GB2329073B - Circuit board - Google Patents

Circuit board

Info

Publication number
GB2329073B
GB2329073B GB9718570A GB9718570A GB2329073B GB 2329073 B GB2329073 B GB 2329073B GB 9718570 A GB9718570 A GB 9718570A GB 9718570 A GB9718570 A GB 9718570A GB 2329073 B GB2329073 B GB 2329073B
Authority
GB
United Kingdom
Prior art keywords
circuit board
board
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB9718570A
Other versions
GB2329073A (en
GB9718570D0 (en
Inventor
Shimon Medalsy
Eyal Brami
Moshe Gabriely
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Motorola Solutions Israel Ltd
Original Assignee
Motorola Israel Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Israel Ltd filed Critical Motorola Israel Ltd
Priority to GB9718570A priority Critical patent/GB2329073B/en
Publication of GB9718570D0 publication Critical patent/GB9718570D0/en
Publication of GB2329073A publication Critical patent/GB2329073A/en
Application granted granted Critical
Publication of GB2329073B publication Critical patent/GB2329073B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0212—Printed circuits or mounted components having integral heating means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09127—PCB or component having an integral separable or breakable part
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
GB9718570A 1997-09-03 1997-09-03 Circuit board Expired - Fee Related GB2329073B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB9718570A GB2329073B (en) 1997-09-03 1997-09-03 Circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB9718570A GB2329073B (en) 1997-09-03 1997-09-03 Circuit board

Publications (3)

Publication Number Publication Date
GB9718570D0 GB9718570D0 (en) 1997-11-05
GB2329073A GB2329073A (en) 1999-03-10
GB2329073B true GB2329073B (en) 2002-04-17

Family

ID=10818389

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9718570A Expired - Fee Related GB2329073B (en) 1997-09-03 1997-09-03 Circuit board

Country Status (1)

Country Link
GB (1) GB2329073B (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2345453B (en) * 1999-09-14 2000-12-27 Lee John Robinson Laminated reflow soldering
TW471067B (en) * 2000-08-31 2002-01-01 Advanced Semiconductor Eng Integrated circuit package board which integrates de-coupled capacitor
DE10211647B4 (en) * 2002-03-15 2014-02-13 Endress + Hauser Gmbh + Co. Kg Method for loading and soldering a printed circuit board
US20040108130A1 (en) * 2002-12-09 2004-06-10 Yazaki Corporation Mounting structure for electronic component
EP1864143A4 (en) * 2005-03-15 2009-11-25 Medconx Inc Mini wave soldering system and method for soldering wires and pin configurations
DE102005032135A1 (en) * 2005-07-07 2007-01-18 Endress + Hauser Gmbh + Co. Kg Method for soldering a circuit board with lead-free solder paste in a reflow soldering oven, circuit board for such a method and reflow soldering oven

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2124035A (en) * 1982-07-15 1984-02-08 Standard Telephones Cables Ltd Printed circuit boards

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2124035A (en) * 1982-07-15 1984-02-08 Standard Telephones Cables Ltd Printed circuit boards

Also Published As

Publication number Publication date
GB2329073A (en) 1999-03-10
GB9718570D0 (en) 1997-11-05

Similar Documents

Publication Publication Date Title
TW369229U (en) Angled circuit board connector
IL132074A0 (en) Circuit board mount
SG73972A1 (en) Circuit board
GB9726323D0 (en) Non board
GB2306904B (en) Circuit boards
GB9721706D0 (en) Printed circuit boards
GB9506522D0 (en) Circuit board
GB9702120D0 (en) Electronic circuit
TW391620U (en) Circuit arrangement
GB9802869D0 (en) Circuit board
GB9922116D0 (en) Circuit board
HUP9801903A3 (en) Electronic circuit
GB2329073B (en) Circuit board
GB2289170B (en) Circuit board
TW381804U (en) Circuit arrangement
GB9612024D0 (en) Circuit board
GB9714558D0 (en) Circuit board
GB9807866D0 (en) Circuit board
GB9727271D0 (en) Electronic circuit
GB2335626B (en) Board
GB2325313B (en) Electronic circuits
PL324307A1 (en) Insulating board
GB9704064D0 (en) Electronic circuits
AU133704S (en) Printed circuit board
AU131460S (en) Printed circuit board

Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee