DE60221377D1 - Undurchlässiges gehäuse für ein optisches halbleiterbauelement - Google Patents

Undurchlässiges gehäuse für ein optisches halbleiterbauelement

Info

Publication number
DE60221377D1
DE60221377D1 DE60221377T DE60221377T DE60221377D1 DE 60221377 D1 DE60221377 D1 DE 60221377D1 DE 60221377 T DE60221377 T DE 60221377T DE 60221377 T DE60221377 T DE 60221377T DE 60221377 D1 DE60221377 D1 DE 60221377D1
Authority
DE
Germany
Prior art keywords
optical semiconductor
semiconductor component
portable housing
portable
housing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60221377T
Other languages
English (en)
Inventor
Juan Exposito
Remi Brechignac
Julien Vittu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STMicroelectronics SA
Original Assignee
STMicroelectronics SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by STMicroelectronics SA filed Critical STMicroelectronics SA
Application granted granted Critical
Publication of DE60221377D1 publication Critical patent/DE60221377D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14618—Containers
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/4277—Protection against electromagnetic interference [EMI], e.g. shielding means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0232—Optical elements or arrangements associated with the device
    • H01L31/02325—Optical elements or arrangements associated with the device the optical elements not being integrated nor being directly associated with the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48095—Kinked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Optics & Photonics (AREA)
  • Light Receiving Elements (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Lens Barrels (AREA)
DE60221377T 2001-05-18 2002-05-17 Undurchlässiges gehäuse für ein optisches halbleiterbauelement Expired - Lifetime DE60221377D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR0106552A FR2824955B1 (fr) 2001-05-18 2001-05-18 Boitier semi-conducteur optique blinde
PCT/FR2002/001690 WO2002095837A1 (fr) 2001-05-18 2002-05-17 Boîtier blinde pour un composant semi-conducteur optique

Publications (1)

Publication Number Publication Date
DE60221377D1 true DE60221377D1 (de) 2007-09-06

Family

ID=8863419

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60221377T Expired - Lifetime DE60221377D1 (de) 2001-05-18 2002-05-17 Undurchlässiges gehäuse für ein optisches halbleiterbauelement

Country Status (5)

Country Link
US (1) US6870238B2 (de)
EP (1) EP1388174B1 (de)
DE (1) DE60221377D1 (de)
FR (1) FR2824955B1 (de)
WO (1) WO2002095837A1 (de)

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US7012315B1 (en) * 2000-11-01 2006-03-14 Micron Technology, Inc. Frame scale package using contact lines through the elements
FR2824953B1 (fr) * 2001-05-18 2004-07-16 St Microelectronics Sa Boitier semi-conducteur optique a lentille incorporee et blindage
SG104293A1 (en) 2002-01-09 2004-06-21 Micron Technology Inc Elimination of rdl using tape base flip chip on flex for die stacking
SG115455A1 (en) * 2002-03-04 2005-10-28 Micron Technology Inc Methods for assembly and packaging of flip chip configured dice with interposer
SG111935A1 (en) 2002-03-04 2005-06-29 Micron Technology Inc Interposer configured to reduce the profiles of semiconductor device assemblies and packages including the same and methods
SG121707A1 (en) 2002-03-04 2006-05-26 Micron Technology Inc Method and apparatus for flip-chip packaging providing testing capability
SG115459A1 (en) * 2002-03-04 2005-10-28 Micron Technology Inc Flip chip packaging using recessed interposer terminals
SG115456A1 (en) * 2002-03-04 2005-10-28 Micron Technology Inc Semiconductor die packages with recessed interconnecting structures and methods for assembling the same
US6975035B2 (en) * 2002-03-04 2005-12-13 Micron Technology, Inc. Method and apparatus for dielectric filling of flip chip on interposer assembly
US20040036170A1 (en) * 2002-08-20 2004-02-26 Lee Teck Kheng Double bumping of flexible substrate for first and second level interconnects
US7274094B2 (en) * 2002-08-28 2007-09-25 Micron Technology, Inc. Leadless packaging for image sensor devices
FR2854498B1 (fr) * 2003-04-29 2005-09-16 St Microelectronics Sa Boitier semi-conducteur a capteur optique s'installant a l'interieur d'un objet.
CN100377360C (zh) * 2004-04-14 2008-03-26 亚泰影像科技股份有限公司 影像感测器
TWI321342B (en) * 2004-11-05 2010-03-01 Altus Technology Inc An integrate circuit chip encapsulation and the method of manufacturing it
JP2006178045A (ja) * 2004-12-21 2006-07-06 Konica Minolta Photo Imaging Inc 手振れ補正ユニットおよび撮像装置
US7084391B1 (en) * 2005-04-05 2006-08-01 Wen Ching Chen Image sensing module
US7227236B1 (en) 2005-04-26 2007-06-05 Amkor Technology, Inc. Image sensor package and its manufacturing method
US20070272827A1 (en) * 2005-04-27 2007-11-29 Amkor Technology, Inc. Image sensor package having mount holder attached to image sensor die
US7576401B1 (en) 2005-07-07 2009-08-18 Amkor Technology, Inc. Direct glass attached on die optical module
US20070138585A1 (en) * 2005-12-16 2007-06-21 Hsin Chung H Image sensor package
US20080036025A1 (en) * 2005-12-16 2008-02-14 Hsin Chung H Image sensor package
CN101132478A (zh) * 2006-08-23 2008-02-27 鸿富锦精密工业（深圳）有限公司 影像感测器封装及其应用的数码相机模组
GB2452073B (en) * 2007-08-23 2012-03-07 Int Currency Tech Anti-EMI lens module
US7760971B2 (en) * 2007-08-30 2010-07-20 International Currency Technologies Corporation Anti-EMI lens module
US7665903B2 (en) * 2007-10-03 2010-02-23 Avago Technologies Fiber Ip (Singapore) Pte. Ltd. Optical receptacle having an electrically isolating ring for electrically isolating the signal ground and the chassis ground in an optical transceiver module
ES2325720B1 (es) * 2007-12-10 2010-04-20 International Currency Technologies Corporation Modulo de lentes para la rpevencion de interferencia electrica, de ondas de radio y electromagnetica.
CN101498822B (zh) * 2008-02-03 2011-09-28 旭丽电子(广州)有限公司 镜头模块及其制造方法及具有该镜头模块的电子装置
JP5498684B2 (ja) * 2008-11-07 2014-05-21 ラピスセミコンダクタ株式会社 半導体モジュール及びその製造方法
US8066437B2 (en) * 2009-03-12 2011-11-29 Avago Technologies Fiber Ip (Singapore) Pte. Ltd Optical transceiver module providing EMI shielding and electrical isolation between a signal ground and a chassis ground
US8890269B2 (en) * 2012-05-31 2014-11-18 Stmicroelectronics Pte Ltd. Optical sensor package with through vias
JP2014044409A (ja) * 2012-07-30 2014-03-13 Kyocera Corp 光装置用部品、光装置および光モジュール
WO2016013978A1 (en) 2014-07-23 2016-01-28 Heptagon Micro Optics Pte. Ltd. Light emitter and light detector modules including vertical alignment features
BR112018003132B1 (pt) 2015-08-19 2022-12-20 Diebold Nixdorf, Incorporated Invólucro para dispositivo óptico
GB201700904D0 (en) * 2017-01-19 2017-03-08 Purelifi Ltd Sheilding apparatus and method
CN108493261A (zh) * 2018-03-13 2018-09-04 谱诉光电科技（苏州）有限公司 光电传感器封装及封装方法
CN109001870A (zh) * 2018-08-06 2018-12-14 青岛海信宽带多媒体技术有限公司 一种新型光器件及其光模块
CN112888282B (zh) * 2019-11-29 2022-08-19 华为终端有限公司 屏蔽装置和电子设备
WO2023206974A1 (zh) * 2022-04-26 2023-11-02 上海禾赛科技有限公司 封装结构及其封装方法、光电装置、接收单元、激光雷达
FR3147428A1 (fr) * 2023-03-30 2024-10-04 Stmicroelectronics International N.V. Boitier optique avec blindage electromagnetique

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JPH0453155A (ja) * 1990-06-15 1992-02-20 Mitsubishi Electric Corp 半導体容器
FR2701786B1 (fr) * 1993-02-17 1995-09-22 Europ Agence Spatiale Cellule photovoltauique, son procede de realisation et panneau solaire comportant de telles cellules.
DE19508222C1 (de) * 1995-03-08 1996-06-05 Siemens Ag Optoelektronischer Wandler und Herstellverfahren
DE19527026C2 (de) * 1995-07-24 1997-12-18 Siemens Ag Optoelektronischer Wandler und Herstellverfahren
US5650659A (en) * 1995-08-04 1997-07-22 National Semiconductor Corporation Semiconductor component package assembly including an integral RF/EMI shield
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US6303978B1 (en) * 2000-07-27 2001-10-16 Motorola, Inc. Optical semiconductor component and method of manufacture

Also Published As

Publication number Publication date
FR2824955B1 (fr) 2004-07-09
US20040212055A1 (en) 2004-10-28
EP1388174B1 (de) 2007-07-25
US6870238B2 (en) 2005-03-22
EP1388174A1 (de) 2004-02-11
FR2824955A1 (fr) 2002-11-22
WO2002095837A1 (fr) 2002-11-28

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Legal Events

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8332 No legal effect for de