EP1547141A4 - Halbleiter-mehrfachkapselungsmodul mit drahtbondverbindung zwischen gestapelten kapselungen - Google Patents

Halbleiter-mehrfachkapselungsmodul mit drahtbondverbindung zwischen gestapelten kapselungen

Info

Publication number
EP1547141A4
EP1547141A4 EP03754585A EP03754585A EP1547141A4 EP 1547141 A4 EP1547141 A4 EP 1547141A4 EP 03754585 A EP03754585 A EP 03754585A EP 03754585 A EP03754585 A EP 03754585A EP 1547141 A4 EP1547141 A4 EP 1547141A4
Authority
EP
European Patent Office
Prior art keywords
microcablages
housings
interconnection
housing module
semiconductor multi
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
EP03754585A
Other languages
English (en)
French (fr)
Other versions
EP1547141A2 (de
Inventor
Marcos Karnezos
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ChipPac Inc
Original Assignee
ChipPac Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/632,550 external-priority patent/US6972481B2/en
Priority claimed from US10/632,552 external-priority patent/US20040061213A1/en
Priority claimed from US10/632,568 external-priority patent/US7205647B2/en
Priority claimed from US10/632,553 external-priority patent/US7053476B2/en
Priority claimed from US10/632,549 external-priority patent/US7064426B2/en
Priority claimed from US10/632,551 external-priority patent/US6838761B2/en
Application filed by ChipPac Inc filed Critical ChipPac Inc
Publication of EP1547141A2 publication Critical patent/EP1547141A2/de
Publication of EP1547141A4 publication Critical patent/EP1547141A4/de
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01515—Forming coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/20—Configurations of stacked chips
    • H10W90/28—Configurations of stacked chips the stacked chips having different sizes, e.g. chip stacks having a pyramidal shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/20—Configurations of stacked chips
    • H10W90/288—Configurations of stacked chips characterised by arrangements for thermal management of the stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/722—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/752—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
EP03754585A 2002-09-17 2003-09-15 Halbleiter-mehrfachkapselungsmodul mit drahtbondverbindung zwischen gestapelten kapselungen Ceased EP1547141A4 (de)

Applications Claiming Priority (15)

Application Number Priority Date Filing Date Title
US632551 1990-12-21
US632553 1990-12-24
US632568 1996-04-15
US632549 2000-08-04
US41159002P 2002-09-17 2002-09-17
US411590P 2002-09-17
US10/632,550 US6972481B2 (en) 2002-09-17 2003-08-02 Semiconductor multi-package module including stacked-die package and having wire bond interconnect between stacked packages
US10/632,552 US20040061213A1 (en) 2002-09-17 2003-08-02 Semiconductor multi-package module having package stacked over die-up flip chip ball grid array package and having wire bond interconnect between stacked packages
US10/632,568 US7205647B2 (en) 2002-09-17 2003-08-02 Semiconductor multi-package module having package stacked over ball grid array package and having wire bond interconnect between stacked packages
US10/632,553 US7053476B2 (en) 2002-09-17 2003-08-02 Semiconductor multi-package module having package stacked over die-down flip chip ball grid array package and having wire bond interconnect between stacked packages
US632550 2003-08-02
US10/632,549 US7064426B2 (en) 2002-09-17 2003-08-02 Semiconductor multi-package module having wire bond interconnect between stacked packages
US632552 2003-08-02
US10/632,551 US6838761B2 (en) 2002-09-17 2003-08-02 Semiconductor multi-package module having wire bond interconnect between stacked packages and having electrical shield
PCT/US2003/028919 WO2004027823A2 (en) 2002-09-17 2003-09-15 Semiconductor multi-package module having wire bond interconnection between stacked packages

Publications (2)

Publication Number Publication Date
EP1547141A2 EP1547141A2 (de) 2005-06-29
EP1547141A4 true EP1547141A4 (de) 2010-02-24

Family

ID=32034538

Family Applications (1)

Application Number Title Priority Date Filing Date
EP03754585A Ceased EP1547141A4 (de) 2002-09-17 2003-09-15 Halbleiter-mehrfachkapselungsmodul mit drahtbondverbindung zwischen gestapelten kapselungen

Country Status (6)

Country Link
EP (1) EP1547141A4 (de)
JP (3) JP4800625B2 (de)
KR (1) KR101166575B1 (de)
AU (1) AU2003272405A1 (de)
TW (3) TWI378548B (de)
WO (1) WO2004027823A2 (de)

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KR101563910B1 (ko) * 2013-10-24 2015-10-28 앰코 테크놀로지 코리아 주식회사 반도체 패키지 및 이의 제조 방법
EP3623785A1 (de) * 2013-10-30 2020-03-18 Honeywell International Inc. Kraftsensor mit spaltgesteuertem überkraftschutz
JP6357371B2 (ja) * 2014-07-09 2018-07-11 新光電気工業株式会社 リードフレーム、半導体装置及びリードフレームの製造方法
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KR101961377B1 (ko) * 2015-07-31 2019-03-22 송영희 에지에 사이드 패드를 포함하는 ｌｇａ 반도체 패키지
KR101799668B1 (ko) * 2016-04-07 2017-11-20 앰코 테크놀로지 코리아 주식회사 반도체 패키지 및 그 제조 방법
KR102652721B1 (ko) * 2016-12-30 2024-03-28 인텔 코포레이션 고주파수 통신을 위한 3d 적층된 초박형 패키지 모듈로 설계된 마이크로 전자 디바이스
EP3644351A1 (de) * 2018-10-26 2020-04-29 Nagravision SA Schutz von integrierten schaltungschips, die in einer drahtgebundenen kugelgitteranordnung gepackt sind
KR102283390B1 (ko) 2019-10-07 2021-07-29 제엠제코(주) 멀티칩용 반도체 패키지 및 그 제조방법
KR102325217B1 (ko) 2020-05-18 2021-11-11 제엠제코(주) 멀티 다이 스택 반도체 패키지
CN114361063B (zh) * 2021-11-24 2024-12-13 苏州科阳半导体有限公司 基板键合方法及基板
US20240006278A1 (en) * 2022-07-01 2024-01-04 Mediatek Inc. Multi-die qfn hybrid package
US12469765B2 (en) 2022-09-22 2025-11-11 Apple Inc. Thermally enhanced chip-on-wafer or wafer-on-wafer bonding
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CN119916090B (zh) * 2025-04-02 2025-07-04 杭州广立测试设备有限公司 晶圆的电容测试方法、装置、电子设备和存储介质

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TW200419765A (en) 2004-10-01
JP2013211589A (ja) 2013-10-10
JP5602685B2 (ja) 2014-10-08
JP2011181971A (ja) 2011-09-15
WO2004027823A2 (en) 2004-04-01
EP1547141A2 (de) 2005-06-29
KR101166575B1 (ko) 2012-07-18
JP4800625B2 (ja) 2011-10-26
WO2004027823A3 (en) 2004-05-21
TWI469301B (zh) 2015-01-11
KR20050044925A (ko) 2005-05-13
TWI329918B (en) 2010-09-01
AU2003272405A8 (en) 2004-04-08
TW201131731A (en) 2011-09-16
JP5856103B2 (ja) 2016-02-09
AU2003272405A1 (en) 2004-04-08
TWI378548B (en) 2012-12-01
JP2005539403A (ja) 2005-12-22

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