭 坂本 台紙並びに書籍の表紙
JP4777104B2 (ja) * 2006-03-16 2011-09-21 富士通セミコンダクター株式会社 半導体装置包装用カバーテープ及び半導体装置用包装体
US20080252317A1 (en) * 2007-04-12 2008-10-16 Semiconductor Testing Advanced Research Lab Inc. Apparatus for testing system-in-package devices
DE102007037506A1 (de) * 2007-08-08 2009-02-19 Amphenol-Tuchel Electronics Gmbh Trägerband zur Aufnahme elektronischer Bauteile
JP5632616B2 (ja) * 2010-01-26 2014-11-26 ラピスセミコンダクタ株式会社 半導体装置の製造方法及び基板収容構造
KR20120018644A (ko) * 2010-08-23 2012-03-05 삼성전자주식회사 반도체 패키지 이송 장치

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JP5732260B2 (ja) 2015-06-10
JP2011148555A (ja) 2011-08-04
KR101784518B1 (ko) 2017-10-11
KR20110085870A (ko) 2011-07-27
US20110203967A1 (en) 2011-08-25
EP2348804A1 (fr) 2011-07-27
US8405195B2 (en) 2013-03-26
CN102145795B (zh) 2015-08-19
CN102145795A (zh) 2011-08-10

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