EP1486104A2 - Procede pour equiper et braser une carte de circuits imprimes, four de refusion et carte de circuits imprimes adaptee a un tel procede - Google Patents

Procede pour equiper et braser une carte de circuits imprimes, four de refusion et carte de circuits imprimes adaptee a un tel procede

Info

Publication number
EP1486104A2
EP1486104A2 EP03722340A EP03722340A EP1486104A2 EP 1486104 A2 EP1486104 A2 EP 1486104A2 EP 03722340 A EP03722340 A EP 03722340A EP 03722340 A EP03722340 A EP 03722340A EP 1486104 A2 EP1486104 A2 EP 1486104A2
Authority
EP
European Patent Office
Prior art keywords
circuit board
printed circuit
soldering
tht
components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP03722340A
Other languages
German (de)
English (en)
Inventor
Dietmar Birgel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Endress and Hauser SE and Co KG
Original Assignee
Endress and Hauser SE and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Endress and Hauser SE and Co KG filed Critical Endress and Hauser SE and Co KG
Publication of EP1486104A2 publication Critical patent/EP1486104A2/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/008—Soldering within a furnace
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0212—Printed circuits or mounted components having integral heating means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3415—Surface mounted components on both sides of the substrate or combined with lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/062—Means for thermal insulation, e.g. for protection of parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/0557—Non-printed masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1121—Cooling, e.g. specific areas of a PCB being cooled during reflow soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/304—Protecting a component during manufacturing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion

Definitions

  • the invention relates to a method for assembling and soldering a circuit board, a reflow oven for soldering the circuit board and a circuit board for the aforementioned method.
  • the invention relates to such printed circuit boards which are equipped with a wired electrical component with at least one connecting wire or pin and one or a thermally critical housing or casing for conventional automatic soldering processes.
  • the aim today is to have the assembly or soldering of printed circuit boards carried out by machine as far as possible in order to optimize manufacturing costs and effort.
  • a more or less diffuse hot gas stream from pure hot air or a heated special gas is directed vertically onto the surface of the circuit board to be soldered.
  • the circuit boards are heated when entering such a reflow oven and then in the actual work- Transported soldering area.
  • Usual temperatures in the area of the PCB surface to be soldered are up to 220 ° C with dwell times of up to 30 s.
  • a major problem today when soldering in reflow ovens are those components which do not withstand the thermal conditions in conventional reflow ovens and which are deformed or even destroyed under the conditions prevailing there.
  • connectors, flex connectors, DIP switches or other components, including semiconductor components, with a plastic housing in a commercially available version are not suitable for the usual reflow oven.
  • Such components which are not resistant to the temperatures prevailing in the reflow oven during the soldering process, cannot participate in the inexpensive mechanical assembly and soldering in reflow oven, but require additional labor-intensive and therefore cost-intensive individual or special assemblies in several special operations.
  • high-temperature resistant versions are also available, but they are significantly more expensive than the usual components. However, their use is often uneconomical, since they negate the cost savings that are gained by purely mechanical assembly and soldering.
  • a first variant of a method for equipping and soldering a printed circuit board with a first and a second side and with at least one wired electrical component (“THT component”) with at least one connecting wire or connecting pin and one or a thermally critical housing or casing for conventional automatic soldering technology which method comprises the following process steps:
  • the THT component On the first side of the circuit board, the THT component is assembled and its connecting wire or connecting pin from the first side through a hole inserted so that it is led out on the second side of the circuit board in the area of a solder contact area printed with a solder paste;
  • the printed circuit board equipped in this way is placed in a reflow oven, the first side equipped with the THT component being at least partially shielded from a heat or energy supply which brings about the soldering.
  • a second variant of a method for assembling and soldering a printed circuit board with a first and a second side and with at least one wired electrical component (“THT component”) with at least one connecting wire or connecting pin and one or a thermally critical housing or casing for conventional automatic soldering technology which method comprises the following process steps:
  • the THT component is fitted on the first side of the printed circuit board and its connecting wire or connecting pin is inserted through a hole from the first side, so that it leads out on the second side of the printed circuit board in the area of a solder contact area printed with a solder paste is;
  • the printed circuit board equipped in this way is placed in a reflow oven, the first side equipped with the THT component being thermally separated from the heat or energy supply acting on the second side of the printed circuit board for soldering, and a temperature difference between them by suitable means the first and the second side of at least 28 ° C is adjustable.
  • solder paste is provided on soldering contact surfaces provided therefor, and after equipping the second side of the printed circuit board with the SMD component, this together with the connecting wire of the THT -Soldered in one step in the reflow oven.
  • the first side of the printed circuit board is also equipped with at least one SMD component.
  • a further preferred embodiment of the method according to the invention comprises the following method steps: a) printing solder paste on the first side of the printed circuit board; b) equip the first side with SMD components; c) soldering the SMD components of the first side in the reflow oven; d) equip the first side with at least one THT component; e) printing solder paste on the second page; f) equip the second side with SMD components and g) solder SMD components on the second side and the THT component (s) in the reflow oven.
  • Further embodiments of the method according to the invention relate to the assembly of connecting wires of the THT components before the solder paste is printed on the second side of the printed circuit board.
  • Yet another preferred embodiment of the method according to the invention comprises the following method steps: a) printing solder paste on the first page; b) application of adhesive to the locations on the first side to be filled with THT components; c) equip the first side with SMD components; d) equip the first side with THT components; e) soldering the SMD components of the first side in the reflow oven; f) printing solder paste on the second page; g) equip the second side with SMD components and h) solder the components of the second side and the THT components in the reflow oven.
  • Yet another embodiment of the method according to the invention relates to equipping the printed circuit board with at least one pin-in-hole component (PIH component).
  • PHI component pin-in-hole component
  • the first side equipped with the THT component (s) is the The circuit board in the reflow oven is essentially shielded or thermally separated from the heat or energy supply acting on the second side for soldering.
  • Yet another preferred embodiment of the method according to the invention relates to a horizontal arrangement of the printed circuit board when passing through the reflow oven, the thermally critical THT components to be soldered being located below the printed circuit board.
  • Yet another preferred embodiment of the method according to the invention is directed to cooling the first side of the printed circuit board in the reflow oven when the second side is soldered.
  • those areas of the printed circuit board in the reflow oven which, because of a printed circuit board layout, tend to absorb above-average heat energy are covered by a cover which prevents or delays the absorption of heat energy.
  • those areas of the circuit board in the reflow oven where above-average absorption of thermal energy is desired are covered by a cover which improves the absorption of thermal energy.
  • a first variant of a reflow oven for soldering a printed circuit board with a first and a second side and with at least one wired electrical component (“THT component”) with at least one connecting wire or connecting Pin and one or a thermally critical housing or casing for conventional automatic soldering technology the first side of the printed circuit board equipped with the THT component being soldered when soldering the second side of the printed circuit board in the area of a connecting wire of the THT component which is printed with a solder paste printed on with solder paste a heat or energy supply causing the soldering is shielded.
  • THT component wired electrical component
  • a second variant of a reflow oven for soldering a circuit board with a first one and a second side and with at least one wired electrical component (“THT component”) with at least one connecting wire or connecting pin and one or a thermally critical housing or casing for conventional automatic soldering technology the first being equipped with the THT component
  • THT component wired electrical component
  • the side of the printed circuit board when the second side of the printed circuit board is soldered in the region of a connecting wire of the THT component which is led out with a solder paste printed on with solder paste, is separated from a heat or energy supply which brings about the soldering, and a temperature difference between the first and the second side of at least 28 by suitable means ° C is adjustable.
  • the side of the printed circuit board equipped with the THT component (s) is essentially shielded or thermally separated by the latter itself in the reflow oven from the heat or energy supply which brings about the soldering.
  • a cooling device is provided therein, by means of which the side of the printed circuit board equipped with the THT component or components is cooled during the soldering process.
  • Yet another embodiment of the reflow oven according to the invention has at least one infrared radiation source which supplies the energy which brings about the soldering.
  • the above-mentioned object is also achieved by a printed circuit board for one of the above-mentioned methods according to the invention, the printed circuit board being designed or designed in such a way that, with thermal energy acting on the printed circuit board from outside, regions which can be predetermined locally and have above-average thermal energy absorption.
  • a preferred embodiment of the printed circuit board according to the invention relates to an inner layer of the printed circuit board, which is designed or designed in such a way that a large-area, metallic and / or electrically conductive part is located in the areas of desired above-average heat energy absorption.
  • the invention is based on the idea of arranging the thermally sensitive components when they pass through the reflow furnace in such a way that they are opposite to the ones towards heat or energy supply acting on the soldering circuit board surface are essentially shielded.
  • the shielding is achieved in the simplest manner by the printed circuit board itself, this effect being supported by additional covers and / or temperature-reducing measures in further preferred embodiments of the invention.
  • the shielding effect of the arrangement of the circuit board according to the invention is also advantageously supported by an appropriately selected design or layout of the circuit board.
  • Fig. 1 is a schematic representation of various components
  • FIG. 2 shows a schematic illustration of another conventional arrangement of different components on a printed circuit board equipped on both sides;
  • FIG. 3 shows a schematic representation of a further conventional arrangement of various components on a printed circuit board equipped on both sides;
  • Fig. 4 is a schematic representation of the sequence of what is common today
  • FIG. 5 shows a schematic illustration of a customary reflow oven
  • Fig. 6 is a schematic representation of the sequence of a preferred embodiment
  • Fig. 7 is a schematic representation of a reflow oven according to the invention.
  • FIG. 8 shows a schematic illustration of a preferred arrangement of various components on a printed circuit board according to the invention.
  • FIG. 9 shows a schematic illustration of a further preferred arrangement of various components on a printed circuit board according to the invention.
  • 10a shows a schematic illustration of a connection point of a
  • 10b shows a schematic representation of a connection point of a
  • connection wire of a component after an assembly and soldering process according to the invention shows a schematic illustration of a further printed circuit board according to the invention during the soldering process with a thermal shield;
  • Fig. 12 is a schematic representation of another circuit board according to the invention during the soldering process with a special cover.
  • FIG. 1 An example of such a printed circuit board 1 is shown schematically in FIG. 1.
  • the following explanations of previously used printed circuit boards, assembly and soldering methods also serve to show the progress and advantages achieved by the invention.
  • THT components are not shown as such, but are illustrated by the printed circuit board 1.
  • transformers 2 special plugs 4 with large housings, rotary switches 5 and resistors 6.
  • angled plugs 7 and semiconductor components in TO housings 8 and in DIL housings 9 are also provided on the printed circuit board 1.
  • the components shown are either wired or those with connecting pins, in which the connecting wires or pins are inserted through metallized bores in the soldered connections of the printed circuit board 1; they are therefore referred to below as "THT components".
  • THT is short for Through Hole Technique.
  • Such THT components are usually soldered in a wave solder bath or, if they do not withstand the temperatures there or deform, manually. As described above, this is a very expensive process.
  • PIH is short for Pin
  • the connecting wires or pins are greatly shortened and configured so that they can be inserted into metallized blind holes drilled with solder paste at the soldered connections of the printed circuit board 1. If these PIH components are insensitive to the temperatures and conditions prevailing in a reflow oven, they can stand up there soldered in an upright position, for example - if also fitted on the circuit board - with SMD components.
  • FIG. 2 Another example of a conventional printed circuit board is shown schematically in FIG. 2 as a side view of a section of a printed circuit board.
  • This circuit board is shown schematically in FIG. 2 as a side view of a section of a printed circuit board.
  • THT resistors 13a, 13b are shown as examples, one on each side 11, 12 and a component with a THT-DIL housing 14 and a THT angle plug.
  • the first side 11 with the resistor 13a, the DIL housing 14 and all others is first from this first side
  • FIG. 3 shows yet another printed circuit board 20 which is equipped with SMD and THT components.
  • the cutout shown here is also a printed circuit board 20 equipped on both sides with a first 21 and a second component side 22.
  • first 21 and a second component side 22 are illustrated on the first side 21 .
  • Third SMD components 27 and fourth SMD components 28 are illustrated on the second side 22 of the printed circuit board 20.
  • the printed circuit board 20 according to FIG. 3 is produced in a conventional manner in accordance with a method schematically represented by FIG. 4.
  • a solder paste 30 preferably using a printing process, for example a screen printing process
  • This SMD assembly 31 is usually done automatically by an automatic placement machine and with the help of belted SMD components.
  • the circuit board 20 is soldered together with other circuit boards to be soldered in a conventional reflow oven. An example of such a reflow oven is shown in FIG. 5 and will be described below described.
  • the circuit board After soldering in the reflow oven, the circuit board is turned over and an adhesive application 33 is carried out on its second side 22 at the points where the SMD components 27 and 28 are to be placed. A subsequent assembly 34 of the third and fourth SMD components 27 and 28 is again carried out automatically. After the adhesive has hardened, the THT components and those that cannot be fully automatically assembled are assembled. In the printed circuit board shown in FIG. 3, these are, for example, the THT resistors 23 which are to be soldered on the second side 22.
  • the so-called exotic components also include those that require special fastening on the circuit board because of their uneven mass distribution, since they cannot be adequately fixed against tilting, for example, by a simple adhesive process. These components must be held in their position by means of snap-in technology or by inserting them into a base or the like on the circuit board until the soldering has been carried out or even beyond.
  • the printed circuit board 20 is placed in a wave solder bath 38, where the components assembled in step 36 are soldered together with the SMD components 27 and 28; if necessary, the circuit boards become still after wave soldering 38 subjected to an additional cleaning.
  • FIG. 5 shows a conventional reflow oven 40, which is briefly explained in comparison with a reflow oven 60 according to the invention described later and shown in FIG. 7.
  • a reflow oven 40 essentially comprises a housing 41, which is subdivided into a plurality of chambers 42 in its interior in order to enable better temperature control and convection in the individual chambers 42 and targeted heating and soldering of printed circuit boards 46.
  • Each of the chambers 42 is usually equipped with a heat exchanger and a fan 44 provided, above and below a conveyor belt 45 on which the circuit boards 46 are transported through the reflow oven 40 in the direction of an arrow 47.
  • cooling fans 48 are often provided, which are used for the targeted cooling of the soldered circuit boards 46 to ambient conditions.
  • the temperature inside is a major problem in conventional reflow ovens, particularly for components whose housings cannot withstand these temperatures for the length of time in the oven. It should be noted here that a temperature of up to 220 ° C. prevails above the conveyor belt 45 in a conventional reflow oven 40, as is shown, for example, in FIG. 5. Such a temperature cannot withstand conventional plastic housings on angled plugs, TO or DIL housings of the THT version (see also FIG. 1) without deforming and thus questioning the functionality of the components.
  • Fig. 6 is a schematic representation of the sequence of a preferred method according to the invention for assembling and soldering components. With this method it is now possible to solder thermally critical components in the reflow oven.
  • the assembly and soldering of a printed circuit board equipped with SMD and PIH components on both sides is considered in detail (see, for example, FIG. 9).
  • an automatic SMD component assembly 51 is carried out, which is sent to reflow soldering 52 in and through a reflow oven.
  • 53 of THT components and other thermally critical components are assembled on the first side of the circuit board.
  • connection pins or wires of the THT components are inserted through the corresponding holes and through the printed circuit board so that they protrude on the second side.
  • Heavy exotic components or those with an uneven mass distribution that tend to tip over are either fixed with adhesive or are held in the desired position by means of holders, such as snap-in fasteners.
  • holders such as snap-in fasteners.
  • the printed circuit board is rotated so that its first side points upwards and the so-called exotic components point downwards, that is to say are arranged below the printed circuit board.
  • the connecting wires or connecting pins of the THT components are shortened and / or clinched, i.e. so spread or bent that the THT components do not fall out of the circuit board in their overhead position and are held in their position.
  • By shortening the connecting wires or connecting pins of the THT components it is also achieved that they protrude only slightly beyond the printed circuit board and thus hinder a subsequent application 55 of the solder paste, preferably by means of printing, on the second side of the printed circuit board. In the case of long protruding connecting wires or connecting pins, there is a risk that they will protrude into the plane of the printing screen required for applying the solder paste or prevent its positioning.
  • connection wires or connection pins of the THT components After the connection wires or connection pins of the THT components have been assembled, an automatic assembly 56 of SMD components and then of PIH components 57 is carried out on the second side of the printed circuit board.
  • PIH components are preferably used which are held by a kind of "wet adhesive force" of the solder paste and for which no additional measures for fixing their position and at the desired location are required.
  • the circuit board which is now populated on the second side is placed in a reflow oven according to the invention, for example one according to FIG. 7, and soldered 58 there.
  • a reflow oven 60 shown in FIG. 7 comprises a housing 61 which, like the reflow oven 40 shown in FIG. 5, is divided into a plurality of chambers 62. In most chambers 62, heat exchangers 63 and blowers 64 are provided in order to control the heat flow in the reflow oven 60 and thereby to heat the circuit board (s) 66 in a desired manner before the actual soldering process and to apply the energy required for soldering to and on the Bring PCB (s) 66. In contrast to the conventional reflow oven 40 according to FIG. 5, the printed circuit boards 66 are arranged on frames 67 or similar structures on the conveyor belt 65.
  • These frames 67 allow a greater distance between the printed circuit boards 66 than usual to the conveyor belt 65, so that in the case of printed circuit boards 66 in which the first side has relatively bulky THT or other “exotic” and thermally critical components, such as transformers 2, connectors 7 1 and 7 or rotary switches 5 of the printed circuit board according to FIG. 1, the latter, despite their size, can be accommodated between the conveyor belt 65 and printed circuit boards 66.
  • the space between the conveyor belt and the printed circuit board is only designed for SMD components; relatively large THT components can only be soldered on the side of the printed circuit board facing the heat energy. Then, as described above, only those THT components can be used whose housings are thermally resistant in the reflow oven. If no such THT components are available or they are disproportionately expensive, the only solution is to solder these components separately, for example manually or in a wave solder bath, which allows spot soldering.
  • the invention also allows THT components with thermally critical housings or other thermally sensitive THT components to be transported through the reflow oven 60 and soldered there.
  • the main idea here is that the second side of the circuit boards 66, ie where soldering is to be carried out, is exposed to the action of the current of thermal energy required for the soldering, while its first side with the THT or other "exotic" and thermal elements thereon critical components to the conveyor belt 65 points.
  • the circuit boards 66 themselves shield the thermally critical components from the thermal energy.
  • the printed circuit boards 66 are preferably aligned horizontally, as is shown in the reflow oven 60 in FIG.
  • the second side to be soldered pointing upward to the thermal energy acting on it and the thermally critical components being located below the printed circuit boards 66.
  • the thermally critical components are, so to speak, "overhead” and soldered together with the SMD and PIH components fitted on the second side of the printed circuit boards.
  • the printed circuit boards can also be arranged in a different way through the reflow oven if it is ensured that the thermal energy required for soldering is in Desirably meets the side of the circuit board to be soldered and the circuit boards themselves cover the thermally critical components and shield them from the flow of thermal energy.
  • the reflow oven 60 shown in FIG. 5 has at least one quartz radiator 68.
  • the quartz radiator (s) 68 allow the temperature prevailing in the chambers 62 used for soldering in the reflow oven 60 to be reduced to a temperature below the temperature required for soldering the components.
  • the quartz emitters provide infrared radiation, which then provides the energy required for soldering as additional energy radiation at the soldering points on the side of the circuit board 66 to be soldered. This measure limits the overall temperature prevailing in the reflow oven 60 both on the side to be soldered and on the opposite side of the printed circuit boards 66, where the thermally critical components are. These components can be shielded even better by the printed circuit boards 66 against the infrared radiation of the quartz emitters 68 used for soldering.
  • the above-mentioned temperature difference of 28 ° to 35 ° C. between the first and the second side of the printed circuit board is sufficient to avoid the thermally critical THT To be able to solder components in the reflow oven without the housing or the components themselves being damaged or even destroyed by the temperature. If this temperature difference is not sufficient, it is possible, for example, the blowers 64 and / or heat exchangers 63 arranged below the conveyor belt 65 in the last or the last two output-side chambers 62 in the reflow oven 60 according to FIG. 7 for cooling the lower first side of the printed circuit board 66 and the thermally critical components located thereon.
  • FIG. 8 and 9 are schematic representations of preferred arrangements of various components on a circuit board according to the invention.
  • the drawing shows such a printed circuit board 70 after it has been soldered in a reflow oven, preferably in one according to the invention, for example in a reflow oven 60 according to FIG. 7.
  • the thermally sensitive THT resistors 75 and the angled connector 76 with respect to the thermal energy acting on the second side 72 of the circuit board 70 is used.
  • soldering method according to the invention can also be used for the soldering of thermally critical PIH components.
  • This is illustrated by the circuit board 70 in FIG. 9, in which thermally critical PIH resistors 78 and a PIH angle plug 79 are used instead of the corresponding THT components 75 and 76 according to FIG. 8.
  • thermally critical PIH resistors 78 and a PIH angle plug 79 are used instead of the corresponding THT components 75 and 76 according to FIG. 8.
  • the PIH components 78, 79 can be fixed with adhesive or the PIH blind holes into which the connecting wires or Pins of the PIH components 78, 79 are arranged or spaced apart in the individual PIH components 78, 79 in such a way that the connecting wires or pins of the PIH components 78, 79 must be bent such that they jam the PIH components 78, 79 in the PIH blind holes.
  • 10a and 10b illustrate a particular additional advantage that is achieved with the soldering and assembly method according to the invention when soldering THT components.
  • 10a shows a printed circuit board 80 equipped with a THT component 81, the connecting wire 82 of which has been inserted through a desired metallized feedthrough 83 after it has previously been provided with a solder paste 84.
  • the solder paste 84 which usually rests in a type of drop on the metallized feedthrough 83 and closes it is also pierced and divided when the connecting wire 82 is pushed through the metallized feedthrough 83.
  • a part of the solder paste 84 remains on the upper side of the metallized feedthrough 83, the other part forms a drop or a kind of ball on or at the tip of the connecting wire 82.
  • solder paste 84 softens and flows due to the influence of heat in the Reflow oven, where often the drop or ball of solder paste drips on the tip of the lead wire 82 due to gravity. If the remaining solder paste 84 lying on top of the metallized feedthrough 83 is not sufficient to fill a gap around the connecting wire 82 and in the feedthrough 83 during soldering, a defective soldering point can be assumed.
  • 11 and 12 show a further embodiment of a printed circuit board 90 according to the invention, specifically during soldering in a reflow oven, preferably a reflow oven according to the invention.
  • a thermally sensitive, relatively heavy THT component 91 is equipped with connecting wires 94, which, as described above, was fixed on the printed circuit board 90 by adhesive dots 93, i.e. dots made of suitable adhesive the circuit board 90 has been brought into the reflow oven in the horizontal position shown in FIGS. 11 and 12. Without gluing, the relatively heavy THT component 91 would fall off the printed circuit board 90.
  • Adhesives of this type are always advantageous if the THT component 91 cannot be fixed in the desired position by other measures, such as, for example, by clinching the connecting wires 94 and by jamming on the printed circuit board 90. These and other types of fixing such a THT component have already been described above.
  • the temperature caused by the thermal energy supply 96 on the upper side of the printed circuit board 90 can be set to the minimum temperature required for soldering the selected solder paste.
  • temperature differences between the top and bottom of the circuit board 90 of approximately 28 ° C. to 35 ° C. can be achieved solely by the shielding effect of the circuit board itself. Since the soldering temperature has already been set at the lower limit, this is sufficient in some cases to avoid damaging the thermally critical components 91 on the underside of the printed circuit board 90.
  • FIGS. 11 and 12 show two examples of covers.
  • a mask 98 is schematically shown as an example, with which the "free" locations of the printed circuit board 90 between the connecting wires 94 to be soldered are covered. This essentially limits the absorption of thermal energy to the points to be soldered, and excessive heating of the entire printed circuit board 90 is reduced, so that less thermal energy can be released to the thermally critical component 91 on the lower side of the printed circuit board 90.
  • Such a mask is preferably made of a non-metallic material.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

La présente invention concerne un procédé pour équiper et braser une carte de circuits imprimés qui est équipée d'un composant électrique câblé présentant au moins un fil ou une broche de connexion et un boîtier ou une enveloppe critique d'un point de vue thermique pour des procédés de brasage automatique classiques. La présente invention concerne également un four de refusion conçu pour le brasage de la carte de circuits imprimés, ainsi qu'une carte de circuits imprimés adaptée audit procédé. Cette invention permet de braser le composant critique d'un point de vue thermique dans un four de refusion, en ce que la carte de circuits imprimés elle-même est utilisée pour assurer la protection thermique du composant THT critique d'un point de vue thermique par rapport à l'énergie calorifique qui agit sur la carte de circuits imprimés et est nécessaire au brasage. Les cartes à circuits imprimés (66) sont, à cette fin, par exemple posées sur des montures (67) et sont transportées à travers le four de refusion (60) de façon que les composants critiques d'un point de vue thermique se trouvent sur la face inférieure des cartes à circuits imprimés (66) qui est opposée à l'énergie calorifique.
EP03722340A 2002-03-15 2003-03-15 Procede pour equiper et braser une carte de circuits imprimes, four de refusion et carte de circuits imprimes adaptee a un tel procede Withdrawn EP1486104A2 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10211647.4A DE10211647B4 (de) 2002-03-15 2002-03-15 Verfahren zum Bestücken und Löten einer Leiterplatte
DE10211647 2002-03-15
PCT/EP2003/002627 WO2003079743A2 (fr) 2002-03-15 2003-03-15 Procede pour equiper et braser une carte de circuits imprimes, four de refusion et carte de circuits imprimes adaptee a un tel procede

Publications (1)

Publication Number Publication Date
EP1486104A2 true EP1486104A2 (fr) 2004-12-15

Family

ID=27815690

Family Applications (1)

Application Number Title Priority Date Filing Date
EP03722340A Withdrawn EP1486104A2 (fr) 2002-03-15 2003-03-15 Procede pour equiper et braser une carte de circuits imprimes, four de refusion et carte de circuits imprimes adaptee a un tel procede

Country Status (8)

Country Link
US (1) US20050161252A1 (fr)
EP (1) EP1486104A2 (fr)
JP (1) JP2005521249A (fr)
KR (1) KR100702544B1 (fr)
CN (1) CN100493299C (fr)
AU (1) AU2003229558A1 (fr)
DE (1) DE10211647B4 (fr)
WO (1) WO2003079743A2 (fr)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2864420B1 (fr) * 2003-12-18 2006-04-28 Johnson Controls Tech Co Boitier electrique a connecteur integre
KR101013257B1 (ko) * 2004-07-08 2011-02-09 인터내셔널 비지네스 머신즈 코포레이션 전자 장치의 적어도 2개의 부품의 정렬 정밀도를 향상시키는 방법
DE102004037786A1 (de) * 2004-08-03 2006-03-16 Endress + Hauser Gmbh + Co. Kg Leiterplatte mit SMD-Bauteilen und mindestens einem bedrahteten Bauteil sowie ein Verfahren zum Bestücken, Befestigen
US20060202332A1 (en) * 2005-01-08 2006-09-14 Samsung Electronics Co., Ltd. Semiconductor chip packaging apparatus and method of manufacturing semiconductor chip package
DE102005032135A1 (de) * 2005-07-07 2007-01-18 Endress + Hauser Gmbh + Co. Kg Verfahren zum Löten einer Leiterplatte mit bleifreier Lotpaste in einem Reflow-Lötofen, Leiterplatte für solch ein Verfahren und Reflow-Lötofen
DE102005039829A1 (de) * 2005-08-22 2007-03-08 Endress + Hauser Gmbh + Co. Kg Verfahren zum Löten von SMD-Bauteilen, Leiterplatte und Reflow-Lötofen dazu
DE102005045161A1 (de) * 2005-09-21 2007-04-05 Endress + Hauser Gmbh + Co. Kg Vorrichtung zum Wenden und Bestücken von Leiterplatten
KR100693813B1 (ko) * 2006-02-28 2007-03-12 방상돈 전자회로기판 수리방법
DE102008019055A1 (de) 2008-04-15 2009-10-22 Endress + Hauser Gmbh + Co. Kg Reflowlötofen und Verfahren zur Reflow-Lötung
DE102008035405B4 (de) * 2008-07-29 2016-09-01 Endress + Hauser Gmbh + Co. Kg Verfahren zur Herstellung einer Leiterplatte und Fertigungslinie zur Ausführung desselben
DE102009002288A1 (de) 2009-04-08 2010-10-14 Endress + Hauser Gmbh + Co. Kg Verfahren zur Fixierung von THT-Bauteilen und zur Herstellung von Leiterplatten mit darauf fixierten THT-Bauteilen
CN101959330B (zh) * 2009-07-16 2015-06-10 B·马丁 用于加热印制电路板的装置
CN101827501B (zh) * 2010-03-31 2012-01-04 伟创力电子科技（上海）有限公司 通孔回流焊接工艺,以及对应的模板和制具
US8299393B2 (en) 2010-08-17 2012-10-30 International Business Machines Corporation Selective thermal conditioning components on a PCB
CN102794519B (zh) * 2011-05-28 2014-09-03 上海朗仕电子设备有限公司 一种设置在加热区的线圈式冷却器
KR101229069B1 (ko) * 2011-06-08 2013-02-04 방상돈 아이알 리플로우 솔더링 시스템
KR101894387B1 (ko) * 2012-05-22 2018-09-04 해성디에스 주식회사 인쇄회로기판 및 그의 제조 방법
DE102012112100A1 (de) 2012-12-11 2014-06-12 Endress + Hauser Gmbh + Co. Kg Verfahren zur Herstellung von mischbestückten Leiterplatten
US9055701B2 (en) * 2013-03-13 2015-06-09 International Business Machines Corporation Method and system for improving alignment precision of parts in MEMS
DE102013104806A1 (de) * 2013-05-08 2014-11-13 Sandvik Materials Technology Deutschland Gmbh Bandofen
CN103648232A (zh) * 2013-12-27 2014-03-19 广东威创视讯科技股份有限公司 一种用于解决信号过孔与封装焊盘短路的方法
US20160339486A1 (en) * 2015-05-21 2016-11-24 Illinois Tool Works Inc. Reflow oven liner, system and method
CN105234516A (zh) * 2015-10-14 2016-01-13 桂林市味美园餐饮管理有限公司 一种电子元器件印制电路板回流焊工艺
US11224927B2 (en) 2015-11-25 2022-01-18 International Business Machines Corporation Circuit card attachment for enhanced robustness of thermal performance
DE102016110040A1 (de) 2016-05-31 2017-11-30 Endress + Hauser Gmbh + Co. Kg Fertigungslinie zum Löten
JP6642386B2 (ja) * 2016-11-18 2020-02-05 株式会社デンソー リフロー装置およびそれを用いた基板の製造方法
DE102018116410A1 (de) 2018-07-06 2020-01-09 Endress+Hauser SE+Co. KG Verfahren zur Herstellung einer hochtemperaturfesten bleifreien Lotverbindung und hochtemperaturfeste bleifreie Lotverbindung
CN110142478B (zh) * 2019-06-11 2024-01-30 上海福宇龙汽车科技有限公司 一种自动化电路板焊接装置
CN110498230B (zh) * 2019-09-16 2024-04-16 苏州威兹泰克自动化科技有限公司 一种治具运输回流设备
DE102020105180A1 (de) 2020-02-27 2021-09-02 Endress+Hauser SE+Co. KG Verfahren zur Herstellung einer Lotverbindung, Verfahren zum Trennen zumindest eines Bauelements von einer Kontaktfläche, Leiterplatte und Feldgerät
DE102022109905A1 (de) 2021-04-26 2022-10-27 Pac Tech - Packaging Technologies Gmbh Verfahren und Vorrichtung zum Löten eines elektronischen Bauteils an eine Schaltkreisplatine, Computerprogrammprodukt und computerlesbares Medium
CN113613486A (zh) * 2021-08-05 2021-11-05 惠州市夏瑞科技有限公司 一种高速多功能自动贴片方法
US20240237228A9 (en) * 2022-10-19 2024-07-11 International Business Machines Corporation Reworking solder component without part removal

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4200900A (en) * 1978-06-30 1980-04-29 Robertshaw Controls Company Circuit board arrangement
US4515304A (en) * 1982-09-27 1985-05-07 Northern Telecom Limited Mounting of electronic components on printed circuit boards
FR2556550B1 (fr) * 1983-12-09 1987-01-30 Lignes Telegraph Telephon Procede de brasage de composants electroniques sur un circuit imprime et circuit hybride obtenu par ce procede
US4761881A (en) * 1986-09-15 1988-08-09 International Business Machines Corporation Single step solder process
JPH02152297A (ja) * 1988-12-02 1990-06-12 Matsushita Electric Ind Co Ltd 電子部品の半田接続方法
US4982376A (en) * 1989-04-20 1991-01-01 U.S. Philips Corporation Method of mounting electrical and/or electronic components on a single-sided printed board
JPH0357295A (ja) * 1989-07-26 1991-03-12 Fujitsu Ltd 両面実装プリント板への電子部品実装方法
JP2844778B2 (ja) * 1989-12-28 1999-01-06 ソニー株式会社 片面プリント基板に２種類の部品を半田付けする方法
JP2502826B2 (ja) * 1991-02-26 1996-05-29 権士 近藤 プリント基板のリフロ−はんだ付け方法
US5180096A (en) * 1990-07-25 1993-01-19 Nihon Den-Netsu Keiki Co., Ltd. Method and apparatus for reflow-soldering of printed circuit boards
JP2541063Y2 (ja) * 1991-09-04 1997-07-09 日本電気株式会社 プリント基板のパターン構造
US5373984A (en) * 1993-09-27 1994-12-20 Sundstrand Corporation Reflow process for mixed technology on a printed wiring board
JPH07221442A (ja) * 1994-01-31 1995-08-18 Mitsumi Electric Co Ltd リフロー半田付け方法
JPH0846348A (ja) * 1994-08-01 1996-02-16 Hitachi Cable Ltd 混載基板の部品実装方法
US5617990A (en) * 1995-07-03 1997-04-08 Micron Electronics, Inc. Shield and method for selective wave soldering
DE29519294U1 (de) * 1995-12-06 1997-04-03 Robert Bosch Gmbh, 70469 Stuttgart Elektrisches Gerät
US5785233A (en) * 1996-02-01 1998-07-28 Btu International, Inc. Apparatus and method for solder reflow bottom cooling
US6145734A (en) * 1996-04-16 2000-11-14 Matsushita Electric Industrial Co., Ltd. Reflow method and reflow device
JP2924888B2 (ja) * 1997-05-08 1999-07-26 松下電器産業株式会社 電子ユニットの半田付け装置
JP2937188B2 (ja) * 1997-05-12 1999-08-23 松下電器産業株式会社 電子ユニットの製造装置と製造方法
JPH117937A (ja) * 1997-06-17 1999-01-12 Mitsubishi Paper Mills Ltd 電池用セパレータの製造方法、電池用セパレータおよび電池
GB2329073B (en) * 1997-09-03 2002-04-17 Motorola Israel Ltd Circuit board
DE29718449U1 (de) * 1997-10-17 1999-02-11 Robert Bosch Gmbh, 70469 Stuttgart Bauelementefixierung bei elektrischem Steuergerät
JPH11307927A (ja) * 1998-04-24 1999-11-05 Sony Corp はんだ付け装置とはんだ付け方法
US6133634A (en) * 1998-08-05 2000-10-17 Fairchild Semiconductor Corporation High performance flip chip package
US6202916B1 (en) * 1999-06-08 2001-03-20 Delphi Technologies, Inc. Method of wave soldering thin laminate circuit boards
JP2001345548A (ja) * 2000-05-31 2001-12-14 Fuji Electric Co Ltd 挿入実装部品のリフロー半田接合方法
US6651869B2 (en) * 2001-09-21 2003-11-25 Intel Corporation Methods and electronic board products utilizing endothermic material for filling vias to absorb heat during wave soldering

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO03079743A2 *

Also Published As

Publication number Publication date
AU2003229558A1 (en) 2003-09-29
AU2003229558A8 (en) 2003-09-29
DE10211647A1 (de) 2003-10-16
DE10211647B4 (de) 2014-02-13
CN1643999A (zh) 2005-07-20
CN100493299C (zh) 2009-05-27
KR100702544B1 (ko) 2007-04-04
KR20040089734A (ko) 2004-10-21
JP2005521249A (ja) 2005-07-14
WO2003079743A3 (fr) 2003-12-24
WO2003079743A2 (fr) 2003-09-25
US20050161252A1 (en) 2005-07-28

Similar Documents

Publication Publication Date Title
WO2003079743A2 (fr) Procede pour equiper et braser une carte de circuits imprimes, four de refusion et carte de circuits imprimes adaptee a un tel procede
DE10256250B4 (de) Lötsystem zum Auflöten von elektronischen Komponenten mittels eines Lots auf ein flexibles Substrat
DE69918489T2 (de) Erdungsklemme und dessen Montagestruktur auf einer Leiterplatte
AT503705B1 (de) Anordnung zur kühlung von smd-leistungsbauelementen auf einer leiterplatte
DE19632413C2 (de) Vorrichtung zum Befestigen einer Bauteilekomponente
DE19735409A1 (de) Leiterplatine sowie zugehöriges Kontaktelement
DE19809138A1 (de) Leiterplatte mit SMD-Bauelementen
EP2361001A1 (fr) Masque de soudage pour procédé de brasage à la vague et procédé de soudage sélectif de composants individuels d'une plaquette dans un automate de brasage à la vague
EP1917844B1 (fr) Procede pour souder des composants smd sur une carte de circuits imprimes et four de soudure par refusion a cet effet
DE212019000465U1 (de) LED-Röhrenlampe
DE10123684A1 (de) Leiterplatte mit einer darauf aufgebrachten Kontakthülse
WO2017084906A1 (fr) Carte de circuit imprimé permettant la fixation mécanique d'un boîtier
DE102004037786A1 (de) Leiterplatte mit SMD-Bauteilen und mindestens einem bedrahteten Bauteil sowie ein Verfahren zum Bestücken, Befestigen
DE3445625A1 (de) Verfahren zum loeten einer beidseitig mit smd-bauelementen bestueckten leiterbahnenplatine und eine nach diesem verfahren geloetete platine
DE102012112546A1 (de) Verfahren zur Herstellung von mischbestückten Leiterplatten
EP2747531B1 (fr) Procédé de fabrication de cartes de circuit imprimé à composants mixtes
DE4204882C2 (de) Vorrichtung und Verfahren zum Bestücken von oberflächenmontierbaren Bauelementen mit kleinen Kontaktabständen
DE10219427B4 (de) Verfahren zur Herstellung einer mechanischen und einer elektrischen Verbindung zwischen einer Leiterplatte und einem auf dieser anzuordnenden Kontaktstift
EP4207956B1 (fr) Module de phare de véhicule
DE19826023C2 (de) Mehrlagige elektrische Schaltungsanordnung
DE69508134T2 (de) Verfahren zur Herstellung einer elektronischen Leistungsschaltung und nach diesem Verfahren erhaltene elektronische Schaltung
DE29621801U1 (de) Anordnung zum Entlöten oder Löten sowie Heizeinrichtung für eine derartige Anordnung
DE10259277A1 (de) Einspannvorrichtung und Verfahren zur Fixierung von mindestens einem elektronischen Bauteils auf einer Leiterplatte und zum Löten des Bauteils
WO2007006598A1 (fr) Procede pour souder une carte de circuits imprimes a l'aide d'une pate de soudure exempte de plomb dans un four de soudage par refusion, carte de circuits imprimes servant a la mise en oeuvre de ce procede, et four de soudage par refusion
DE19610586B4 (de) Leiterplatte und lagegenauen Bestücken und Löten von elektronischen Bauelementen auf der Oberfläche der Leiterplatte

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20040828

AK Designated contracting states

Kind code of ref document: A2

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT RO SE SI SK TR

AX Request for extension of the european patent

Extension state: AL LT LV MK

17Q First examination report despatched

Effective date: 20110119

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20150811