EP1347473A1 - SMD-Gleichtaktdrosselspule und Verfahren zu deren Herstellung - Google Patents

SMD-Gleichtaktdrosselspule und Verfahren zu deren Herstellung Download PDF

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Publication number
EP1347473A1
EP1347473A1 EP03012309A EP03012309A EP1347473A1 EP 1347473 A1 EP1347473 A1 EP 1347473A1 EP 03012309 A EP03012309 A EP 03012309A EP 03012309 A EP03012309 A EP 03012309A EP 1347473 A1 EP1347473 A1 EP 1347473A1
Authority
EP
European Patent Office
Prior art keywords
common mode
mode choke
choke coil
conductive layer
base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP03012309A
Other languages
English (en)
French (fr)
Inventor
Atshushi Kiyota
Shigeyoshi Yoshida
Takayuki Kesen
Masashi Ikeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokin Corp
Original Assignee
NEC Tokin Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Tokin Corp filed Critical NEC Tokin Corp
Publication of EP1347473A1 publication Critical patent/EP1347473A1/de
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F5/00—Coils
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F17/0033—Printed inductances with the coil helically wound around a magnetic core
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/041—Printed circuit coils
    • H01F41/046—Printed circuit coils structurally combined with ferromagnetic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/04—Fixed inductances of the signal type  with magnetic core
    • H01F17/045—Fixed inductances of the signal type  with magnetic core with core of cylindric geometry and coil wound along its longitudinal axis, i.e. rod or drum core
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F2017/0093—Common mode choke coil
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F37/00—Fixed inductances not covered by group H01F17/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a noise filter so as to restrain electromagnetic noise, and particularly to a substrate-mounted common mode choke coil and the method of manufacture thereof.
  • Impedance elements generally shield frequency noise as impedance characteristics for the measures against EMI.
  • Wound type and laminated type common mode choke coils are used as electromagnetic noise filters.
  • the wound type is miniaturized by thinning wires or the like, thus increasing defects thereby. Additionally, pitch variations or the like causes errors in resonance frequencies and inductance, and the adjustments thereof are difficult. The manufacture thereof is also hard.
  • a common mode choke coil which has first and second spiral conducive layer elements electrically insulated from each other at a base.
  • the base is made of a magnetic or dielectric material. At least one of the first and the second spiral conductive layer elements is formed in close contact with the surface of the base.
  • a method of manufacturing the above-mentioned common mode choke coils is characterized in that, after at least one conductive layer is formed on the surface of the base, two spiral conductors are formed by at least one processes of laser trimming, sandblast and water jet while the conductive layer is being removed to form grooves.
  • a method of manufacturing the common mode choke coils mentioned above is obtained.
  • the method is characterized in that, after forming two spiral conductive layers and an insulating layer by screen printing, a binder is removed and baking is carried out, thus forming the coil.
  • a method of manufacturing any of the above-mentioned common mode choke coils is obtained.
  • the method is characterized in that input and output terminals at a spiral conductive layer part, which is formed in close contact with the base, are formed by etching with a resist until a conductive layer constituting the spiral conductive layer part is exposed.
  • a structure of a common mode choke coil according to the first example of the present invention will be explained based on the manufacturing processes thereof.
  • a conductive material is coated on the surface of a prismatic base 10, made of a dielectric or magnetic material.
  • the conductive material for use may be provided by plating, sputtering or depositing copper, aluminum, silver, or the like.
  • the conductive material for use may also be provided by, after coating a conductive paste made of a conductive powder and a binder, removing the binder and then baking the paste.
  • terminal parts 11 and 12 may be prismatic and a spiral conductive part 17 may be a polygonal pillar, cylinder or the like as explained later in the second example and the third example relating to Figs. 3A, 3B, 4A, and 4B.
  • the edges may have R herein.
  • spiral grooves 14a, 14b are formed on these base 10 in two stages by laser trimming, sandblast or water jet, thus forming two spiral conductive layer elements 15 and 16 alternately on the surface of the base 10.
  • One of the spiral conductive layer elements will be referred to as a first spiral conductive layer element 15 and is illustrated by a hatched portion in Fig. 1.
  • Another of the spiral conductive layer elements will be referred to as a second spiral conductive layer element 16 and is illustrated by non hatched portion in Fig. 1.
  • the terminal parts 11 and 12 on both ends are divided into four terminals 20, 21, 22, and 23 by providing grooves 13.
  • a common mode choke coil 1 is provided that has mutually insulated two spiral conductive layers of the first and the second spiral conductive layer elements 15 and 16 alternately.
  • grooves 14a, 14b were formed in a spiral form by laser trimming.
  • the base 10 was moved in a perpendicular direction to the laser, thus forming a groove 13 at the base terminal part 11 toward the corner of and in a longitudinal direction of the base.
  • the base 10 was also rotated perpendicularly to the shifting direction.
  • a first spiral conductive layer element 15 was formed in the base 10 thereby. The rotation was then stopped at the opposite terminal part 12 so as to cut the conductive layer.
  • the base 10 was rotated by 90° or 180°, thus forming a second spiral conductive layer element 16 by laser trimming as described above.
  • the insulating resin 24 was coated as in Fig. 2.
  • Four terminals 20, 21, 22, and 23 were solder-plated, and both ends 18 and 19 at the terminals were cut off from the lines at both ends.
  • the common mode choke coil was formed thereby that has the first and the second spiral conductive layer elements 15 and 16 insulated from each other alternately.
  • An impedance analyzer measured the impedance of this common mode choke coil at a common mode.
  • the impedance was 300 ⁇ at 500 MHz.
  • a common mode choke coil of example 2 has the same structure as the common mode choke coil of example 1, except that the base has a different shape. Even if the spiral conductive part 17' of the base 30 is a polygonal pillar as shown in example 2, the coil may be formed as in examples 1 and 2.
  • An impedance analyzer measured the impedance of the common mode choke coil of example 2 at a common mode. The impedance was 290 ⁇ at 500 MHz.
  • a common mode choke coil of example 3 as shown in Figs. 4A and 4B has the same structure as the common mode choke coil of example 1, except that the base has a different shape. Even if the spiral conductive part 17" of a base 30' is cylindrical as shown in example 3, the coil may be formed as in example 1.
  • An impedance analyzer measured the impedance of the common mode choke coil of example 3 at a common mode. The impedance was 250 ⁇ at 500 MHz.
  • the spiral conductive part was formed by laser trimming in example 1, but was formed by sandblast instead in example 4.
  • the same common mode choke coil as in example 1 was obtained.
  • the spiral conductive part was formed by laser trimming in the common mode choke coil of example 1, but was formed by water jet instead in example 5. The same common mode choke coil as in example 1 was obtained.
  • a common mode choke coil of example 6 of the present invention has the same structure as the common mode choke coil of example 1 shown in Figs. 1 and 2, except that a different insulator or the like is applied.
  • the common mode choke coil of this example will be explained by referring to Figs. 1 and 2.
  • a conductive material for use may be provided by plating, sputtering or depositing copper, aluminum, silver, or the like.
  • the conductive material for use may also be provided by, after coating a conductive paste made of a conductive powder and a binder, removing the binder and then baking the paste.
  • an insulating layer made of a dielectric or magnetic material is formed over double spiral electrodes 15 and 16 that are two alternately formed electrodes.
  • This spiral conductive part 17 may be formed by laser trimming, sandblast, water jet, or the like.
  • a resin 24 is formed by, on the surface of the spiral conductive part 17 of the base, coating and then drying a mixed resin, in which a soft magnetic material was added and then mixed with an insulating resin having a lower viscosity by dissolving it with a solvent or the like.
  • a soft magnetic material and an organic binder are mixed, and the paste thereof is formed into a sheet by a doctor blade method, screen printing method, roll method, or the like. If no problems are found in the manufactured strength of the sheet, a coating insulating resin can be also used for the sheet.
  • the common mode choke coil is formed that contains a soft magnetic material in an insulating resin.
  • Epoxy resin was prepared by dissolving it with a solvent.
  • An impedance analyzer measured the impedance of this common mode choke coil at a common mode. The impedance was 580 ⁇ at 500 MHz.
  • the same coil as in the first example was formed without mixing a magnetic material into an insulating resin.
  • An impedance analyzer measured the impedance of this common mode choke coil at a common mode.
  • the impedance was 300 ⁇ at 500 MHz.
  • a multi-layer spiral common mode choke coil of example 7 of the present invention will be explained by referring to Figs. 5 and 6.
  • a conductive material for use may be provided by plating, sputtering or depositing copper, aluminum, silver, or the like.
  • the conductive material for use may also be provided by, after coating a conductive paste made of a conductive powder and a binder, removing the binder and then baking the paste.
  • a spiral conductive part 28 has a structure of spiral conductive portion 28' as shown in Fig. 6, in which a second conductive layer element 27 is attached on a first conductor 25 through a dielectric or magnetic body 26 therebetween.
  • This spiral conductive portion 28' may be formed by laser trimming, sandblast, water jet, or the like.
  • a resin 35 is formed by, on the surface of the spiral conductive portion 28' of the base, coating and then drying a mixed resin, in which a soft magnetic material was added and then mixed with an insulating resin having a lower viscosity by dissolving it with a solvent or the like.
  • a soft magnetic material and an organic binder are mixed, and the paste thereof is formed into a sheet by a doctor blade method, screen printing method, roll method, or the like. If no problems are found in the strength of the sheet, a coating insulating resin can also be used for the sheet.
  • the common mode choke coil is formed that contains a soft magnetic material in an insulating resin.
  • the same common mode choke coil as in example 6 was formed in example 7, except that the spiral conductive part has a double-layer structure.
  • An impedance analyzer measured the impedance of this common mode choke coil at a common mode.
  • the impedance was 630 ⁇ at 500 MHz.
  • a common mode choke coil was made without mixing a magnetic material into an insulating resin.
  • An impedance analyzer measured the impedance of this common mode choke coil at a common mode.
  • the impedance was 320 ⁇ at 500 MHz.
  • a common mode choke coil according to example 8 has the same structure as the common mode choke coil of example 1, except that the material of an insulating layer or the like is different. Thus, the coil of this example will be explained by referring to Fig. 1.
  • PVB was added to Ni-Zn ferrite powder at 5 wt. % relative to the powder, and a mixed solvent of ethyl cellosolve and buthyl carbinol was added thereto, which was subsequently kneaded by a planetary mixer.
  • This paste was formed into a sheet form at 10 microns by a doctor blade method. This sheet was cut into an appropriate size, and was wound around the spiral conductive part 17 after coating epoxy resin over the surface.
  • An impedance analyzer measured the impedance of this common mode choke coil at a common mode.
  • the impedance was 580 ⁇ at 500 MHz.
  • a common mode choke coil was made without mixing a magnetic material into an insulating resin.
  • An impedance analyzer measured the impedance of this common mode choke coil at a common mode.
  • the impedance was 300 ⁇ at 500 MHz.
  • the base was cylindrical at both ends and at the center in example 6 to example 8 described above, the polygonal pillar base shown in Figs. 3 and the cylindrical base shown in Figs. 4 may be used.
  • the spiral conductive part of a base being either a polygonal pillar or a cylinder, the same effects may be clearly obtained. Moreover, even with a different soft magnetic material or insulating resin, the same effects may be obtained.
  • a first conductive layer element 41 is coated on a prismatic base made of a dielectric or magnetic material.
  • a conductor in use may be provided by soldering, sputtering or depositing copper, aluminum, silver, or the like.
  • the conductor for use may also be provided by, after coating a conductive paste made of a conductive powder and a binder, removing the binder and then baking the paste.
  • a second conductive layer element 43 is coated on the surface of this first conductive layer element 41 through an insulating layer 42.
  • the insulating layer 42 and the second conductive layer element 43 may be formed like the first conductive layer element 41.
  • a spiral groove 44 is formed as illustrated by a black thick line in Fig. 8. Laser trimming, or sandblast or water jet forms this groove 44.
  • a portion of electrodes 45 and 46 is etched down to the first conductive layer 41, thus forming terminals 48 and 49 as illustrated by hatched portions.
  • the terminal parts 45 and 46 may be prismatic, and a spiral conductive part 47 may be a polygonal pillar, cylinder, or the like.
  • the edges may have R.
  • an insulating resin 24 is coated over the entire surface of the conductive layer between the terminal parts, and four electrodes 51, 52, 53 and 54 are solder-plated. Accordingly, the common mode choke coil is formed that has the first and the second spiral conductive layer elements 41 and 43 insulated from each other.
  • the terminal parts 45 and 46 may be prismatic, and the spiral conductive part 47 may be a polygonal pillar, cylinder, or the like.
  • the above-noted paste of a conductive powder and a binder is printed by screen printing onto the base so as to form two spiral conductive layer elements 41 and 43 and the insulating layer 42.
  • the binder is removed, and the paste is baked, thus forming the common mode choke coil.
  • the common mode choke coil 3 is formed that has two mutually insulating spiral conductive layers 41 and 43.
  • An impedance analyzer measured the impedance of this common mode choke coil at a common mode.
  • the impedance was 300 ⁇ at 500 MHz.
  • a common mode choke coil of example 10 has the same structure as the common mode choke coil of the ninth example, except that the spiral conductive part of the base is a polygonal pillar.
  • An impedance analyzer measured the impedance of this common mode choke coil at a common mode. The impedance was 300 ⁇ at 500 MHz.
  • a common mode choke coil of example 11 as shown in Figs. 4a and 4b has the same structure as the common mode choke coil of example 9, except that the spiral conductive part of the base 30 is cylindrical.
  • An impedance analyzer measured the impedance of this common mode choke coil at a common mode.
  • the impedance was 290 ⁇ at 500 MHz.
  • the groove 44 is formed to make the spiral conductive portion 47' with laser trimming.
  • a common mode choke coil was made by sandblast. The same results as in example 9 were also obtained in example 12.
  • the spiral conductive part was formed by laser trimming.
  • a common mode choke coil was made by water jet. The same results as in example 9 were also obtained in example 13.
  • spiral grooves may be formed by sandblast or water jet when the spiral conductive part of the base is a polygonal pillar or a cylinder. Clearly, similar results can be obtained.
  • a conductive paste was prepared by using a mixed solvent of ethyl cellosolve and butyl carbinol, copper powder and PVB. In this case, the ratio of copper powder to PVD was 95:5.
  • an alumina layer was printed on the surface of the first conductor and was then dried, thus printing and drying a second conductor.
  • the alumina paste has the same composition as the copper paste. After the second conductor was dried, a binder was removed and the paste was baked.
  • a common mode choke coil is formed by coating the insulating resin 55 and solder plating the terminal parts.
  • An impedance analyzer measured the impedance of this common mode choke coil at a common mode.
  • the impedance was 300 ⁇ at 500 MHz.
  • a base made of a magnetic or dielectric body has two mutually electrically insulated spiral conductors, and the conductive layer thereof is trimmed by laser or the like.
  • the common mode choke coil may be easily and economically provided that has high Q-characteristics and little fluctuation of resonance frequencies and inductance.
  • binding increases by mixing a magnetic material to an insulating resin, so that the common mode choke coil may be easily and economically provided that has high impedance at a common mode in a high frequency range.
  • a base made of a magnetic or dielectric material has two mutually electrically insulated laminated spiral conductors.
  • the conductive layers are formed by trimming with laser or the like or screen printing, so that the common mode choke coil may be easily and economically provided that has high Q-characteristics and little fluctuation of resonance frequencies and inductance.
EP03012309A 1999-09-30 2000-09-29 SMD-Gleichtaktdrosselspule und Verfahren zu deren Herstellung Withdrawn EP1347473A1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP28007999 1999-09-30
JP28007999A JP2001102222A (ja) 1999-09-30 1999-09-30 コモンモードチョークコイル及びその製造方法
EP00121450A EP1089302A1 (de) 1999-09-30 2000-09-29 SMD-Gleichtaktdrosselspule und Verfahren zu deren Herstellung

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
EP00121450.1 Division 2000-09-29

Publications (1)

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EP1347473A1 true EP1347473A1 (de) 2003-09-24

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EP03012309A Withdrawn EP1347473A1 (de) 1999-09-30 2000-09-29 SMD-Gleichtaktdrosselspule und Verfahren zu deren Herstellung
EP00121450A Withdrawn EP1089302A1 (de) 1999-09-30 2000-09-29 SMD-Gleichtaktdrosselspule und Verfahren zu deren Herstellung

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EP00121450A Withdrawn EP1089302A1 (de) 1999-09-30 2000-09-29 SMD-Gleichtaktdrosselspule und Verfahren zu deren Herstellung

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EP (2) EP1347473A1 (de)
JP (1) JP2001102222A (de)
KR (1) KR20010067263A (de)
CN (1) CN1199205C (de)
SG (1) SG96573A1 (de)
TW (1) TW508597B (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8106739B2 (en) 2007-06-12 2012-01-31 Advanced Magnetic Solutions United Magnetic induction devices and methods for producing them

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004534474A (ja) * 2001-07-04 2004-11-11 コーニンクレッカ　フィリップス　エレクトロニクス　エヌ　ヴィ 誘導性及び容量性のある電子部品
JP5121606B2 (ja) * 2008-07-09 2013-01-16 東京特殊電線株式会社 渦巻きコイル
KR101630090B1 (ko) * 2014-12-24 2016-06-13 삼성전기주식회사 적층 전자부품 및 그 제조방법
TWI592955B (zh) * 2015-06-25 2017-07-21 Wafer Mems Co Ltd Embedded passive components and methods of mass production
TWI555044B (zh) * 2015-06-25 2016-10-21 Wafer Mems Co Ltd A method for producing a passive element with a terminal electrode
TWI592956B (zh) 2015-06-25 2017-07-21 Wafer Mems Co Ltd Core inductor production methods
US11881343B2 (en) * 2020-03-13 2024-01-23 Cirrus Logic, Inc. Layered process-constructed double-winding embedded solenoid inductor

Citations (6)

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Publication number Priority date Publication date Assignee Title
DE888271C (de) * 1942-04-10 1953-08-31 Siemens Ag Stoerschutzdrossel
EP0778593A1 (de) * 1995-12-07 1997-06-11 Co.Ri.M.Me. Consorzio Per La Ricerca Sulla Microelettronica Nel Mezzogiorno Herstellungsverfahren für einen Magnetkreis in einem integrierten Kreis
US5692290A (en) * 1994-09-19 1997-12-02 Taiyo Yuden Kabushiki Kaisha Method of manufacturing a chip inductor
GB2318218A (en) * 1996-10-11 1998-04-15 Matsushita Electric Ind Co Ltd Inductive device
FR2763739A3 (fr) * 1997-05-23 1998-11-27 Frontier Electonics Co Ltd Inducteur perfectionne
JPH11238634A (ja) * 1997-12-17 1999-08-31 Taiyo Yuden Co Ltd 面実装型コイル部品

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JPH02256214A (ja) * 1988-06-09 1990-10-17 Tokin Corp チップインダクタおよびその製造方法
EP0698896B1 (de) * 1994-08-24 1998-05-13 Yokogawa Electric Corporation Gedruckte Spule
JP3139368B2 (ja) * 1995-04-03 2001-02-26 株式会社村田製作所 積層コモンモードチョークコイル
EP1077455B1 (de) * 1999-08-19 2007-10-17 Murata Manufacturing Co., Ltd. Spulenbauteil

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE888271C (de) * 1942-04-10 1953-08-31 Siemens Ag Stoerschutzdrossel
US5692290A (en) * 1994-09-19 1997-12-02 Taiyo Yuden Kabushiki Kaisha Method of manufacturing a chip inductor
EP0778593A1 (de) * 1995-12-07 1997-06-11 Co.Ri.M.Me. Consorzio Per La Ricerca Sulla Microelettronica Nel Mezzogiorno Herstellungsverfahren für einen Magnetkreis in einem integrierten Kreis
GB2318218A (en) * 1996-10-11 1998-04-15 Matsushita Electric Ind Co Ltd Inductive device
FR2763739A3 (fr) * 1997-05-23 1998-11-27 Frontier Electonics Co Ltd Inducteur perfectionne
JPH11238634A (ja) * 1997-12-17 1999-08-31 Taiyo Yuden Co Ltd 面実装型コイル部品

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 1999, no. 13 30 November 1999 (1999-11-30) *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8106739B2 (en) 2007-06-12 2012-01-31 Advanced Magnetic Solutions United Magnetic induction devices and methods for producing them

Also Published As

Publication number Publication date
CN1290947A (zh) 2001-04-11
TW508597B (en) 2002-11-01
KR20010067263A (ko) 2001-07-12
SG96573A1 (en) 2003-06-16
CN1199205C (zh) 2005-04-27
JP2001102222A (ja) 2001-04-13
EP1089302A1 (de) 2001-04-04

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